Decorative plate with digital printing medium layer
By setting a porous structure and surface modification treatment in the medium layer of the decorative board, combined with a UV adhesive protective layer, the problems of ink spreading and adhesion were solved, and the stability and wear resistance of the ink layer were achieved.
CN224161367UActive Publication Date: 2026-04-24HUNAN YUESHENG NEW MATERIAL CO LTD
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Patent Information
- Application Number
- CN202520999102.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-20
- Publication Date
- 2026-04-24
- Estimated Expiration
- 2035-05-20
AI Technical Summary
Technical Problem
The inks on traditional decorative panels are difficult to spread and adhere properly, and over time problems such as stains, peeling, or fading may occur.
Method used
The decorative board uses a digital printing media layer with a porous structure. Before curing, the ink layer penetrates into the porous structure to form an interlocking physical structure. The adhesion of the ink is improved by a surface modifier, and the wear-resistant layer is protected by UV adhesive.
Benefits of technology
It improves ink adhesion, prevents ink layer peeling, maintains long-term color stability, and enhances the wear resistance of decorative panels.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model discloses a decorative plate with a digital printing medium layer. The decorative plate with the digital printing medium layer comprises a core layer, a medium layer arranged on the core layer, an ink layer arranged on the medium layer and a wear-resistant layer arranged on the ink layer. The dielectric layer is located on the upper surface of the core layer and is provided with a porous structure, and the porous structure can allow part of ink to permeate, so that the connection strength is improved. The ink layer is arranged in the porous structure of the dielectric layer in a penetrating mode before curing forming, so that an interlocked physical structure is formed after curing, and the ink layer and the dielectric layer are prevented from falling off. The upper surface of the dielectric layer is a bonding surface, and a surface-modified functional layer is formed on the upper surface of the dielectric layer, so that the surface free energy is optimized, and the adhesive force of the ink is improved.
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