Vehicle body height sensor

Abstract

The utility model discloses a vehicle body height sensor which comprises a chip framework, a chip installation position is arranged on the chip framework, a chip body is connected to the chip installation position, an injection molding outer wrapping body is wrapped outside the chip framework, a supporting column is connected to the chip framework, the supporting column is arranged in a protruding mode relative to the chip framework, and the chip framework is provided with a groove. The supporting columns are flush with the outer surface of the injection molding outer wrapping body, and the injection molding outer wrapping body wraps the chip framework and the chip body in all directions. According to the vehicle body height sensor provided by the utility model, the requirement on injection molding equipment can be reduced, the production equipment is simpler, and the chip framework can be lifted up through the supporting column, so that the scheme of wrapping the chip framework can be realized through common injection molding, meanwhile, the actions in the injection molding process are reduced, and the injection molding efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to a vehicle height sensor. Background Technology

[0002] For example, publication number "CN217155235U" discloses a "vehicle height sensor," including: a sensor housing component with a shaft cavity, one axial end of which is open, and at least the portion surrounding the opening being a soft rubber part; a rocker arm, including a rotating shaft, which is pressed into the shaft cavity through the opening; and an angle sensing assembly, including a first sensing part and a second sensing part, the first sensing part being disposed on the sensor housing component and the second sensing part being disposed on the rotating shaft. However, in practical applications, during the injection molding process of this type of sensor, it is necessary to fully encapsulate the chip body and chip skeleton, while facilitating demolding. This places high demands on the injection molding equipment, requiring an ejector structure to ensure that the chip skeleton is encapsulated during injection molding. Summary of the Invention

[0003] In view of the problem mentioned in the background art that the existing technology has high requirements for injection molding equipment, this utility model provides a vehicle height sensor that can reduce the requirements for injection molding equipment, simplify the production equipment, and lift the chip skeleton through the support column, so that ordinary injection molding can also achieve the solution of wrapping the chip skeleton, while reducing the actions in the injection molding process and improving injection molding efficiency.

[0004] To achieve the above objectives, the present invention adopts the following technical solution.

[0005] A vehicle height sensor includes a chip skeleton with chip mounting positions. A chip body is connected to the chip mounting positions. The chip skeleton is encased in a molded outer casing. A support column is connected to the chip skeleton and protrudes from it. The support column is flush with the outer surface of the molded outer casing. The molded outer casing completely encloses the chip skeleton and the chip body. Typical vehicle height sensors include a chip skeleton for fixing the chip body, with a molded outer casing surrounding it. The outer casing typically encapsulates the entire chip skeleton and chip body through injection molding. Therefore, during injection molding, an ejector mechanism is used to lift the chip skeleton and chip body, allowing the area below the chip skeleton to be filled with the injection molding material, achieving full encapsulation. The ejector mechanism also needs to be removed. However, this structure leads to more production steps in injection molding and places higher demands on the injection molding machine. Higher costs would increase production costs. Therefore, to address the aforementioned issues, this application incorporates support pillars on the chip skeleton for support. By protruding the chip skeleton through the support pillar structure, the chip skeleton itself is suspended during injection molding. The area below the chip skeleton can be filled with injection molding material, thus encapsulating the chip skeleton and chip body without the need for an ejector mechanism. After injection molding, the outer surface of the injection-molded outer casing is flush with the end face of the support pillar, preventing gaps between it and the chip skeleton and ensuring the stability of the encapsulation of the chip skeleton.

[0006] Preferably, the chip skeleton has several protrusions in the area near the support pillar, and fusion grooves are formed between the protrusions. Because there are multiple protrusions on the chip skeleton, fusion grooves can be formed between adjacent protrusions. During injection molding, the injection molding material fills the spaces between the fusion grooves, thereby improving the connection stability and sealing of the area.

[0007] Preferably, the protrusion is an annular structure, the fusion groove is an annular groove structure, and the support column is disposed at the annular center of the protrusion. By setting the protrusion structure as an annular structure, a corresponding annular groove structure can be formed in the fusion groove. By setting it as an annular structure, the uniformity and flowability of injection molding can be ensured, as well as the uniformity of connection and the sealing stability of each area.

[0008] Preferably, the protrusion includes an inclined surface near the support column and a flat surface away from the support column, and the protrusion has a toothed cross-section. Different inclinations are provided on both sides of the protrusion; the side near the support column has an inclined surface, while the side away from the support column has a flat surface. This toothed structure improves connection stability, reduces the risk of delamination, ensures sealing, improves the uniformity of injection molding material flow and the completeness of filling, reduces the generation of filling dead zones, and reduces the probability of air bubbles forming in the injection molded outer casing.

[0009] Preferably, the chip skeleton has protrusions and fusion grooves on both sides of its extension direction along the support pillar. Having protrusions and fusion grooves on both sides of the chip skeleton ensures the stability and uniformity of the connection between the two sides.

[0010] Preferably, the chip mounting position is provided with a positioning post, and the chip body is provided with a connecting frame that can engage with the positioning post. The positioning post is melted and then attached to the connecting frame. The positioning post on the chip mounting position can engage with the connecting frame, and after being connected to the connecting frame, the positioning post can be melted, so that the molten positioning post covers the connecting frame, locking the chip body and chip skeleton in place and ensuring positioning stability.

[0011] Preferably, the connector is provided with positioning holes through which the positioning posts can pass. The positioning holes in the connector allow the positioning posts to pass through, enabling the molten positioning posts to form a semi-enclosed structure around the chip skeleton, thereby ensuring connection stability and pre-positioning the chip skeleton.

[0012] Preferably, a secondary injection-molded elastomer is connected to the injection-molded outer casing. By connecting the secondary injection-molded elastomer to the injection-molded outer casing, and by separating the secondary injection-molded elastomer from the injection-molded outer casing, rather than using a one-piece injection-molded structure, the material and injection method of the secondary injection-molded elastomer can be more flexible, adapting to the installation requirements of the ball head during use and improving production efficiency.

[0013] Preferably, the injection-molded outer casing includes a mounting cylinder with a plurality of connecting rings on it, and the secondary injection-molded elastomer wraps around the connecting rings. The mounting cylinder on the injection-molded outer casing, with its plurality of connecting rings, ensures reliable connection through their connection with the secondary injection-molded elastomer.

[0014] Preferably, the injection-molded outer casing includes a mounting cylinder, and a connecting protrusion is provided on the inner wall of the mounting cylinder. The connecting protrusion engages with the secondary injection-molded elastomer. The connecting protrusion on the inner wall of the mounting cylinder of the injection-molded outer casing allows for an engaging connection with the secondary injection-molded elastomer, thereby ensuring uniformity and reliability of the connection in the axial direction of the secondary injection-molded elastomer.

[0015] The beneficial effects of this utility model are as follows:

[0016] (1) The chip skeleton can be lifted by the support column, which makes it easier for the injection molding mechanism to perform injection molding. This ensures that the injection molding outer shell can also wrap the chip skeleton without using the ejection mechanism, thus reducing production costs.

[0017] (2) During the injection molding process, the injection molding material fills the spaces between the various fusion grooves, thereby improving the connection stability and sealing of the area;

[0018] (3) The molten positioning post can form a semi-enclosed structure for the chip skeleton, thereby ensuring the stability of the connection, and can also pre-position the chip skeleton. Attached Figure Description

[0019] Figure 1 This is an isometric view of the chip skeleton and chip body in this utility model.

[0020] Figure 2 This is an exploded view of the chip skeleton and chip body in this utility model.

[0021] Figure 3 This is a cross-sectional view of the chip skeleton in this utility model.

[0022] Figure 4 This is an exploded view of the present invention.

[0023] Figure 5 This is a schematic diagram of the structure of this utility model.

[0024] In the picture:

[0025] 1. Chip skeleton, 11. Chip mounting position, 12. Support post, 13. Protrusion, 131. Bevel, 132. Plane, 14. Fusion groove, 15. Positioning post;

[0026] 2 chip body, 21 connector, 22 positioning holes;

[0027] 3. Injection molded outer casing; 31. Mounting cylinder; 32. Connecting ring piece; 33. Connecting protrusion;

[0028] 4. Secondary injection molding elastomer. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0030] Example 1:

[0031] like Figure 1 , 5 As shown, a vehicle height sensor includes a chip frame 1, a chip mounting position 11 on the chip frame 1, a chip body 2 connected to the chip mounting position 11, and an injection-molded outer casing 3 encasing the chip frame 1. A support column 12 is connected to the chip frame 1, protruding from the chip frame 1 and flush with the outer surface of the injection-molded outer casing 3. The injection-molded outer casing 3 completely encloses the chip frame 1 and the chip body 2. Typical vehicle height sensors include a chip frame 1 for fixing the chip body 2, with an injection-molded outer casing 3 encasing the chip frame 1. The outer injection-molded outer casing 3 typically encapsulates the entire chip frame 1 and chip body 2 through injection molding. Therefore, during the injection molding process, an ejector mechanism is used to lift the chip frame 1 and chip body 2, allowing the area below the chip frame 1 to be filled with injection molding material, achieving a complete encapsulation of the chip frame 1. Simultaneously, the ejector mechanism needs to be removed. However, this structure results in more production steps during injection molding and places higher demands on the injection molding machine. This would increase production costs. Therefore, to address the above issues, this application provides a support column 12 on the chip skeleton 1 for support. By setting the support column 12 to protrude from the chip skeleton 1, the chip skeleton 1 itself is in a suspended state during the injection molding process. The lower area of ​​the chip skeleton 1 can be filled with injection molding material, thereby wrapping the chip skeleton 1 and the chip body 2 without setting an ejection mechanism. After the injection molding is completed, the outer surface of the injection molded outer casing 3 will be flush with the end face of the support column 12, so there will be no gap between it and the chip skeleton 1, ensuring the stability of the wrapping of the chip skeleton 1.

[0032] like Figure 1 , 3 As shown, the chip skeleton 1 has several protrusions 13 in the area near the support pillar 12, and fusion grooves 14 are formed between the protrusions 13. Since there are multiple protrusions 13 on the chip skeleton 1, fusion grooves 14 can be formed between adjacent protrusions 13. During injection molding, the injection molding material fills the spaces between the fusion grooves 14, thereby improving the connection stability and sealing of the area.

[0033] like Figure 1 , 2As shown, the protrusion 13 has an annular structure, the fusion groove 14 has an annular groove structure, and the support column 12 is located at the annular center of the protrusion 13. By setting the protrusion 13 into an annular structure, the fusion groove 14 can be formed accordingly. By setting it into an annular structure, the uniformity and flowability of injection molding can be ensured, as well as the uniformity of connection and the sealing stability of each area.

[0034] like Figure 3 As shown, the protrusion 13 includes an inclined surface 131 on the side near the support column 12 and a flat surface 132 on the side away from the support column 12. The cross-section of the protrusion 13 is toothed. Different inclinations are provided on both sides of the protrusion 13. The side near the support column 12 has an inclined surface 131 structure, while the side away from the support column 12 has a flat surface 132 structure. This toothed structure of the protrusion 13 improves connection stability, reduces the risk of delamination, ensures sealing, improves the uniformity of injection molding material flow and the completeness of filling, reduces the generation of filling dead zones, and reduces the probability of air bubbles forming in the injection molded outer casing.

[0035] like Figure 3 As shown, the chip skeleton 1 has protrusions 13 and fusion grooves 14 on both sides of its extension direction along the support column 12. The protrusions 13 and fusion grooves 14 on both sides of the chip skeleton 1 can ensure the connection stability and uniformity of the two sides of the chip skeleton 1.

[0036] Example 2:

[0037] like Figure 1 , 2 As shown, in this embodiment, a positioning post 15 is provided on the chip mounting position 11, and a connecting frame 21 is provided on the chip body 2, which can engage with the positioning post 15. After the positioning post 15 is melted, it adheres to the connecting frame 21. The positioning post 15 is provided on the chip mounting position 11, wherein the positioning post 15 can engage with the connecting frame 21, and after the positioning post 15 is connected to the connecting frame 21, it can be melted to melt the positioning post 15, so that the melted positioning post 15 covers the connecting frame 21, locking the chip body 2 and the chip skeleton 1 in position and ensuring the stability of positioning.

[0038] like Figure 2 As shown, the connector 21 is provided with a positioning hole 22 through which the positioning post 15 can pass. The positioning hole 22 on the connector 21 allows the positioning post 15 to pass through, thereby enabling the molten positioning post 15 to form a semi-enclosed structure on the chip skeleton 1, thus ensuring the stability of the connection and pre-positioning the chip skeleton 1.

[0039] This embodiment also includes a chip skeleton 1, on which a chip mounting position 11 is provided, and a chip body 2 is connected to the chip mounting position 11. The chip skeleton 1 is encased in an injection-molded outer casing 3, and a support post 12 is connected to the chip skeleton 1. The support post 12 protrudes relative to the chip skeleton 1 and is flush with the outer surface of the injection-molded outer casing 3. The injection-molded outer casing 3 completely encloses the chip skeleton 1 and the chip body 2. The chip skeleton 1 has several protrusions 13 in the area near the support post 12, and fusion grooves 14 are formed between the protrusions 13. The protrusions 13 have annular structures, the fusion grooves 14 have annular groove structures, and the support post 12 is located at the annular center of the protrusions 13. The protrusions 13 include a slope 131 on the side near the support post 12 and a plane 132 on the side away from the support post 12. The cross-section of the protrusions 13 has a toothed structure. The chip skeleton 1 has protrusions 13 and fusion grooves 14 on both sides along the extension direction of the support post 12.

[0040] Typical vehicle height sensors include a chip frame 1 for fixing the chip body 2. An injection-molded outer casing 3 surrounds the chip frame 1. This outer casing 3 typically encapsulates the entire chip frame 1 and chip body 2 through injection molding. Therefore, during the injection molding process, an ejector mechanism is used to lift the chip frame 1 and chip body 2, allowing the area below the chip frame 1 to be filled with the injection molding material, achieving a complete encapsulation of the chip frame 1. Simultaneously, the ejector mechanism needs to be removed. However, this structure results in more production steps during injection molding and places higher demands on the injection molding machine. This would increase production costs. Therefore, to address the aforementioned issues, this application provides support pillars 12 on the chip skeleton 1. By protruding the chip skeleton 1 with the support pillars 12, the chip skeleton 1 is suspended during injection molding. The lower area of ​​the chip skeleton 1 can be filled with injection molding material, thus encapsulating the chip skeleton 1 and the chip body 2 without the need for an ejector mechanism. After injection molding, the outer surface of the injection-molded outer casing 3 is flush with the end face of the support pillars 12, preventing gaps between it and the chip skeleton 1 and ensuring stable encapsulation of the chip skeleton 1. Several protrusions 13 are provided on the chip skeleton 1. Since there are multiple protrusions 13, fusion grooves 14 can be formed between adjacent protrusions 13. During injection molding, the injection molding material fills the spaces between the fusion grooves 14, thereby improving the connection stability and sealing of the area. The protrusion 13 is designed as a ring structure, which corresponds to the fusion groove 14 forming a ring groove structure. This ring structure ensures uniformity and flowability of the injection molding process, as well as uniformity of connection and sealing stability in each area. Different inclinations are provided on both sides of the protrusion 13. The side closer to the support column 12 has an inclined surface 131, while the side farther from the support column 12 has a flat surface 132. This toothed structure of the protrusion 13 improves connection stability, reduces the risk of delamination, ensures sealing, and enhances the uniformity and completeness of the injection molding material flow, reducing dead zones and the probability of air bubbles forming in the injection molding outer casing. The protrusion 13 and fusion groove 14 are provided on both sides of the chip skeleton 1, ensuring the connection stability and uniformity on both sides of the chip skeleton 1.

[0041] Example 3:

[0042] like Figure 4 , 5As shown, in this embodiment, a secondary injection-molded elastomer 4 is connected to the injection-molded outer casing. By connecting the secondary injection-molded elastomer 4 to the injection-molded outer casing separately from the injection-molded outer casing, rather than using a one-piece injection-molded structure, the material and injection method of the secondary injection-molded elastic component can be more flexible, adapting to the installation requirements of the ball head during use and improving production efficiency.

[0043] like Figure 4 As shown, the injection-molded outer casing includes an installation cylinder 31, on which several connecting rings 32 are provided. The secondary injection-molded elastomer 4 encloses the connecting rings 32. The installation cylinder 31 on the injection-molded outer casing, with several connecting rings 32, ensures reliable connection through the connection between the connecting rings 32 and the secondary injection-molded elastomer.

[0044] like Figure 4 As shown, the injection-molded outer casing includes a mounting cylinder 31, and a connecting protrusion 33 is provided on the inner wall of the mounting cylinder 31. The connecting protrusion 33 engages with the secondary injection-molded elastomer 4. The connecting protrusion 33 on the inner wall of the mounting cylinder 31 of the injection-molded outer casing can engage with the secondary injection-molded elastomer 4, thereby ensuring the uniformity and reliability of the connection in the axial direction of the secondary injection-molded elastomer 4.

[0045] This embodiment also includes a chip skeleton 1, on which a chip mounting position 11 is provided, and a chip body 2 is connected to the chip mounting position 11. The chip skeleton 1 is encased in an injection-molded outer casing 3, and a support post 12 is connected to the chip skeleton 1. The support post 12 protrudes relative to the chip skeleton 1 and is flush with the outer surface of the injection-molded outer casing 3. The injection-molded outer casing 3 completely encloses the chip skeleton 1 and the chip body 2. The chip skeleton 1 has several protrusions 13 in the area near the support post 12, and fusion grooves 14 are formed between the protrusions 13. The protrusions 13 have annular structures, the fusion grooves 14 have annular groove structures, and the support post 12 is located at the annular center of the protrusions 13. The protrusions 13 include a slope 131 on the side near the support post 12 and a plane 132 on the side away from the support post 12. The cross-section of the protrusions 13 has a toothed structure. The chip skeleton 1 has protrusions 13 and fusion grooves 14 on both sides along the extension direction of the support post 12.

[0046] Typical vehicle height sensors include a chip frame 1 for fixing the chip body 2. An injection-molded outer casing 3 surrounds the chip frame 1. This outer casing 3 typically encapsulates the entire chip frame 1 and chip body 2 through injection molding. Therefore, during the injection molding process, an ejector mechanism is used to lift the chip frame 1 and chip body 2, allowing the area below the chip frame 1 to be filled with the injection molding material, achieving a complete encapsulation of the chip frame 1. Simultaneously, the ejector mechanism needs to be removed. However, this structure results in more production steps during injection molding and places higher demands on the injection molding machine. This would increase production costs. Therefore, to address the aforementioned issues, this application provides support pillars 12 on the chip skeleton 1. By protruding the chip skeleton 1 with the support pillars 12, the chip skeleton 1 is suspended during injection molding. The lower area of ​​the chip skeleton 1 can be filled with injection molding material, thus encapsulating the chip skeleton 1 and the chip body 2 without the need for an ejector mechanism. After injection molding, the outer surface of the injection-molded outer casing 3 is flush with the end face of the support pillars 12, preventing gaps between it and the chip skeleton 1 and ensuring stable encapsulation of the chip skeleton 1. Several protrusions 13 are provided on the chip skeleton 1. Since there are multiple protrusions 13, fusion grooves 14 can be formed between adjacent protrusions 13. During injection molding, the injection molding material fills the spaces between the fusion grooves 14, thereby improving the connection stability and sealing of the area. The protrusion 13 is designed as a ring structure, which corresponds to the fusion groove 14 forming a ring groove structure. This ring structure ensures uniformity and flowability of the injection molding process, as well as uniformity of connection and sealing stability in each area. Different inclinations are provided on both sides of the protrusion 13. The side closer to the support column 12 has an inclined surface 131, while the side farther from the support column 12 has a flat surface 132. This toothed structure of the protrusion 13 improves connection stability, reduces the risk of delamination, ensures sealing, and enhances the uniformity and completeness of the injection molding material flow, reducing dead zones and the probability of air bubbles forming in the injection molding outer casing. The protrusion 13 and fusion groove 14 are provided on both sides of the chip skeleton 1, ensuring the connection stability and uniformity on both sides of the chip skeleton 1.

Claims

1. A vehicle height sensor, characterized in that, The chip includes a chip skeleton with chip mounting positions, a chip body connected to the chip mounting positions, an injection-molded outer casing, and support columns connected to the chip skeleton. The support columns protrude relative to the chip skeleton and are flush with the outer surface of the injection-molded outer casing. The injection-molded outer casing completely encloses the chip skeleton and the chip body.

2. A vehicle height sensor according to claim 1, characterized in that, The chip skeleton has several protrusions in the area near the support pillar, and fusion grooves are formed between the protrusions.

3. A vehicle height sensor according to claim 2, characterized in that, The protrusion has a ring structure, the fusion groove has a ring groove structure, and the support column is located at the annular center of the protrusion.

4. A vehicle height sensor according to claim 2, characterized in that, The protrusion includes an inclined surface located near the support column, and a flat surface located away from the support column. The cross-section of the protrusion has a toothed structure.

5. A vehicle height sensor according to claim 1, characterized in that, The chip skeleton has protrusions and fusion grooves on both sides of the support column extending along the direction of the support column.

6. A vehicle height sensor according to claim 1, characterized in that, The chip mounting position is provided with a positioning post, and the chip body is provided with a connecting frame that can engage with the positioning post. The positioning post is melted and then attached to the connecting frame.

7. A vehicle height sensor according to claim 6, characterized in that, The connecting frame is provided with positioning holes through which the positioning posts can pass.

8. A vehicle height sensor according to any one of claims 1-7, characterized in that, The injection-molded outer casing is connected to a secondary injection-molded elastomer.

9. A vehicle height sensor according to claim 8, characterized in that, The injection-molded outer casing includes an installation cylinder, on which a plurality of connecting ring pieces are provided, and the secondary injection-molded elastomer wraps around the connecting ring pieces.

10. A vehicle height sensor according to claim 8, characterized in that, The injection-molded outer casing includes an installation cylinder, and a connecting protrusion is provided on the inner wall of the installation cylinder, which engages with the secondary injection-molded elastomer.

Images