Packaging equipment of embedded intelligent integrated sensing magnetic ring

Abstract

The utility model discloses a packaging device of embedded intelligent integrated sensing magnetic ring, specifically relates to electronic packaging technical field, including transfer subassembly, positioning cleaning subassembly, burdening subassembly and potting subassembly, the positioning cleaning subassembly is installed above transfer subassembly, and the burdening subassembly is placed on the side face of positioning cleaning subassembly, and the potting subassembly is placed on the side face of the burdening subassembly. By means of the positioning and cleaning assembly, when the packaging equipment uses a mechanical arm to splice a substrate and a magnetic ring, accurate splicing and positioning can be provided, the problems of eccentricity and inclination in butt joint of the substrate and the magnetic ring are solved, and therefore the efficiency and performance of the magnetic ring in the subsequent machining process are not affected. And the plasma cleaning gun can carry out dirt removal and oil stain removal treatment on the surface of the magnetic ring, so that the surface of the magnetic ring base connector is smoother, and subsequent potting treatment of the potting assembly on the magnetic ring base connector is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging technology, and more specifically, to a packaging device for an embedded intelligent integrated sensing magnetic ring. Background Technology

[0002] Packaging equipment refers to equipment that uses specific processes to encapsulate products in specific packaging materials, forming a complete package that provides protection and isolation. Packaging equipment is widely used in various industries. For example, when packaging electronic components, it first wraps the electronic components in a protective shell, thereby achieving electrical connection and mechanical fixation between the components and external circuits. Packaging equipment typically includes various types such as chip mounting equipment, wire bonding equipment, molding equipment, and testing equipment. They work together to complete the entire production process from chip to packaged device.

[0003] A search revealed that publication number CN119630136A discloses an automatic LED chip packaging device, relating to the field of LED chip technology. The device includes: an installation component comprising a processing table with a conveyor belt on top, the processing table supporting the entire device and the conveyor belt handling the transfer of LED chips during processing; a dispensing component comprising a first support platform on top of the processing table, a movable beam on the side of the first support platform, a glue conveying structure on the side of the movable beam, a dispensing structure at the bottom of the glue conveying structure, and a second support platform on the side of the glue conveying structure; a curing component; and an adjustment component. This device can automatically fill and cure the base glue between LED chips on the substrate. When changing chips, the adjustment component causes a motion mechanism to move the flexible dispensing tube, adjusting the dispensing nozzle position and the final dispensing width to adapt to the new spacing. The inventors discovered the following problems with the existing technology during the development of this invention:

[0004] While existing magnetic ring packaging equipment has a certain degree of automation, manual intervention is still required in processes such as loading, unloading, and material handling. For example, magnetic rings are placed one by one in designated positions. This not only reduces the overall packaging efficiency but also increases the packaging cost of magnetic rings. Furthermore, manual operation is susceptible to factors such as fatigue and emotional state, leading to unstable production efficiency. In addition, during the assembly process of magnetic rings and substrates, the positioning mechanism of traditional magnetic ring packaging equipment is not very accurate, which can lead to problems such as eccentricity and tilting of the assembled magnetic ring-substrate connector, thus affecting the performance and stability of the magnetic ring.

[0005] Therefore, an embedded intelligent integrated sensing magnetic ring packaging device is proposed to address the above problems. Utility Model Content

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a packaging device for an embedded intelligent integrated sensing magnetic ring to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: an encapsulation device for an embedded intelligent integrated sensing magnetic ring, comprising a conveying component, a positioning and cleaning component, a dispensing component, and a potting component. The positioning and cleaning component is mounted on top of the conveying component, and the dispensing component is placed on the side of the positioning and cleaning component. The potting component is also mounted on the side of the conveying component.

[0008] Preferably, the conveying assembly includes a vibratory feeder, a robotic arm, a high-precision positioning platform, an air-bearing guide rail, and a servo linear motor. The robotic arm is placed on the side of the vibratory feeder, and the high-precision positioning platform is installed on the side of the robotic arm away from the vibratory feeder. The air-bearing guide rail is installed above the high-precision positioning platform, and the servo linear motor is installed on the side of the air-bearing guide rail.

[0009] Preferably, the positioning cleaning assembly includes an industrial camera, a telecentric lens, and a plasma cleaning gun, with the telecentric lens mounted below the industrial camera and the plasma cleaning gun placed below the telecentric lens.

[0010] Preferably, the batching assembly includes a dual-liquid metering pump, a dynamic stirring chamber, and a defoaming chamber, wherein the dynamic stirring chamber is placed on the side of the dual-liquid metering pump, and the defoaming chamber is installed on the side of the dynamic stirring chamber away from the dual-liquid metering pump.

[0011] Preferably, the potting assembly includes a microdispensing valve, a pressure sensor, a tunnel curing oven, and an infrared temperature measurement array. The pressure sensor is placed on the side of the microdispensing valve, and the tunnel curing oven is placed on the side of the microdispensing valve away from the pressure sensor. The inner wall of the tunnel curing oven is equipped with an infrared temperature measurement array.

[0012] Preferably, the vibratory feeder is connected to the gripping range of the robotic arm via the discharge track, and the end of the robotic arm is equipped with a gripper, and the air-bearing slider of the air-bearing guide rail and the servo linear motor are rigidly fixed together.

[0013] Preferably, the industrial camera and the telecentric lens are connected by a thread, and the telecentric lens is placed vertically downward on the shooting platform to maintain the same vertical line, and the cleaning nozzle of the plasma cleaning gun is facing the surface of the magnetic ring.

[0014] Preferably, the valve head of the micro-dispensing valve is kept 1mm-3mm away from the surface of the magnetic ring to facilitate precise control of the dispensing amount. The pressure sensor is integrated into the inlet of the micro-dispensing valve, and the infrared temperature measuring array is evenly distributed on the top and sides of the tunnel curing oven cavity.

[0015] The technical effects and advantages of this utility model are as follows:

[0016] 1. Compared with the existing technology, the packaging equipment for this embedded intelligent integrated sensing magnetic ring can provide accurate assembly positioning when the robotic arm of the packaging equipment assembles the substrate and the magnetic ring through the positioning and cleaning component. This ensures that the docking of the two will not have problems with eccentricity or tilting, which would affect the efficiency and performance of the magnetic ring in subsequent processing. In addition, the plasma cleaning gun can remove dirt and oil stains from the surface of the magnetic ring, making the surface of the magnetic ring substrate connector smoother, which is convenient for the subsequent potting component to pot the magnetic ring substrate connector.

[0017] 2. Compared with the prior art, the encapsulation device for this embedded intelligent integrated sensing magnetic ring allows the pressure sensor to be interconnected with the control panel to monitor the pressure of the solution in the micro-dispensing valve in real time and control its internal pressure when the magnetic ring is injection molded through the potting assembly. Furthermore, the encapsulation device uses a two-stage injection molding process when the magnetic ring is injection molded. This allows for the injection of solutions with different flow rates and pressures into the magnetic ring when different parts of the magnetic ring are injection molded using the micro-dispensing valve, thereby protecting the relatively weak sensor parts inside the magnetic ring. Attached Figure Description

[0018] Figure 1 This is a side view of the overall structure of this utility model.

[0019] Figure 2 This is a side view of the transmission component of this utility model.

[0020] Figure 3 This is a front view structural diagram of the potting assembly of this utility model.

[0021] Figure 4 For the present utility model Figure 2 A schematic diagram of the structure at point A.

[0022] Figure 5 For the present utility model Figure 1 A schematic diagram of the structure at point B.

[0023] The attached diagram is labeled as follows: 1. Conveying assembly; 2. Positioning and cleaning assembly; 3. Dispensing assembly; 4. Filling assembly; 5. Vibratory feeder; 6. Robotic arm; 7. High-precision positioning platform; 8. Air-bearing guide rail; 9. Servo linear motor; 10. Industrial camera; 11. Telecentric lens; 12. Plasma cleaning gun; 13. Dual-liquid metering pump; 14. Dynamic mixing chamber; 15. Defoaming chamber; 16. Micro-dispensing valve; 17. Pressure sensor; 18. Tunnel curing oven; 19. Infrared temperature measurement array; 601. Gripper. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Example 1

[0026] As attached Figures 1 to 5 The packaging device for an embedded intelligent integrated sensing magnetic ring shown includes a conveying component 1, a positioning and cleaning component 2, a dispensing component 3, and a potting component 4. The positioning and cleaning component 2 is mounted on top of the conveying component 1, the dispensing component 3 is placed on the side of the positioning and cleaning component 2, and the potting component 4 is mounted on the side of the conveying component 1.

[0027] In the process of encapsulating the embedded intelligent integrated sensor magnetic ring, the worker needs to place the magnetic ring into the conveying component 1. The ring is then effectively aligned based on the vibration of the conveying component 1. The aligned magnetic ring moves forward along the track, and during this movement, the base and magnetic ring are installed. During the installation process, the positioning and cleaning component 2 positions the two components and makes detailed adjustments to the conveying component 1 via the control panel to ensure that the assembly error of the base and magnetic ring is within an acceptable range. After the base and magnetic ring are assembled, they continue to be conveyed forward by the conveying component 1 and cleaned by the positioning and cleaning component 2 to remove surface oil. The cleaned base and magnetic ring are then transported to the potting component 4 via a solution supplied by the dispensing component 3 for two injection molding processes. The injection-molded magnetic ring base connector is then sent to the potting component 4 by the conveying component 1, where it undergoes curing.

[0028] Example 2

[0029] Based on Example 1, the solution in Example 1 will be further described in detail below with reference to the specific working method, such as... Figures 1 to 5 As shown below, see details:

[0030] In a preferred embodiment, the conveying assembly 1 includes a vibratory feeder 5, a robotic arm 6, a high-precision positioning platform 7, an air-bearing guide rail 8, and a servo linear motor 9. The robotic arm 6 is placed on the side of the vibratory feeder 5, the high-precision positioning platform 7 is installed on the side of the robotic arm 6 away from the vibratory feeder 5, the air-bearing guide rail 8 is installed above the high-precision positioning platform 7, and the servo linear motor 9 is installed on the side of the air-bearing guide rail 8.

[0031] In a preferred embodiment, the positioning cleaning assembly 2 includes an industrial camera 10, a telecentric lens 11, and a plasma cleaning gun 12. The telecentric lens 11 is mounted below the industrial camera 10, and the plasma cleaning gun 12 is placed below the telecentric lens 11.

[0032] In a preferred embodiment, the batching assembly 3 includes a dual-liquid metering pump 13, a dynamic mixing chamber 14, and a defoaming chamber 15. The dynamic mixing chamber 14 is placed on the side of the dual-liquid metering pump 13, and the defoaming chamber 15 is installed on the side of the dynamic mixing chamber 14 away from the dual-liquid metering pump 13. The dynamic mixing chamber 14 and the defoaming chamber 15 are connected by threads.

[0033] In a preferred embodiment, the potting assembly 4 includes a micro-dispensing valve 16, a pressure sensor 17, a tunnel curing oven 18, and an infrared temperature measurement array 19. The pressure sensor 17 is placed on the side of the micro-dispensing valve 16, and the tunnel curing oven 18 is placed on the side of the micro-dispensing valve 16 away from the pressure sensor 17. The infrared temperature measurement array 19 is bolted to the inner wall of the tunnel curing oven 18. The pressure sensor 17 is a CYG1002 model, which converts the minute deformation caused by liquid pressure on the outside of the pipe into an electrical signal, thereby accurately measuring and monitoring the pressure of the liquid inside the pipe, so as to detect pressure anomalies in a timely manner and ensure the safe and stable operation of the pipeline system. It is mainly composed of an elastic element, a strain gauge, a measuring circuit, etc. The elastic element deforms under the action of liquid pressure, and the strain gauge attached to the elastic element deforms accordingly, causing its resistance value to change. The measuring circuit converts this resistance change into a corresponding electrical signal output to realize the measurement of liquid pressure.

[0034] In a preferred embodiment, the vibratory feeder 5 is connected to the gripping range of the robotic arm 6 via the discharge track. The end of the robotic arm 6 is equipped with a gripper 601, and the inner wall of the gripper 601 is equipped with a suction cup to facilitate quick gripping of the magnetic ring and the substrate. The air-bearing slider of the air-bearing guide rail 8 and the servo linear motor 9 are rigidly fixed together.

[0035] In a preferred embodiment, the industrial camera 10 and the telecentric lens 11 are connected by a thread. The lens of the telecentric lens 11 is placed vertically downward on the shooting platform to maintain the same vertical line, and the cleaning nozzle of the plasma cleaning gun 12 is facing the surface of the magnetic ring.

[0036] In a preferred embodiment, the micro-dispensing valve 16 is fixed to the bottom of the gantry frame by bolts. The valve head of the micro-dispensing valve 16 is 1mm-3mm away from the surface of the magnetic ring, which facilitates precise control of the dispensing amount. The pressure sensor 17 is integrated into the feed port of the micro-dispensing valve 16. The infrared temperature measurement array 19 is evenly distributed on the top and sides of the oven cavity of the tunnel curing oven 18.

[0037] The working process of this utility model is as follows: First, when packaging the embedded intelligent integrated sensing magnetic ring, the worker needs to put the magnetic ring into the vibratory plate 5 of the conveying component 1, and then start the packaging equipment. The magnetic ring will slide out in an orderly manner from the track connected in front of the vibratory plate 5 due to the vibration of the vibratory plate 5. The slid-out magnetic ring will be accurately grasped by the robotic arm 6 and placed on the air-floating guide rail 8 of the high-precision positioning platform 7. The grasped magnetic ring and the substrate will be aligned at the sub-micron level by the vision system composed of the industrial camera 10 and the telecentric lens 11 of the positioning cleaning component 2 to ensure that the relative position error between the magnetic ring and the substrate is controlled within ±5μm. The aligned magnetic ring substrate connector will be on the air-floating guide rail 8 and driven by the servo linear motor 9 to reach the side of the ion cleaning machine. At this time, the ion cleaning machine will pre-treat the surface of the magnetic ring through the cleaning nozzle to remove oil and impurities and enhance the adhesion of the subsequent packaging material. After the oil and impurities are removed, the magnetic ring substrate connector will move horizontally on the air-floating guide rail 8.

[0038] Meanwhile, the dual-liquid metering pump 13 of the mixing component 3 delivers epoxy resin and curing agent, along with other encapsulation materials, to the dynamic mixing chamber 14 with a mixing accuracy of ±1%. After uniform mixing at 500-2000 rpm, the mixture is transferred to a defoaming chamber 15 with a vacuum degree ≤10 mbar for at least 5 minutes of vacuum treatment to eliminate air bubbles in the material and prevent them from affecting the insulation performance. The mixed defoaming solution is then injected through the micro-dispensing valve 16 at a flow rate of 5-20 mL / min to first treat the gaps in the magnetic ring base connector, and then performs a secondary injection molding process on the internal sensor to completely encapsulate the sensor. During the potting process of the sensor inside the magnetic ring base connector, the micro-dispensing valve must be... The flow rate of the micro-dispensing valve 16 is less than 40 MPa to prevent component movement. During this period, the flow rate and pressure of the micro-dispensing valve 16 are monitored in real time by the pressure sensor 17. The magnetic ring that has completed the potting process will enter the tunnel curing oven 18 of the potting assembly 4 and be cured according to the preset segmented heating curve. During the curing process in the oven, the nitrogen purging system will control the oxygen content to below 50 ppm, and the infrared temperature measuring array 19 will monitor the surface temperature of the magnetic ring in real time with an accuracy of ±1℃ to avoid internal stress concentration due to excessive heating. The cured magnetic ring will be transmitted from the other side of the tunnel curing oven 18. The above is the working principle of the encapsulation device for an embedded intelligent integrated sensing magnetic ring.

Claims

1. A packaging device for an embedded intelligent integrated sensing magnetic ring, comprising a conveying assembly (1), a positioning and cleaning assembly (2), a dispensing assembly (3), and a potting assembly (4), characterized in that: A positioning and cleaning component (2) is installed above the conveying component (1), and a dispensing component (3) is placed on the side of the positioning and cleaning component (2), and a filling component (4) is installed on the side of the conveying component (1).

2. The packaging device for an embedded intelligent integrated sensing magnetic ring according to claim 1, characterized in that: The transmission assembly (1) includes a vibratory plate (5), a robotic arm (6), a high-precision positioning platform (7), an air-bearing guide rail (8), and a servo linear motor (9). The robotic arm (6) is placed on the side of the vibratory plate (5), and the high-precision positioning platform (7) is installed on the side of the robotic arm (6) away from the vibratory plate (5). The air-bearing guide rail (8) is installed above the high-precision positioning platform (7), and the servo linear motor (9) is installed on the side of the air-bearing guide rail (8).

3. The packaging device for an embedded intelligent integrated sensing magnetic ring according to claim 1, characterized in that: The positioning cleaning assembly (2) includes an industrial camera (10), a telecentric lens (11) and a plasma cleaning gun (12), and the telecentric lens (11) is installed below the industrial camera (10), and the plasma cleaning gun (12) is placed below the telecentric lens (11).

4. The packaging device for an embedded intelligent integrated sensing magnetic ring according to claim 1, characterized in that: The batching assembly (3) includes a dual-liquid metering pump (13), a dynamic mixing chamber (14), and a defoaming chamber (15). The dynamic mixing chamber (14) is placed on the side of the dual-liquid metering pump (13), and the defoaming chamber (15) is installed on the side of the dynamic mixing chamber (14) away from the dual-liquid metering pump (13).

5. The packaging device for an embedded intelligent integrated sensing magnetic ring according to claim 1, characterized in that: The potting assembly (4) includes a micro-dispensing valve (16), a pressure sensor (17), a tunnel curing oven (18), and an infrared temperature measurement array (19). The pressure sensor (17) is placed on the side of the micro-dispensing valve (16), and the tunnel curing oven (18) is placed on the side of the micro-dispensing valve (16) away from the pressure sensor (17). The inner wall of the tunnel curing oven (18) is equipped with an infrared temperature measurement array (19).

6. The packaging device for an embedded intelligent integrated sensing magnetic ring according to claim 2, characterized in that: The vibratory plate (5) is connected to the gripping range of the robotic arm (6) through the discharge track, and the end of the robotic arm (6) is equipped with a gripper (601), and the air-bearing slider of the air-bearing guide rail (8) and the servo linear motor (9) are rigidly fixed together.

7. The packaging device for an embedded intelligent integrated sensing magnetic ring according to claim 3, characterized in that: The industrial camera (10) and the telecentric lens (11) are connected by a thread, and the lens of the telecentric lens (11) is placed vertically downward on the shooting platform to maintain the same vertical line, and the cleaning nozzle of the plasma cleaning gun (12) is facing the surface of the magnetic ring.

8. The packaging device for an embedded intelligent integrated sensing magnetic ring according to claim 5, characterized in that: The valve head of the micro-dispensing valve (16) is 1mm-3mm away from the surface of the magnetic ring, which facilitates precise control of the dispensing amount. The pressure sensor (17) is integrated into the inlet of the micro-dispensing valve (16), and the infrared temperature measurement array (19) is evenly distributed on the top and sides of the oven cavity of the tunnel curing oven (18).

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