Slitting device for semiconductor chip processing

Abstract

The utility model discloses a slitting device for semiconductor chip processing, which belongs to the technical field of semiconductor chip processing and comprises a slitting device main body, a cutting groove is arranged on the top surface of the slitting device main body, a second fixed baffle plate is fixedly connected to the top surface of the slitting device main body, one side of the second fixed baffle plate is connected with a movable clamping plate, and the other side of the second fixed baffle plate is connected with the movable clamping plate. A slitting frame is installed on the top of the slitting device body, an electric pneumatic cylinder is installed on the surface of the top of the slitting frame, the output end of the electric pneumatic cylinder is fixedly connected with a cutting knife, an ash removal assembly is installed at the bottom of the slitting device body, and a pushing assembly is arranged on one side of the slitting frame. According to the device, semiconductor chips and dust around the separation grooves can be collected, meanwhile, waste of semiconductor resources can be avoided, the chips can be directly pushed to move towards one side of the device by arranging the pushing assembly, the chips do not need to be manually transferred, and the working efficiency of the device is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor chip processing technology, and specifically relates to a slitting device for semiconductor chip processing. Background Technology

[0002] Semiconductor chips are semiconductor devices that perform a certain function by etching and wiring on semiconductor wafers. Since semiconductor wafers have a large area while semiconductor chips have a small area, semiconductor wafers need to be cut into small wafers of equal size during the production of semiconductor chips. Then, the small wafers are processed to make semiconductor chips.

[0003] Chinese patent application number 202321464416.X discloses a semiconductor chip processing slitting device, including a slitting device body, a cutting groove at the upper end of the slitting device body, a first fixed baffle fixed at the upper end of the slitting device body, a second fixed baffle connected to the upper end of the slitting device body, a slitting frame at the upper end of the slitting device body, a crossbar fixed to the inner side of the slitting frame, and an electric pneumatic cylinder installed at the upper end of the slitting frame. This semiconductor chip processing slitting device, by providing connecting shafts on the left and right sides of the cutting blade, and utilizing the rotation of the connecting arms to drive the protective partition to move back and forth, allows the protective partition to move backward synchronously when the cutting blade moves downward, facilitating cutting. When the cutting blade rises after cutting, it simultaneously drives the protective partition to move forward, thereby isolating the cutting blade area, effectively preventing worker scratches, and improving safety.

[0004] The aforementioned disclosed patents have the following problems when used:

[0005] 1. When slicing semiconductor chips, this device cannot effectively clean the debris and dust generated during the slicing process. Over time, this will lead to dust accumulation, which will further result in poor positioning and limiting effect of semiconductor chips, reduced slicing accuracy, and low practicality.

[0006] 2. After the device cuts the semiconductor chips, the cut chips need to be transferred manually for subsequent processing. However, manual transfer is inefficient and labor-intensive, which is not conducive to its widespread adoption. Utility Model Content

[0007] To address the problems mentioned in the background section, this invention provides a semiconductor chip slitting device with excellent dust removal, comprehensive chip transfer function, and high practicality.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a slitting device for semiconductor chip processing, comprising a slitting device body, a cutting groove formed on the top surface of the slitting device body, a second fixed baffle fixedly connected to the top surface of the slitting device body, a movable clamping plate connected to one side of the second fixed baffle, a slitting frame installed on the top of the slitting device body, an electric pneumatic cylinder installed on the top surface of the slitting frame, a cutting blade fixedly connected to the output end of the electric pneumatic cylinder, a dust removal assembly installed at the bottom of the slitting device body, and a pushing assembly provided on one side of the slitting frame.

[0009] Preferably, the dust removal assembly includes an air pump, a collection box, a partition, a filter plate, a slider, a collection frame, a conveying pipe, an air inlet, a discharge pipe, and a fixed base. The bottom of the main body of the slitting device is provided with a collection box, an air pump is installed inside the collection box, a collection frame is provided on one side of the air pump, a filter plate is provided inside the collection frame, sliders are fixed to both ends of the filter plate, a partition is provided on the side of the collection frame near the air pump, a conveying pipe is connected to the input end of the air pump, a fixed base is connected to one end of the conveying pipe, an air inlet is provided on the surface of the fixed base, and a discharge pipe is provided at the output end of the air pump.

[0010] Preferably, a groove is provided at the contact point between the collection frame and the slider, and a handle is provided on one side surface of the collection frame.

[0011] Preferably, the pushing assembly includes a motor, a transmission belt, a protrusion, a fixed shaft, a movable plate, a support rod, a tension spring, and a support block. The motor is installed at the bottom of the main body of the slitting device, the output end of the motor is connected to the transmission belt, the fixed shaft is provided on the side of the transmission belt away from the motor, the bottom of the fixed shaft is provided with a protrusion, the top of the fixed shaft is fixedly connected to the support block, the movable plate is provided on one side of the support block, the support rod is fixedly connected to the surface of the movable plate near the support block, and a tension spring is sleeved on the surface of the support rod.

[0012] Preferably, a stop plate is provided on one side surface of the movable plate, a screw is fixedly connected to one side of the stop plate, and a handwheel is installed on the side of the screw away from the stop plate.

[0013] Preferably, a through hole is provided at the contact point between the support block and the support rod, and a limit block is provided at the end of the support rod away from the tension spring.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. By setting up a dust removal component, this utility model enables the device to collect semiconductor debris and dust around the separator groove when cutting semiconductor chips, thus preventing dust accumulation from affecting the positioning of the semiconductor chips. At the same time, it can also separate semiconductor fragments and dust, facilitating subsequent processing and avoiding waste of semiconductor resources.

[0016] 2. By setting up a pushing component, this utility model enables the device to directly push the semiconductor chip to one side of the device after the chip is cut, eliminating the need for manual transfer of the chip, saving a lot of manpower, improving the working efficiency of the device, and enhancing its practicality. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a cross-sectional view of the dust removal component of this utility model;

[0019] Figure 3 This is a cross-sectional view of the pushing component of this utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the movable plate of this utility model.

[0021] In the diagram: 1. Main body of the slitting device; 2. Second fixed baffle; 3. Dust removal assembly; 31. Air pump; 32. Collection box; 33. Partition plate; 34. Filter plate; 35. Slider; 36. Collection frame; 37. Feed pipe; 38. Air inlet; 39. Discharge pipe; 390. Fixed seat; 4. Movable clamping plate; 5. Pushing assembly; 51. Motor; 52. Transmission belt; 53. Protrusion; 54. Fixed shaft; 55. Movable plate; 56. Support rod; 57. Tension spring; 58. Support block; 6. Electric pneumatic cylinder; 7. Slitting frame; 8. Cutting blade; 9. Cutting groove. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1

[0024] Please see Figure 1-4 The present invention provides the following technical solution: a slitting device for semiconductor chip processing, comprising a slitting device body 1, a cutting groove 9 formed on the top surface of the slitting device body 1, a second fixed baffle 2 fixedly connected to the top surface of the slitting device body 1, a movable clamping plate 4 connected to one side of the second fixed baffle 2, a slitting frame 7 installed on the top of the slitting device body 1, an electric pneumatic cylinder 6 installed on the top surface of the slitting frame 7, a cutting blade 8 fixedly connected to the output end of the electric pneumatic cylinder 6, a dust removal assembly 3 installed at the bottom of the slitting device body 1, and a pushing assembly 5 provided on one side of the slitting frame 7.

[0025] Specifically, the dust removal assembly 3 includes an air pump 31, a collection box 32, a partition 33, a filter plate 34, a slider 35, a collection frame 36, a conveying pipe 37, an air inlet 38, a discharge pipe 39, and a fixed base 390. The bottom of the main body 1 of the slitting device is provided with a collection box 32, and an air pump 31 is installed inside the collection box 32. A collection frame 36 is provided on one side of the air pump 31, and a filter plate 34 is provided inside the collection frame 36. Slider 35 is fixed to both ends of the filter plate 34. A partition 33 is provided on the side of the collection frame 36 near the air pump 31. The input end of the air pump 31 is connected to the conveying pipe 37, and one end of the conveying pipe 37 is connected to the fixed base 390. An air inlet 38 is opened on the surface of the fixed base 390, and a discharge pipe 39 is provided at the output end of the air pump 31.

[0026] By adopting the above technical solution, when using the dust removal component 3, the air pump 31 is started, and the chip fragments and dust generated during chip slitting are sucked into the collection frame 36 through the air pump 31 and the conveying pipe 37. When the chip slitting produces larger fragments, the fragments can fall directly through the cutting groove 9 onto the surface of the filter plate 34, thereby collecting the chip dust on the surface of the main body 1 of the slitting device and filtering the chip fragments to separate them from the dust, making the subsequent separation work more efficient. After cleaning, the collection frame 36 is pulled out first, and then the filter plate 34 is further removed by pulling the slider 35 upward. At this time, the chip fragments and slitting dust can be processed separately. This process avoids dust accumulation affecting chip positioning and also avoids the waste of semiconductor materials, thus enhancing practicality.

[0027] Specifically, a groove is provided at the contact point between the collection frame 36 and the slider 35, and a handle is provided on one side surface of the collection frame 36.

[0028] By adopting the above technical solution, the collection frame 36 can be easily pulled out by the handle. When it is necessary to remove the filter plate 34, the filter plate 34 can be easily removed by pulling it upward and sliding it in the groove via the slider 35, which enhances the practicality.

[0029] In this embodiment, when using the dust removal component 3, the air pump 31 is activated. The air pump 31 and the conveying pipe 37 suck the chip fragments and dust generated during chip cutting into the collection frame 36. When chip cutting produces large fragments, the fragments can fall directly through the cutting groove 9 onto the surface of the filter plate 34, thereby collecting the chip dust on the surface of the main body 1 of the cutting device and filtering the chip fragments to separate them from the dust, making the subsequent separation work more efficient. After cleaning, the collection frame 36 is pulled out first, and then the filter plate 34 is further removed by pulling the slider 35 upward. At this time, the chip fragments and cutting dust can be processed separately. This process avoids dust accumulation affecting chip positioning and also avoids the waste of semiconductor materials, enhancing practicality. The collection frame 36 can be easily pulled out by the handle. When the filter plate 34 needs to be removed, the filter plate 34 can be easily removed by pulling it upward and sliding it in the groove through the slider 35, enhancing practicality.

[0030] Example 2

[0031] The difference between this embodiment and embodiment 1 is that, specifically, the pushing component 5 includes a motor 51, a transmission belt 52, a protrusion 53, a fixed shaft 54, a movable plate 55, a support rod 56, a tension spring 57, and a support block 58. The motor 51 is installed at the bottom of the main body 1 of the slitting device. The output end of the motor 51 is connected to the transmission belt 52. The fixed shaft 54 ​​is provided on the side of the transmission belt 52 away from the motor 51. The bottom of the fixed shaft 54 ​​is provided with a protrusion 53. The top of the fixed shaft 54 ​​is fixedly connected to the support block 58. The movable plate 55 is provided on one side of the support block 58. The support rod 56 is fixedly connected to the surface of the movable plate 55 near the support block 58. The surface of the support rod 56 is sleeved with a tension spring 57.

[0032] By adopting the above technical solution, when pushing component 5 during use, after the chip is diced, the motor 51 is started. The motor 51 drives the fixed shaft 54 ​​to rotate through the transmission belt 52. The fixed shaft 54 ​​further drives the protrusion 53 to rotate. Under the action of the tension spring 57 and the support rod 56, the protrusion 53 can achieve reciprocating motion, so that the movable plate 55 pushes the diced chip to one side of the device to continue moving. There is no need for manual transfer, which reduces the labor intensity of the operator and improves work efficiency.

[0033] Specifically, a backing plate is provided on one side of the movable plate 55, a screw is fixed to one side of the backing plate, and a handwheel is installed on the side of the screw away from the backing plate.

[0034] By adopting the above technical solution, the distance between the back plate and the movable plate 55 can be adjusted by the handwheel and screw, making the component suitable for chips of different specifications and enhancing its practicality.

[0035] Specifically, a through hole is provided at the contact point between the support block 58 and the support rod 56, and a limit block is provided at the end of the support rod 56 away from the tension spring 57.

[0036] By adopting the above technical solution, the synchronous movement of the support rod 56 in the through hole can ensure the stability of the movement of the movable plate 55. At the same time, the limiting block can prevent the support rod 56 from dislodging from the through hole and affecting the support and use of the component.

[0037] In this embodiment, when the component 5 is pushed, after the chip slitting is completed, the motor 51 is started. The motor 51 drives the fixed shaft 54 ​​to rotate via the transmission belt 52. The fixed shaft 54 ​​further drives the protrusion 53 to rotate. Under the action of the tension spring 57 and the support rod 56, the protrusion 53 can achieve reciprocating motion, so that the movable plate 55 pushes the slitting chip to one side of the device to continue moving. No manual transfer is required, which reduces the labor intensity of the operator and improves the work efficiency. The distance between the back plate and the movable plate 55 can be adjusted by the handwheel and screw, so that the component can be used for chips of different specifications, which enhances its practicality. The synchronous movement of the support rod 56 in the through hole can ensure the stability of the movement of the movable plate 55. At the same time, the limiting block can prevent the support rod 56 from dislodging from the through hole, which would affect the support and use of the component.

[0038] The structure and operating principle of the second fixed baffle 2, movable clamping plate 4, electric pneumatic cylinder 6 and slitting frame 7 in this utility model have been disclosed in a semiconductor chip processing and slitting device disclosed in Chinese patent application number 202321464416.X.

[0039] The working principle and usage process of this utility model: This utility model adjusts a semiconductor chip processing and slitting device. During use, when the dust removal component 3 is activated, the air pump 31 is started. The air pump 31 and the conveying pipe 37 suck the chip slitting fragments and dust into the collection frame 36. When larger fragments are generated during chip slitting, they can fall directly through the cutting groove 9 onto the surface of the filter plate 34, thus collecting the chip dust on the surface of the slitting device body 1 and filtering the chip fragments, separating them from the dust, making subsequent separation work more efficient. After cleaning, first pull out the collection frame 36, then pull up the slider 35 to further remove the filter plate 34. At this point, the chip fragments and slitting dust can be processed separately. This process avoids dust accumulation affecting chip positioning and also avoids waste of semiconductor materials, enhancing practicality. The collection frame 36 can be easily pulled out using the handle. When the filter plate 34 needs to be removed, pull up the slider 35 to remove it. The filter plate 34 slides in the groove via the slider 35, making it easy to remove and enhancing its practicality. This utility model is an adjustment for a semiconductor chip processing and slitting device. When pushing the component 5 during use, after the chip slitting is completed, the motor 51 is started. The motor 51 drives the fixed shaft 54 ​​to rotate via the transmission belt 52. The fixed shaft 54 ​​further drives the protrusion 53 to rotate. Under the action of the tension spring 57 and the support rod 56, the protrusion 53 can achieve reciprocating motion, allowing the movable plate 55 to push the slitting chip to one side of the device. No manual transfer is required, reducing the labor intensity of the operator and improving work efficiency. The distance between the back plate and the movable plate 55 can be adjusted by the handwheel and screw, making the component suitable for chips of different specifications and enhancing its practicality. The synchronous movement of the support rod 56 in the through hole ensures the stability of the movement of the movable plate 55. At the same time, the limiting block can prevent the support rod 56 from dislodging from the through hole, which would affect the support and use of the component.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A slitting apparatus for semiconductor chip processing, comprising a slitting apparatus body (1), wherein a cutting groove (9) is formed on the top surface of the slitting apparatus body (1), a second fixed baffle (2) is fixedly connected to the top surface of the slitting apparatus body (1), a movable clamping plate (4) is connected to one side of the second fixed baffle (2), a slitting frame (7) is installed on the top of the slitting apparatus body (1), an electric pneumatic cylinder (6) is installed on the top surface of the slitting frame (7), and a cutting blade (8) is fixedly connected to the output end of the electric pneumatic cylinder (6), characterized in that: A dust removal component (3) is installed at the bottom of the main body (1) of the slitting device, and a pushing component (5) is provided on one side of the slitting frame (7).

2. The slitting apparatus for processing semiconductor chips according to claim 1, wherein: The dust removal assembly (3) includes an air pump (31), a collection box (32), a partition (33), a filter plate (34), a slider (35), a collection frame (36), a conveying pipe (37), an air inlet (38), a discharge pipe (39), and a fixed base (390). The bottom of the main body (1) of the slitting device is provided with a collection box (32), the air pump (31) is installed inside the collection box (32), and a collection frame (36) is provided on one side of the air pump (31). A filter plate (34) is provided inside the collection frame (36). A slider (35) is fixed to both ends of the filter plate (34). A partition plate (33) is provided on the side of the collection frame (36) near the air pump (31). A conveying pipe (37) is connected to the input end of the air pump (31). A fixed seat (390) is connected to one end of the conveying pipe (37). An air inlet hole (38) is opened on the surface of the fixed seat (390). A discharge pipe (39) is provided at the output end of the air pump (31).

3. The slitting apparatus for processing semiconductor chips according to claim 2, wherein: A groove is provided at the contact point between the collection frame (36) and the slider (35), and a handle is provided on one side surface of the collection frame (36).

4. The slitting apparatus for processing semiconductor chips according to claim 1, wherein: The pushing assembly (5) includes a motor (51), a transmission belt (52), a protrusion (53), a fixed shaft (54), a movable plate (55), a support rod (56), a tension spring (57), and a support block (58). The motor (51) is installed at the bottom of the main body (1) of the slitting device. The output end of the motor (51) is connected to the transmission belt (52). The fixed shaft (54) is provided on the side of the transmission belt (52) away from the motor (51). The bottom of the fixed shaft (54) is provided with a protrusion (53). The top of the fixed shaft (54) is fixedly connected to the support block (58). The movable plate (55) is provided on one side of the support block (58). The support rod (56) is fixedly connected to the surface of the movable plate (55) near the support block (58). The surface of the support rod (56) is sleeved with a tension spring (57).

5. The slitting apparatus for processing semiconductor chips according to claim 4, wherein: A stop plate is provided on one side surface of the movable plate (55), a screw is fixedly connected to one side of the stop plate, and a handwheel is installed on the side of the screw away from the stop plate.

6. The slitting apparatus for processing semiconductor chips according to claim 4, wherein: A through hole is provided at the contact point between the support block (58) and the support rod (56), and a limit block is provided at the end of the support rod (56) away from the tension spring (57).

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