Relay contact rebound time testing device
By designing a relay contact bounce time testing device and using a microcontroller to control the switching logic to achieve automatic testing, the problems of low testing efficiency and accuracy were solved, and efficient and automated test result judgment and recording were realized.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENYANG RAILWAY SIGNAL
- Filing Date
- 2025-05-14
- Publication Date
- 2026-04-24
AI Technical Summary
In existing technologies, the testing efficiency and accuracy of relay contact backflip time are low, and manual operation consumes a lot of manpower and resources, which cannot meet the requirements of the new railway industry standard.
A relay contact bounce time testing device was designed, including a relay test socket, a main control board, a touch screen, a power module, and circuit connections. Automatic testing is achieved by switching logic through a microcontroller, and the test results are automatically saved and judged.
It enables automatic testing of relay contact bounce time, improving testing efficiency and accuracy, reducing the need for manual operation, and saving manpower and resources.
Smart Images

Figure CN224163780U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of relay time characteristic testing technology, and in particular relates to a relay contact bounce time testing device. Background Technology
[0002] Contact backlash time is one of the main electrical characteristic parameters of a relay and an important indicator related to the reliability of relay applications. After the implementation of the new railway industry standard TB / T 3383-2023, contact backlash time has become a mandatory test item. However, the current method, which often involves building circuits with oscilloscopes, manually analyzing waveforms to select the start and end points of the backlash time test, manually moving the scale, and manually calculating values, cannot guarantee testing efficiency and accuracy. Furthermore, the manual recording of test results wastes too much manpower and resources. Utility Model Content
[0003] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a relay contact bounce time testing device for testing the bounce time of relay contacts.
[0004] To achieve the above objectives, the main technical solutions adopted by this utility model include:
[0005] A relay contact bounce time testing device includes a relay test socket, a main control board, a touch screen, a debugging switch, a 5V switching power supply, a 24V switching power supply, a 24V drive power supply, a 24V touch screen power supply, voltage divider resistors, a fuse, a three-phase socket, and a main switch. The main control board is connected to each contact of the relay test socket via a main control board connector. The touch screen is connected to the main control board via a serial port. The main control board is equipped with a microcontroller connected to the relay. Each input pin of the microcontroller is connected to the series and parallel circuits of the relay contacts under test. Each output signal of the microcontroller is connected to the contact relationship logic switching circuit and power supply access circuit of the relay under test. The 5V switching power supply, 24V switching power supply, and 24V drive power supply are connected to the main control board connector. The 24V touch screen power supply is connected to the touch screen. The voltage divider resistor is connected to the main control board connector. The debugging switch is connected to the terminal block on the touch screen. The three-phase socket is connected to the main switch through a fuse. The 5V switching power supply, 24V switching power supply, 24V drive power supply, and 24V touch screen power supply are connected in parallel to the main switch.
[0006] Furthermore, the pin N of the 5V switching power supply, 24V switching power supply, 24V drive power supply, and 24V touch screen power supply is connected in parallel and then connected to pin 1 of the main switch; the pin L of the 5V switching power supply, 24V switching power supply, 24V drive power supply, and 24V touch screen power supply is connected in parallel and then connected to pin 2 of the main switch.
[0007] Furthermore, the terminals on the connectors CZ1~CZ2 of the main control board are respectively connected to the contacts corresponding to the relay test socket JCZ.
[0008] Furthermore, the main control board includes a contact acquisition circuit, a relay under test driving circuit, a communication circuit, and a logic driving circuit. The logic driving circuit includes a PIC microcontroller, the relay under test driving circuit includes several Panasonic relays, and the contact acquisition circuit includes several Panasonic relays. The I / O port of the PIC microcontroller is connected to the input terminal of a Darlington transistor ULN2003. The output terminal of the Darlington transistor ULN2003 is connected to pin 12 of the Panasonic relays in the contact acquisition circuit and the relay under test driving circuit. Pin 1 of the Panasonic relays in the relay under test driving circuit is connected to the positive terminal of 24V power. Pin 8 of the Panasonic relays in the contact acquisition circuit is connected to the moving contact of the relay under test. Pin 9 of the Panasonic relays in the contact acquisition circuit is connected to the high-speed capture interface of the PIC microcontroller. Pin 5 of the Panasonic relays in the contact acquisition circuit is connected to the intermediate contact of the relay under test. Pin 4 of the Panasonic relays in the contact acquisition circuit is connected to 5V GND. Pin 9 of the Panasonic relay is connected to CZ5-2. Pin 4 of the Panasonic relay in the relay drive circuit under test is connected to CZ5-1. Pin 8 of the Panasonic relay in the relay drive circuit under test is connected to the negative terminal of the relay under test. Pin 1 of the Panasonic relay in the relay drive circuit under test is connected to the positive terminal of the relay under test. The communication circuit includes a 485 communication chip. Pin 1 of the 485 communication chip is connected to pin 26 of the PIC microcontroller. Pin 4 of the 485 communication chip is connected to pin 25 of the PIC microcontroller. Pin 7 of the 485 communication chip is connected to pin 8 and pin 1 of the anti-interference chip via a series 22Ω resistor R5. Pin 6 of the 485 communication chip is connected to pin 5 and pin 4 of the anti-interference chip via a series 22Ω resistor R4. The communication circuit is connected to connector CZ3. The contact acquisition circuit, the relay drive circuit under test, and the logic drive circuit are connected to connector CZ4. Connector CZ6 is connected to the power supply circuit of the relay drive circuit under test.
[0009] Furthermore, the positive output port of the 5V switching power supply is connected to connector CZ4-3 of the main control board, and the negative output port of the 5V switching power supply is connected to connector CZ4-4 of the main control board; the positive output port of the 24V switching power supply is connected to connector CZ4-1 of the main control board, and the negative output port of the 24V switching power supply is connected to connector CZ4-2 of the main control board; the positive output port of the 24V drive power supply is connected to connector CZ5-1 of the main control board, and the negative output port of the 24V drive power supply is connected to connector CZ5-2 of the main control board, and is connected to the relay drive circuit under test.
[0010] Furthermore, the voltage divider resistors include R1 and R2, wherein pins R1-1, R1-2, R2-1, and R2-2 are respectively connected to pins 3, 4, 2, and 1 of the main control board connector CZ6.
[0011] Furthermore, the touch screen is connected to the main control board's terminal CZ3 via RS485 half-duplex serial communication; the touch screen's VDD is connected to the positive output port of the 24V touch screen power supply; the touch screen's GND is connected to the negative output port of the 24V touch screen power supply; and the touch screen's TX1 and TX2 are connected to pins 1 and 2 of the toggle switch, respectively.
[0012] Furthermore, the relay contact bounce time testing device is a portable box-like structure.
[0013] The beneficial effects of this utility model are as follows: This utility model connects the relay socket to the main control board, and connects the contacts of the relay under test to the test interface of the main control unit on the main control board through the logic switching of the internal circuit of the main control board. The relay under test is driven by the 24V driving power supply to complete the automatic test of the relay contact return. The test results are automatically saved and the test results are automatically judged as qualified. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall connection of the relay contact bounce time testing device of this utility model;
[0015] Figure 2 A schematic diagram of the main control board structure;
[0016] Figure 3 This is a schematic diagram of the relay test socket structure;
[0017] Figure 4 This is a schematic diagram of the touchscreen and debug switch structure;
[0018] Figure 5 Schematic diagram of fuse, three-phase socket, and main switch;
[0019] Figure 6 This is a schematic diagram of a logic driver circuit;
[0020] Figure 7 This is a schematic diagram of the contact acquisition circuit;
[0021] Figure 8 This is a schematic diagram of the relay drive circuit under test;
[0022] Figure 9 This is a schematic diagram of a communication circuit.
[0023] In the diagram: 1 is the relay test socket, 2 is the main control board, 3 is the touch screen, 4 is the debug switch, 5 is the 5V switching power supply, 6 is the 24V switching power supply, 7 is the 24V drive power supply, 8 is the 24V touch screen power supply, 9 is the voltage divider resistor, 10 is the fuse, 11 is the three-phase socket, and 12 is the main switch. Detailed Implementation
[0024] To better explain and facilitate understanding of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0025] This utility model provides a relay contact bounce time testing device, such as... Figure 1 As shown, the system includes a relay test socket 1, a main control board 2, a touch screen 3, a debug switch 4, a 5V switching power supply 5, a 24V switching power supply 6, a 24V drive power supply 7, a 24V touch screen power supply 8, a voltage divider resistor 9, a fuse 10, a three-phase socket 11, and a main switch 12. The main control board 2 is connected to each contact of the relay test socket 1 via a main control board connector. The touch screen 3 is connected to the main control board 2 via a serial port. The main control board 2 is equipped with a microcontroller connected to the relay. Each input pin of the microcontroller is connected to the series and parallel circuits of the relay contacts under test. Each output signal of the microcontroller is connected to the contact relationship logic switching circuit and power supply access circuit of the relay under test. The 5V switching power supply 5, the 24V switching power supply 6, and the 24V drive power supply 7 are connected to the main control board 1 connector. The 24V touch screen power supply 8 is connected to the touch screen 3. The voltage divider resistor 9 is connected to the main control board 1 connector. The debug switch 4 is connected to the terminals on the touch screen 3. Figure 5 As shown, the three-phase socket 11 is connected to the main switch 12 via fuse 10; the 5V switching power supply 5, 24V switching power supply 6, 24V drive power supply 7, and 24V touch screen power supply 8 are connected in parallel to the main switch 12. There can be multiple main control boards 1; specifically, in this embodiment, one workstation is set up, corresponding to one main control board 1.
[0026] Specifically, such as Figure 2-3 As shown, the terminals on connectors CZ1~CZ2 of the main control board 2 are respectively connected to the contacts corresponding to the relay test socket 1JCZ.
[0027] Specifically, such as Figure 1 , 4 As shown, the touch screen 3 is connected to the main control board 2 via RS485 half-duplex serial communication via terminal CZ3; the VDD of the touch screen 3 is connected to the positive output port of the 24V touch screen power supply 8; the GND of the touch screen 3 is connected to the negative output port of the 24V touch screen power supply 8; the TX1 and TX2 of the touch screen 3 are connected to pins 1 and 2 of the toggle switch 4, respectively.
[0028] Specifically, the positive output port of the 5V switching power supply 5 is connected to connector CZ4-3 of the main control board 1, and the negative output port of the 5V switching power supply 5 is connected to connector CZ4-4 of the main control board 1, providing operating power to the main control unit on the main control board 1. The positive output port of the 24V switching power supply 6 is connected to connector CZ4-1 of the main control board 1, and the negative output port of the 24V switching power supply 6 is connected to connector CZ4-2 of the main control board 1, providing switching power to the contact acquisition circuit and the drive circuit of the relay under test on the main control board. The positive output port of the 24V drive power supply 7 is connected to connector CZ5-1 of the main control board 1, and the negative output port of the 24V drive power supply 7 is connected to connector CZ5-2 of the main control board 1, providing drive power for the operation of the relay under test.
[0029] Specifically, the N pins of the 5V switching power supply 5, 24V switching power supply 6, 24V drive power supply 7, and 24V touch screen power supply 8 are connected in parallel and then connected to the pin 1 of the main switch 12; the L pins of the 5V switching power supply 5, 24V switching power supply 6, 24V drive power supply 7, and 24V touch screen power supply 8 are connected in parallel and then connected to the pin 2 of the main switch 12.
[0030] Specifically, such as Figure 6-9 As shown, the main control board 2 includes a contact acquisition circuit, a relay under test driving circuit, a communication circuit, and a logic driving circuit. The logic driving circuit includes a PIC microcontroller, which can be a PIC18F45K80. The relay under test driving circuit includes several Panasonic relays, and the contact acquisition circuit includes several Panasonic relays. The I / O port of the PIC microcontroller is connected to the input terminal of the Darlington transistor ULN2003. The output terminal of the Darlington transistor ULN2003 is connected to pin 12 of the Panasonic relay in the contact acquisition circuit and the relay under test driving circuit. Pin 1 of the Panasonic relay is connected to the positive terminal of 24V power.
[0031] Specifically, the output port of the logic drive circuit is connected to pin 12 of the Panasonic relay in the contact acquisition circuit, which is responsible for building the contact acquisition circuit. Pin 8 of the Panasonic relay in the contact acquisition circuit is connected to the moving contact of the relay under test, pin 9 of the Panasonic relay in the contact acquisition circuit is connected to the high-speed capture interface of the PIC microcontroller, pin 5 of the Panasonic relay in the contact acquisition circuit is connected to the intermediate contact of the relay under test, and pin 4 of the Panasonic relay in the contact acquisition circuit is connected to 5V GND to provide a reference voltage for the high-speed capture interface and complete multi-channel testing.
[0032] The output port of the logic drive circuit is connected to pin 12 of the Panasonic relay in the relay under test drive circuit, which is responsible for driving the relay under test. Pin 9 of the Panasonic relay in the relay under test drive circuit is connected to CZ5-2, and pin 4 of the Panasonic relay is connected to CZ5-1, which provides drive power for the operation of the relay under test. Pin 8 of the Panasonic relay is connected to the negative terminal of the relay under test, and pin 1 of the Panasonic relay is connected to the positive terminal of the relay under test, which completes the switching of the normally open-normally closed state of the relay under test.
[0033] The communication circuit includes a 485 communication chip. Pin 1 of the 485 communication chip is connected to pin 26 of the PIC microcontroller. Pin 4 of the 485 communication chip is connected to pin 25 of the PIC microcontroller. Pin 7 of the 485 communication chip is connected to pin 8 and pin 1 of the anti-interference chip via a series 22Ω resistor R5. Pin 6 of the 485 communication chip is connected to pin 5 and pin 4 of the anti-interference chip via a series 22Ω resistor R4. The communication circuit is connected to connector CZ3. The contact acquisition circuit, the relay under test drive circuit, and the logic drive circuit are connected to connector CZ4. Connector CZ6 is connected to the power supply circuit of the relay under test drive circuit.
[0034] Specifically, the voltage divider resistor 9 includes R1 and R2, wherein pins R1-1, R1-2, R2-1, and R2-2 are respectively connected to pins 3, 4, 2, and 1 of connector CZ6 on the main control board 2.
[0035] For ease of portability, the relay contact bounce time testing device of this utility model can be a portable box structure, with the relay test socket 1, touch screen 3, debugging switch 4, three-prong socket 11, etc. set on the box, and the rest of the internal circuits fixed inside the box.
[0036] The specific test method for relay contact bounce time is as follows:
[0037] Touchscreen 3 sends commands to main control board 2 via the 485 serial port in the communication circuit. Upon receiving the commands, main control board 2 changes the state of the microcontroller's output I / O port, thereby changing the input state of the logic drive circuit and consequently the output state of the logic drive circuit. After the logic drive circuit output state changes, the Panasonic relay in the control contact acquisition circuit completes the state transition, connecting the contact under test to the microcontroller's high-speed capture interface and the test contact of the relay under test to the test interface of the main control unit on main control board 2. Simultaneously, the logic drive circuit drives the relevant relays to complete the state change of the relay under test's drive circuit. The relay under test operates via the 24V drive power supply 7. During this operation, the main control unit on main control board 2 tests the contact bounce time and automatically records the test results.
[0038] This invention achieves automatic testing of relay contact bounce time through the control of touch screen 3 and main control board 2, which solves the drawbacks of manual testing that cannot guarantee testing efficiency and accuracy. Moreover, the test results are automatically judged and recorded, saving a lot of manpower and material resources.
[0039] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any modifications, alterations, substitutions, and variations made by those skilled in the art to the above embodiments are within the scope of the present invention.
Claims
1. A relay contact bounce time testing device, characterized in that: The system includes a relay test socket (1), a main control board (2), a touch screen (3), a debug switch (4), a 5V switching power supply (5), a 24V switching power supply (6), a 24V drive power supply (7), a 24V touch screen power supply (8), a voltage divider resistor (9), a fuse (10), a three-phase socket (11), and a main switch (12). The main control board (2) is connected to each contact of the relay test socket (1) via a main control board connector. The touch screen (3) is connected to the main control board (2) via a serial port. The main control board (2) is equipped with a microcontroller connected to the relay. Each input pin of the microcontroller is connected to the series circuit and parallel circuit of the contact of the relay under test. Each output signal of the microcontroller is connected to... In the contact relationship logic switching circuit and power supply access circuit of the relay under test, the 5V switching power supply (5), 24V switching power supply (6), and 24V driving power supply (7) are connected to the main control board (1) connector, the 24V touch screen power supply (8) is connected to the touch screen (3), the voltage divider resistor (9) is connected to the main control board (1) connector, the debugging switch (4) is connected to the wiring terminal on the touch screen (3), and the three-phase socket (11) is connected to the main switch (12) through the fuse (10); the 5V switching power supply (5), 24V switching power supply (6), 24V driving power supply (7), and 24V touch screen power supply (8) are connected in parallel to the main switch (12).
2. The relay contact bounce time testing device according to claim 1, characterized in that: The pin N of the 5V switching power supply (5), 24V switching power supply (6), 24V driving power supply (7), and 24V touch screen power supply (8) are connected in parallel and then connected to pin 1 of the main switch (12); the pin L of the 5V switching power supply (5), 24V switching power supply (6), 24V driving power supply (7), and 24V touch screen power supply (8) are connected in parallel and then connected to pin 2 of the main switch (12).
3. The relay contact bounce time testing device according to claim 1, characterized in that: The terminals on the connectors CZ1~CZ2 of the main control board (2) are respectively connected to the contacts corresponding to JCZ of the relay test socket (1).
4. The relay contact bounce time testing device according to claim 1, characterized in that: The main control board (2) includes a contact acquisition circuit, a relay under test driving circuit, a communication circuit, and a logic driving circuit. The logic driving circuit includes a PIC microcontroller. The relay under test driving circuit includes several Panasonic relays. The contact acquisition circuit includes several Panasonic relays. The I / O port of the PIC microcontroller is connected to the input terminal of the Darlington transistor ULN2003. The output terminal of the Darlington transistor ULN2003 is connected to pin 12 of the Panasonic relay in the contact acquisition circuit and the relay under test driving circuit. Pin 1 of the Panasonic relay in the relay under test driving circuit is connected to the positive terminal of 24V. Pin 8 of the Panasonic relay in the contact acquisition circuit is connected to the moving contact of the relay under test. Pin 9 of the Panasonic relay in the contact acquisition circuit is connected to the high-speed capture interface of the PIC microcontroller. Pin 5 of the Panasonic relay in the contact acquisition circuit is connected to the intermediate contact of the relay under test. Pin 4 of the Panasonic relay in the contact acquisition circuit is connected to 5V GND. Pin 9 of the Panasonic relay is connected to CZ5-2. Pin 4 of the Panasonic relay in the relay under test drive circuit is connected to CZ5-1. Pin 8 of the Panasonic relay in the relay under test drive circuit is connected to the negative terminal of the relay under test. Pin 1 of the Panasonic relay in the relay under test drive circuit is connected to the positive terminal of the relay under test. The communication circuit includes a 485 communication chip. Pin 1 of the 485 communication chip is connected to pin 26 of the PIC microcontroller. Pin 4 of the 485 communication chip is connected to pin 25 of the PIC microcontroller. Pin 7 of the 485 communication chip is connected to pin 8 and pin 1 of the anti-interference chip via a series 22Ω resistor R5. Pin 6 of the 485 communication chip is connected to pin 5 and pin 4 of the anti-interference chip via a series 22Ω resistor R4. The communication circuit is connected to connector CZ3. The contact acquisition circuit, the relay under test drive circuit, and the logic drive circuit are connected to connector CZ4. Connector CZ6 is connected to the power supply circuit of the relay under test drive circuit.
5. The relay contact bounce time testing device according to claim 1, characterized in that: The positive output port of the 5V switching power supply (5) is connected to connector CZ4-3 of the main control board (1), and the negative output port of the 5V switching power supply (5) is connected to connector CZ4-4 of the main control board (1); the positive output port of the 24V switching power supply (6) is connected to connector CZ4-1 of the main control board (1), and the negative output port of the 24V switching power supply (6) is connected to connector CZ4-2 of the main control board (1); the positive output port of the 24V driving power supply (7) is connected to connector CZ5-1 of the main control board (1), and the negative output port of the 24V driving power supply (7) is connected to connector CZ5-2 of the main control board (1).
6. The relay contact bounce time testing device according to claim 1, characterized in that: The voltage divider resistor (9) includes R1 and R2, wherein pins R1-1, R1-2, R2-1, and R2-2 are respectively connected to pins 3, 4, 2, and 1 of connector CZ6 on the main control board (2).
7. The relay contact bounce time testing device according to claim 1, characterized in that: The touch screen (3) is connected to the main control board (2) terminal CZ3 via RS485 half-duplex serial communication; the VDD of the touch screen (3) is connected to the positive output port of the 24V touch screen power supply (8); the GND of the touch screen (3) is connected to the negative output port of the 24V touch screen power supply (8); the TX1 and TX2 of the touch screen (3) are connected to pins 1 and 2 of the toggle switch (4) respectively.
8. The relay contact bounce time testing device according to claim 1, characterized in that: The relay contact bounce time testing device is a portable box-shaped structure.