Protective disc tablet and single crystal furnace
By setting stepped holes and bosses in the gaps between the protective plate pressing segments, the problem of soft and sticky material being blown up in the single crystal furnace was solved, thus improving the cleanliness of the single crystal furnace and the quality of single crystal growth.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QINGHAI GOKIN SOLAR TECH CO LTD
- Filing Date
- 2025-05-26
- Publication Date
- 2026-04-21
AI Technical Summary
In existing single crystal furnaces, the pores of the protective plate are relatively large, causing soft, sticky materials to be blown up by argon gas, affecting the cleanliness inside the single crystal furnace and consequently the quality of single crystal growth.
A protective plate pressing device is designed. By setting a first step hole and a second step hole in the gap between the pressing parts, the range of airflow influence is limited. The boss part blocks the outflow of molten silicon, ensuring that the airflow and molten silicon flow in a smaller area and reducing the possibility of soft and sticky material being blown up.
It improves the cleanliness inside the single crystal furnace, prevents silicon melt contamination, ensures the quality of single crystal growth, reduces the risk of soft-sticky material being blown away by airflow, and improves the stability of single crystal growth.
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Figure CN224148231U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of monocrystalline silicon production technology, and in particular to a protective plate pressing and monocrystalline furnace. Background Technology
[0002] During the operation of a single crystal furnace, the protective plate is a crucial component for ensuring the stability of the internal environment during single crystal growth. The protective plate typically has multiple functional holes, including a support rod hole in the center for placing the support rod, an electrode hole for connecting the electrodes, and a gas guide hole for guiding gas.
[0003] The protective plate is typically composed of multiple separate plates assembled together. During the operation of the single crystal furnace, the argon gas blowing causes the soft, sticky material below to flow. However, the existing protective plate has relatively large pores, and under the action of the airflow, the soft, sticky material below the protective plate is easily blown up, affecting the cleanliness inside the single crystal furnace and thus affecting the growth quality of the single crystal. Utility Model Content
[0004] In view of the above problems, this application provides a protective plate pressing and a single crystal furnace to solve the problem that the soft and sticky material under the protective plate pressing in the existing single crystal furnace is easily blown up.
[0005] To achieve the above objectives, the embodiments of this application provide the following technical solutions:
[0006] A first aspect of this application provides a protective disc pressing device, comprising:
[0007] Multiple tablet compression units are joined together circumferentially;
[0008] The tablet compression unit has target surfaces on both circumferential sides; the target surfaces are provided with a first recess and a second recess;
[0009] The target surfaces of two adjacent tableting parts are fitted together, the first recess of the two adjacent tableting parts are enclosed to form a first stepped hole, the second recess of the two adjacent tableting parts are enclosed to form a second stepped hole, and the second stepped hole is connected to the first stepped hole.
[0010] The cross-sectional area of the first stepped hole is larger than that of the second stepped hole, and the second stepped hole is located on the side of the tablet assembly closer to the soft adhesive component.
[0011] In one possible implementation, the first recess and the second recess have a radially extending length along the tablet body; the first stepped hole and the second stepped hole extend radially to form a strip-shaped hole.
[0012] In one possible implementation, along the axial direction, the orthographic projection of the second stepped hole is located within the orthographic projection region of the first stepped hole, and the orthographic projection symmetry axis of the second stepped hole coincides with the orthographic projection symmetry axis of the first stepped hole.
[0013] In one possible implementation, the first stepped hole includes at least a first cross section and a second cross section, the second cross section being located on the side of the first cross section closer to the flexible adhesive, and the area of the second cross section being less than or equal to the area of the first cross section;
[0014] And / or, the second stepped hole includes at least a third cross section and a fourth cross section, the fourth cross section being located on the side of the third cross section closer to the flexible adhesive, and the area of the fourth cross section being less than or equal to the area of the third cross section.
[0015] In one possible implementation, the protective platen also has a first through hole, a second through hole, and a third through hole;
[0016] The first through hole is located at the axial center of the protective plate pressing sheet, and the first through hole is formed by the inner peripheral walls of multiple pressing sheet components; the second through hole and the third through hole are arranged circumferentially relative to the first through hole;
[0017] The tablet compression unit is also provided with a boss portion, which is provided around the circumferential edge of the first through hole, the second through hole and the third through hole, and the boss portion is provided on the side of the tablet compression unit away from the soft adhesive.
[0018] In one possible implementation, the cross-sectional area of the boss gradually decreases axially from the surface of the tablet assembly toward the direction away from the soft adhesive;
[0019] And / or, the boss portion includes an outer peripheral connecting surface, which is angled to the surface of the tablet assembly.
[0020] In one possible implementation, the axial extension height of the boss relative to the tablet body is H, where H satisfies 5 mm ≤ H ≤ 10 mm.
[0021] In one possible implementation, the tableting body is further provided with a groove, which is located on the side of the tableting body close to the boss along the axial direction, and the groove is connected to the first stepped hole.
[0022] In one possible implementation, the protective platen further includes a support member disposed on the side of the platen assembly near the soft adhesive component.
[0023] A second aspect of this application provides a single crystal furnace, comprising: a single crystal furnace body, and a protective platen as described above.
[0024] The protective plate provided in this application embodiment, by setting a first stepped hole and a second stepped hole in the gap between the segments of the protective plate, limits the influence range of the airflow to a relatively small area, thus preventing soft adhesives from being blown up over a large area. The cross-sectional area of the first stepped hole is larger than that of the second stepped hole. When the airflow passes through the second stepped hole and the first stepped hole sequentially from below the protective plate, the pressure in the first stepped hole is greater than that in the second stepped hole, thereby reducing the possibility of soft adhesives being blown up under the action of airflow, ensuring the cleanliness inside the single crystal furnace, and thus improving the growth quality of single crystals.
[0025] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the protective plate pressing and single crystal furnace provided by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific implementation. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 A perspective view of the assembled multiple pressing pieces of the protective platen provided in this application embodiment, wherein no grooves are formed on the pressing pieces;
[0028] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle;
[0029] Figure 3 for Figure 1 A three-dimensional view of a single tablet compression unit in the central protective disc tableting unit;
[0030] Figure 4 for Figure 3 A magnified view of a portion of point B in the middle;
[0031] Figure 5 for Figure 1 A top view of the assembled tablet press components of the central protective disc tablet press;
[0032] Figure 6 for Figure 5 A sectional view of section C-C;
[0033] Figure 7 for Figure 6 A magnified view of a portion at point D, where both the first and second stepped holes have constant cross-sections;
[0034] Figure 8 The first and second stepped holes of the protective platen provided in the embodiments of this application are longitudinal cross-sectional views, wherein both the first and second stepped holes are variable cross-sections.
[0035] Figure 9 for Figure 6 A magnified view of a portion of point E in the middle;
[0036] Figure 10 A top view of the multiple pressing pieces of the protective platen provided in this embodiment of the application after assembly, wherein the pressing pieces are provided with grooves;
[0037] Figure 11 An exploded view of the protective disc pressing sheet provided in the embodiments of this application;
[0038] Figure 12 for Figure 11 A three-dimensional view of the support components for the middle protective plate pressing.
[0039] Explanation of reference numerals in the attached figures:
[0040] 10-Tablet compression unit; 101-First stepped hole; 102-Second stepped hole; 103-First through hole; 104-Second through hole; 105-Third through hole; 106-Groove;
[0041] 11-target surface; 111-first concave portion; 112-second concave portion;
[0042] 12-Boss; 121-Outer peripheral connecting surface;
[0043] 20 - Support component; 201 - Fourth through hole; 202 - Fifth through hole; 203 - Sixth through hole. Detailed Implementation
[0044] First, those skilled in the art should understand that these embodiments are merely for explaining the technical principles of this application and are not intended to limit the scope of protection of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.
[0045] Secondly, it should be noted that, in the description of the embodiments of this application, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.
[0046] As described in the background section, the single crystal furnace in the related technology has the problem that the soft and sticky material under the protective plate is easily blown up. The inventors have found that the reason for this problem is that the pores of the protective plate are relatively large. Under the action of airflow, the soft and sticky material under the protective plate is easily blown up, affecting the cleanliness inside the single crystal furnace and thus affecting the growth quality of the single crystal.
[0047] To address the aforementioned technical problems, this application provides a protective plate pressing and a single crystal furnace. The protective plate pressing includes: multiple pressing segments circumferentially spliced together; each pressing segment has a target surface on both circumferential sides; a first recess and a second recess are provided on the target surface; the target surfaces of two adjacent pressing segments are fitted together, the first recesses of two adjacent pressing segments enclose a first stepped hole, and the second recesses of two adjacent pressing segments enclose a second stepped hole, which is connected to the first stepped hole; the cross-sectional area of the first stepped hole is larger than the cross-sectional area of the second stepped hole, and the second stepped hole is located on the side of the pressing segment closer to the soft adhesive. By setting a first and a second stepped hole in the gap between the segments of the protective plate, the influence range of the airflow is limited to a relatively small area, preventing soft adhesive from being blown up over a large area. The cross-sectional area of the first stepped hole is larger than that of the second stepped hole. When the airflow passes through the second and first stepped holes sequentially from below the protective plate, the pressure in the first stepped hole is greater than that in the second stepped hole. This reduces the possibility of soft adhesive being blown up by the airflow, ensuring the cleanliness inside the single crystal furnace and thus improving the growth quality of the single crystal.
[0048] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0049] Please refer to Figures 1-12 The first aspect of this application provides a protective disc press, comprising:
[0050] Multiple tableting units (10) are joined together circumferentially.
[0051] The tablet compression body 10 has target surfaces 11 on both circumferential sides; the target surfaces 11 are provided with a first recess 111 and a second recess 112;
[0052] The target surfaces 11 of two adjacent tableting parts 10 are fitted together. The first recess 111 of the two adjacent tableting parts 10 surrounds to form a first stepped hole 101. The second recess 112 of the two adjacent tableting parts 10 surrounds to form a second stepped hole 102. The second stepped hole 102 is connected to the first stepped hole 101.
[0053] The cross-sectional area of the first stepped hole 101 is larger than that of the second stepped hole 102. The second stepped hole 102 is located on the side of the tablet body 10 close to the soft adhesive.
[0054] It should be noted that the flexible bonding element is the core insulation structure of the single crystal furnace's thermal field system. Its low thermal conductivity, high temperature resistance, and flexibility are crucial for improving crystal quality and reducing energy consumption. Located below the protective platen, the flexible bonding element reduces heat loss to the furnace bottom; however, under prolonged high-temperature conditions, it is prone to loosening and peeling. During operation, the argon gas blowing causes the flexible bonding element below to flow. In related technologies, due to the relatively large pores in the protective platen, the flexible bonding element below the platen is easily blown upwards by the airflow.
[0055] In this embodiment of the application, please refer to Figure 3 As shown, Figure 3 The three-dimensional structure of a single tablet compression unit 10 is shown. Please refer to it together. Figure 1 As shown, multiple tablet compression units are joined together in 10 circumferential rings to form a disc structure; please refer to [link / reference]. Figure 3 and Figure 4 As shown, the target surface 11 is located on both sides of the circumference of each tableting component 10, and each target surface 11 is provided with a first recess 111 and a second recess 112. After the multiple tableting components 10 are spliced together around the circumference, the target surfaces 11 of two adjacent tableting components 10 are fitted together to reduce the gap between the tableting components. The first recess 111 of two adjacent tableting components 10 surrounds to form a first stepped hole 101, and the second recess 112 of two adjacent tableting components 10 surrounds to form a second stepped hole 102. The first stepped hole 101 and the second stepped hole 102 are connected, wherein the second stepped hole 102 is located on the side of the tableting component 10 close to the soft adhesive.
[0056] By setting a first stepped hole 101 and a second stepped hole 102 in the gap between the segments of the protective plate pressing sheet, the influence range of the airflow is limited to a relatively small area, thus preventing soft adhesive from being blown up over a large area. The cross-sectional area of the first stepped hole 101 is larger than that of the second stepped hole 102. When the airflow passes through the second stepped hole 102 and the first stepped hole 101 sequentially from below the protective plate pressing sheet, the pressure in the first stepped hole 101 is greater than the pressure in the second stepped hole 102. This reduces the possibility of soft adhesive being blown up under the action of airflow, ensuring the cleanliness inside the single crystal furnace and thus improving the growth quality of the single crystal.
[0057] Furthermore, by providing a first stepped hole 101 and a second stepped hole 102, when silicon leakage occurs, the molten silicon can flow into the first stepped hole 101. Since the cross-sectional area of the first stepped hole 101 is larger than that of the second stepped hole 102, the first stepped hole 101 can temporarily store the molten silicon. Then, the molten silicon enters the second stepped hole 102 through the first stepped hole 101 and flows to the bottom of the protective platen through the second stepped hole 102, thereby preventing the molten silicon from flowing around and causing contamination inside the single crystal furnace.
[0058] In one possible implementation, please see Figure 4 As shown, the first recess 111 and the second recess 112 have a radially extending length along the tablet body 10; please refer to them together. Figure 2 As shown, the first stepped hole 101 and the second stepped hole 102 extend radially to form a strip-shaped hole.
[0059] In this embodiment, the first recess 111 and the second recess 112 extend radially along the pressing body 10. After two adjacent pressing bodies 10 are spliced together, the first stepped hole 101 and the second stepped hole 102 can form a strip-shaped hole. The strip-shaped hole extends along the gap between the segments of the protective plate pressing body, thereby increasing the flow area of the first stepped hole 101 and the second stepped hole 102 without increasing the width of the gap between the protective plate pressing body. In the event of silicon leakage, the molten silicon can flow quickly to the bottom of the protective plate pressing body, avoiding the accumulation of molten silicon on the surface of the protective plate pressing body, and thus preventing the molten silicon from contaminating or even damaging other components inside the single crystal furnace.
[0060] In one possible implementation, please see Figure 7 As shown, along the axial direction, the orthographic projection of the second stepped hole 102 is located within the orthographic projection area of the first stepped hole 101, and the orthographic projection symmetry axis of the second stepped hole 102 coincides with the orthographic projection symmetry axis of the first stepped hole 101.
[0061] In this embodiment, the orthographic projection symmetry axis of the second stepped hole 102 coincides with the orthographic projection symmetry axis of the first stepped hole 101, so that the second stepped hole 102 is located in the central region of the first stepped hole 101, which helps to reduce local turbulence disturbance when airflow passes through, and at the same time helps to ensure assembly accuracy.
[0062] In one possible implementation, please see Figure 8 As shown, the first stepped hole 101 includes at least a first cross section and a second cross section. The second cross section is located on the side of the first cross section close to the flexible adhesive. The area of the second cross section is less than or equal to the area of the first cross section, so that the first stepped hole 101 forms a V-shaped cross section.
[0063] And / or, the second stepped hole 102 includes at least a third cross section and a fourth cross section, the fourth cross section being located on the side of the third cross section closer to the flexible adhesive, and the area of the fourth cross section being less than or equal to the area of the third cross section, so that the second stepped hole 102 forms a V-shaped cross section.
[0064] In this embodiment, the cross-sectional area of the first stepped hole 101 is larger than that of the second stepped hole 102. The first stepped hole 101 and the second stepped hole 102 adopt a V-shaped cross-section, which helps to reduce local turbulence disturbance when the airflow passes through, and further reduces the possibility of soft sticky material being blown up by the airflow.
[0065] In one possible implementation, please see Figure 1 As shown, the protective plate also has a first through hole 103, a second through hole 104 and a third through hole 105;
[0066] The first through hole 103 is located at the axial center of the protective plate pressing sheet. The first through hole 103 is formed by the inner peripheral walls of multiple pressing sheet parts 10. The second through hole 104 and the third through hole 105 are arranged circumferentially relative to the first through hole 103.
[0067] Please combine them together Figure 3 As shown, the tablet body 10 is also provided with a boss portion 12. The boss portion 12 is provided around the circumferential edge of the first through hole 103, the second through hole 104 and the third through hole 105. The boss portion 12 is located on the side of the tablet body 10 away from the soft adhesive.
[0068] It should be noted that the first through hole 103 can be used as a support rod hole for the single crystal furnace, the second through hole 104 can be used as a gas guide hole for the single crystal furnace, and the third through hole 105 can be used as an electrode hole for the single crystal furnace.
[0069] In this embodiment, by providing a boss 12 on the circumferential edge of the first through hole 103, the second through hole 104, and the third through hole 105, when the single crystal furnace is operating normally, the boss 12 can strengthen and protect the area around the first through hole 103, the second through hole 104, and the third through hole 105. Once silicon leakage occurs, due to the presence of the boss 12, the molten silicon will be blocked by the boss 12, and the molten silicon cannot flow directly from the inside of the first through hole 103, the second through hole 104, and the third through hole 105. Instead, it slides down the outer periphery of the boss 12 onto the surface of the protective plate. When the molten silicon enters the first stepped hole 101, the first stepped hole 101 can store the molten silicon and allow the molten silicon to flow down along the second stepped hole 102, thereby preventing the molten silicon from flowing around and causing pollution to the inside of the single crystal furnace. Meanwhile, under the action of airflow, because the gaps of the protective plate pressing sheet are divided by the first step hole 101 and the second step hole 102, the influence range of the airflow is limited to a relatively small area, and the soft and sticky material is not easily blown up over a large area, thus maintaining the relative cleanliness inside the single crystal furnace, which is conducive to the stable growth of single crystals.
[0070] Furthermore, the boss portion 12 and the tablet pressing body 10 are integrally formed.
[0071] In this embodiment, the boss portion 12 on the circumferential edge of the first through hole 103 can also replace the upper half of the support rod sleeve, shortening the length of the support rod sleeve and reducing costs.
[0072] In one possible implementation, please see Figure 9 As shown, along the axial direction from the surface of the pressing body 10 toward the direction away from the soft adhesive, the cross-sectional area of the boss portion 12 gradually decreases;
[0073] And / or, the boss portion 12 includes an outer peripheral connecting surface 121, which is angled to the surface of the tablet body 10.
[0074] In this embodiment, the boss portion 12 has a conical structure. The outer peripheral connecting surface 121 of the boss portion 12 forms a certain slope with the surface of the pressing body 10. When silicon leakage occurs, the molten silicon can slide down the outer peripheral connecting surface 121 of the boss portion 12 to the surface of the pressing body. After the molten silicon enters the first stepped hole 101, the first stepped hole 101 can store the molten silicon and allow the molten silicon to flow down the second stepped hole 102, thus avoiding the accumulation of molten silicon on the surface of the boss portion 12. This effectively prevents the molten silicon from flowing out directly from the inside of the first through hole 103, the second through hole 104 and the third through hole 105.
[0075] In one possible implementation, please see Figure 9 As shown, the axial extension height of the boss portion 12 relative to the tablet pressing body 10 is H, where H satisfies 5 mm ≤ H ≤ 10 mm.
[0076] In this embodiment, the axial extension height H of the boss portion 12 relative to the pressing body 10 satisfies 5 mm ≤ H ≤ 10 mm, thereby ensuring that the boss portion 12 has sufficient height to block the molten silicon and effectively prevent the molten silicon from flowing out directly from the inside of the first through hole 103, the second through hole 104 and the third through hole 105.
[0077] Furthermore, depending on actual needs and process requirements, the extension height of the boss portion 12 can be 5mm, 6.5mm, 7mm, 8.5mm, or 10mm.
[0078] In one possible implementation, please see Figure 10 As shown, a groove 106 is also provided on the tablet compression body 10. The groove 106 is located on the side of the tablet compression body 10 close to the boss part 12 along the axial direction. The groove 106 is connected to the first stepped hole 101.
[0079] In this embodiment, by creating a groove 106 on the pressing body 10, the groove 106 is connected to the first stepped hole 101. When silicon leakage occurs, due to the presence of the boss 12, the molten silicon will be blocked by the boss 12. The molten silicon cannot flow directly out from the inside of the first through hole 103, the second through hole 104 and the third through hole 105. Instead, it slides down the outer periphery of the boss 12 onto the surface of the pressing plate and can flow into the groove 106 for storage. Then, it flows into the first stepped hole 101 along the groove 106. After entering the first stepped hole 101, the molten silicon can be stored and then flows down along the second stepped hole 102, thereby avoiding the molten silicon flowing everywhere and causing pollution to the inside of the single crystal furnace.
[0080] In one possible implementation, please see Figure 11 As shown, the protective plate press also includes a support member 20, which is located on the side of the press body 10 near the soft adhesive.
[0081] In this embodiment, the support member 20 is an integral disc structure with multiple tablet pressing parts 10 spliced together around the periphery. The support member 20 is located below the tablet pressing parts 10 and can support and position the multiple tablet pressing parts 10.
[0082] Further, please see Figure 12 As shown, the support member 20 is provided with a fourth through hole 201, a fifth through hole 202 and a sixth through hole 203; the fourth through hole 201 and the first through hole 103 are arranged opposite each other along the axial direction, and the fourth through hole 201 and the first through hole 103 are arranged coaxially with the support rod; the fifth through hole 202 and the second through hole 104 are arranged opposite each other along the axial direction; the sixth through hole 203 and the third through hole 105 are arranged opposite each other along the axial direction.
[0083] A second aspect of this application also provides a single crystal furnace, including: a single crystal furnace body, and a protective platen as described above.
[0084] Given that the single crystal furnace in this embodiment includes the protective plate pressing structure and beneficial effects described in any of the above embodiments, the single crystal furnace includes the protective plate pressing structure and beneficial effects, which will not be elaborated further in this embodiment.
[0085] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.
[0086] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.
[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A shield tablet characterized by, include: Multiple tableting units (10) are circumferentially spliced together; The tablet compression unit (10) has target surfaces (11) on both circumferential sides; the target surfaces (11) are provided with a first recess (111) and a second recess (112); The target surfaces (11) of two adjacent tableting components (10) are fitted together, and the first recesses (111) of the two adjacent tableting components (10) form a first stepped hole (101), and the second recesses (112) of the two adjacent tableting components (10) form a second stepped hole (102), and the second stepped hole (102) is connected to the first stepped hole (101); The cross-sectional area of the first stepped hole (101) is larger than that of the second stepped hole (102), and the second stepped hole (102) is located on the side of the tablet body (10) near the soft adhesive.
2. The shield tablet of claim 1, wherein, The first recess (111) and the second recess (112) have a radially extending length along the tablet body (10); the first stepped hole (101) and the second stepped hole (102) extend radially to form a strip-shaped hole.
3. The shield tablet of claim 1, wherein, Along the axial direction, the orthographic projection of the second stepped hole (102) is located within the orthographic projection area of the first stepped hole (101), and the orthographic projection symmetry axis of the second stepped hole (102) coincides with the orthographic projection symmetry axis of the first stepped hole (101).
4. The shield tablet of claim 1, wherein, The first stepped hole (101) includes at least a first cross section and a second cross section, the second cross section being located on the side of the first cross section closer to the flexible adhesive, and the area of the second cross section being less than or equal to the area of the first cross section; And / or, the second stepped hole (102) includes at least a third cross section and a fourth cross section, the fourth cross section being located on the side of the third cross section closer to the flexible adhesive, and the area of the fourth cross section being less than or equal to the area of the third cross section.
5. The tablet shield of any one of claims 1-4, wherein, The protective plate also has a first through hole (103), a second through hole (104) and a third through hole (105); The first through hole (103) is located at the axial center of the protective plate pressing sheet, and the first through hole (103) is formed by the inner peripheral walls of multiple pressing sheet segments (10); the second through hole (104) and the third through hole (105) are arranged circumferentially relative to the first through hole (103); The tablet pressing body (10) is also provided with a boss (12), which is arranged around the circumferential edge of the first through hole (103), the second through hole (104) and the third through hole (105). The boss (12) is located on the side of the tablet pressing body (10) away from the soft adhesive.
6. The shield tablet of claim 5, wherein, Along the axial direction from the surface of the tablet body (10) away from the soft adhesive, the cross-sectional area of the boss portion (12) gradually decreases; And / or, the boss portion (12) includes an outer peripheral connecting surface (121), which is angled to the surface of the tablet body (10).
7. The shield tablet of claim 5, wherein, The axial extension height of the boss portion (12) relative to the tablet body (10) is H, where H satisfies 5 mm ≤ H ≤ 10 mm.
8. The shield tablet of claim 5, wherein, The tablet compression body (10) is also provided with a groove (106), which is located on the side of the tablet compression body (10) along the axial direction close to the boss (12), and the groove (106) is connected to the first stepped hole (101).
9. The shield tablet of claim 5, wherein, The protective plate also includes a support member (20), which is located on the side of the plate split (10) near the soft adhesive.
10. A single crystal furnace characterized by comprising: include: The single crystal furnace body, and the protective plate pressing sheet as described in any one of claims 1 to 9 above.