Temperature control device and optical module

Abstract

The utility model relates to the technical field of optical communication, in particular to a temperature control device and an optical module, the actual temperature of a temperature control device is obtained through a thermosensitive unit, and a comparison circuit outputs a voltage regulation signal according to a voltage signal corresponding to the actual temperature and a preset voltage. The boost-buck chip generates a driving voltage of the TEC unit according to the voltage regulation signal so as to drive the TEC unit to refrigerate or heat the temperature control device, the temperature of the temperature control device is controlled by controlling the TEC unit, the working stability of the temperature control device is ensured, and the whole temperature control device is simple, reliable, small in size and convenient to use. Cost is low and adjustment is convenient. And meanwhile, the driving voltage required by the TEC unit is generated by using a conventional boost-buck chip, so that the use of a special temperature control chip is avoided, the circuit cost is reduced, the size is reduced, and the circuit reliability is improved.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to a temperature control device and an optical module. Background Technology

[0002] In the field of optical communication, optical transmitting devices and optical receiving devices are widely used. Optical transmitting devices are used for electro-optical conversion, while optical receiving devices are used for photoelectric conversion. Optical transmitting devices mainly use various types of laser products, while optical receiving devices mainly use various types of photodiodes. To ensure device performance, in most practical applications, lasers and photodiodes require temperature control using a Thermo Electric Cooler (TEC) to keep the die temperature of the devices within a certain range, thereby meeting the requirements of a full-temperature application environment.

[0003] Currently, most TECs use integrated dedicated temperature control chips for their temperature control circuits, which results in high overall costs and complex peripheral circuits.

[0004] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Utility Model Content

[0005] The technical problem to be solved by this invention is how to solve the problem that the overall structure is more complicated in the existing technology by designing the temperature control circuit corresponding to TEC by integrating a dedicated temperature control chip.

[0006] The present invention adopts the following technical solution:

[0007] In a first aspect, a temperature control device is provided, comprising: a comparator circuit, a buck-boost chip, and a temperature control module; the temperature control module includes a TEC unit and a thermistor unit; the TEC unit and the thermistor unit are respectively disposed in contact with the temperature control device;

[0008] One end of the thermistor is grounded, and the other end of the thermistor is connected to one input terminal of the comparator circuit. The other input terminal of the comparator circuit is used to receive a preset voltage.

[0009] The output terminal of the comparator circuit is connected to the input terminal of the buck-boost chip, and the output terminal of the buck-boost chip is connected to the positive and negative terminals of the TEC unit, respectively.

[0010] Preferably, the comparison circuit includes a proportional unit, an integral unit, and a differential unit;

[0011] One input terminal of the proportional unit is used to receive a preset voltage, and the other input terminal of the proportional unit is connected to one end of the thermistor unit.

[0012] The output of the proportional unit is connected to the input of the integral unit, the output of the integral unit is connected to the input of the differential unit, and the output of the differential unit is connected to the input of the buck-boost chip.

[0013] Preferably, the proportional unit includes an input resistor R1, an input resistor R2, a feedback resistor R3, and an operational amplifier U1;

[0014] One end of the input resistor R1 is used to receive a preset voltage, and the other end of the input resistor R1 is connected to the non-inverting input terminal of the operational amplifier U1. The non-inverting input terminal of the operational amplifier U1 is also connected to one end of the thermistor.

[0015] One end of the input resistor R2 is grounded, and the other end of the input resistor R2 is connected to the inverting input terminal of the operational amplifier U1;

[0016] The output terminal of the operational amplifier U1 is connected to one end of the feedback resistor R3 and the input terminal of the integration unit, respectively, and the other end of the feedback resistor R3 is connected to the inverting input terminal of the operational amplifier U1.

[0017] Preferably, the integrating unit includes a resistor R4 and a capacitor C1; one end of the resistor R4 is connected to the output terminal of the operational amplifier U1 and one end of the capacitor C1, respectively, and the other end of the resistor R4 is connected to the input terminal of the differentiating unit and the other end of the capacitor C1, respectively.

[0018] Preferably, the differentiating unit includes an operational amplifier U2, a feedback capacitor C2, and an output resistor R5;

[0019] The non-inverting input terminal of the operational amplifier U2 is used to receive the input voltage. The inverting input terminal of the operational amplifier U2 is connected to one end of the resistor R4. One end of the feedback capacitor C2 is connected to the inverting input terminal of the operational amplifier U2, and the other end of the feedback capacitor C2 is connected to the output terminal of the operational amplifier U2.

[0020] One end of the output resistor R5 is connected to the output terminal of the operational amplifier U2, and the other end of the output resistor R5 is connected to the input terminal of the buck-boost chip.

[0021] Preferably, the feedback pin of the buck-boost chip is connected to one end of the output resistor R5, the input pin of the buck-boost chip is connected to the positive terminal of the TEC unit, and the output pin of the buck-boost chip is connected to the negative terminal of the TEC unit.

[0022] Preferably, the input voltage range of the buck-boost chip is 2.7V to 3.6V, and the output voltage range of the buck-boost chip is 1.2V to 5.5V.

[0023] Preferably, the buck-boost chip is model TPS63802.

[0024] Preferably, the thermistor is a thermistor.

[0025] In a second aspect, an optical module is provided, including optical components and a temperature control device as described in the first aspect, wherein the TEC unit and the thermistor unit are respectively disposed in contact with the optical components.

[0026] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0027] This invention obtains the actual temperature of a temperature control device through a thermistor. The comparison circuit outputs a voltage adjustment signal based on the voltage signal corresponding to the actual temperature and a preset voltage. The buck-boost chip generates a driving voltage for the TEC unit based on the voltage adjustment signal, thereby driving the TEC unit to cool or heat the temperature control device and regulate its operating temperature. This ensures the stability of the temperature control device's operation. The entire temperature control device is simple, reliable, small in size, low in cost, and easy to adjust. Furthermore, by using a conventional buck-boost chip to generate the driving voltage required by the TEC unit, the use of a dedicated temperature control chip is avoided, reducing circuit costs, minimizing size, and improving circuit reliability. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the peripheral circuit of a dedicated temperature control chip provided in an embodiment of this utility model;

[0030] Figure 2 This is a schematic diagram of the structure of a temperature control device provided in an embodiment of this utility model;

[0031] Figure 3 This is a schematic diagram of a comparison circuit provided in an embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of a specific structure of a comparison circuit provided in an embodiment of the present invention;

[0033] Figure 5 This is a schematic diagram of the structure of a buck-boost chip provided in an embodiment of this utility model;

[0034] Figure 6 This is a schematic diagram of the specific structure of a buck-boost chip provided in this embodiment of the present invention;

[0035] Figure 7 This is a schematic diagram of the structure of an optical module provided in an embodiment of this utility model. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0037] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as openly inclusive, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples; that is, although they may be incorporated into embodiments or examples using the above terms for reasons such as order and position, it does not limit them to be incorporated in combination by a single embodiment or example.

[0038] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more. Furthermore, for example, the description may use the prefix "A" or "B" to describe the same type of nouns as two independent entities. In this case, the features defined with "A" and "B" are used only to distinguish between similar entities and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0039] In describing some embodiments, the terms "coupled," "coupled," and "connected," and their derivative expressions, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "connected" or "coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other, such as "optical coupling" or "wireless connection." The embodiments disclosed herein are not necessarily limited to the scope of this invention.

[0040] Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0041] Example 1:

[0042] In one embodiment, such as Figure 1 As shown, in the existing technology, most temperature control circuits corresponding to TECs are designed using integrated dedicated temperature control chips. Dedicated temperature control chips are expensive, resulting in high overall cost and complex peripheral circuitry. (Referring to...) Figure 1 TEC+ and TEC- are connected to the positive and negative terminals of the TEC unit, respectively, and D1_TEC is used to receive the corresponding control signals.

[0043] To address the problems of existing technologies, this embodiment proposes a temperature control device. In one embodiment, such as... Figure 2 As shown, it includes: a comparator circuit, a buck-boost chip, and a temperature control module; the temperature control module includes a TEC unit and a thermistor unit; the TEC unit and the thermistor unit are respectively connected in contact with the temperature control device; one end of the thermistor unit is grounded, and the other end of the thermistor unit is connected to one input terminal of the comparator circuit, the other input terminal of the comparator circuit is used to receive a preset voltage; the output terminal of the comparator circuit is connected to the input terminal of the buck-boost chip, and the output terminal of the buck-boost chip is respectively connected to the positive and negative terminals of the TEC unit.

[0044] The temperature control device includes devices such as lasers or photodiodes in the optical module that generate heat during operation and require temperature control.

[0045] The TEC unit can achieve cooling or heating depending on the direction of the incoming current; the thermistor is a temperature-sensitive element that can sense the temperature change of the temperature control device and convert it into an electrical signal. In one embodiment, the thermistor is a thermistor. The TEC unit and the thermistor being in contact with the temperature control device respectively means that the TEC unit is used to directly contact the temperature control device to control its temperature; the thermistor can directly or indirectly contact the temperature control device to obtain its real-time temperature and convert it into a corresponding resistance value.

[0046] The comparison unit is used to determine the difference between the actual temperature and the set temperature. By comparing the set temperature (corresponding to a preset voltage) and the actual temperature (corresponding to the voltage of the thermistor's resistance), it generates the required voltage adjustment signal through its internal circuit structure. The buck-boost chip receives the voltage adjustment signal output by the comparison circuit and adjusts the output drive voltage to the TEC unit according to the voltage adjustment signal. The TEC unit controls the magnitude and direction of the current flowing through the TEC unit according to the drive voltage, thereby controlling the TEC unit to cool or heat the temperature control device, so that the temperature of the temperature control device approaches the set value.

[0047] The overall temperature control device's workflow includes:

[0048] 1. The thermistor is attached to the temperature control device to sense its temperature in real time. As the temperature changes, the resistance of the thermistor changes, which is converted into an electrical signal and transmitted to the comparator circuit.

[0049] 2. The comparator circuit compares the electrical signal from the thermistor with the preset voltage. If the actual temperature is lower than the set temperature, the comparator circuit outputs a voltage adjustment signal to the buck-boost chip, causing the buck-boost chip to heat the TEC unit; if the actual temperature is higher than the set temperature, it controls the TEC unit to cool.

[0050] 3. The buck-boost chip adjusts the output drive voltage to the TEC unit according to the voltage regulation signal. By changing the current magnitude, the cooling or heating intensity can be controlled; by changing the current direction, the cooling or heating mode can be switched, achieving precise temperature control of the temperature controller.

[0051] In one embodiment, such as Figure 3 As shown, the comparison circuit includes a proportional unit, an integral unit, and a differential unit; one input terminal of the proportional unit is used to receive a preset voltage, and the other input terminal of the proportional unit is connected to one end of the thermistor unit; the output terminal of the proportional unit is connected to the input terminal of the integral unit, the output terminal of the integral unit is connected to the input terminal of the differential unit, and the output terminal of the differential unit is connected to the input terminal of the buck-boost chip.

[0052] The comparison circuit can obtain a suitable control quantity (i.e., voltage regulation signal) based on the deviation between the preset voltage (representing the target temperature) and the signal corresponding to the actual temperature fed back by the thermistor unit, through a combination of three control actions: proportional unit, integral unit, and differential unit. This control quantity is then output to the buck-boost chip, thereby precisely adjusting the working state of the TEC unit so that the temperature of the temperature control device reaches and stabilizes at the preset value.

[0053] In one embodiment, such as Figure 4 As shown, the proportional unit includes an input resistor R1, an input resistor R2, a feedback resistor R3, and an operational amplifier U1. One end of the input resistor R1 is used to receive a preset voltage (i.e., V2.5), and the other end of the input resistor R1 is connected to the non-inverting input terminal of the operational amplifier U1. The non-inverting input terminal of the operational amplifier U1 is also connected to one end of the thermistor (i.e., RTH+). One end of the input resistor R2 is grounded, and the other end of the input resistor R2 is connected to the inverting input terminal of the operational amplifier U1. The output terminal of the operational amplifier U1 is connected to one end of the feedback resistor R3 and the input terminal of the integral unit, respectively. The other end of the feedback resistor R3 is connected to the inverting input terminal of the operational amplifier U1.

[0054] The proportional unit's output Vout1 is proportional to the input deviation (the difference between the preset voltage and the actual temperature signal). The proportional coefficient Kp is related to the resistance values ​​of the input resistor R2 and the feedback resistor R3, and is expressed as Kp = 1 + R3 / R2. When there is a deviation between the actual temperature and the preset temperature, the proportional unit will quickly output a signal proportional to the deviation (i.e., Vout1) to prompt the system to adjust in the direction of reducing the deviation.

[0055] The rapid response of the proportional unit allows the system to react quickly to temperature deviations, but it may introduce steady-state error. The subsequent integral unit integrates the deviation signal output by the proportional unit, continuously adjusting the output over time to eliminate steady-state error and enable the temperature control system to more accurately control the temperature within the preset value. In one embodiment, referencing... Figure 4 The integration unit includes a resistor R4 and a capacitor C1; one end of the resistor R4 is connected to the output terminal of the operational amplifier U1 and one end of the capacitor C1, respectively, and the other end of the resistor R4 is connected to the input terminal of the differentiating unit and the other end of the capacitor C1, respectively.

[0056] In the integrator unit, when the proportional unit output signal Vout1 is applied to the integrator unit, current flows through resistor R4 to charge or discharge capacitor C1. Assuming the capacitor voltage is 0 at the initial moment, the voltage across capacitor C1 will continuously change over time, and the amount of voltage change is proportional to the integral of the input current over time.

[0057] The integrator unit integrates the output signal Vout1 of the proportional unit. As long as there is a deviation, the integral value will continue to accumulate. As the integral value increases, the output signal Vout2 of the integrator unit will also be continuously adjusted, thereby gradually strengthening the control effect of the system until the deviation is eliminated. This effectively eliminates steady-state error, improves the control accuracy of the temperature control system, and enables the temperature of the temperature controller to more accurately reach and stabilize at the preset temperature.

[0058] In one embodiment, refer to Figure 4 The differentiating unit includes an operational amplifier U2, a feedback capacitor C2, and an output resistor R5. The non-inverting input terminal of the operational amplifier U2 is used to receive the input voltage (i.e., V2.5). The inverting input terminal of the operational amplifier U2 is connected to one end of the resistor R4. One end of the feedback capacitor C2 is connected to the inverting input terminal of the operational amplifier U2, and the other end of the feedback capacitor C2 is connected to the output terminal of the operational amplifier U2. One end of the output resistor R5 is connected to the output terminal of the operational amplifier U2, and the other end of the output resistor R5 (i.e., D1_TEC) is connected to the input terminal of the buck-boost chip.

[0059] In this system, when the output signal Vout2 of the integrator changes, the feedback capacitor C2 responds to this change. At the instant the signal changes, the feedback capacitor C2 acts as a short circuit, causing the output of operational amplifier U2 to change rapidly. As time progresses, if the output signal Vout2 of the integrator rises rapidly, the feedback capacitor C2 charges rapidly, resulting in a large negative change at the output of operational amplifier U2; conversely, if the output signal Vout2 of the integrator falls rapidly, the feedback capacitor C2 discharges rapidly, resulting in a large positive change at the output of operational amplifier U2. The differentiating unit can detect the rate of change of the input signal and output a corresponding signal (i.e., a voltage adjustment signal).

[0060] In comparator circuits, the proportional unit can respond quickly to temperature deviations, and the integral unit can eliminate steady-state errors, but their ability to respond quickly to temperature changes and suppress overshoot is limited. The differential unit, by processing the rate of change of temperature deviation, can predict temperature trends. For example, when the temperature rapidly approaches a preset value, the differential unit can generate a reverse control signal in advance to suppress further temperature increases or decreases, thereby reducing system overshoot and allowing the temperature to stabilize more quickly near the preset value, improving the dynamic performance and stability of the temperature control system.

[0061] In summary, the signal processed by the proportional, integral, and differential units (i.e., the voltage regulation signal) is output to the buck-boost chip. The buck-boost chip precisely adjusts the magnitude and direction of the current output to the positive and negative terminals of the TEC unit according to the voltage regulation signal, thereby achieving precise control of the TEC unit's cooling or heating power, ultimately stabilizing the temperature of the temperature controller near the preset temperature value.

[0062] In order to generate a corresponding drive voltage to drive the TEC unit according to the voltage regulation signal, in one embodiment, such as Figure 5 and Figure 6 As shown, the feedback pin (i.e., FB pin) of the buck-boost chip is connected to one end of the output resistor R5, the input pin (Vin) of the buck-boost chip is connected to the positive terminal of the TEC unit, and the output pin (Vout) of the buck-boost chip is connected to the negative terminal of the TEC unit.

[0063] In one embodiment, the buck-boost chip can be a TPS63802. The input voltage range of the buck-boost chip is 2.7V to 3.6V, and the output voltage range is 1.2V to 5.5V.

[0064] In one embodiment, the input voltage Vin of the buck-boost chip is fixed at 3.3V, and the output voltage Vout is adjustable according to the voltage of its feedback pin FB (i.e., the voltage adjustment signal output from the comparator circuit) (the specific formula will vary depending on the external configuration), with an adjustment range of 1.2V to 5.5V. When the output voltage is 1.2V, the voltage across the TEC unit is Vin - Vout = 3.3V - 1.2V = 2.1V, which is the maximum forward voltage of the TEC unit. If the resistance of the TEC unit is 1 ohm, the forward current is 2.1A. When the output voltage is 5.5V, the voltage across the TEC unit is:

[0065] Vin-Vout = 3.3V - 5.5V = -2.2V. This voltage is the maximum reverse voltage of the TEC unit. If the resistance of the TEC unit is 1 ohm, then the reverse current is 2.2A.

[0066] It is worth noting that all the method-related content proposed in this embodiment is prior art and will not be explained in detail in this embodiment.

[0067] In summary, this embodiment obtains the actual temperature of the temperature control device through a thermistor. The comparison circuit outputs a voltage adjustment signal based on the voltage signal corresponding to the actual temperature and a preset voltage. The buck-boost chip then generates a drive voltage for the TEC unit based on the voltage adjustment signal, driving the TEC unit to cool or heat the temperature control device. Controlling the TEC unit controls the temperature of the temperature control device, ensuring its stable operation. The entire temperature control device is simple, reliable, small in size, low in cost, and easy to adjust. Furthermore, by using a conventional buck-boost chip to generate the drive voltage required by the TEC unit, the use of a dedicated temperature control chip is avoided, reducing circuit cost, size, and improving circuit reliability.

[0068] Example 2:

[0069] Based on the temperature control device provided in the foregoing embodiments, this embodiment proposes an optical module, such as... Figure 7 As shown, the optical module includes optical components and the temperature control device described in Embodiment 1. The TEC unit and the thermistor unit are respectively in contact with the optical components. The optical components include devices such as lasers or photodiodes in the optical module that generate heat during operation and require temperature control, corresponding to the temperature control device described in Embodiment 1.

[0070] This embodiment obtains the actual temperature of the temperature control device through a thermistor. The comparison circuit outputs a voltage adjustment signal based on the voltage signal corresponding to the actual temperature and a preset voltage. The buck-boost chip generates a drive voltage for the TEC unit based on the voltage adjustment signal, thereby driving the TEC unit to cool or heat the temperature control device. By controlling the TEC unit, the temperature of the temperature control device is controlled, ensuring the stability of the temperature control device's operation. The entire temperature control device is simple, reliable, small in size, low in cost, and easy to adjust. Furthermore, by using a conventional buck-boost chip to generate the drive voltage required by the TEC unit, the use of a dedicated temperature control chip is avoided, reducing circuit costs, minimizing size, and improving circuit reliability.

[0071] For the specific structure of the temperature control device, please refer to Embodiment 1, which will not be repeated in this embodiment.

[0072] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A temperature control device, characterized by, include: The system includes a comparator circuit, a step-up / step-down chip, and a temperature control module; the temperature control module includes a TEC unit and a thermistor unit; the TEC unit and the thermistor unit are respectively connected in contact with the temperature control device. One end of the thermistor is grounded, and the other end of the thermistor is connected to one input terminal of the comparator circuit. The other input terminal of the comparator circuit is used to receive a preset voltage. The output terminal of the comparator circuit is connected to the input terminal of the buck-boost chip, and the output terminal of the buck-boost chip is connected to the positive and negative terminals of the TEC unit, respectively.

2. The temperature control device of claim 1, wherein The comparator circuit includes a proportional unit, an integral unit, and a differential unit; One input terminal of the proportional unit is used to receive a preset voltage, and the other input terminal of the proportional unit is connected to one end of the thermistor unit. The output of the proportional unit is connected to the input of the integral unit, the output of the integral unit is connected to the input of the differential unit, and the output of the differential unit is connected to the input of the buck-boost chip.

3. The temperature control device of claim 2, wherein, The proportional unit includes an input resistor R1, an input resistor R2, a feedback resistor R3, and an operational amplifier U1; One end of the input resistor R1 is used to receive a preset voltage, and the other end of the input resistor R1 is connected to the non-inverting input terminal of the operational amplifier U1. The non-inverting input terminal of the operational amplifier U1 is also connected to one end of the thermistor. One end of the input resistor R2 is grounded, and the other end of the input resistor R2 is connected to the inverting input terminal of the operational amplifier U1; The output terminal of the operational amplifier U1 is connected to one end of the feedback resistor R3 and the input terminal of the integration unit, respectively, and the other end of the feedback resistor R3 is connected to the inverting input terminal of the operational amplifier U1.

4. The temperature control device of claim 3, wherein The integration unit includes a resistor R4 and a capacitor C1; one end of the resistor R4 is connected to the output terminal of the operational amplifier U1 and one end of the capacitor C1, respectively, and the other end of the resistor R4 is connected to the input terminal of the differentiating unit and the other end of the capacitor C1, respectively.

5. The temperature control device of claim 4, wherein, The differentiating unit includes an operational amplifier U2, a feedback capacitor C2, and an output resistor R5; The non-inverting input terminal of the operational amplifier U2 is used to receive the input voltage. The inverting input terminal of the operational amplifier U2 is connected to one end of the resistor R4. One end of the feedback capacitor C2 is connected to the inverting input terminal of the operational amplifier U2, and the other end of the feedback capacitor C2 is connected to the output terminal of the operational amplifier U2. One end of the output resistor R5 is connected to the output terminal of the operational amplifier U2, and the other end of the output resistor R5 is connected to the input terminal of the buck-boost chip.

6. The temperature control device of claim 5, wherein, The feedback pin of the buck-boost chip is connected to one end of the output resistor R5, the input pin of the buck-boost chip is connected to the positive terminal of the TEC unit, and the output pin of the buck-boost chip is connected to the negative terminal of the TEC unit.

7. The temperature control device of claim 1, wherein The input voltage range of the buck-boost chip is 2.7V to 3.6V, and the output voltage range of the buck-boost chip is 1.2V to 5.5V.

8. The temperature control device of claim 1, wherein, The buck-boost chip is model TPS63802.

9. The temperature control device of claim 1, wherein, The thermally sensitive unit is a thermistor.

10. An optical module characterized by comprising: The temperature control device as claimed in any of claims 1 to 9, comprising an optical device, the TEC unit and the thermally sensitive unit being arranged in contact with the optical device, respectively.

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