Stacked capacitor packaging structure and electronic device

Abstract

The utility model provides a stacked capacitor packaging structure and an electronic device. The stacked capacitor packaging structure comprises a capacitor unit, an insulation packaging body and a terminal electrode structure. The capacitor unit includes a plurality of capacitor elements. The insulating package is configured to partially cover the plurality of capacitor elements. The terminal electrode structure comprises a first electrode structure layer and a second electrode structure layer. The plurality of positive electrode portions of the plurality of capacitor elements are separated from each other by a predetermined distance, and the plurality of negative electrode portions of the plurality of capacitor elements are sequentially stacked to provide a shared side end negative electrode structure. A positive electrode side end face of the positive electrode part of each capacitor element is exposed by the first side end part of the insulating packaging body, so that the capacitor element is directly and electrically connected to the first electrode structure layer. At least one cathode side end face of the sharing side end cathode structure is exposed by the second side end portion of the insulation packaging body so as to be directly and electrically connected to the second electrode structure layer.

Description

Technical Field

[0001] This utility model relates to a capacitor packaging structure, and more particularly to a stacked capacitor packaging structure and an electronic device using the stacked capacitor packaging structure. Background Technology

[0002] In the prior art, when multiple capacitor elements of a stacked capacitor are stacked, the multiple capacitor elements need to be pre-supported on a conductive substrate, and the positive terminal of each capacitor element needs to be bent and stacked together. Therefore, the stacked capacitor of the prior art still has room for improvement. Utility Model Content

[0003] The problem that this utility model aims to improve or solve is to provide a stacked capacitor package structure and an electronic device using the stacked capacitor package structure, addressing the shortcomings of the prior art.

[0004] To improve or solve the above-mentioned problems, one of the technical means adopted by this utility model is to provide a stacked capacitor package structure, which includes: a capacitor unit, an insulating package, and an end electrode structure. The capacitor unit includes a plurality of capacitor elements stacked sequentially and electrically connected to each other. The insulating package is configured to partially cover the plurality of capacitor elements. The end electrode structure includes a first electrode structure layer for covering a first end portion of the insulating package and a second electrode structure layer for covering a second end portion of the insulating package. Each capacitor element has a positive electrode portion and a negative electrode portion. The positive electrode portions of multiple capacitor elements are separated from each other by a predetermined distance, and the negative electrode portions of multiple capacitor elements are stacked sequentially to provide a shared side negative electrode structure. A positive electrode side end face of the positive electrode portion of each capacitor element is exposed by a first side end face of an insulating package, thereby being directly electrically connected to a first electrode structure layer. At least one negative electrode side end face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is exposed by a second side end face of an insulating package, thereby being directly electrically connected to a second electrode structure layer.

[0005] Furthermore, each capacitor element includes a metal foil, an oxide layer formed on the metal foil, a surrounding insulating layer disposed around the oxide layer, a conductive polymer layer for connecting the surrounding insulating layer and partially covering the oxide layer, and a conductive adhesive structure layer for connecting the surrounding insulating layer and completely covering the conductive polymer layer. The metal foil has a porous corrosion structure covered by the oxide layer. The conductive adhesive structure layer includes a carbon adhesive layer for completely covering the conductive polymer layer and a silver adhesive layer for completely covering the carbon adhesive layer. The length of the positive electrode portion of the capacitor element is less than the length of the surrounding insulating layer. Neither the positive electrode side face of the positive electrode portion of each capacitor element nor at least one negative electrode side face of the shared negative electrode structure provided by the sequential stacking of multiple negative electrode portions is completely covered by the insulating encapsulation. The positive electrode portion of each capacitor element is configured to be horizontally extended without bending. A shared side negative electrode structure, provided by a positive conductive pin portion and a plurality of negative electrode portions stacked sequentially, is configured as a negative electrode conductive shared portion that does not need to be supported by a conductive carrier substrate; wherein, the shared side negative electrode structure provided by the plurality of negative electrode portions stacked sequentially is configured as a thickened conductive adhesive structure or a composite conductive adhesive structure; wherein, when the shared side negative electrode structure is configured as a thickened conductive adhesive structure, the shared side negative electrode structure is formed by connecting a plurality of silver paste layers of a plurality of capacitor elements sequentially, and the shared side negative electrode structure gradually decreases in size towards the second electrode structure layer; wherein, when the shared side negative electrode structure is configured as a composite conductive adhesive structure, the shared side negative electrode structure includes a negative electrode base portion formed by connecting a plurality of silver paste layers of a plurality of capacitor elements sequentially and a negative electrode thickening portion disposed on the negative electrode base portion, and the negative electrode thickening portion gradually decreases in size towards the second electrode structure layer.

[0006] Furthermore, the positive electrode side face of the positive electrode portion of each capacitor element is completely or partially exposed by the first side end of the insulating package, and at least one negative electrode side face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is completely or partially exposed by the second side end of the insulating package; wherein, the positive electrode side face of the positive electrode portion of each capacitor element is exposed from a first side end face of the first side end of the insulating package, so that the first electrode structure layer is configured to directly electrically contact the positive electrode side face of the positive electrode portion of each capacitor element; wherein, at least one negative electrode side face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is exposed from a second side end face of the second side end of the insulating package, so that the second electrode structure layer is configured to directly electrically contact at least one negative electrode side face of the shared side negative electrode structure.

[0007] Furthermore, the top end of the uppermost capacitor element only contacts the insulating package, and the bottom end of the lowermost capacitor element only contacts the insulating package; wherein, the insulating package has a top package portion between the top end of the uppermost capacitor element and an upper surface of the insulating package, and the insulating package has a bottom package portion between the bottom end of the lowermost capacitor element and a lower surface of the insulating package; wherein, the minimum thickness of the top package portion and the minimum thickness of the bottom package portion are both less than the maximum thickness of each capacitor element, and the volume occupied by the top package portion and the volume occupied by the bottom package portion of the insulating package are both less than the volume occupied by each capacitor element.

[0008] Furthermore, the first electrode structure layer includes a first bottom electrode portion disposed on the bottom surface of a first portion of the insulating package and a first side electrode portion disposed on a first side end face of the insulating package and electrically connected to the first bottom electrode portion; wherein, the second electrode structure layer includes a second bottom electrode portion disposed on the bottom surface of a second portion of the insulating package and a second side electrode portion disposed on a second side end face of the insulating package and electrically connected to the second bottom electrode portion; wherein, the positive electrode side end face of the positive electrode portion of each capacitor element is configured as a positive electrode cut surface, and a shared side is provided by a plurality of negative electrode portions stacked sequentially. At least one negative electrode side face of the negative electrode structure is configured as a negative electrode processing surface; wherein, the positive electrode side face of the positive electrode portion of each capacitor element directly contacts the first side electrode portion of the first electrode structure layer and is separated from the first bottom electrode portion of the first electrode structure layer; wherein, at least one negative electrode side face of the shared side negative electrode structure provided by a plurality of negative electrode portions stacked sequentially directly contacts the second side electrode portion of the second electrode structure layer and is separated from the second bottom electrode portion of the second electrode structure layer; wherein, the stacked capacitor package structure is configured as a chip capacitor package structure that does not require bending of the positive electrode leads and does not require the use of a conductive carrier substrate.

[0009] To improve or solve the above-mentioned problems, another technical means adopted by this utility model is to provide an electronic device, which includes: a circuit board structure and a stacked capacitor package structure. The circuit board structure has at least one positive electrode pad and at least one negative electrode pad. The stacked capacitor package structure is disposed on the circuit board structure and electrically connected to the circuit board structure. The stacked capacitor package structure includes a capacitor unit, an insulating package, and an end electrode structure. The capacitor unit comprises a plurality of capacitor elements stacked sequentially and electrically connected to each other. The insulating package is configured to partially cover the plurality of capacitor elements. The end electrode structure includes a first electrode structure layer covering a first side end of the insulating package and a second electrode structure layer covering a second side end of the insulating package. Each capacitor element has a positive electrode portion and a negative electrode portion. The positive electrode portions of the plurality of capacitor elements are separated from each other by a predetermined distance, and the negative electrode portions of the plurality of capacitor elements are stacked sequentially to provide a shared side negative electrode structure. A positive electrode side end face of the positive electrode portion of each capacitor element is exposed by the first side end of the insulating package, thereby directly electrically connected to the first electrode structure layer. At least one negative electrode side end face of the shared side negative electrode structure provided by the sequential stacking of the plurality of negative electrode portions is exposed by the second side end of the insulating package, thereby directly electrically connected to the second electrode structure layer.

[0010] Furthermore, each capacitor element includes a metal foil, an oxide layer formed on the metal foil, a surrounding insulating layer disposed around the oxide layer, a conductive polymer layer for connecting the surrounding insulating layer and partially covering the oxide layer, and a conductive adhesive structure layer for connecting the surrounding insulating layer and completely covering the conductive polymer layer. The metal foil has a porous corrosion structure covered by the oxide layer. The conductive adhesive structure layer includes a carbon adhesive layer for completely covering the conductive polymer layer and a silver adhesive layer for completely covering the carbon adhesive layer. The length of the positive electrode portion of the capacitor element is less than the length of the surrounding insulating layer. Neither the positive electrode side face of the positive electrode portion of each capacitor element nor at least one negative electrode side face of the shared negative electrode structure provided by the sequential stacking of multiple negative electrode portions is completely covered by the insulating encapsulation. The positive electrode portion of each capacitor element is configured to be horizontally extended without bending. A shared side negative electrode structure, provided by a positive conductive pin portion and a plurality of negative electrode portions stacked sequentially, is configured as a negative electrode conductive shared portion that does not need to be supported by a conductive carrier substrate; wherein, the shared side negative electrode structure provided by the plurality of negative electrode portions stacked sequentially is configured as a thickened conductive adhesive structure or a composite conductive adhesive structure; wherein, when the shared side negative electrode structure is configured as a thickened conductive adhesive structure, the shared side negative electrode structure is formed by connecting a plurality of silver paste layers of a plurality of capacitor elements sequentially, and the shared side negative electrode structure gradually decreases in size towards the second electrode structure layer; wherein, when the shared side negative electrode structure is configured as a composite conductive adhesive structure, the shared side negative electrode structure includes a negative electrode base portion formed by connecting a plurality of silver paste layers of a plurality of capacitor elements sequentially and a negative electrode thickening portion disposed on the negative electrode base portion, and the negative electrode thickening portion gradually decreases in size towards the second electrode structure layer.

[0011] Furthermore, the positive electrode side face of the positive electrode portion of each capacitor element is completely or partially exposed by the first side end of the insulating package, and at least one negative electrode side face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is completely or partially exposed by the second side end of the insulating package; wherein, the positive electrode side face of the positive electrode portion of each capacitor element is exposed from a first side end face of the first side end of the insulating package, so that the first electrode structure layer is configured to directly electrically contact the positive electrode side face of the positive electrode portion of each capacitor element; wherein, at least one negative electrode side face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is exposed from a second side end face of the second side end of the insulating package, so that the second electrode structure layer is configured to directly electrically contact at least one negative electrode side face of the shared side negative electrode structure.

[0012] Furthermore, the top end of the uppermost capacitor element only contacts the insulating package, and the bottom end of the lowermost capacitor element only contacts the insulating package; wherein, the insulating package has a top package portion between the top end of the uppermost capacitor element and an upper surface of the insulating package, and the insulating package has a bottom package portion between the bottom end of the lowermost capacitor element and a lower surface of the insulating package; wherein, the minimum thickness of the top package portion and the minimum thickness of the bottom package portion are both less than the maximum thickness of each capacitor element, and the volume occupied by the top package portion and the volume occupied by the bottom package portion of the insulating package are both less than the volume occupied by each capacitor element.

[0013] Furthermore, the first electrode structure layer includes a first bottom electrode portion disposed on the bottom surface of a first portion of the insulating package and a first side electrode portion disposed on a first side end face of the insulating package and electrically connected to the first bottom electrode portion; wherein, the second electrode structure layer includes a second bottom electrode portion disposed on the bottom surface of a second portion of the insulating package and a second side electrode portion disposed on a second side end face of the insulating package and electrically connected to the second bottom electrode portion; wherein, the positive electrode side end face of the positive electrode portion of each capacitor element is configured as a positive electrode cut surface, and a shared side is provided by a plurality of negative electrode portions stacked sequentially. At least one negative electrode side face of the negative electrode structure is configured as a negative electrode processing surface; wherein, the positive electrode side face of the positive electrode portion of each capacitor element directly contacts the first side electrode portion of the first electrode structure layer and is separated from the first bottom electrode portion of the first electrode structure layer; wherein, at least one negative electrode side face of the shared side negative electrode structure provided by a plurality of negative electrode portions stacked sequentially directly contacts the second side electrode portion of the second electrode structure layer and is separated from the second bottom electrode portion of the second electrode structure layer; wherein, the stacked capacitor package structure is configured as a chip capacitor package structure that does not require bending of the positive electrode leads and does not require the use of a conductive carrier substrate.

[0014] One of the beneficial effects of this utility model is that the stacked capacitor package structure and the electronic device using the stacked capacitor package structure provided by this utility model can achieve the following technical solutions: "multiple positive electrode portions of multiple capacitor elements are separated from each other by a predetermined distance," "multiple negative electrode portions of multiple capacitor elements are stacked sequentially to provide a shared side negative electrode structure," "a positive electrode side end face of the positive electrode portion of each capacitor element is exposed by a first side end face of an insulating package," and "at least one negative electrode side end face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is exposed by a second side end face of an insulating package." This allows the positive electrode side end face of the positive electrode portion of each capacitor element to be directly electrically connected to a first electrode structure layer, and the negative electrode side end face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions to be directly electrically connected to a second electrode structure layer. Therefore, the stacked capacitor package structure can be configured as a chip-type capacitor package structure that "does not require bending the positive electrode leads" and "does not require using a conductive carrier substrate."

[0015] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings provided are for reference and illustration only and are not intended to limit this utility model. Attached Figure Description

[0016] Figure 1 This is a process diagram illustrating the manufacturing method of the stacked capacitor package structure provided in the first embodiment of this utility model.

[0017] Figure 2 This is a cross-sectional schematic diagram of the original capacitor element before it has been cut, as provided in the first embodiment of this utility model.

[0018] Figure 3 for Figure 2 An enlarged schematic diagram of Part III.

[0019] Figure 4 This is a side cross-sectional view of step S100 of the method for manufacturing the stacked capacitor package structure provided in the first embodiment of the present invention.

[0020] Figure 5 This is a top view of step S100 of the method for manufacturing the stacked capacitor package structure provided in the first embodiment of this utility model.

[0021] Figure 6 This is a side cross-sectional view of steps S102 and S104 of the method for manufacturing the stacked capacitor package structure provided in the first embodiment of this utility model.

[0022] Figure 7This is a side cross-sectional view of step S106 of the method for manufacturing the stacked capacitor package structure provided in the first embodiment of the present invention.

[0023] Figure 8 A side cross-sectional view of step S108 of the method for manufacturing the stacked capacitor package structure provided in the first embodiment of the present invention (or a side cross-sectional view of the stacked capacitor package structure provided in the first embodiment of the present invention).

[0024] Figure 9 This is a side cross-sectional view of an electronic device using a stacked capacitor package structure, provided in the second embodiment of the present invention.

[0025] Figure 10 This is a side cross-sectional view of the stacked capacitor package structure provided in the third embodiment of the present invention. Detailed Implementation

[0026] The following specific embodiments illustrate the implementation of the "stacked capacitor package structure," "method of manufacturing the stacked capacitor package structure," and "electronic device using the stacked capacitor package structure" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, it should be stated in advance that the accompanying drawings of this utility model are for simple illustration only and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model. Additionally, the term "or" used herein may, depending on the actual situation, include any combination of one or more of the associated listed items.

[0027] First Embodiment

[0028] See Figures 1 to 8 As shown, the first embodiment of this utility model provides a method for manufacturing a stacked capacitor package structure S, which may include at least the following steps: First, in conjunction with... Figure 1 , Figure 2 and Figure 4As shown, multiple capacitor elements 10 (or chip-type capacitor assemblies) are stacked sequentially, wherein each capacitor element 10 may have a positive electrode portion 10P (or anode portion), a negative electrode portion 10N (or cathode portion), and a temporary support portion 10C (or removable support portion) extending from the positive electrode portion 10P, and the multiple negative electrode portions 10N of the multiple capacitor elements 10 are stacked sequentially to provide a shared side negative electrode structure N (step S100); then, in conjunction with Figure 1 , Figure 4 and Figure 6 As shown, an insulating encapsulation 2 (e.g., made of epoxy, silicone, or any insulating material) is formed to partially encapsulate a plurality of capacitor elements 10 (the plurality of capacitor elements 10 stacked sequentially can constitute a capacitor unit 1), wherein at least one negative electrode side face 1002 of the shared side negative electrode structure N provided is provided by a plurality of negative electrode portions 10N stacked sequentially (e.g., Figure 6 Taking five negative electrode side end faces 1002 as an example, each negative electrode side end face 1002 can be, for example, a negative electrode processing surface that is arc-shaped or curved. For example, after grinding the insulating package 2, the shared side negative electrode structure N exposed from the insulating package 2 is exposed by a second side end 202 of the insulating package 2, and the temporary support portion 10C of each capacitor element 10 is exposed from the insulating package 2 (step S102); then, in conjunction with Figure 1 and Figure 6 As shown, a first side electrode material (e.g., including a first bottom electrode portion 311 and a second bottom electrode portion 321) can be formed on the insulating package 2 by electroplating, coating, spraying, printing, impregnation, or any conductive material forming method (step S104); next, in conjunction with Figure 1 , Figure 6 and Figure 7 As shown, along Figure 6 The cutting lines shown are used to remove the temporary support portion 10C of each capacitor element 10, so that a positive electrode side end face 1001 (e.g., a flat positive electrode cut surface) of the positive electrode portion 10P of each capacitor element 10 is exposed by a first side end 201 of the insulating package 2 (step S106); then, in conjunction with Figure 1 , Figure 7 and Figure 8 As shown, a second side electrode material (e.g., including a first side electrode portion 312 and a second side electrode portion 322) can be formed on the insulating package 2 by electroplating, coating, spraying, printing, impregnation, or any conductive material forming method (step S108). It is worth noting that, as Figure 8As shown, the first and second side electrode materials can cooperate to form an end electrode structure 3, and the end electrode structure 3 may include a first electrode structure layer 31 and a second electrode structure layer 32. Furthermore, the first electrode structure layer 31 of the end electrode structure 3 can be configured to cover the first side end 201 of the insulating package 2 and be directly electrically connected to the positive electrode side end face 1001 of the positive electrode portion 10P of each capacitor element 10, and the second electrode structure layer 32 of the end electrode structure 3 can be configured to cover the second side end 202 of the insulating package 2 and be directly electrically connected to at least one negative electrode side end face 1002 of the shared side negative electrode structure N. However, the examples given above are merely one feasible embodiment and are not intended to limit the present invention.

[0029] For example, such as Figure 4 As shown, in step S100, where multiple capacitor elements 10 are stacked sequentially, the positive electrode portion 10P of each capacitor element 10 does not need to be bent and extends horizontally (or approximately horizontally), and the shared side negative electrode structure N provided by the sequential stacking of multiple negative electrode portions 10N does not need to be supported by any conductive carrier substrate (that is, only multiple capacitor elements 10 are stacked sequentially and electrically connected to each other). Furthermore, as... Figure 4 As shown, in step S100, where multiple capacitor elements 10 are stacked sequentially, the multiple positive electrode portions 10P of the multiple capacitor elements 10 can be separated from each other, and the multiple negative electrode portions 10N of the multiple capacitor elements 10 can be stacked sequentially and electrically connected to each other. It is worth noting that, in conjunction with... Figure 4 and Figure 5 As shown, in step S100, where multiple capacitor elements 10 are stacked sequentially, the rear portions of multiple temporary support portions 10C of the multiple capacitor elements 10 can be stacked sequentially to form a support structure (but as shown in the figure). Figure 4 As shown, the multiple front portions of the multiple temporary support portions 10C near the multiple positive electrode portions 10P can be separated from each other, and the support structure can be configured to simultaneously support multiple capacitor units 1 (each capacitor unit 1 may include multiple capacitor elements 10). However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0030] For example, such as Figure 6 As shown, in step S102 of forming the insulating package 2 to partially cover the plurality of capacitor elements 10, at least one negative electrode side face 1002 of the shared side negative electrode structure N can be completely or partially exposed by the second side end 202 of the insulating package 2 (e.g., Figure 6The five negative electrode side faces 1002 of the shared negative electrode structure N can be partially exposed by the second side end 202 of the insulating package 2. Furthermore, as... Figure 6 As shown, in step S104 of forming the first side electrode material on the insulating package 2, the first side electrode material may include a first bottom electrode portion 311 disposed on a first portion of the bottom surface of the insulating package 2 and a second bottom electrode portion 321 disposed on a second portion of the bottom surface of the insulating package 2. Furthermore, as... Figure 7 As shown, in step S106, when the temporary support portion 10C of each capacitor element 10 is removed, the positive electrode side end face 1001 (e.g., a flat positive electrode cut surface) of the positive electrode portion 10P of each capacitor element 10 can be completely or partially exposed by the first side end face 201 of the insulating package 2. Additionally, as... Figure 8 As shown, in step S108 of forming the second side electrode material on the insulating package 2, the first electrode structure layer 31 may include a first side electrode portion 312 disposed on a first side end face 2010 of the insulating package 2 and electrically connected to the first bottom electrode portion 311, and a second side electrode portion 322 disposed on a second side end face 2020 of the insulating package 2 and electrically connected to the second bottom electrode portion 321. However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0031] Furthermore, cooperation Figures 1 to 8 As shown, the method for manufacturing a stacked capacitor package structure S provided by the first embodiment of the present invention can further provide a stacked capacitor package structure S, which may include at least: a capacitor unit 1 (or a capacitor assembly), an insulating package 2, and an end electrode structure 3. More specifically, the capacitor unit 1 may include a plurality of capacitor elements 10 stacked sequentially and electrically connected to each other, wherein each capacitor element 10 may have a positive electrode portion 10P and a negative electrode portion 10N. The plurality of positive electrode portions 10P of the plurality of capacitor elements 10 may be separated from each other by a predetermined distance, and the plurality of negative electrode portions 10N of the plurality of capacitor elements 10 may be stacked sequentially to provide a shared side negative electrode structure N. In addition, the insulating package 2 may be configured to partially cover the plurality of capacitor elements 10, and the end electrode structure 3 may include a first electrode structure layer 31 for covering a first side end portion 201 of the insulating package 2 and a second electrode structure layer 32 for covering a second side end portion 202 of the insulating package 2.

[0032] For example, coordination Figure 2 , Figure 3 and Figure 8As shown, each capacitor element 10 may include a metal foil 101 (e.g., aluminum foil, copper foil, or any type of conductive foil), an oxide layer 102 formed on the metal foil 101, a surrounding insulating layer 103 disposed around the oxide layer 102, a conductive polymer layer 104 for connecting the surrounding insulating layer 103 and partially covering the oxide layer 102, and a conductive adhesive structure layer for connecting the surrounding insulating layer 103 and completely covering the conductive polymer layer 104. The metal foil 101 may have a porous corrosion structure 1010 covered by the oxide layer 102. Additionally, the conductive adhesive structure layer may include a carbon adhesive layer 105 for completely covering the conductive polymer layer 104 and a silver adhesive layer 106 for completely covering the carbon adhesive layer 105. The length L1 (or the length along the extension direction of the metal foil 101) of the positive electrode portion 10P of the capacitor element 10 is less than the length L2 (or the length along the extension direction of the metal foil 101) of the surrounding insulating layer 103. It is worth noting that the positive electrode portion 10P of each capacitor element 10 can be configured as a positive conductive pin portion that does not need to be bent and extends horizontally (or nearly horizontally), and the shared side negative electrode structure N provided by the sequential stacking of multiple negative electrode portions 10N can be configured as a shared negative conductive portion that does not need to be supported by any conductive carrier substrate (e.g., in conjunction with...). Figure 4 and Figure 8 (As shown). However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0033] For example, coordination Figure 2 , Figure 4 and Figure 8As shown, the positive electrode side end face 1001 of the positive electrode portion 10P of each capacitor element 10 can be completely or partially exposed by the first side end face 201 of the insulating package 2 (that is, the positive electrode side end face 1001 of the positive electrode portion 10P of each capacitor element 10 is not completely covered by the insulating package 2), thereby enabling the positive electrode side end face 1001 of the positive electrode portion 10P of each capacitor element 10 to be directly electrically connected to the first electrode structure layer 31. Furthermore, at least one negative electrode side end face 1002 (or multiple negative electrode side end faces 1002) of the shared side negative electrode structure N provided by the sequential stacking of multiple negative electrode portions 10N can be completely or partially exposed by the second side end face 202 of the insulating package 2 (that is, at least one or multiple negative electrode side end faces 1002 of the shared side negative electrode structure N provided by the sequential stacking of multiple negative electrode portions 10N will not be completely covered by the insulating package 2), thereby enabling at least one negative electrode side end face 1002 (or multiple negative electrode side end faces 1002) of the shared side negative electrode structure N to be directly electrically connected to the second electrode structure layer 32. In other words, the positive electrode side face 1001 of the positive electrode portion 10P of each capacitor element 10 can be exposed from a first side face 2010 of the first side end 201 of the insulating package 2, so that the first electrode structure layer 31 can be configured for direct electrical contact with the positive electrode side face 1001 of the positive electrode portion 10P of each capacitor element 10. Additionally, at least one negative electrode side face 1002 of the shared side negative electrode structure N provided by a plurality of negative electrode portions 10N stacked sequentially can be exposed from a second side face 2020 of the second side end 202 of the insulating package 2, so that the second electrode structure layer 32 can be configured for direct electrical contact with at least one negative electrode side face 1002 (or multiple negative electrode side faces 1002) of the shared side negative electrode structure N. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0034] For example, coordination Figure 2 , Figure 6 and Figure 8As shown, the top end of the uppermost capacitor element 10 only contacts the insulating package 2, and the bottom end of the lowermost capacitor element 10 only contacts the insulating package 2. Furthermore, the insulating package 2 may have a top package portion 203 located between the top end of the uppermost capacitor element 10 and an upper surface of the insulating package 2, and a bottom package portion 204 located between the bottom end of the lowermost capacitor element 10 and a lower surface of the insulating package 2. It is noteworthy that the minimum thickness H1 (or maximum thickness, or average thickness) of the top package portion 203 and the minimum thickness H2 (or maximum thickness, or average thickness) of the bottom package portion 204 are both less than the maximum thickness H3 (or minimum thickness, or average thickness) of each capacitor element 10, and the volume occupied by the top package portion 203 and the volume occupied by the bottom package portion 204 of the insulating package 2 are both less than the volume occupied by each capacitor element 10. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0035] For example, coordination Figure 6 , Figure 7 and Figure 8 As shown, the first electrode structure layer 31 may include a first bottom electrode portion 311 and a first side electrode portion 312. The first bottom electrode portion 311 may be disposed on a first portion of the bottom surface of the insulating package 2, and the first side electrode portion 312 may be disposed on a first side end face 2010 of the insulating package 2 and electrically connected to the first bottom electrode portion 311. Furthermore, the second electrode structure layer 32 may include a second bottom electrode portion 321 and a second side electrode portion 322. The second bottom electrode portion 321 may be disposed on a second portion of the bottom surface of the insulating package 2, and the second side electrode portion 322 may be disposed on a second side end face 2020 of the insulating package 2 and electrically connected to the second bottom electrode portion 321. It is worth noting that the positive electrode side face 1001 of the positive electrode portion 10P of each capacitor element 10 can directly contact the first side electrode portion 312 of the first electrode structure layer 31 and is separated from the first bottom electrode portion 311 of the first electrode structure layer 31. Furthermore, at least one negative electrode side face 1002 (or multiple negative electrode side faces 1002) of the shared side negative electrode structure N provided by the sequential stacking of multiple negative electrode portions 10N can directly contact the second side electrode portion 322 of the second electrode structure layer 32 and is separated from the second bottom electrode portion 321 of the second electrode structure layer 32. However, the examples given above are merely one feasible embodiment and are not intended to limit the present invention.

[0036] In this way, such as Figure 8As shown, the stacked capacitor package structure S provided in the first embodiment of this utility model can be configured as a chip-type capacitor package structure that "does not require bending the positive electrode pins" and "does not require using a conductive carrier substrate (e.g., lead frame)". That is, since the multiple positive electrode portions 10P of the multiple capacitor elements 10 can directly contact the first side electrode portion 312 of the first electrode structure layer 31, and the multiple negative electrode portions 10N of the multiple capacitor elements 10 (or a shared side negative electrode structure N) can directly contact the second side electrode portion 322 of the second electrode structure layer 32, the stacked capacitor package structure S provided in the first embodiment of this utility model can achieve the benefits of reducing volume (or reducing thickness and length), increasing capacitance (that is, increasing the number of stacked layers of multiple capacitor elements 10), reducing impedance (that is, reducing the positive electrode conductive path and the negative electrode conductive path), and reducing manufacturing cost (that is, not requiring bending and stacking of positive electrode pins, and not requiring the use of a conductive carrier substrate).

[0037] Second Embodiment

[0038] See Figure 9 As shown, the second embodiment of this utility model provides an electronic device E (or an electronic carrier module, or an electronic component module), which may include: a circuit board structure P and a stacked capacitor package structure S provided by the first embodiment. Figure 9 and Figure 8 A comparison reveals that the most significant difference between the second embodiment and the first embodiment of this invention lies in the following: In the second embodiment, the circuit board structure P can have at least one positive electrode pad P101 and at least one negative electrode pad P102, and the stacked capacitor package structure S provided by the first embodiment can be disposed (or fixed) on and electrically connected to the circuit board structure P through a conductive material. It is worth noting that the electronic device E can be a desktop computer, a laptop computer, a tablet computer, or any type of electronic device, and the circuit board structure P of the electronic device E can be configured to carry any type of electronic component, such as a control chip, a memory chip, an inductor, a resistor, or any type of semiconductor chip. However, the examples given above are merely one feasible embodiment and are not intended to limit the present invention.

[0039] Third Embodiment

[0040] See Figure 10 As shown, the third embodiment of this utility model provides a stacked capacitor package structure S, which may include at least: a capacitor unit 1, an insulating package 2, and an end electrode structure 3. Figure 10 and Figure 8A comparison reveals that the most significant difference between the third embodiment and the first embodiment of this utility model lies in the fact that, in the third embodiment, the shared side negative electrode structure N provided by the sequential stacking of multiple negative electrode portions 10N can be configured as a thickened conductive adhesive structure (or a single-layer conductive adhesive structure) or a composite conductive adhesive structure (or a multi-layer conductive adhesive structure).

[0041] For example, such as Figure 10 As shown, when the shared-side negative electrode structure N can be configured as a composite conductive adhesive structure, the shared-side negative electrode structure N may include multiple silver paste layers 106 (in conjunction with) multiple capacitor elements 10. Figure 2 The negative electrode base portion N1 (or a first conductive adhesive layer for connecting multiple silver paste layers 106 of multiple capacitor elements 10, which may use the same or different conductive material as the silver paste layers 106) and a negative electrode thickening portion N2 (or a second conductive adhesive layer for connecting or covering the first conductive adhesive layer, which may use the same or different conductive material as the silver paste layers 106) are sequentially connected on the negative electrode base portion N1, and at least one negative electrode side end face 1002 may be provided by the negative electrode thickening portion N2. It is worth noting that the negative electrode thickening portion N2 may gradually shrink towards the direction of the second electrode structure layer 32, so that the shared side end negative electrode structure N can present a tapered shape. However, the example given above is only one possible embodiment and is not intended to limit the present invention.

[0042] For example, when the shared-side negative electrode structure N can be configured as a thickened conductive adhesive structure, the shared-side negative electrode structure N can be formed by multiple silver paste layers 106 of multiple capacitor elements 10 (in conjunction with) Figure 2 The shared-side negative electrode structure N is formed by sequentially connecting multiple silver paste layers 106 of multiple capacitor elements 10. That is, the shared-side negative electrode structure N can be a negative electrode base portion N1 formed by sequentially connecting multiple silver paste layers 106 of multiple capacitor elements 10 (or a first conductive paste layer for connecting the multiple silver paste layers 106 of multiple capacitor elements 10, which can use the same or different conductive material as the silver paste layers 106), and the shared-side negative electrode structure N may not use a negative electrode thickening portion N2 disposed on the negative electrode base portion N1, so at least one negative electrode side surface 1002 can be provided by the negative electrode base portion N1. It is worth noting that the shared-side negative electrode structure N (that is, the negative electrode base portion N1) can gradually shrink towards the direction of the second electrode structure layer 32, so that the shared-side negative electrode structure N can present a tapered shape. However, the examples given above are only one feasible embodiment and are not intended to limit the present invention.

[0043] Beneficial effects of the embodiments

[0044] One of the beneficial effects of this utility model is that the stacked capacitor package structure S and the electronic device E using the stacked capacitor package structure S provided by this utility model can provide a shared side negative electrode structure N by "separating multiple positive electrode portions 10P of multiple capacitor elements 10 from each other by a predetermined distance", "stacking multiple negative electrode portions 10N of multiple capacitor elements 10 in sequence", and "a positive electrode side end face 1001 of the positive electrode portion 10P of each capacitor element 10 being insulated by the first side end face 201 of the insulating package 2". The technical solution of "exposing" and "at least one negative electrode side face 1002 of the shared side negative electrode structure N provided by a plurality of negative electrode portions 10N stacked sequentially is exposed by the second side end 202 of the insulating package 2" allows the positive electrode side face 1001 of the positive electrode portion 10P of each capacitor element 10 to be directly electrically connected to the first electrode structure layer 31, and the negative electrode side face 1002 of the shared side negative electrode structure N provided by a plurality of negative electrode portions 10N stacked sequentially to be directly electrically connected to the second electrode structure layer 32. In this way, the stacked capacitor package structure S can be configured as a chip-type capacitor package structure that "does not require bending the positive electrode pin" and "does not require using a conductive carrier substrate".

[0045] One of the beneficial effects of this utility model is that the method for manufacturing a stacked capacitor package structure S provided by this utility model can achieve the following: "a plurality of capacitor elements 10 are stacked sequentially, wherein each capacitor element 10 may have a positive electrode portion 10P, a negative electrode portion 10N, and a temporary support portion 10C extending from the positive electrode portion 10P, and the plurality of negative electrode portions 10N of the plurality of capacitor elements 10 are stacked sequentially to provide a shared side negative electrode structure N", "an insulating package 2 is formed to partially cover the plurality of capacitor elements 10, wherein at least one negative electrode side end face 1002 of the shared side negative electrode structure N provided by the plurality of negative electrode portions 10N being stacked sequentially is exposed by a second side end 202 of the insulating package 2, and the temporary support portion 10C of each capacitor element 10 is exposed from the insulating package 2", "a first side electrode material is formed in..." The technical solutions described are: "on the insulating package 2", "removing the temporary support portion 10C of each capacitor element 10 so that a positive electrode side end face 1001 of the positive electrode portion 10P of each capacitor element 10 is exposed by a first side end face 201 of the insulating package 2", "forming a second side end electrode material on the insulating package 2", and "the first side end electrode material and the second side end electrode material cooperate with each other to form an end electrode structure 3, and the end electrode structure 3 may include a first electrode structure layer 31 and a second electrode structure layer 32". These solutions allow the first electrode structure layer 31 of the end electrode structure 3 to be configured for direct electrical connection to the positive electrode side end face 1001 of the positive electrode portion 10P of each capacitor element 10, and the second electrode structure layer 32 of the end electrode structure 3 to be configured for direct electrical connection to at least one negative electrode side end face 1002 of the shared side negative electrode structure N. In this way, the stacked capacitor package structure S can be configured as a chip capacitor package structure that "does not require bending the positive lead" and "does not require using a conductive carrier substrate".

[0046] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the scope of protection of the claims of the present utility model. Therefore, all equivalent technical changes made based on the content of the present utility model specification and drawings are included in the scope of protection of the claims of the present utility model.

Claims

1. A stacked capacitor package structure, characterized by, The stacked capacitor package structure includes: A capacitor unit, the capacitor unit comprising a plurality of capacitor elements stacked sequentially and electrically connected to each other; An insulating package, the insulating package being configured to partially enclose a plurality of said capacitor elements; and An end electrode structure, the end electrode structure including a first electrode structure layer for covering a first side end of the insulating package and a second electrode structure layer for covering a second side end of the insulating package; Each capacitor element has a positive electrode portion and a negative electrode portion. The positive electrode portions of multiple capacitor elements are separated from each other by a predetermined distance, and the negative electrode portions of multiple capacitor elements are stacked sequentially to provide a shared side negative electrode structure. In each of the capacitor elements, a positive electrode side face of the positive electrode portion is exposed by the first side end of the insulating package, thereby allowing direct electrical connection to the first electrode structure layer; and In this embodiment, at least one negative electrode side face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is exposed by the second side end of the insulating package, thereby being directly electrically connected to the second electrode structure layer.

2. The stacked capacitor packaging structure according to claim 1, characterized in that, wherein Each of the capacitor elements includes a metal foil, an oxide layer formed on the metal foil, a surrounding insulating layer disposed on the oxide layer, a conductive polymer layer for connecting the surrounding insulating layer and partially covering the oxide layer, and a conductive adhesive structure layer for connecting the surrounding insulating layer and completely covering the conductive polymer layer, and the metal foil has a porous corrosion structure covered by the oxide layer. The conductive adhesive structure layer includes a carbon adhesive layer for completely covering the conductive polymer layer and a silver adhesive layer for completely covering the carbon adhesive layer, and the length of the positive electrode portion of the capacitor element is less than the length of the surrounding insulating layer. In this case, the positive end face of the positive electrode portion of each capacitor element and at least one negative end face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions are not completely covered by the insulating encapsulation. In this configuration, the positive electrode portion of each capacitor element is configured as a horizontally extending positive conductive pin portion that does not need to be bent, and the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is configured as a shared negative conductive portion that does not need to be supported by a conductive carrier substrate. The shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is configured as a thickened conductive adhesive structure or a composite conductive adhesive structure. Wherein, when the shared-side negative electrode structure is configured as the thickened conductive adhesive structure, the shared-side negative electrode structure is formed by sequentially connecting multiple silver paste layers of multiple capacitor elements, and the shared-side negative electrode structure gradually decreases in size towards the second electrode structure layer; and When the shared side negative electrode structure is configured as the composite conductive adhesive structure, the shared side negative electrode structure includes a negative electrode base portion formed by connecting multiple silver paste layers of multiple capacitor elements in sequence, and a negative electrode thickening portion disposed on the negative electrode base portion, and the negative electrode thickening portion gradually decreases in the direction toward the second electrode structure layer.

3. The stacked capacitor packaging structure according to claim 2, characterized in that, wherein The positive electrode side face of the positive electrode portion of each capacitor element is fully or partially exposed by the first side end of the insulating package, and at least one negative electrode side face of the shared side negative electrode structure provided by the sequential stacking of a plurality of negative electrode portions is fully or partially exposed by the second side end of the insulating package. In this embodiment, the positive electrode side face of the positive electrode portion of each capacitor element is exposed from a first side face of the first side end of the insulating package, such that the first electrode structure layer is configured for direct electrical contact with the positive electrode side face of the positive electrode portion of each capacitor element; and In this configuration, at least one negative electrode side face of the shared side negative electrode structure, provided by a plurality of negative electrode portions stacked sequentially, is exposed from a second side face of the second side end of the insulating package, such that the second electrode structure layer is configured to directly electrically contact the at least one negative electrode side face of the shared side negative electrode structure.

4. The stacked capacitor packaging structure according to claim 1, characterized in that, wherein The top end of the uppermost capacitor element will only contact the insulating package, and the bottom end of the lowermost capacitor element will only contact the insulating package. The insulating package has a top encapsulation portion located between the top end of the uppermost capacitor element and an upper surface of the insulating package, and a bottom encapsulation portion located between the bottom end of the lowermost capacitor element and a lower surface of the insulating package; and Wherein, the minimum thickness of the top encapsulation portion and the minimum thickness of the bottom encapsulation portion are both less than the maximum thickness of each capacitor element, and the volume occupied by the top encapsulation portion and the volume occupied by the bottom encapsulation portion of the insulating encapsulation body are both less than the volume occupied by each capacitor element.

5. The stacked capacitor package structure of claim 4, Its features are, in, The first electrode structure layer includes a first bottom electrode portion disposed on a first portion bottom surface of the insulating package and a first side electrode portion disposed on a first side surface of the insulating package and electrically connected to the first bottom electrode portion; The second electrode structure layer includes a second bottom electrode portion disposed on a second portion bottom surface of the insulating package and a second side electrode portion disposed on a second side surface of the insulating package and electrically connected to the second bottom electrode portion. In this embodiment, the positive electrode side end face of the positive electrode portion of each capacitor element is configured as a positive electrode cutting surface, and at least one negative electrode side end face of the shared side end negative electrode structure provided by the sequential stacking of multiple negative electrode portions is configured as a negative electrode processing surface. In this embodiment, the positive electrode side end face of the positive electrode portion of each capacitor element directly contacts the first side end electrode portion of the first electrode structure layer and is separated from the first bottom end electrode portion of the first electrode structure layer. In the shared side-end negative electrode structure provided by sequentially stacking multiple negative electrode portions, at least one negative electrode side face directly contacts the second side-end electrode portion of the second electrode structure layer and is separated from the second bottom-end electrode portion of the second electrode structure layer; and The stacked capacitor package structure is configured as a chip-type capacitor package structure that does not require bending of the positive lead and does not require the use of a conductive carrier substrate.

6. An electronic device, comprising: The electronic device includes: A circuit board structure having at least one positive electrode pad and at least one negative electrode pad; and A stacked capacitor package structure is disposed on the circuit board structure and electrically connected to the circuit board structure; The stacked capacitor package structure includes a capacitor unit, an insulating package, and an end electrode structure. The capacitor unit includes a plurality of capacitor elements stacked sequentially and electrically connected to each other. The insulating package is configured to partially cover the plurality of capacitor elements. The end electrode structure includes a first electrode structure layer for covering a first side end of the insulating package and a second electrode structure layer for covering a second side end of the insulating package. Each capacitor element has a positive electrode portion and a negative electrode portion. The positive electrode portions of multiple capacitor elements are separated from each other by a predetermined distance, and the negative electrode portions of multiple capacitor elements are stacked sequentially to provide a shared side negative electrode structure. In each of the capacitor elements, a positive electrode side face of the positive electrode portion is exposed by the first side end of the insulating package, thereby allowing direct electrical connection to the first electrode structure layer; and In this embodiment, at least one negative electrode side face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is exposed by the second side end of the insulating package, thereby being directly electrically connected to the second electrode structure layer.

7. The electronic device according to claim 6, characterized in that, wherein Each of the capacitor elements includes a metal foil, an oxide layer formed on the metal foil, a surrounding insulating layer disposed on the oxide layer, a conductive polymer layer for connecting the surrounding insulating layer and partially covering the oxide layer, and a conductive adhesive structure layer for connecting the surrounding insulating layer and completely covering the conductive polymer layer, and the metal foil has a porous corrosion structure covered by the oxide layer. The conductive adhesive structure layer includes a carbon adhesive layer for completely covering the conductive polymer layer and a silver adhesive layer for completely covering the carbon adhesive layer, and the length of the positive electrode portion of the capacitor element is less than the length of the surrounding insulating layer. In this case, the positive end face of the positive electrode portion of each capacitor element and at least one negative end face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions are not completely covered by the insulating encapsulation. In this configuration, the positive electrode portion of each capacitor element is configured as a horizontally extending positive conductive pin portion that does not need to be bent, and the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is configured as a shared negative conductive portion that does not need to be supported by a conductive carrier substrate. The shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is configured as a thickened conductive adhesive structure or a composite conductive adhesive structure. Wherein, when the shared-side negative electrode structure is configured as the thickened conductive adhesive structure, the shared-side negative electrode structure is formed by sequentially connecting multiple silver paste layers of multiple capacitor elements, and the shared-side negative electrode structure gradually decreases in size towards the second electrode structure layer; and When the shared side negative electrode structure is configured as the composite conductive adhesive structure, the shared side negative electrode structure includes a negative electrode base portion formed by connecting multiple silver paste layers of multiple capacitor elements in sequence, and a negative electrode thickening portion disposed on the negative electrode base portion, and the negative electrode thickening portion gradually decreases in the direction toward the second electrode structure layer.

8. The electronic device according to claim 7, characterized in that, wherein The positive electrode side face of the positive electrode portion of each capacitor element is fully or partially exposed by the first side end of the insulating package, and at least one negative electrode side face of the shared side negative electrode structure provided by the sequential stacking of a plurality of negative electrode portions is fully or partially exposed by the second side end of the insulating package. In this embodiment, the positive electrode side face of the positive electrode portion of each capacitor element is exposed from a first side face of the first side end of the insulating package, such that the first electrode structure layer is configured for direct electrical contact with the positive electrode side face of the positive electrode portion of each capacitor element; and In this configuration, at least one negative electrode side face of the shared side negative electrode structure, provided by a plurality of negative electrode portions stacked sequentially, is exposed from a second side face of the second side end of the insulating package, such that the second electrode structure layer is configured to directly electrically contact the at least one negative electrode side face of the shared side negative electrode structure.

9. The electronic device according to claim 6, characterized in that, wherein, The top end of the uppermost capacitor element will only contact the insulating package, and the bottom end of the lowermost capacitor element will only contact the insulating package. The insulating package has a top encapsulation portion located between the top end of the uppermost capacitor element and an upper surface of the insulating package, and a bottom encapsulation portion located between the bottom end of the lowermost capacitor element and a lower surface of the insulating package; and Wherein, the minimum thickness of the top encapsulation portion and the minimum thickness of the bottom encapsulation portion are both less than the maximum thickness of each capacitor element, and the volume occupied by the top encapsulation portion and the volume occupied by the bottom encapsulation portion of the insulating package are both less than the volume occupied by each capacitor element. 10.The electronic device of claim 9, Its features are, in, The first electrode structure layer includes a first bottom electrode portion disposed on a first portion bottom surface of the insulating package and a first side electrode portion disposed on a first side surface of the insulating package and electrically connected to the first bottom electrode portion; The second electrode structure layer includes a second bottom electrode portion disposed on a second portion bottom surface of the insulating package and a second side electrode portion disposed on a second side surface of the insulating package and electrically connected to the second bottom electrode portion. In this configuration, the positive electrode side face of the positive electrode portion of each capacitor element is configured as a positive electrode cutting surface, and at least one negative electrode side face of the shared side negative electrode structure provided by the sequential stacking of multiple negative electrode portions is configured as a negative electrode processing surface. In this embodiment, the positive electrode side end face of the positive electrode portion of each capacitor element directly contacts the first side end electrode portion of the first electrode structure layer and is separated from the first bottom end electrode portion of the first electrode structure layer. In this configuration, at least one negative electrode side face of the shared side negative electrode structure, provided by sequentially stacking multiple negative electrode portions, directly contacts the second side electrode portion of the second electrode structure layer and is separate from the second bottom electrode portion of the second electrode structure layer; and The stacked capacitor package structure is configured as a chip-type capacitor package structure that does not require bending of the positive electrode pins and does not require the use of a conductive carrier substrate.

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