Cleaning device for semiconductor equipment parts

Abstract

The semiconductor equipment part cleaning device comprises a bottom plate, a groove is formed in the upper surface of the bottom plate, an electric push rod is fixedly installed on the inner side wall of the groove, a control block is fixedly installed at the telescopic end of the electric push rod, and a bent plate is fixedly installed on the upper surface of the control block; an air pump is fixedly installed on the upper surface of the bent plate, the output end of the air pump fixedly communicates with a bent pipe, and the right end of the bent pipe fixedly communicates with a shell. According to the device, through cooperation of the motor, the rotating rod and the rotating disc, the rotating disc can rotate, the rotating disc can drive a workpiece to rotate, through cooperation of an air pump, a bent pipe and a shell, air pressure can be provided for a nozzle, the nozzle can blow air to semiconductor equipment parts, and through cooperation of a spring, a brush and a sliding rod, the air pressure can be provided for the nozzle; and the brush plate can clean the top of the part, so that a worker does not need to turn over the workpiece, and the cleaning speed of the part is increased.

Description

Technical Field

[0001] This application relates to the field of semiconductor component technology, and in particular to a cleaning device for semiconductor equipment components. Background Technology

[0002] Semiconductor components refer to various basic elements and components used in semiconductor devices and systems. They are widely used in electronics, communications, computers, automobiles and other fields. These components play a vital role in modern technology, supporting the operation of various electronic devices. Semiconductor components include, but are not limited to, transistors, diodes, capacitors, integrated circuits (ICs) and so on.

[0003] Referring to patent publication number CN220941995U, a cleaning device for semiconductor equipment components relates to the field of component processing technology. It includes a cleaning workbench with a high-efficiency cleaning mechanism on its top and auxiliary cleaning mechanisms on its top and bottom. The high-efficiency cleaning mechanism includes a convenient disassembly unit and a rotating cleaning unit. The auxiliary cleaning mechanism includes a convenient movement unit and a dust suppression unit. The rotating cleaning unit includes an initial dust collection cylinder with a ring-shaped support net fixedly installed on its inner wall. This invention, through the design of a drive motor, can drive a square shaft to rotate, synchronously driving a cross-shaped connector and a brush body to rotate. The rotating brush body enables automatic brushing cleaning of components, avoiding the problem of component damage easily caused by water rinsing, while also reducing water waste and increasing environmental friendliness.

[0004] While the above solution can clean the components, it still has some shortcomings. For example, it is not easy to control the rotation of the semiconductor components, which requires the staff to make multiple adjustments during cleaning, seriously affecting the cleaning speed.

[0005] To address this issue, we propose a cleaning device for semiconductor equipment components. Utility Model Content

[0006] The purpose of this application is to provide a cleaning device for semiconductor equipment components to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A cleaning device for semiconductor equipment components includes a base plate. A groove is formed on the upper surface of the base plate. An electric push rod is fixedly installed on the inner wall of the groove. A control block is fixedly installed on the telescopic end of the electric push rod. A curved plate is fixedly installed on the upper surface of the control block. An air pump is fixedly installed on the upper surface of the curved plate. The output end of the air pump is fixedly connected to a curved pipe. The right end of the curved pipe is fixedly connected to a housing. Nozzles are fixedly connected to the inner side wall and the inner top wall of the housing. The bottom surface of the housing is fixedly installed to the upper surface of the curved plate. The base plate... A motor is fixedly installed on the bottom surface of the housing. A rotating shaft is fixedly installed on the output end of the motor. A turntable is fixedly installed on the upper surface of the rotating shaft. Support plates are fixedly installed on both the front and back of the housing. Each support plate has two sliding holes on its upper surface. A sliding rod is slidably connected to the inner wall of each sliding hole. Two control rods are fixedly installed at the top of the two sets of sliding rods. Two brush plates are fixedly installed at the bottom of the two sets of sliding rods. A spring is sleeved on the outer surface of each sliding rod. A control panel is fixedly installed on the upper surface of the bottom plate.

[0009] In a further embodiment, two support seats are provided below the base plate, and the upper surface of each support seat is fixedly installed to the bottom surface of the base plate.

[0010] In a further embodiment, a fixing seat is fixedly installed on both the front and back of the housing, and the bottom surface of each fixing seat is fixedly installed to the upper surface of the curved plate.

[0011] In a further embodiment, an annular groove is provided on the upper surface of the base plate, and two sets of sliders are slidably connected to the inner wall of the annular groove. The upper surface of each slider is fixedly installed to the bottom surface of the turntable.

[0012] In a further embodiment, an anti-slip pad is provided above the base plate, and the bottom surface of the anti-slip pad is fixedly installed on the upper surface of the turntable.

[0013] In a further embodiment, two warning strips are provided above the base plate, and the bottom surface of each warning strip is fixedly installed to the upper surface of the base plate.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This application, through the cooperation of a motor, a rotating rod, and a turntable, enables the turntable to rotate, thereby driving the workpiece to rotate. Through the cooperation of an air pump, a bent pipe, and a housing, air pressure can be provided to the nozzle, enabling the nozzle to blow air onto the semiconductor equipment components. Furthermore, through the cooperation of a spring, a brush, and a sliding rod, the brush plate can clean the top of the components, thus eliminating the need for workers to flip the workpieces and improving the cleaning speed of the components. Attached Figure Description

[0016] Figure 1 A three-dimensional structural diagram of a cleaning device for semiconductor equipment components.

[0017] Figure 2 This is a side view of a three-dimensional structural diagram of a cleaning device for semiconductor equipment components.

[0018] Figure 3 This is a three-dimensional structural schematic diagram of a cleaning device for semiconductor equipment components, shown in a cross-sectional view.

[0019] Figure 4 Cleaning equipment for semiconductor equipment components Figure 1 Enlarged schematic diagram of the structure at point A in the middle.

[0020] In the diagram: 1. Base plate; 2. Groove; 3. Electric push rod; 4. Bend plate; 5. Air pump; 6. Bend pipe; 7. Housing; 8. Nozzle; 9. Control block; 10. Warning strip; 11. Turntable; 12. Annular groove; 13. Anti-slip pad; 14. Slider; 15. Control panel; 16. Motor; 17. Shaft; 18. Fixing base; 19. Support plate; 20. Sliding hole; 21. Sliding rod; 22. Control rod; 23. Brush plate; 24. Spring; 25. Support base. Detailed Implementation

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4In this utility model, a cleaning device for semiconductor equipment components includes a base plate 1. Two warning strips 10 are provided on the upper part of the base plate 1. The bottom surface of each warning strip 10 is fixedly installed to the upper surface of the base plate 1. The warning strips 10 can warn non-staff members and prevent them from loosening the device. Two support seats 25 are provided on the lower part of the base plate 1. The upper surface of each support seat 25 is fixedly installed to the bottom surface of the base plate 1. The support seats 25 can support the base plate 1 and make the base plate 1 more stable during use.

[0024] A groove 2 is provided on the upper surface of the base plate 1. An electric push rod 3 is fixedly installed on the inner side wall of the groove 2. A control block 9 is fixedly installed on the telescopic end of the electric push rod 3. A bent plate 4 is fixedly installed on the upper surface of the control block 9. An air pump 5 is fixedly installed on the upper surface of the bent plate 4. A bent pipe 6 is fixedly connected to the output end of the air pump 5. A housing 7 is fixedly connected to the right end of the bent pipe 6. A fixing seat 18 is fixedly installed on both the front and back of the housing 7. The bottom surface of each fixing seat 18 is fixedly installed to the upper surface of the bent plate 4. The fixing seat 18 can be used to reinforce the housing 7 and prevent the housing 7 from becoming loose. A nozzle 8 is fixedly connected to both the inner side wall and the inner top wall of the housing 7.

[0025] The bottom surface of the housing 7 is fixedly installed on the upper surface of the curved plate 4. A motor 16 is fixedly installed on the bottom surface of the base plate 1. A rotating shaft 17 is fixedly installed on the output end of the motor 16. A turntable 11 is fixedly installed on the upper surface of the rotating shaft 17. An anti-slip pad 13 is provided on the top of the base plate 1. The bottom surface of the anti-slip pad 13 is fixedly installed on the upper surface of the turntable 11. The anti-slip pad 13 can increase the friction of the surface of the turntable 11 and prevent the turntable 11 from becoming loose. An annular groove 12 is provided on the upper surface of the base plate 1. Two sets of sliders 14 are slidably connected to the inner wall of the annular groove 12. The upper surface of each slider 14 is fixedly installed on the bottom surface of the turntable 11. The annular groove 12 and the sliders 14 can reinforce the turntable 11 and prevent the turntable 11 from becoming loose.

[0026] Support plates 19 are fixedly installed on both the front and back of the housing 7. Each support plate 19 has two sliding holes 20 on its upper surface. Each sliding hole 20 has a sliding rod 21 slidably connected to its inner wall. Two control rods 22 are fixedly installed at the top of the two sets of sliding rods 21. Two brush plates 23 are fixedly installed at the bottom of the two sets of sliding rods 21. A spring 24 is sleeved on the outer surface of each sliding rod 21. A control panel 15 is fixedly installed on the upper surface of the base plate 1.

[0027] The working principle of this application is:

[0028] In use, the parts are first placed on the turntable 11, and then the motor 16 is started, which drives the turntable 11 to rotate through the rotating shaft 17. This causes the turntable 11 to rotate the parts. Then, the air pump 5 is started, which blows air into the housing 7 through the bent pipe 6, increasing the air pressure inside the housing 7. The nozzle 8 blows air onto the parts, removing dust. The electric push rod 3 is then started, which pushes the control block 9 to move. The control block 9 then moves the bent plate 4, which in turn moves the housing 7, allowing it to get closer to the parts for cleaning. Under the action of the spring 24, the brush plate 23 is pushed downwards, allowing it to clean the surface of the parts.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A cleaning device for semiconductor equipment components, characterized in that: The system includes a base plate (1), on the upper surface of which a groove (2) is provided. An electric push rod (3) is fixedly installed on the inner wall of the groove (2). A control block (9) is fixedly installed on the telescopic end of the electric push rod (3). A bent plate (4) is fixedly installed on the upper surface of the control block (9). An air pump (5) is fixedly installed on the upper surface of the bent plate (4). The output end of the air pump (5) is fixedly connected to a bent pipe (6). The right end of the bent pipe (6) is fixedly connected to a housing (7). A nozzle (8) is fixedly connected to both the inner wall and the inner top wall of the housing (7). The bottom surface of the housing (7) is fixedly installed to the upper surface of the bent plate (4). A motor (16) is fixedly installed on the bottom surface of the base plate (1). The output end of the motor (16) is fixedly mounted with a rotating shaft (17), and a turntable (11) is fixedly mounted on the upper surface of the rotating shaft (17). Support plates (19) are fixedly mounted on the front and back of the housing (7). Two sliding holes (20) are opened on the upper surface of each support plate (19). A sliding rod (21) is slidably connected to the inner wall of each sliding hole (20). Two control rods (22) are fixedly mounted at the top of the two sets of sliding rods (21). Two brush plates (23) are fixedly mounted at the bottom of the two sets of sliding rods (21). A spring (24) is sleeved on the outer surface of each sliding rod (21). A control panel (15) is fixedly mounted on the upper surface of the base plate (1).

2. The cleaning device for semiconductor equipment components according to claim 1, characterized in that: Two support seats (25) are provided below the base plate (1), and the upper surface of each support seat (25) is fixedly installed to the bottom surface of the base plate (1).

3. The cleaning device for semiconductor equipment components according to claim 1, characterized in that: A fixing seat (18) is fixedly installed on both the front and back of the housing (7), and the bottom surface of each fixing seat (18) is fixedly installed on the upper surface of the bending plate (4).

4. The cleaning device for semiconductor equipment components according to claim 1, characterized in that: The upper surface of the base plate (1) is provided with an annular groove (12), and the inner wall of the annular groove (12) is slidably connected with two sets of sliders (14). The upper surface of each slider (14) is fixedly installed with the bottom surface of the turntable (11).

5. A cleaning device for semiconductor equipment components according to claim 1, characterized in that: An anti-slip pad (13) is provided above the base plate (1), and the bottom surface of the anti-slip pad (13) is fixedly installed on the upper surface of the turntable (11).

6. A cleaning device for semiconductor equipment components according to claim 1, characterized in that: Two warning strips (10) are provided above the base plate (1), and the bottom surface of each warning strip (10) is fixedly installed to the upper surface of the base plate (1).

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