Jig for testing semiconductor chip

Abstract

A jig for testing a semiconductor chip comprises a fixing base, a jig body is fixedly connected to the upper side wall of the fixing base, a cover body is arranged on the jig body, an installation groove is formed in the jig body, a testing socket is arranged in the installation groove, and limiting grooves are formed in the two sides of the lower side wall of the installation groove respectively. The two sides of the bottom wall of the test socket are fixedly connected with installation blocks matched with the limiting grooves respectively, a quick replacement mechanism is arranged on the jig, and a heat dissipation mechanism is arranged on one side wall of the jig. Compared with the prior art, the test socket has the advantages that through the arrangement of the rapid replacement mechanism, the test socket can be replaced without using bolts, and the replacement can be completed by an operator through simple operation. According to the design, the replacement time is greatly shortened, and the chip testing efficiency is improved; by arranging the heat dissipation mechanism, the temperature of the chip in the testing process can be effectively reduced, it is ensured that the chip is tested under the condition that the temperature is close to the actual working temperature, and therefore the precision and reliability of the testing result are greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of chip testing fixture technology, and in particular to a semiconductor chip testing fixture. Background Technology

[0002] Chips work based on the physical properties of semiconductor materials, integrating electronic components onto a small semiconductor wafer through specific manufacturing processes. The main steps include design, manufacturing, and packaging. Chips can perform specific functions, such as data processing, signal amplification, and information storage, and are widely used in computers, communications, consumer electronics, industrial control, automotive electronics, and medical devices. Chip testing fixtures are tools used to test and verify the performance of semiconductor chips, ensuring that the chips meet design requirements and quality standards during the manufacturing process.

[0003] In existing semiconductor chip testing technologies, test sockets on fixtures are typically secured with four bolts. When testing different chip models, operators must first remove the four bolts, detach the current test socket, select the appropriate test socket for the new chip model, install it on the base, and finally retighten the four bolts. This traditional fixing method is not only cumbersome but also time-consuming, severely impacting testing efficiency. Furthermore, fixtures usually lack heat dissipation capabilities. When chips undergo high-load testing, the relatively enclosed space generates a significant amount of heat, causing the chip temperature to rise rapidly. This high-temperature environment not only affects chip performance but can also lead to deviations in test results or even chip damage. Therefore, traditional fixtures suffer from significant heat dissipation deficiencies during chip testing and urgently require improvement. Utility Model Content

[0004] The main objective of this invention is to provide a semiconductor chip testing fixture that can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a semiconductor chip testing fixture, including a fixed base, a fixture fixedly connected to the upper side wall of the fixed base, a cover provided on the fixture, an installation groove inside the fixture, a test socket provided in the installation groove, limit grooves respectively opened on both sides of the lower side wall of the installation groove, and mounting blocks adapted to the limit grooves respectively fixedly connected to both sides of the bottom wall of the test socket, a quick replacement mechanism provided on the fixture, and a heat dissipation mechanism provided on one side wall of the fixture.

[0006] As a further description of the above technical solution, the quick-change mechanism includes a first cavity, a first piston, a second cavity, a connecting cavity, a second piston, a positioning pin, a spring, and a pressing rod. The front side wall of the fixture has a first cavity, and the first piston is provided in the first cavity. The two limiting grooves are each provided with a second cavity on their respective side walls. The rear side wall of the first cavity is connected to the second cavity through a connecting cavity. The second piston is provided in the second cavity. A positioning pin is fixedly connected to the side wall of the second piston near the limiting groove. A spring is provided between the side wall of the second piston near the limiting groove and the second cavity. The front end of the first piston is fixedly connected to a pressing rod.

[0007] As a further description of the above technical solution, the heat dissipation mechanism includes a heat dissipation box, a fan, an electrocooling chip, heat dissipation fins, and a radiator. The heat dissipation box is fixedly connected to one side wall of the fixture. A fan is installed on one inner side wall of the heat dissipation box. An electrocooling chip is installed on the rear side wall of the heat dissipation box. Heat dissipation fins are installed on the cold side of the electrocooling chip, and a radiator is installed on the hot side.

[0008] As a further description of the above technical solution, a limiting rod is slidably inserted at the front end of the pressing rod, and a slot for inserting the limiting rod is provided at the front of the upper side wall of the fixed base.

[0009] As a further description of the above technical solution, each of the two mounting blocks has a pin hole on one of its side walls that is far apart from each other, into which a positioning pin can be inserted.

[0010] As a further description of the above technical solution, a dustproof mesh is embedded on one side wall of the heat sink.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] 1. The quick-change mechanism eliminates the need for bolts when replacing test sockets, allowing operators to complete the replacement with simple operations. This design significantly reduces replacement time and improves chip testing efficiency.

[0013] 2. The heat dissipation mechanism effectively reduces the chip temperature during testing, ensuring that the chip is tested under conditions close to its actual operating temperature, thereby significantly improving the accuracy and reliability of the test results. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of a semiconductor chip testing fixture according to the present invention;

[0015] Figure 2 This is a schematic diagram of the mounting slot structure of a semiconductor chip testing fixture according to the present invention;

[0016] Figure 3 This is a cross-sectional view of a semiconductor chip testing fixture according to the present invention;

[0017] Figure 4 This is an enlarged view of point A of a semiconductor chip testing fixture according to this utility model;

[0018] Figure 5 This is a schematic diagram of the limiting rod structure of a semiconductor chip testing fixture according to the present invention;

[0019] Figure 6 This is a cross-sectional view of the mounting groove of a semiconductor chip testing fixture according to the present invention;

[0020] Figure 7 This is a schematic diagram of the heat sink structure of a semiconductor chip testing fixture according to the present invention;

[0021] In the diagram: 1. Fixture; 2. Fixture; 21. Cover; 3. Mounting slot; 4. Test socket; 31. Limiting slot; 41. Mounting block; 5. Quick replacement mechanism; 6. Heat dissipation mechanism; 51. First cavity; 52. First piston; 53. Second cavity; 54. Connecting cavity; 55. Second piston; 56. Positioning pin; 57. Spring; 58. Pressing rod; 61. Heat dissipation box; 62. Fan; 63. Electrothermal cooling element; 64. Heat dissipation fins; 65. Radiator; 581. Limiting rod; 11. Slot; 611. Dustproof net. Detailed Implementation

[0022] To make the technical means, creative features, and objectives of this utility model easier to understand, the following describes this utility model in conjunction with specific embodiments.

[0023] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] Please see Figure 1-7 This utility model provides a semiconductor chip testing fixture, including a fixed base 1, a fixture 2 fixedly connected to the upper side wall of the fixed base 1, a cover 21 on the fixture 2, an installation groove 3 inside the fixture 2, a test socket 4 inside the installation groove 3, limit grooves 31 respectively opened on both sides of the lower side wall of the installation groove 3, and mounting blocks 41 adapted to the limit grooves 31 respectively fixedly connected to both sides of the bottom wall of the test socket 4, a quick replacement mechanism 5 on the fixture 2, and a heat dissipation mechanism 6 on one side wall of the fixture 2.

[0026] Specifically, such as Figure 3 and Figure 4As shown, a semiconductor chip testing fixture includes a quick-change mechanism 5 comprising a first cavity 51, a first piston 52, a second cavity 53, a connecting cavity 54, a second piston 55, a positioning pin 56, a spring 57, and a pressing rod 58. The fixture 2 has a first cavity 51 on its front sidewall, within which the first piston 52 is located. Two second cavities 53 are formed on the sidewalls of the two limiting grooves 31 that are far apart from each other. The rear sidewall of the first cavity 51 is connected to the second cavity 53 via a connecting cavity 54. A second piston 55 is located within the second cavity 53. A positioning pin 56 is fixedly connected to the sidewall of the second piston 55 near the limiting groove 31. A spring 57 is provided between the sidewall of the second piston 55 near the limiting groove 31 and the second cavity 53. A pressing rod 58 is fixedly connected to the front end of the first piston 52. When the test socket 4 needs to be replaced, the limiting rod 58 is pulled upwards. 81, causing it to disengage from the slot 11 on the fixed base 1. After losing the limit of the limit rod 581, the spring 57 pushes the second piston 55 to move. The movement of the second piston 55 will cause the positioning pin 56 to disengage from the pin hole on the mounting block 41, releasing the positioning of the mounting block 41. At the same time, under the push of the airflow, the first piston 52 moves forward to reset. Then, the test socket 4 can be removed from the mounting groove 3 to complete the disassembly. When installing a new test socket 4, the test socket 4 is placed in the mounting groove 3. The mounting block 41 will be inserted into the limit groove 31. Then, push the pressing rod 58. The pressing rod 58 pushes the first piston 52 to move backward. When the first piston 52 moves backward, the airflow enters the second groove cavity 53 through the connecting cavity 54. The second piston 55 will be pushed by the air pressure to move closer to the mounting block 41, so that the positioning pin 56 is inserted into the pin hole, fixing the mounting block 41 in the limit groove 31, thus completing the installation of the test socket 4.

[0027] Specifically, such as Figure 6 and Figure 7 As shown, a semiconductor chip testing fixture includes a heat dissipation mechanism 6 comprising a heat sink 61, a fan 62, an electrocooler 63, heat dissipation fins 64, and a heat sink 65. The heat sink 61 is fixedly connected to one side wall of the fixture 2. The fan 62 is installed on one inner side wall of the heat sink 61, and the electrocooler 63 is installed on the rear side wall of the heat sink 61. Heat dissipation fins 64 are installed on the cold side of the electrocooler 63, and the heat sink 65 is installed on the hot side. During testing, the heat dissipation fins 64 cool the inside of the heat sink 61 under the action of the electrocooler 63. The fan 62 draws outside air into the heat sink 61, performs heat exchange, and then blows cold air into the fixture 2 to dissipate heat from the test chip, reducing its temperature during testing and ensuring that the chip is tested under conditions close to its actual operating temperature. This significantly improves the accuracy and reliability of the test results. The heat sink 65 is used to dissipate heat from the hot side of the electrocooler 63. The heat sink 65 is existing technology, and its structure and principle will not be described in detail here.

[0028] Specifically, such as Figure 5As shown, a semiconductor chip testing fixture has a limiting rod 581 slidably inserted into the front end of the pressing rod 58. A slot 11 is provided in front of the upper side wall of the fixing base 1 for the limiting rod 581 to be inserted. After the limiting rod 581 is inserted into the slot 11, it can limit the pressing rod 58, so that the first piston 52 will not reset after the test socket 4 is positioned.

[0029] Specifically, such as Figure 2 As shown, a semiconductor chip testing fixture has pin holes on the side walls of two mounting blocks 41 that are far apart from each other, into which positioning pins 56 can be inserted.

[0030] Specifically, such as Figure 7 As shown, a semiconductor chip testing fixture has a dustproof mesh 611 embedded on one side wall of the heat sink 61, which can filter the air entering the heat sink 61 and prevent dust from affecting the test chip.

[0031] It should be noted that this utility model is a semiconductor chip testing fixture. When the test socket 4 needs to be replaced, pull up the limiting rod 581 to disengage it from the slot 11 on the fixing base 1. After the limiting rod 581 is released, the spring 57 pushes the second piston 55 to move. The movement of the second piston 55 will cause the positioning pin 56 to disengage from the pin hole on the mounting block 41, releasing the positioning of the mounting block 41. At the same time, under the push of the airflow, the first piston 52 moves forward to reset. Then, the test socket 4 can be removed from the mounting slot 3 to complete the disassembly. When installing a new test socket 4, place the test socket 4 into the mounting slot 3. The mounting block 41 will be inserted into the limiting slot 31. Then push the pressing rod 58. The pressing rod 58 pushes the first piston 52 to move backward. When the first piston 52 moves backward, the airflow enters the second slot cavity 53 through the connecting cavity 54. The second piston 55 will... Driven by air pressure, the chip moves closer to the mounting block 41, causing the positioning pin 56 to insert into the pin hole, fixing the mounting block 41 in the limiting groove 31, thus completing the installation of the test socket 4. Then, the limiting rod 581 is inserted into the slot 11 to limit the pressing rod 58 and prevent the first piston 52 from resetting. Then, the chip is placed on the test socket 4, and the cover 21 is closed for testing. This is a mature existing technology, so it will not be described in detail here. During the test, under the action of the electrothermal cooling chip 63, the heat sink 64 will cool the heat sink 61. The fan 62 draws outside air into the heat sink 61 for heat exchange and then blows it into the fixture 2 to dissipate heat from the test chip, reducing the chip temperature during the test and ensuring that the chip is tested under conditions close to the actual operating temperature, thereby greatly improving the accuracy and reliability of the test results.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip testing jig, comprising a fixing base (1), a jig (2) is fixedly connected to the upper side wall of the fixing base (1), and a cover (21) is arranged on the jig (2), characterized in that: The fixture (2) has an installation groove (3) and a test socket (4) in the installation groove (3). Limiting grooves (31) are respectively opened on both sides of the lower side wall of the installation groove (3). Mounting blocks (41) that are compatible with the limiting grooves (31) are respectively fixedly connected to both sides of the bottom wall of the test socket (4). The fixture (2) is provided with a quick replacement mechanism (5). A heat dissipation mechanism (6) is provided on one side wall of the fixture (2).

2. The semiconductor chip testing fixture of claim 1, wherein: The quick-change mechanism (5) includes a first cavity (51), a first piston (52), a second cavity (53), a connecting cavity (54), a second piston (55), a positioning pin (56), a spring (57), and a pressing rod (58). The front side wall of the fixture (2) has a first cavity (51), and a first piston (52) is provided in the first cavity (51). A second cavity (53) is provided on the side wall of each of the two limiting grooves (31) that are far apart from each other. The rear side wall of the first cavity (51) is connected to the second cavity (53) through a connecting cavity (54). A second piston (55) is provided in the second cavity (53). A positioning pin (56) is fixedly connected to the side wall of the second piston (55) near the limiting groove (31). A spring (57) is provided between the side wall of the second piston (55) near the limiting groove (31) and the second cavity (53). A pressing rod (58) is fixedly connected to the front end of the first piston (52).

3. The semiconductor chip testing fixture of claim 1, wherein: The heat dissipation mechanism (6) includes a heat dissipation box (61), a fan (62), an electric cooling plate (63), heat dissipation fins (64), and a radiator (65). The heat dissipation box (61) is fixedly connected to one side wall of the fixture (2). The fan (62) is installed on one side inner wall of the heat dissipation box (61). The electric cooling plate (63) is installed on the rear side wall of the heat dissipation box (61). The cold side of the electric cooling plate (63) is equipped with heat dissipation fins (64), and the hot side is equipped with a radiator (65).

4. The semiconductor chip testing fixture of claim 2, wherein: The front end of the pressing rod (58) is slidably inserted with a limiting rod (581), and the upper side wall of the fixing seat (1) is provided with a slot (11) for the limiting rod (581) to be inserted.

5. The semiconductor chip testing fixture of claim 2, wherein: Both mounting blocks (41) have pin holes on their opposite side walls for inserting positioning pins (56).

6. The semiconductor chip testing fixture of claim 3, wherein: A dustproof mesh (611) is embedded on one side wall of the heat sink (61).

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