Notebook type ultrasonic detector

Abstract

The utility model provides a notebook type ultrasonic detector. The notebook type ultrasonic detector comprises a host, a display, a mainboard, an electronic component and a heat dissipation assembly, a containing cavity is formed in the host, and the displayer is rotatably connected to one side of the host. The mainboard is arranged in the containing cavity and comprises a first surface and a second surface, the first surface faces the displayer, and the second surface is opposite to the displayer. The input module is arranged on the first surface, and the input module is electrically connected with the mainboard and used for inputting a control signal. The electronic component is electrically connected with the mainboard and is arranged on the second surface, so that the electronic component is far away from the input module and the display, and interference of heat generated during operation of the electronic component on the input module and the display is avoided. The heat dissipation assembly is arranged in the containing cavity and corresponds to the electronic component, and the side, back to the mainboard, of the heat dissipation assembly is attached to the side, back to the displayer, of the host, so that the heat dissipation assembly can conduct heat generated by the electronic component to the outer side of the host to reduce the temperature of the mainboard.

Description

Technical Field

[0001] This utility model relates to the field of ultrasonic equipment technology, and in particular to a laptop-type ultrasonic testing instrument. Background Technology

[0002] Laptop-style ultrasound scanners are a type of portable ultrasound diagnostic device, commonly used in clinical testing and medical diagnosis in the healthcare field. Due to their portability, their applications are becoming increasingly widespread.

[0003] Currently, laptop-style ultrasonic testing instruments consist of a monitor and a main unit. The monitor is connected to the main unit and can rotate relative to it. The main unit includes a keyboard, motherboard, and a back cover assembly. The motherboard houses key components such as the ultrasonic module and core components such as the CPU. Typically, the keyboard and back cover assembly are located on opposite sides of the motherboard, while the key components and core components are distributed on the same side of the motherboard, closer to the keyboard. This can lead to the keyboard overheating during operation, and the key components and core components can generate electromagnetic interference, affecting the image display on the monitor and thus impacting the testing performance of the laptop-style ultrasonic testing instrument. Utility Model Content

[0004] The purpose of this invention is to provide a laptop-style ultrasonic testing instrument that optimizes the layout of the ultrasonic testing instrument and avoids the heat generated by key components and core parts during operation from affecting the use of the ultrasonic testing instrument.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] According to one aspect of the present invention, a laptop-type ultrasonic testing instrument is provided, the ultrasonic testing instrument comprising: a main unit forming a receiving cavity; a display rotatably connected to one side of the main unit; a motherboard disposed within the receiving cavity, the motherboard including a first surface facing the display and a second surface facing away from the display; an input module disposed on the first surface, the input module being used to input control signals and electrically connected to the motherboard; electronic components disposed on the second surface and electrically connected to the motherboard; and a heat dissipation assembly disposed within the receiving cavity and located on one side of the second surface of the motherboard, the heat dissipation assembly being disposed corresponding to the electronic components, and the side of the heat dissipation assembly facing away from the electronic components being attached to the side wall of the receiving cavity away from the display, for dissipating heat from the electronic components.

[0007] In one embodiment of this application, the ultrasonic testing instrument further includes an insulating film for insulation and heat insulation, the insulating film being wrapped around the side of the input module facing the motherboard.

[0008] In one embodiment of this application, the input module includes a keyboard assembly, which is integrated with the motherboard and located on the first surface, protruding from the host in the direction of the display, and the insulating film wraps around the side of the keyboard assembly facing the motherboard.

[0009] In one embodiment of this application, the input module includes a touch screen connected to the motherboard and located on the first surface, protruding from the host in the direction of the display, and the insulating film wrapping around the side of the touch screen facing the motherboard.

[0010] In one embodiment of this application, the input module includes a touch screen and a keyboard assembly, both of which are detachably connected to the host and located on the side of the host facing the display.

[0011] In one embodiment of this application, the ultrasonic detector further includes an external heat sink for heat dissipation, the external heat sink being detachably connected to the side of the host away from the display and configured corresponding to the heat dissipation component.

[0012] In one embodiment of this application, the electronic components include an ultrasound module, a controller, and a battery module. The ultrasound module is used to electrically connect to a probe, and the controller is electrically connected to the ultrasound module and the input module, enabling the controller to control the ultrasound module through the control signal. The battery module is used to provide electrical energy.

[0013] In one embodiment of this application, the host includes a main shell and a bottom shell, the bottom shell being detachably connected to the main shell and forming the receiving cavity between the main shell and the bottom shell.

[0014] In one embodiment of this application, the main shell includes a cover and a middle frame, the cover being connected to the middle frame, and the bottom shell being detachably connected to the middle frame and located on one side opposite to the cover.

[0015] In one embodiment of this application, the ultrasonic detector further includes a cooling fan for heat dissipation, the cooling fan being installed inside the receiving cavity, and the main unit having ventilation holes corresponding to the cooling fan.

[0016] As can be seen from the above technical solution, this utility model has at least the following advantages and positive effects:

[0017] In this invention, a laptop-style ultrasonic testing instrument includes a main unit, a display, a motherboard, electronic components, and a heat dissipation assembly. The main unit has a receiving cavity, and the display is rotatably connected to one side of the main unit. The motherboard is disposed within the receiving cavity and includes a first surface and a second surface, with the first surface facing the display and the second surface facing away from the display. An input module is disposed on the first surface and electrically connected to the motherboard for inputting control signals. The electronic components are electrically connected to the motherboard and disposed on the second surface, thus keeping them away from the input module and the display, thereby preventing heat generated during operation from interfering with the input module and the display.

[0018] Meanwhile, the heat dissipation component is located inside the housing cavity and is positioned in accordance with the electronic components. The side of the heat dissipation component facing away from the motherboard is attached to the side of the host facing away from the display, so that the heat dissipation component can conduct the heat generated by the electronic components to the outside of the host to reduce the temperature of the motherboard and thus prevent the heat generated on the motherboard from affecting the input module and the display. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a notebook-type ultrasonic testing instrument according to an embodiment of the present invention.

[0020] Figure 2 yes Figure 1 An exploded view of an ultrasonic testing instrument.

[0021] Figure 3 yes Figure 1 A schematic diagram of the first surface of the motherboard of an ultrasonic testing instrument.

[0022] Figure 4 yes Figure 1 A schematic diagram of the second surface of the motherboard of the ultrasonic testing instrument.

[0023] Figure 5 yes Figure 1 An exploded view of the main unit of the ultrasonic testing instrument.

[0024] Figure 6 yes Figure 1 A simplified schematic diagram of the main unit of the ultrasonic testing instrument.

[0025] The annotations in the attached figures are explained as follows:

[0026] 10-Main unit; 11-Receiving cavity; 12-Main shell; 13-Bottom shell; 14-Cover; 15-Middle frame; 20-Display; 30-Main board; 31-First surface; 32-Second surface; 40-Input module; 41-Touch screen; 42-Keyboard assembly; 50-Electronic components; 51-Ultrasonic module; 52-Controller; 53-Battery module; 60-Heat dissipation assembly; 61-External heat sink; 62-Cooling fan; 70-Insulating film; 511-Ultrasonic interface. Detailed Implementation

[0027] Typical embodiments embodying the features and advantages of this utility model will be described in detail in the following description. It should be understood that this utility model can have various variations in different embodiments, all of which do not depart from the scope of this utility model, and the descriptions and illustrations therein are for illustrative purposes only and not intended to limit this utility model.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] Currently, laptop-style ultrasonic testing instruments consist of a monitor and a main unit. The monitor is connected to the main unit and can rotate relative to it. The main unit includes a keyboard, motherboard, and a back cover assembly. The motherboard houses key components such as the ultrasonic module and core components such as the CPU. Typically, the keyboard and back cover assembly are located on opposite sides of the motherboard, while the key components and core components are distributed on the same side of the motherboard, closer to the keyboard. This leads to the keyboard easily overheating during operation, and the key components and core components are prone to generating electromagnetic interference, which affects the image display on the monitor and thus the testing performance of the laptop-style ultrasonic testing instrument. Therefore, a laptop-style ultrasonic testing instrument is proposed to solve the above problems.

[0030] The solution is further illustrated by the following examples:

[0031] Figure 1 This is a schematic diagram of a notebook-type ultrasonic testing instrument according to an embodiment of the present invention. Figure 2 yes Figure 1 An exploded view of an ultrasonic testing instrument. Figure 3 yes Figure 1 A schematic diagram of the first surface of the motherboard of an ultrasonic testing instrument. Figure 4 yes Figure 1 A schematic diagram of the second surface of the motherboard of the ultrasonic testing instrument.

[0032] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 The laptop-style ultrasound detector of this embodiment can be used for clinical testing and medical diagnosis, and the laptop-style ultrasound detector is convenient for medical staff to move and carry.

[0033] Specifically, the ultrasonic testing instrument may include a main unit 10, a display 20, a main board 30, an input module 40, electronic components 50, and a heat dissipation assembly 60. The display 20 is rotatably connected to the main unit 10, the main board 30, the input module 40, and the heat dissipation assembly 60 are all mounted on the main unit 10, and the electronic components 50 are located on the main board 30, on the side of the main board 30 opposite to the display 20.

[0034] Figure 5 yes Figure 1 An exploded view of the main unit of the ultrasonic testing instrument.

[0035] See Figure 2 and Figure 5 The host 10 has a receiving cavity 11 inside, in which the motherboard 30, electronic components 50 and heat dissipation components 60 are all housed.

[0036] Specifically, the main unit 10 may include a main shell 12 and a bottom shell 13, with the bottom shell 13 detachably connected to the main shell 12 and forming a receiving cavity 11 between the main shell 12 and the bottom shell 13.

[0037] The motherboard 30 is installed inside the receiving cavity 11 and is fixedly connected to the main shell 12. Electronic components 50 are disposed on the motherboard 30 and located on the side of the motherboard 30 facing the bottom shell 13. Since the bottom shell 13 is detachably connected to the main shell 12, the user can directly repair the electronic components 50 on the motherboard 30 after opening the bottom shell 13, thus facilitating the maintenance of the main unit 10.

[0038] In this embodiment, the main shell 12 may include a cover 14 and a middle frame 15. The cover 14 is connected to the middle frame 15, and the bottom shell 13 is detachably connected to the middle frame 15 and located on the side opposite to the cover 14, thereby forming a receiving cavity 11 between the cover 14, the middle frame 15 and the bottom shell 13, and facilitating the installation and removal of the bottom shell 13.

[0039] See Figure 1 and Figure 2The display 20 is rotatably connected to one side of the main unit 10, allowing it to rotate relative to the main unit 10. This enables the display 20 to be unfolded or folded relative to the main unit 10, facilitating the use and portability of the ultrasonic testing instrument. The display 20 is electrically connected to the main board 30 to display image information for user viewing.

[0040] It should be noted that the display 20 can be connected to the middle frame 15 and rotate relative to the main shell 12. Of course, the display 20 can also be connected to the cover 14 and rotate relative to the main shell 12.

[0041] In some other embodiments, the display 20 may also be attached to the bottom housing 13, allowing the display 20 to rotate relative to the bottom housing 13 and the main housing 12. When the display 20 is attached to the host 10, the display surface of the display 20 can abut against the main housing 12.

[0042] See Figure 2 and Figure 4 The motherboard 30 may include a first surface 31 and a second surface 32. The first surface 31 is located on the side of the motherboard 30 facing the display 20, and the second surface 32 is located on the side of the motherboard 30 away from the display 20. That is, the first surface 31 and the second surface 32 are located on opposite sides of the motherboard 30, and the second surface 32 is disposed facing the bottom shell 13.

[0043] In this embodiment, the input module 40 is disposed on the first surface 31 of the motherboard 30 and located within the receiving cavity 11, that is, the input module 40 is located between the display 20 and the motherboard 30. Furthermore, the input module 40 is electrically connected to the motherboard 30 and is used to input control signals, allowing the user to control the operation of the ultrasonic detector through the input module 40.

[0044] See Figure 3 The input module 40 may include a touch screen 41 and a keyboard assembly 42. Both the touch screen 41 and the keyboard assembly 42 are electrically connected to the motherboard 30.

[0045] In this embodiment, the touch screen 41 can be connected to the motherboard 30. Specifically, the touch screen 41 is directly connected to the motherboard 30 and electrically connected to it. Meanwhile, the keyboard assembly 42 can be integrated with the motherboard 30, thereby simplifying the installation structure of the keyboard assembly 42 and the touch screen 41, reducing the volume occupied by the keyboard assembly 42 and the touch screen 41 during installation, and further reducing the volume of the motherboard 30 facing the display 20, thus enabling the ultrasonic testing instrument to be made thinner and lighter.

[0046] In some other embodiments, the touchscreen 41 and the keyboard assembly 42 are both detachably connected to the host 10 and located on the side of the host 10 facing the display 20. Specifically, the touchscreen 41 and the keyboard assembly 42 are both detachably connected to the main housing 12, thereby facilitating the repair or replacement of the touchscreen 41 and the keyboard assembly 42.

[0047] It should be noted that the touch screen 41 and the keyboard assembly 42 are both located on the first surface 31, and both the touch screen 41 and the keyboard assembly 42 protrude from the host 10 or the receiving cavity 11 toward the display 20, so that the user can directly control the touch screen 41 and the keyboard assembly 42.

[0048] In some other embodiments, the input module 40 may consist only of a keyboard assembly 42. The keyboard assembly 42 is formed on the motherboard 30 and located on the first surface 31, thereby reducing the volume occupied by the keyboard assembly 42 during installation and reducing the volume of the motherboard 30 facing the display 20, allowing the host 10 or ultrasonic testing device to be made thinner and lighter. Simultaneously, the keyboard assembly 42 protrudes from the host 10 or the receiving cavity 11 towards the display 20, allowing the user to directly operate the keyboard assembly 42.

[0049] Figure 6 yes Figure 1 A simplified schematic diagram of the main unit of the ultrasonic testing instrument.

[0050] See Figure 6 The ultrasonic testing instrument may also include an insulating film 70. The insulating film 70 is used for insulation and heat insulation, and is wrapped around the side of the input module 40 facing the motherboard 30 to prevent the heat generated on the motherboard 30 from affecting the input module 40.

[0051] Specifically, since the touch screen 41 is located close to the motherboard 30, an insulating film 70 is wrapped around the side of the touch screen 41 facing the motherboard 30, which can effectively prevent heat radiation or electromagnetic waves on the motherboard 30 from affecting the operation of the touch screen 41.

[0052] Similarly, since the keyboard assembly 42 is located close to or integrated with the motherboard 30, wrapping the side of the keyboard assembly 42 facing the motherboard 30 with an insulating film 70 can effectively prevent heat radiation or electromagnetic waves from the motherboard 30 from affecting the operation of the keyboard assembly 42.

[0053] See Figure 2 and Figure 4The electronic component 50 is electrically connected to the motherboard 30 and is located on the second surface 32. That is, in this embodiment, the input module 40 and the electronic component 50 are located on opposite sides of the motherboard 30, thereby avoiding the heat generated by the electronic component 50 during operation from affecting the operation of the input module 40, and also avoiding the input module 40 from overheating and affecting the operator's experience.

[0054] Specifically, the electronic component 50 includes an ultrasonic module 51 and a controller 52. The ultrasonic module 51 and the second surface 32 are both located on the second surface 32. The controller 52 is electrically connected to the ultrasonic module 51 and the input module 40, enabling the controller 52 to control the operation of the ultrasonic module 51 through control signals.

[0055] In this embodiment, the ultrasound module 51 and controller 52 can be configured as key components and core parts of the ultrasound detector. The ultrasound module 51 is used to electrically connect to the probe, allowing the image data read by the probe to be converted and transmitted to the motherboard 30. The controller 52 can be configured as the processing center of the host 10, such as a CPU module, enabling the controller 52 to process relevant data and control the operation of the ultrasound detector.

[0056] It should be noted that electronic components 50 may also include a BIOS (Basic Input Output System) chip, a northbridge chip, a southbridge chip, memory slots, expansion slots, and a power supply module, etc., to ensure the normal operation of the motherboard 30.

[0057] Meanwhile, since the electronic component 50 is located on the second surface 32, that is, on the side of the motherboard 30 away from the input module 40, the heat or electromagnetic waves generated by the electronic component 50 during operation will not directly affect the input module 40 and the display 20, thereby avoiding interference to the input module 40 and the display 20 during operation.

[0058] It should be noted that the electronic component 50 is the main heat-generating component of the motherboard 30. Furthermore, the electronic component 50 is located on the second surface 32 of the motherboard 30. This avoids the problem of needing to set up a heat dissipation channel between the motherboard 30 and the main shell 12 when the electronic component 50 is located on the first surface 31. In other words, while avoiding interference from the electronic component 50 to the input module 40, it also reduces the space between the motherboard 30 and the main shell 12, thereby compressing the size of the host 10 and making the host 10 or ultrasonic detector thinner and lighter.

[0059] See Figure 2 and Figure 5The ultrasonic testing instrument may also include an ultrasonic interface 511, which is connected to the motherboard 30 and located on the second surface 32, and electrically connected to the ultrasonic module 51 to facilitate the connection between the probe and the host 10. It should be noted that if the ultrasonic interface 511 is located on the first surface 31, it will affect the space between the motherboard 30 and the main housing 12. That is, a larger space needs to be reserved between the motherboard 30 and the main housing 12 to install the ultrasonic interface 511, thus affecting the overall thinness and lightness of the host 10 or the ultrasonic testing instrument. Therefore, placing the ultrasonic interface 511 on the second surface 32 avoids the above problems.

[0060] See Figure 2 , Figure 4 , Figure 5 and Figure 6 The heat dissipation component 60 is disposed within the receiving cavity 11 and located on one side of the second surface 32 of the motherboard 30. The heat dissipation component 60 is disposed corresponding to the ultrasonic module 51 and the controller 52, and the side of the heat dissipation component 60 away from the ultrasonic module 51 and the controller 52 is attached to the side wall of the receiving cavity 11 away from the display 20, so that the heat dissipation component 60 can dissipate heat and cool down the ultrasonic module 51 and the controller 52.

[0061] It should be noted that the heat dissipation component 60 can be directly connected to the motherboard 30, or it can be set apart from the motherboard 30.

[0062] Meanwhile, the side of the heat dissipation component 60 facing away from the motherboard 30 is attached to the side of the host 10 facing away from the display 20, that is, the heat dissipation component 60 is pressed against the bottom shell 13, so that the heat dissipation component 60 can directly conduct the heat generated by the ultrasonic module 51 and the controller 52 to the outside of the host 10, thereby reducing the temperature inside the housing cavity 11, thereby reducing the temperature of each module or component on the motherboard 30, and preventing the temperature on the motherboard 30 from being too high and affecting the operation of the input module 40 and the display 20.

[0063] In this embodiment, the heat dissipation component 60 can be placed between the electronic components 50 of the motherboard 30 and the bottom shell 13, thereby improving the structural strength between the bottom shell 13 and the motherboard 30 and preventing the bottom shell 13 from deforming during use.

[0064] It should be noted that the bottom shell 13 can be a metal bottom shell that is easy to conduct heat, or it can be a graphene bottom shell that is easy to conduct heat, in order to improve the heat dissipation efficiency of the bottom shell 13, thereby avoiding the overheating of various modules or components on the motherboard 30 and affecting the operation of the host 10.

[0065] In addition, since the heat dissipation component 60 can directly dissipate the heat generated by components such as the ultrasonic module 51 and the controller 52 to the outside of the host 10 through the bottom shell 13, there is no need to reserve too much space between the motherboard 30 and the bottom shell 13 for heat dissipation, thereby reducing the size of the host 10 and making ultrasonic testing even thinner and lighter.

[0066] See Figure 5 The ultrasonic testing instrument may also include an external heat sink 61 for heat dissipation. The external heat sink 61 is detachably connected to the side of the host 10 away from the display 20 and is positioned corresponding to the heat dissipation component 60. The external heat sink 61 improves the heat dissipation efficiency of the bottom case 13 to the external environment, thereby improving the overall heat dissipation efficiency of the host 10 and ensuring that the operating temperature of the motherboard 30 remains within a suitable range.

[0067] It should be noted that the external heat sink 61 is configured to correspond with the heat dissipation component 60, which can shorten the heat transfer path and improve heat dissipation efficiency. In actual use, the external heat sink 61 can be mounted on a support base or support frame, so that the external heat sink 61 placed on the support base or support frame can dissipate heat from the host 10.

[0068] In addition, the ultrasonic testing instrument may also include a cooling fan 62 for heat dissipation. The cooling fan 62 is mounted inside the housing cavity 11, and the main unit 10 has ventilation holes corresponding to the cooling fan 62. Specifically, the cooling fan 62 is electrically connected to the motherboard 30, and is located in the space between the motherboard 30 and the bottom shell 13. When the cooling fan 62 is running, it drives the airflow within the space between the motherboard 30 and the bottom shell 13, thereby improving the heat dissipation efficiency within the housing cavity 11 and preventing the motherboard 30 and electronic components 50 from overheating during operation.

[0069] See Figure 2 , Figure 4 and Figure 5 The electronic component 50 may also include a battery module 53. The battery module 53 is mounted on the motherboard 30 and located on the side of the motherboard 30 facing the bottom housing 13, i.e., on the second surface 32. This prevents the heat generated by the battery module 53 during operation from affecting the input module 40. The battery module 53 can provide electrical power, facilitating the use of the ultrasonic testing instrument.

[0070] In summary, a receiving cavity 11 is formed on the host 10, and the display 20 is rotatably connected to one side of the host 10. A motherboard 30 is disposed within the receiving cavity 11. The motherboard 30 includes a first surface 31 and a second surface 32, with the first surface 31 facing the display 20 and the second surface 32 facing away from the display 20. An input module 40 is disposed on the first surface 31 and is electrically connected to the motherboard 30 for inputting control signals. Electronic components are electrically connected to the motherboard 30 and disposed on the second surface 32, keeping them away from the input module 40 and the display 20, thereby preventing heat generated during operation from interfering with the input module 40 and the display 20.

[0071] Meanwhile, the heat dissipation component 60 is located inside the receiving cavity 11 and is positioned corresponding to the electronic components. The side of the heat dissipation component 60 facing away from the motherboard 30 is attached to the side of the host 10 facing away from the display 20, so that the heat dissipation component 60 can conduct the heat generated by the electronic components to the outside of the host 10, thereby reducing the temperature of the motherboard 30 and preventing the heat generated on the motherboard 30 from affecting the input module 40 and the display 20.

[0072] Although the present invention has been described with reference to several typical embodiments, it should be understood that the terminology used is descriptive and exemplary, and not restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A notebook-style ultrasonic testing instrument, characterized in that, The ultrasonic testing instrument includes: The host unit forms a containment cavity; The display is rotatably connected to one side of the host computer; A motherboard is disposed within the receiving cavity, the motherboard including a first surface facing the display and a second surface facing away from the display; An input module is disposed on the first surface, the input module is used to input control signals, and the input module is electrically connected to the motherboard; Electronic components are disposed on the second surface and electrically connected to the motherboard; A heat dissipation component is disposed within the receiving cavity and located on one side of the second surface of the motherboard. The heat dissipation component is disposed corresponding to the electronic components, and the side of the heat dissipation component away from the electronic components is attached to the side wall of the receiving cavity away from the display to dissipate heat from the electronic components.

2. The ultrasonic testing instrument according to claim 1, characterized in that, It also includes an insulating film for insulation and heat insulation, which wraps around the side of the input module facing the motherboard.

3. The ultrasonic testing instrument according to claim 2, characterized in that, The input module includes a keyboard assembly, which is integrated with the motherboard and located on the first surface. The keyboard assembly protrudes from the host in the direction of the display, and the insulating film wraps around the side of the keyboard assembly facing the motherboard.

4. The ultrasonic testing instrument according to claim 2, characterized in that, The input module includes a touch screen, which is connected to the motherboard and located on the first surface, protruding from the host in the direction of the display, and the insulating film is wrapped around the side of the touch screen facing the motherboard.

5. The ultrasonic testing instrument according to claim 1, characterized in that, The input module includes a touch screen and a keyboard assembly, both of which are detachably connected to the host and located on the side of the host facing the display.

6. The ultrasonic testing instrument according to claim 1, characterized in that, It also includes an external heat sink for heat dissipation, which is detachably connected to the side of the host away from the display and is configured corresponding to the heat dissipation component.

7. The ultrasonic testing instrument according to claim 1, characterized in that, The electronic components include an ultrasound module, a controller, and a battery module. The ultrasound module is used to electrically connect to the probe. The controller is electrically connected to the ultrasound module and the input module, enabling the controller to control the ultrasound module through the control signal. The battery module is used to provide power.

8. The ultrasonic testing instrument according to claim 1, characterized in that, The main unit includes a main shell and a bottom shell, the bottom shell being detachably connected to the main shell and forming the receiving cavity between the main shell and the bottom shell.

9. The ultrasonic testing instrument according to claim 8, characterized in that, The main shell includes a cover and a middle frame. The cover is connected to the middle frame, and the bottom shell is detachably connected to the middle frame and located on one side opposite the cover.

10. The ultrasonic testing instrument according to claim 1, characterized in that, It also includes a cooling fan for heat dissipation, which is installed inside the receiving cavity. The host has ventilation holes, which are provided corresponding to the cooling fan.

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