Inner layer line conduction structure of circuit board

Abstract

The utility model provides an inner-layer line conduction structure of a circuit board, and relates to the technical field of circuit boards. The inner layer circuit conduction structure of the circuit board comprises a circuit board body, a through hole, a blind hole and a buried hole are respectively fixed in the circuit board body, and a closing plug is arranged on the inner wall of the blind hole; and grooves are formed in the two sides of the upper end of the through hole, connecting structures are arranged on the inner walls of the two grooves, two upper sealing frames are arranged on the connecting structures, fixing rods are fixed to the close sides of the two upper sealing frames, and lower sealing frames are fixed to the lower ends of the two fixing rods. According to the inner-layer circuit conduction structure of the circuit board, elastic force is generated through the reset spring, the fixed disc fixed to the reset spring is driven to move towards the direction close to the through hole, automatic sealing operation on the through hole is achieved, and the effect of improving the use convenience of the conduction structure is achieved; and the two upper sealing frames are far away from each other, so that a flexible pressing effect is achieved, and the effect of improving the use stability of the conduction structure is achieved.

Description

Technical Field

[0001] This utility model relates to the internal circuit conduction structure of a circuit board, and belongs to the field of circuit board technology. Background Technology

[0002] Flexible printed circuit boards (FPCBs), also known as PCBs, are highly reliable and extremely flexible printed circuit boards made with polyimide or polyester film as the substrate. They feature high wiring density, light weight, thinness, and good bendability, making them an important component in the electronics and information manufacturing industry.

[0003] Compare this to the inner layer circuit conduction structure of the circuit board with patent publication number CN222073479U, which includes a circuit board body, a protective head inserted into the top of the circuit board body, a sealing block fixedly connected to the bottom of the protective head, a positioning block fixedly connected to the bottom of the sealing block, a through hole fixedly connected inside the circuit board body, a blind hole fixedly connected to one side of the through hole, a buried hole fixedly connected to one side of the blind hole, an insulating layer fixedly connected inside the through hole, a drying layer fixedly connected to one side of the insulating layer, solder resist ink fixedly connected to one side of the drying layer, a circuit hole provided on one side of the solder resist ink, and a connecting rod fixedly connected inside the circuit hole.

[0004] The aforementioned patent still has the following problems in practical use: First, from the perspective of ease of use, in order to effectively prevent dust and other impurities from entering the through hole and affecting the stability and reliability of the circuit conduction, the current method is to insert sealing blocks into the two openings of the through hole. However, this operation method has obvious drawbacks. It greatly hinders the realization of automatic sealing operations. For large-scale production and automated production processes, it undoubtedly increases the difficulty of operation and time costs, reduces the overall production efficiency, and greatly reduces the convenience of the conduction structure in actual use, thus making the conduction structure insufficiently convenient to use.

[0005] Secondly, regarding stability, when the pins are connected into the conductive structure, the lack of necessary fixing devices makes the pins prone to wobbling during subsequent soldering. This wobbling not only causes significant inconvenience to the soldering process, increasing the difficulty and probability of errors, but also severely affects the firmness and stability of the connection between the pins and the conductive structure, thus resulting in insufficient stability of the conductive structure in use. Utility Model Content

[0006] (a) Technical problems to be solved

[0007] This utility model provides an inner layer circuit conduction structure for a circuit board to solve the problems of insufficient ease of use and insufficient stability of existing conduction structures.

[0008] (II) Technical Solution

[0009] This utility model is achieved through the following technical solution: the inner layer circuit conduction structure of the circuit board includes the circuit board body, and through holes, blind holes and buried holes are fixed inside the circuit board body respectively, and the inner wall of the blind hole is provided with a sealing plug;

[0010] The through hole has grooves on both sides of its upper end, and the inner walls of the two grooves are provided with a connecting structure. The connecting structure is provided with two upper sealing frames, and a fixing rod is fixed to the adjacent side of the two upper sealing frames. A lower sealing frame is fixed to the lower end of the two fixing rods. The connecting structure can slide along its own length with the two upper sealing frames to automatically close the through hole.

[0011] Preferably, the connection structure includes two return springs, each with a fixed plate at its other end, and an upper sealing frame at the upper end of each fixed plate.

[0012] Preferably, the outer surfaces of the two upper sealing frames are slidably connected to the inner walls on both sides of the upper end of the through hole, the two upper sealing frames are arranged in an inclined symmetrical manner, and the two fixing plates are fixed on the adjacent sides of the two upper sealing frames at the disjoint ends.

[0013] Preferably, the proximal ends of the two reset springs are fixed to the inner walls of the two grooves, and the disjoint ends of the two reset springs are fixed to the proximal sides of the two fixed discs.

[0014] Preferably, the upper ends of the two fixing rods are fixed to the two upper sealing frames on adjacent sides, and the lower ends of the two fixing rods are fixed to the two lower sealing frames on adjacent sides.

[0015] Preferably, two sliding grooves are provided at the proximal ends of the two upper sealing frames and the two lower sealing frames, wherein a sliding plate is slidably connected to the inner wall of each of the two sliding grooves, a buffer spring is fixed at one end of each sliding plate, and a fixing frame is fixed at the other end of each sliding plate, wherein a pressing frame is fixed at the other end of the two fixing frames.

[0016] Preferably, one end of each buffer spring is fixed to one side of each slide, and the other end of each buffer spring is fixed to the inner wall of each slide groove.

[0017] Preferably, one end of each of the fixing brackets is fixed to the other side of each slide, and the other end of each of the fixing brackets is fixed to one side of each extrusion bracket.

[0018] This utility model provides an inner layer circuit conduction structure for a circuit board, which has the following beneficial effects:

[0019] (1) The inner layer circuit conduction structure of the circuit board generates elastic force through the reset spring, which drives the fixed plate fixed to it to move towards the through hole, so that the groove, reset spring, fixed plate, upper sealing frame, fixed rod and lower sealing frame work together to realize the automatic sealing operation of the through hole. There is no need for the staff to manually seal the two ends of the through hole, which brings convenience to the staff and thus improves the ease of use of the conduction structure.

[0020] (2) The inner layer circuit conduction structure of the circuit board, when the connected pins squeeze the two upper cover frames that are set in an inclined and symmetrical manner, the two upper cover frames will move away from each other, so that the slide, slide plate, buffer spring, fixed frame and extrusion frame work together to achieve the effect of flexible pressing, effectively avoiding the position displacement of the pins during soldering, thereby improving the stability of the conduction structure. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a partial cross-sectional view of the present invention;

[0023] Figure 3 This utility model Figure 2 Enlarged view of the A-section structure;

[0024] Figure 4 This utility model Figure 2 Enlarged view of the structure of part B.

[0025] [Explanation of Key Component Symbols]

[0026] 1. Circuit board body; 2. Through hole; 3. Blind hole; 4. Buried hole; 5. Sealing plug; 6. Groove; 7. Return spring; 8. Fixing plate; 9. Upper sealing frame; 10. Fixing rod; 11. Lower sealing frame; 12. Slide groove; 13. Slide plate; 14. Buffer spring; 15. Fixing frame; 16. Extrusion frame. Detailed Implementation

[0027] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0028] Example 1

[0029] This utility model embodiment provides an inner layer circuit conduction structure for a circuit board.

[0030] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4The circuit board body 1 is the physical carrier of the entire circuit system, providing a basic platform for the installation and connection of various electronic components and circuits. It is typically made of insulating material, with complex circuits distributed inside and on its surface. These circuits perform the important functions of transmitting electrical signals and energy, and are key components for realizing various circuit functions. The circuit board body 1 contains through-holes 2, blind vias 3, and buried vias 4. Blind vias 3 have sealing plugs 5 on their inner walls. Through-holes 2 are holes that penetrate the circuit board body 1, establishing electrical connection channels between different layers of the circuit board. Blind vias 3 extend from the surface of the circuit board body 1 to a specific inner layer, but do not penetrate the entire circuit board. They are mainly used to connect the surface layer of the circuit board to a specific inner layer. In some circuit board designs with high wiring density requirements, blind vias 3 can effectively achieve electrical connections between different layers without penetrating the entire circuit board, which is beneficial for… The spatial layout and wiring design of the circuit board are optimized. The buried via 4 is completely hidden inside the circuit board body 1. It connects the inner layer circuits of the circuit board and is not directly connected to the surface layer of the circuit board. The presence of the buried via 4 further increases the wiring density of the circuit board. It can realize complex electrical connections inside the circuit board, allowing more circuits and components to be arranged in a limited space. This is of great significance for improving the performance and integration of the circuit board. The sealing plug 5 is used to seal the blind via 3 to prevent dust and impurities from accumulating in the blind via 3 during transportation, so as not to affect subsequent electrical connection operations. In the circuit board manufacturing process, the transportation link is unavoidable. As a key structure connecting the surface layer of the circuit board and specific internal layers, the cleanliness of the blind via 3 plays a decisive role in the stability and reliability of the electrical connection. When dust and impurities accumulate in the blind via 3, it may lead to an increase in the resistance of the electrical connection.

[0031] Grooves 6 are provided on both sides of the upper end of the through hole 2. The grooves 6 provide space for the reset springs 7. The inner walls of the two grooves 6 are provided with a connecting structure, which includes two reset springs 7. The reset springs 7 provide elastic support. The other end of the two reset springs 7 is fixed with a fixing plate 8. The fixing plate 8 is fixedly connected to the upper sealing frame 9. The upper sealing frame 9 is fixed at the upper end of the two fixing plates 8. The upper sealing frame 9 closes the upper opening of the through hole 2. Fixing rods 10 are fixed on the adjacent sides of the two upper sealing frames 9. The fixing rods 10 connect the upper sealing frame 9 and the lower sealing frame 11. The lower end of the two fixing rods 10 is fixed with the lower sealing frame 11. The lower sealing frame 11 closes the lower opening of the through hole 2.

[0032] Please refer to it again. Figure 1 , Figure 2 , Figure 3 and Figure 4It is worth noting that the outer surfaces of the two upper sealing frames 9 are slidably connected to the inner walls on both sides of the upper end of the through hole 2. The two upper sealing frames 9 are arranged in an inclined and symmetrical manner. The two fixing plates 8 are fixed to the two upper sealing frames 9 at opposite ends with their close sides. The two return springs 7 are fixed to the inner walls of the two grooves 6 at their close ends. The two return springs 7 are fixed to the two fixing plates 8 at opposite ends with their close sides. The upper ends of the two fixing rods 10 are fixed to the two upper sealing frames 9 at their close sides, and the lower ends of the two fixing rods 10 are fixed to the two lower sealing frames 11 at their close sides.

[0033] In use, this invention utilizes a return spring 7 to generate elastic force, causing the fixed plate 8, which is fixed to it, to move closer to the through hole 2. The upper sealing frame 9, connected to the fixed plate 8, then sits on the inner wall of the through hole 2. At this point, the two closest upper sealing frames 9 can close the upper opening of the through hole 2. These two upper sealing frames 9 then move the fixing rods 10 fixed on adjacent sides closer together. The two fixing rods 10 at the closest distance further move the lower sealing frames 11 fixed at their lower ends closer together. Finally, the two closest lower sealing frames 11 close the lower opening of the through hole 2, achieving automatic closure of the through hole 2 without requiring manual closure of both ends, thus improving the ease of use of the conductive structure.

[0034] Example 2

[0035] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 Based on Embodiment 1, a flexible pressing function has been added;

[0036] Please refer to it again. Figure 1 , Figure 2 , Figure 3 and Figure 4 It is worth noting that two upper sealing frames 9 and two lower sealing frames 11 are provided with two sliding grooves 12 at their near ends. The inner walls of the two sliding grooves 12 are slidably connected to sliding plates 13. Each sliding plate 13 has a buffer spring 14 fixed at one end. The buffer spring 14 and the return spring 7 cooperate with each other to achieve flexible snap-fit ​​of the pins in the through hole 2. This achieves a flexible snap-fit ​​effect, so that the pins can be directly soldered without manual pressing, thereby improving the connection stability. Each sliding plate 13 has a fixing frame 15 fixed at the other end. The two fixing frames 15 have a pressing frame 16 fixed at the other end. One end of each buffer spring 14 is fixed to one side of each sliding plate 13, and the other end of each buffer spring 14 is fixed to the inner wall of each sliding groove 12. One end of each fixing frame 15 is fixed to the other side of each sliding plate 13, and the other end of each fixing frame 15 is fixed to one side of each pressing frame 16.

[0037] In use, when the two inclined and symmetrically arranged upper sealing frames 9 are pressed by the connected pins, the two upper sealing frames 9 will move away from each other. These two moving upper sealing frames 9 will cause the two fixed disks 8 fixed at their opposite ends to also move away from each other. The two moving fixed disks 8 will stretch the two return springs 7 fixed on their adjacent sides, causing the two return springs 7 to generate elastic force.

[0038] As the pin is inserted into the through hole 2, the elastic force generated by the two stretched return springs 7 will drive the two upper sealing frames 9 towards the pin via the fixed plate 8. The two upper sealing frames 9 will drive the two pressing frames 16 towards each other via the fixed frame 15 connected to them. The two pressing frames 16 approaching each other will drive the connected fixed frame 15, and the slide plate 13 fixed at the other end of the fixed frame 15 will compress the buffer spring 14 fixed thereto.

[0039] In this way, the elastic force generated by the reset spring 7 and the elastic force generated by the buffer spring 14 can flexibly press the pin, achieving the effect of flexible pressing, effectively preventing the pin from shifting position during soldering, thereby improving the stability of the conductive structure.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An inner layer circuitry through structure of a circuit board, comprising a circuit board body (1), characterized in that: The through hole (2), the blind hole (3) and the buried hole (4) are respectively fixed in the circuit board body (1), and the inner wall of the blind hole (3) is provided with a closing plug (5); The upper end of the through hole (2) is provided with a groove (6) on both sides, and the inner wall of the two grooves (6) is provided with a connecting structure, and the connecting structure is provided with two upper sealing frames (9), and the proximal side of the two upper sealing frames (9) is fixed with a fixed rod (10), and the lower end of the two fixed rods (10) is fixed with a lower sealing frame (11); the connecting structure can slide with the two upper sealing frames (9) in the length direction of itself to automatically seal the through hole (2).

2. The inner layer circuitry via structure of claim 1, wherein: The connecting structure comprises two reset springs (7), and the other end of the two reset springs (7) is fixed with a fixed disc (8), and the upper end of the two fixed discs (8) is fixed with an upper sealing frame (9).

3. The inner layer circuitry via structure of claim 2, wherein: The outer surfaces of the two upper sealing frames (9) are slidingly connected to the inner walls on both sides of the upper end of the through hole (2), and the two upper sealing frames (9) are symmetrically arranged at an inclination, and the proximal sides of the two fixed discs (8) are fixed to the distal ends of the two upper sealing frames (9).

4. The inner layer circuitry via structure of claim 2, wherein: The proximal ends of the two reset springs (7) are fixed to the inner walls of the two grooves (6), and the distal ends of the two reset springs (7) are fixed to the proximal sides of the two fixed discs (8).

5. The inner layer circuitry via structure of claim 1, wherein: The upper ends of the two fixed rods (10) are fixed to the proximal sides of the two upper sealing frames (9), and the lower ends of the two fixed rods (10) are fixed to the proximal sides of the two lower sealing frames (11).

6. The inner layer circuitry via structure of claim 1, wherein: The proximal ends of the two upper sealing frames (9) and the two lower sealing frames (11) are provided with two sliding grooves (12), and the inner walls of the two sliding grooves (12) are slidingly connected with a sliding disc (13), and one end of each sliding disc (13) is fixed with a buffer spring (14), and the other end of each sliding disc (13) is fixed with a fixed frame (15), and the other end of the two fixed frames (15) is fixed with a pressing frame (16).

7. The inner layer circuitry via structure of claim 6, wherein: One end of each buffer spring (14) is fixed to one side of each sliding disc (13), and the other end of each buffer spring (14) is fixed to the inner wall of each sliding groove (12).

8. The inner layer circuitry via structure of claim 6, wherein: One end of each fixed frame (15) is fixed to the other side of each sliding disc (13), and the other end of each fixed frame (15) is fixed to one side of each pressing frame (16).

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