Drying device of thick film hybrid integrated circuit

Abstract

The utility model belongs to the technical field of integrated circuit production, and particularly relates to a thick film hybrid integrated circuit drying device which comprises a thick film integrated circuit drying device, and a sealing plate is installed on the top of the thick film integrated circuit drying device. The top of the sealing plate is fixedly connected with a motor; the output end of the motor is fixedly connected with a guide rod; the bottom of the guide rod is fixedly connected with a fixed plate; a fixing unit is arranged in the fixing plate; a mounting plate is mounted at the bottom of the fixing plate through a fixing unit; then, the drying equipment is started for circumferential drying treatment, and in the drying process, a motor is started to drive a guide rod to rotate, so that the guide rod drives a fixing plate, a mounting plate, a supporting rod, a fixing ring, a connecting rod and the thick film hybrid integrated circuit mounting plate to rotate around the drying equipment; therefore, the thick film hybrid integrated circuit is uniformly dried, and the drying efficiency of the thick film hybrid integrated circuit is effectively improved.

Description

Technical Field

[0001] This utility model belongs to the field of integrated circuit manufacturing technology, specifically a drying device for thick-film hybrid integrated circuits. Background Technology

[0002] Back-film hybrid integrated circuits are integrated electronic components that combine thick-film technology and semiconductor chips. They commonly use alumina (Al2O3) or aluminum nitride (AlN) ceramic substrates, which have high thermal conductivity and insulation. Conductive pastes (such as silver and gold), resistive pastes (such as RuO2), and dielectric pastes are printed layer by layer on the substrate through screen printing, and the circuit pattern is formed after drying and high-temperature sintering (800-1000℃).

[0003] In the manufacturing of thick-film hybrid integrated circuits, drying is a critical step, mainly targeting the printed paste layer. The thick-film paste contains volatile solvents and organic binders, accounting for approximately 30% to 50%. Drying allows the solvents to gradually evaporate, avoiding rapid vaporization during high-temperature sintering that could lead to structural defects.

[0004] In current technologies, when drying thick-film hybrid integrated circuits, the integrated circuits are placed inside a drying device for drying. However, due to the varying distances between the integrated circuits and the drying device, the heating of the integrated circuits is uneven, resulting in localized high heating rates. This leads to problems such as localized bubbles and cracks when disassembling the thick-film hybrid integrated circuits. Therefore, a drying device for thick-film hybrid integrated circuits is proposed to address the above problems. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art and solve at least one of the technical problems mentioned in the background art, this utility model proposes a drying device for thick film hybrid integrated circuits.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: A drying device for thick-film hybrid integrated circuits, comprising a thick-film integrated circuit drying device, a sealing plate installed on the top of the thick-film integrated circuit drying device; a motor fixedly connected to the top of the sealing plate; a guide rod fixedly connected to the output end of the motor; a fixing plate fixedly connected to the bottom of the guide rod; a fixing unit provided inside the fixing plate; an mounting plate installed at the bottom of the fixing plate through the fixing unit; a support rod fixedly connected to the end of the mounting plate, and having several such rods; a fixing ring fixedly connected to the end of the support rod; a connecting rod fixedly connected to the bottom of the support rod; a thick-film hybrid integrated circuit mounting plate installed at the bottom of the connecting rod; and a drying device installed at the bottom of the thick-film integrated circuit drying device, located at the end of the thick-film hybrid integrated circuit mounting plate.

[0007] Preferably, the fixing unit includes a slot; the fixing plate has a slot inside; the fixing plate has a cavity inside; a locking block is fixedly connected to the top of the mounting plate; a locking groove is provided inside the locking block; a locking block is slidably connected inside the cavity; a spring is fixedly connected to one end of the locking block, and the other end of the spring is fixedly connected to the inner wall of the cavity.

[0008] Preferably, a pull rod is fixedly connected to the end of the locking block; a handle is fixedly connected to the end of the pull rod and is slidably connected to the interior of the fixing plate.

[0009] Preferably, a dust cover is fixed to the bottom of the thick film integrated circuit drying device; a fan is installed inside the dust cover; and several air guide holes are opened at the bottom of the thick film integrated circuit drying device.

[0010] Preferably, the end of the locking block is semi-arc-shaped and matches the locking groove; the bottom of the thick film integrated circuit drying device is fixedly connected with a support leg, and several of them are provided.

[0011] The beneficial effects of this utility model are:

[0012] This invention provides a drying device for thick-film hybrid integrated circuits. The device involves placing the thick-film hybrid integrated circuit inside a mounting plate, then fixing the mounting plate at the bottom of a fixed plate using a fixing unit. A sealing plate and a motor are then placed inside the drying device. The fixed plate, mounting plate, and support rod then drive a connecting rod and the thick-film hybrid integrated circuit mounting plate into the drying device. The drying process is then performed by opening the drying equipment for circumferential drying. During the drying process, the motor rotates a guide rod, causing the guide rod to rotate the fixed plate, mounting plate, support rod, fixing ring, connecting rod, and thick-film hybrid integrated circuit mounting plate around the drying equipment, thus uniformly drying the thick-film hybrid integrated circuit and effectively improving the drying efficiency.

[0013] This utility model provides a drying device for thick-film hybrid integrated circuits. When it is necessary to install the support rod, fixing ring, connecting rod and thick-film hybrid integrated circuit mounting plate, the mounting plate is driven to fit against the bottom of the fixing plate, and then the locking block is driven to insert into the inside of the locking groove. The locking block is squeezed and stretched into the cavity, and then the spring is squeezed to generate elastic force. When the cavity and the locking groove are aligned, the spring generates elastic force to push the locking block into the inside of the locking groove for locking and fixing, thus completing the installation of the fixing plate and the mounting plate. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and are used to explain the present invention, but do not constitute an undue limitation of the present invention.

[0015] In the attached diagram:

[0016] Figure 1 This is a perspective view of the present invention;

[0017] Figure 2 This is a cross-sectional view of the present invention;

[0018] Figure 3 This is a perspective view of the medium-thickness film hybrid integrated circuit mounting board of this utility model;

[0019] Figure 4 yes Figure 2 Enlarged view of point A in the middle.

[0020] Legend:

[0021] 1. Thick film integrated circuit drying device; 11. Sealing plate; 21. Motor; 22. Guide rod; 23. Fixing plate; 24. Mounting plate; 25. Support rod; 26. Fixing ring; 27. Connecting rod; 28. Thick film hybrid integrated circuit mounting plate; 29. ​​Drying equipment; 31. Slot; 32. Cavity; 33. Locking block; 34. Locking groove; 35. Locking block; 36. Spring; 41. Pull rod; 42. Pull handle; 51. Dust cover; 52. Fan; 6. Support leg. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] Specific implementation examples are given below.

[0024] Please see Figures 1-4This utility model provides a drying device for thick-film hybrid integrated circuits, including a thick-film integrated circuit drying device 1. A sealing plate 11 is installed on the top of the thick-film integrated circuit drying device 1. A motor 21 is fixedly connected to the top of the sealing plate 11. A guide rod 22 is fixedly connected to the output end of the motor 21. A fixing plate 23 is fixedly connected to the bottom of the guide rod 22. A fixing unit is provided inside the fixing plate 23. An mounting plate 24 is installed at the bottom of the fixing plate 23 through the fixing unit. Several support rods 25 are fixedly connected to the ends of the mounting plate 24. A fixing ring 26 is fixedly connected to the ends of the support rods 25. A connecting rod 27 is fixedly connected to the bottom of the support rods 25. A thick-film hybrid integrated circuit mounting plate 28 is installed at the bottom of the connecting rod 27. A drying device 29 is installed at the bottom of the thick-film integrated circuit drying device 1 and is located at the end of the thick-film hybrid integrated circuit mounting plate 28. During operation, when it is necessary to dry the thick-film hybrid integrated circuit... During the drying process, the thick-film hybrid integrated circuit is placed inside the thick-film hybrid integrated circuit mounting plate 28. Then, the mounting plate 24 is installed at the bottom of the fixing plate 23 by the fixing unit. Then, the sealing plate 11 and the motor 21 are placed inside the thick-film integrated circuit drying device 1. Then, the connecting rod 27 and the thick-film hybrid integrated circuit mounting plate 28 are placed inside the thick-film integrated circuit drying device 1 by the fixing plate 23, the mounting plate 24 and the support rod 25. Then, the drying equipment 29 is turned on to perform circumferential drying. During the drying process, the guide rod 22 is turned on by turning on the motor 21, so that the guide rod 22 drives the fixing plate 23, the mounting plate 24, the support rod 25, the fixing ring 26, the connecting rod 27 and the thick-film hybrid integrated circuit mounting plate 28 to rotate around the drying equipment 29, so as to uniformly dry the thick-film hybrid integrated circuit and effectively improve the drying efficiency of the thick-film hybrid integrated circuit.

[0025] Furthermore, such as Figures 3-4 As shown, the fixing unit includes a slot 31; the fixing plate 23 has a slot 31 inside; the fixing plate 23 has a cavity 32 inside; a locking block 33 is fixedly connected to the top of the mounting plate 24; a locking groove 34 is opened inside the locking block 33; a locking block 35 is slidably connected inside the cavity 32; a spring 36 is fixedly connected to the end of the locking block 35, and the other end of the spring 36 is fixedly connected to the inner wall of the cavity 32; during operation, when it is necessary to adjust the support rod 25, the fixing ring 26, and the connecting rod... When mounting the 27 and the thick film hybrid integrated circuit mounting plate 28, the mounting plate 24 is brought into contact with the bottom of the fixing plate 23, and then the locking block 33 is inserted into the inside of the slot 31, pressing the locking block 35 so that the locking block 35 is compressed and stretched into the inside of the cavity 32. Then the spring 36 is compressed to generate elastic force. When the cavity 32 and the locking slot 34 are aligned with each other, the spring 36 generates elastic force to push the locking block 35 into the inside of the locking slot 34 for locking and fixing, thus completing the installation of the fixing plate 23 and the mounting plate 24.

[0026] Furthermore, such as Figures 3-4 As shown, a pull rod 41 is fixedly connected to the end of the locking block 35; a pull handle 42 is fixedly connected to the end of the pull rod 41 and is slidably connected to the inside of the fixing plate 23; during operation, when the thick film hybrid integrated circuit is dried, the motor 21, the fixing plate 23 and the mounting plate 24 are taken out from the inside of the thick film integrated circuit drying device 1 by pulling the thick film integrated circuit drying device 1, and then the pull rod 41 is slid to the end by pulling the pull handle 42, so that the pull rod 41 pulls the locking block 35 to extend and retract into the cavity 32, and then the locking block 33 is slid out from the inside of the slot 31 by pulling the mounting plate 24, so as to complete the disassembly of the discharge hole and facilitate the staff to take out the thick film hybrid integrated circuit.

[0027] Furthermore, such as Figures 3-4 As shown, a dust cover 51 is fixed to the bottom of the thick film integrated circuit drying device 1; a fan 52 is installed inside the dust cover 51; several air guide holes are opened at the bottom of the thick film integrated circuit drying device 1; during operation, by installing the dust cover 51 and the fan 52 at the bottom of the thick film integrated circuit drying device 1, when the drying equipment 29 is drying, the fan 52 is turned on to generate air force, which is then blown into the interior of the thick film integrated circuit drying device 1 through the air guide holes to generate hot air for a secondary drying process on the thick film hybrid integrated circuit.

[0028] Furthermore, such as Figures 3-4 As shown, the end of the locking block 35 is semi-arc-shaped and matches the locking groove 34; the bottom of the thick film integrated circuit drying device 1 is fixedly connected with a support leg 6, and there are several of them; during operation, the overall support effect of the thick film integrated circuit drying device 1 is improved by installing the support leg 6 at the bottom of the thick film integrated circuit drying device 1.

[0029] Working principle: When drying thick-film hybrid integrated circuits is required, the thick-film hybrid integrated circuit is placed inside the thick-film hybrid integrated circuit mounting plate 28. Then, the mounting plate 24 is installed at the bottom of the fixing plate 23 by the fixing unit. Then, the sealing plate 11 and the motor 21 are driven into the thick-film integrated circuit drying device 1. Then, the connecting rod 27 and the thick-film hybrid integrated circuit mounting plate 28 are driven into the thick-film integrated circuit drying device 1 by the fixing plate 23, the mounting plate 24 and the support rod 25. Then, the drying equipment 29 is turned on for circumferential drying. During the drying process, the motor 21 is turned on. The guide rod 22 rotates, causing the fixing plate 23, mounting plate 24, support rod 25, fixing ring 26, connecting rod 27, and thick-film hybrid integrated circuit mounting plate 28 to rotate around the drying equipment 29, thus uniformly drying the thick-film hybrid integrated circuit and effectively improving the drying efficiency. When it is necessary to install the support rod 25, fixing ring 26, connecting rod 27, and thick-film hybrid integrated circuit mounting plate 28, the mounting plate 24 is driven to fit against the bottom of the fixing plate 23, and then the locking block 33 is inserted into the slot 31, pressing the locking block 35, so that the locking block 33... 5. Under compression, the locking block 35 extends into the cavity 32, and then the compression spring 36 generates elastic force. When the cavity 32 and the locking groove 34 are aligned, the spring 36 generates elastic force to push the locking block 35 into the locking groove 34 for locking and fixing, thus completing the installation of the fixing plate 23 and the mounting plate 24. When the thick film hybrid integrated circuit is dried, the motor 21, fixing plate 23 and mounting plate 24 are removed from the inside of the thick film integrated circuit drying device 1 by pulling the thick film integrated circuit drying device 1. Then, the pull handle 42 drives the pull rod 41 to slide to the end, so that the pull rod 41 pulls the locking block 35 to extend into the cavity 32. Pulling the mounting plate 24 causes the card block 33 to slide out from the inside of the card slot 31, thus completing the disassembly of the discharge hole, which facilitates the staff to take out the thick film hybrid integrated circuit. By installing a dust cover 51 and a fan 52 at the bottom of the thick film integrated circuit drying device 1, when the drying equipment 29 is drying, the fan 52 is turned on to generate air force, which is then blown into the interior of the thick film integrated circuit drying device 1 through the air guide hole to generate hot air for a second drying process on the thick film hybrid integrated circuit. By installing support legs 6 at the bottom of the thick film integrated circuit drying device 1, the overall support effect of the thick film integrated circuit drying device 1 is improved.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A drying apparatus for thick film hybrid integrated circuits, comprising a thick film integrated circuit drying apparatus (1), characterized in that: A sealing plate (11) is installed on the top of the thick film integrated circuit drying device (1); a motor (21) is fixedly connected to the top of the sealing plate (11); a guide rod (22) is fixedly connected to the output end of the motor (21); a fixing plate (23) is fixedly connected to the bottom of the guide rod (22); a fixing unit is provided inside the fixing plate (23); an mounting plate (24) is installed at the bottom of the fixing plate (23) through the fixing unit; a support rod (25) is fixedly connected to the end of the mounting plate (24), and there are several of them; a fixing ring (26) is fixedly connected to the end of the support rod (25); a connecting rod (27) is fixedly connected to the bottom of the support rod (25); a thick film hybrid integrated circuit mounting plate (28) is installed at the bottom of the connecting rod (27); a drying device (29) is installed at the bottom of the thick film integrated circuit drying device (1), and is located at the end of the thick film hybrid integrated circuit mounting plate (28).

2. A drying apparatus for thick film hybrid integrated circuits as claimed in claim 1, wherein: The fixing unit includes a slot (31); the fixing plate (23) has a slot (31) inside; the fixing plate (23) has a cavity (32) inside; a locking block (33) is fixedly connected to the top of the mounting plate (24); a locking groove (34) is opened inside the locking block (33); a locking block (35) is slidably connected inside the cavity (32); a spring (36) is fixedly connected to the end of the locking block (35), and the other end of the spring (36) is fixedly connected to the inner wall of the cavity (32).

3. A drying apparatus for thick film hybrid integrated circuits as claimed in claim 2, wherein: The end of the locking block (35) is fixedly connected to a pull rod (41); the end of the pull rod (41) is fixedly connected to a handle (42) and is slidably connected to the inside of the fixing plate (23).

4. The drying apparatus for a thick film hybrid integrated circuit according to claim 1, wherein: The bottom of the thick film integrated circuit drying device (1) is fixedly connected to a dust cover (51); a fan (52) is installed inside the dust cover (51); and several air guide holes are opened at the bottom of the thick film integrated circuit drying device (1).

5. The drying apparatus for a thick-film hybrid integrated circuit as described in claim 2, characterized in that: The end of the locking block (35) is semi-arc-shaped and matches the locking groove (34).

6. A drying apparatus for thick film hybrid integrated circuits as claimed in claim 1, wherein: The bottom of the thick film integrated circuit drying device (1) is fixed with a support leg (6), and there are several of them.

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