Solder supplementing liquid level height mechanical control device and solder supplementing system
By employing a mechanical structure that separates the control device from the solder bath in the high-temperature solderability test, accurate control of the liquid level and isolation of the solder composition are achieved. This solves the problem that existing technologies cannot simultaneously meet the requirements of height control and avoid solder contamination, thereby improving the accuracy of the test and the service life of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANXI FENXI HEAVY IND CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-04-24
AI Technical Summary
Existing liquid level control technologies cannot simultaneously meet the requirements of height control and avoiding solder contamination in high-temperature solderability tests, and the sensors have low accuracy and are not applicable.
A separate control device is used to separate the control tank from the solder bath. The switching between the feeding process and the heating process is controlled by the weight of the overflow liquid. The circuit switching is achieved by using a mechanical structure to avoid contamination of the solder components.
It enables accurate control of liquid level under high temperature conditions, avoids solder contamination, improves the accuracy of the test and the service life of the equipment, and reduces resource waste.
Smart Images
Figure CN224163920U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of welding technology, and in particular to a mechanical control device for the height of solder replenishment liquid level and a solder replenishment system. Background Technology
[0002] With the revision of the main standards for solderability testing, the solder joint method has become the primary testing method for solderability. In the re-inspection of overdue components, solderability testing has been added as a test item to avoid welding defects. However, because electronic system assembly and debugging companies involve a small number of components undergoing re-testing and a wide variety of package types, their design requirements differ from those of component manufacturers.
[0003] When using the solder bath method as a component solderability testing method, there are significant differences in the minimum immersion depth, immersion angle, and immersion direction for different types of packaged components. To meet the solderability testing requirements of electronic system soldering manufacturers in component re-inspection, the solderability testing device is designed with consistent liquid level and motor stroke. The minimum immersion depth, angle, and direction of the leads are ensured by adjusting the component clamping height and angle. This maximizes the accuracy of the test results and further guarantees the reliability of the soldering quality.
[0004] Existing liquid level control technologies typically employ various sensors, using feedback results to control liquid replenishment and cessation, and are generally applied in ambient temperatures. However, considering the high-temperature testing conditions of 245℃±2℃ or 245℃±5℃ for solderability tests, directly utilizing existing technologies would necessitate the use of sensors specifically designed for liquid level and solder material, requiring custom-made sensors.
[0005] Furthermore, due to the solder composition requirements in the solderability test method, other components should be avoided from falling into the solder as much as possible to prevent affecting the test results. Therefore, existing main liquid level sensors, such as high-temperature glass plates and metal float level gauges, are not suitable for this method; ultrasonic level gauges can avoid changes in solder composition, but their accuracy is lower due to interference from the characteristics of the solder bath material, so they are also not suitable for this immersion method.
[0006] There is currently no effective solution to the above problems in existing technologies. Utility Model Content
[0007] To address the aforementioned issues, this invention provides a mechanical control device for solder replenishment liquid level and a solder replenishment system. By separating the control device from the solder bath, the composition of the solder is not affected. The switching between the feeding process and the heating process is controlled by the weight of the overflowing liquid, ensuring that no replenishment is required during temperature maintenance. This solves the problem in the prior art that it is impossible to simultaneously meet the requirements of height control and avoid solder contamination.
[0008] To achieve the above objectives, this utility model provides a mechanical control device for solder replenishment liquid level height, comprising: a receiving box with an inlet at the top and a liquid-containing cavity inside for receiving solder overflowing from the solder bath; a switch base with a through cavity in the middle along the axial direction, a pin hole along the radial direction, and axially extending positioning grooves on opposite side walls; a first elastic element between the bottom of the receiving box and the top of the switch base; a pressure block disposed inside the through cavity; and an actuating element, which, in the non-stressed state, is partially disposed within the through cavity. The top is limited by movable pin components in the pin holes on both sides; a connecting rod and a switch block are provided at both ends of the connecting rod, and the connecting rod passes through the positioning groove on one side, the pressure block and the positioning groove on the other side in sequence; a feeding power block and a temperature control power block are provided, and the feeding power block and the temperature control power block are respectively set for two switch blocks. Under normal conditions, one of the switch blocks is in contact with the feeding power block. Under the force state, the receiving box pushes the action component to act on the pressure block, thereby causing the switch block on one side to leave the feeding power block to disconnect the feeding circuit, and the switch block on the other side to contact the temperature control power to connect the temperature control circuit.
[0009] Optionally, the through cavity may have a limiting concave surface for limiting the movement of the actuator when it moves to the limiting concave surface.
[0010] Optionally, the movable pin assembly includes: a limiting pin, a second elastic element, and a screw; the elastic element is disposed between the limiting pin and the screw, the limiting pin protrudes from the pin hole and enters the through cavity, and the screw is fixed to the side of the switch base.
[0011] Optionally, there are at least two first elastic elements, evenly distributed along the same circumference on the top of the switch base, wherein the first elastic element is a spring and the second elastic element is a spring.
[0012] Optionally, there are at least two pin holes located at the same height on the switch base, and each pin hole contains a movable pin assembly.
[0013] Alternatively, the actuator may be a sphere.
[0014] Optionally, the feeding power block is connected to a terminal block; the conductive surface of the feeding power block contacts the conductive surface of the on / off block on this side when not under stress, and the on / off block on this side is connected to a terminal block.
[0015] Optionally, the temperature control power block is connected to a terminal block; the top surface of the temperature control power block is a conductive surface, and under stress, the conductive surface of the on / off block on this side contacts the conductive surface of the temperature control power block, and the on / off block on this side is provided with a terminal block.
[0016] Optionally, the feed power block, temperature control power block, and switching block, except for the conductive surface, have all other surfaces that are oxidized.
[0017] On the other hand, this utility model also provides a solder replenishment system, which uses the above-mentioned solder replenishment liquid level mechanical control device for replenishment control, including: a feeding device, a solder tank, a temperature control device, and a solder replenishment liquid level mechanical control device; the solder tank has an overflow port at a specified liquid level; the receiving box of the solder replenishment liquid level mechanical control device corresponds to the overflow port; the feeding device is connected to the inlet of the solder tank and electrically connected to the feeding power supply block of the solder replenishment liquid level mechanical control device; the temperature control device is used to control the temperature of the solder tank and is electrically connected to the temperature control power supply block of the solder replenishment liquid level mechanical control device.
[0018] The above technical solution has the following beneficial effects: the switching of the control circuit through the mechanical structure is more accurate and suitable for immersion experiments, and can meet the needs of various tests; the control system is separated from the solder bath, which does not affect the solder composition and avoids the impact of high temperature environment on equipment life; the mechanical structure can be automatically or manually reset and can be reused multiple times; the liquid in the receiving box can be reused, improving the solder utilization rate and avoiding resource waste. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of the internal structure of the mechanical control device for solder replenishment liquid level height provided in this embodiment of the utility model;
[0021] Figure 2 This is a schematic diagram of the external structure of the mechanical control device for solder replenishment liquid level height provided in this embodiment of the utility model;
[0022] Figure 3 This is a cross-sectional structural schematic diagram of the switch holder provided in an embodiment of the present utility model;
[0023] Figure 4 This is a schematic diagram of the receiving box provided in an embodiment of the present utility model;
[0024] Figure 5 This is a schematic diagram of the structure of the feeding power block provided in this embodiment of the utility model;
[0025] Figure 6This is a schematic diagram of the structure of the temperature control power supply block provided in this embodiment of the utility model;
[0026] Figure 7 This is a schematic diagram of the control circuit provided in an embodiment of the present invention;
[0027] Figure 8 This is a schematic diagram of the solder replenishment system provided in this embodiment of the utility model.
[0028] Reference numerals: 100-Mechanical control device for solder replenishment liquid level; 200-Soldering tank; 300-Specified liquid level height; 400-Overflow outlet; 500-Feeding device; 1-Receiving box; 101-Liquid chamber; 102-Groove; 2-Switch base; 201-Pin hole; 202-Limiting concave surface; 3-Pressure block; 4-Actuating component; 5-Modible pin assembly; 6-Connecting rod; 7-Break block; 8-Feeding power supply block; 801-Conducting surface of feeding power supply block; 9-Temperature control power supply block; 901-Break surface of temperature control power supply block. Detailed Implementation
[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0030] To address the problem in existing solderability tests that cannot simultaneously control solder height and prevent solder contamination, this invention provides a mechanical control device for solder replenishment level. Figure 1 This is a schematic diagram of the internal structure of the mechanical control device for solder replenishment liquid level height provided in this embodiment of the utility model; Figure 2 This is a schematic diagram of the external structure of the mechanical control device for solder replenishment liquid level height provided in this embodiment of the utility model, as shown below. Figures 1-2As shown, the device includes: a receiving box 1 with an inlet at the top and a liquid-containing chamber 101 inside for receiving solder overflowing from the soldering tank; a switch base 2 with a through cavity in the middle along the axial direction and pin holes 201 along the radial direction, and axially extending positioning grooves on opposite side walls; a first elastic element between the bottom of the receiving box 1 and the top of the switch base 2; a pressure block 3 located inside the through cavity; and an actuating element 4, which, in the non-stressed state, is partially located at the top of the through cavity and passes through movable pin assemblies in the pin holes 201 on both sides. 5. Limiting; connecting rod 6 and on / off block 7, with on / off blocks 7 respectively provided at both ends of the connecting rod 6, the connecting rod 6 passing through the positioning groove on one side, the pressure block 3 and the positioning groove on the other side in sequence; feeding power block 8 and temperature control power block 9, the feeding power block 8 and temperature control power block 9 are respectively set corresponding to the two on / off blocks 7. Under normal conditions, one of the on / off blocks 7 is in contact with the feeding power block 8. Under the force state, the receiving box 1 pushes the action member 4 to act on the pressure block 3, thereby causing the on / off block 7 on one side to leave the feeding power block 8 to disconnect the feeding circuit, and the on / off block 7 on the other side to contact the temperature control power to connect the temperature control circuit.
[0031] like Figure 4 As shown, the receiving box 1 is cylindrical with an opening at the top that connects to the internal liquid chamber 101. Solder overflowing from the solder bath can be discharged from the overflow port and enter the liquid chamber 101 through the inlet. As the solder accumulates, gravity acts on the subsequent mechanism to achieve power switching.
[0032] A switch base 2 is provided on the lower side of the receiving box 1. The switch base 2 has a through cavity in the middle along the axial direction to accommodate the movement of the pressure block 3 and the connecting rod 6. The switch base 2 has a pin hole 201 in the radial direction to install the movable pin assembly 5 and limit the displacement of the moving part 4. The opposite side walls are respectively provided with axially extending positioning grooves to guide and limit the movement of the connecting rod 6.
[0033] The first elastic element is located between the bottom of the receiving box 1 and the top of the switch base 2, providing elastic support so that the receiving box 1 returns to its original position when there is no external force, and ensuring that the power switching is triggered only after the solder has accumulated to a certain level. The bottom of the receiving box 1 and the top of the switch base 2 are respectively provided with corresponding grooves 102 to accommodate the two ends of the first elastic element.
[0034] The pressure block 3 is located inside the through cavity and can move axially. When subjected to force, it moves downward and acts on the connecting rod 6 to achieve power switching.
[0035] like Figure 3As shown, the actuator 4 is limited in the pin hole 201 by the movable pin assembly 5, so that part of the actuator 4 is limited in the through cavity, and the other part protrudes from the top surface of the switch seat 2. When the receiving box 1 moves downward, it gradually presses the actuator 4 into the through cavity, contacting the movable pin assembly 5 to limit the actuator 4.
[0036] The connecting rod 6 passes through the positioning groove, switch base 2, and pressure block 3. Under normal conditions, the connecting rod 6 is located at the top of the positioning groove, so that the pressure block 3 is suspended in the through cavity. Each end of the connecting rod 6 is provided with a switching block 7. Each switching block 7 has a conductive surface. In the non-stressed state, the conductive surface of the feeding power block 8 contacts the conductive surface of the corresponding switching block 7 to connect the feeding circuit, while the conductive surface of the temperature control power block 9 does not contact the conductive surface of the corresponding switching block 7, thus disconnecting the temperature control circuit. In the stressed state, the conductive surface of the feeding power block 8 does not contact the conductive surface of the corresponding switching block 7, thus disconnecting the feeding circuit, while the conductive surface of the temperature control power block 9 contacts the conductive surface of the corresponding switching block 7, thus connecting the temperature control circuit.
[0037] The device is used as follows: In the initial state, the feeding device is connected to the power supply, and the temperature control device is connected to the power supply block. The feeding device begins to feed solder into the welding tank. When the solder in the welding tank reaches the predetermined height, it flows into the receiving box 1 through the overflow outlet. The receiving box 1 gradually moves downward under the action of the first elastic element, and exerts downward pressure on the actuating element 4, causing the movable pin assembly 5 to be gradually pressed back by the actuating element 4. The actuating element 4 continues to move downward to act on the pressure block 3, causing it to move downward, and at the same time driving the connecting rod 6 downward, so that the on / off block 7 on one side gradually moves away from the on / off surface of the feeding power supply block, and the on / off block 7 on the other side gradually approaches the on / off surface of the temperature control power supply block until it makes contact, so that the feeding device is closed and the temperature control device is activated.
[0038] As an optional implementation, the through cavity is provided with a limiting concave surface 202, which is used to limit the movement of the actuator 4 when it moves to the limiting concave surface 202.
[0039] The through cavity has a limiting concave surface 202, the main function of which is to limit the movement of the actuator 4 when it moves to the limiting concave surface 202, so as to ensure the stability of the system under a specific state and prevent the components from continuing to move due to inertia or external force, thereby affecting the reliability of circuit switching.
[0040] When the actuator 4 moves to the predetermined position (i.e., when the switch block 7 has just completed the power switching), the limiting concave surface 202 provides a mechanical constraint to stop the actuator 4 from moving further and prevent it from exceeding the design range.
[0041] As an optional implementation, the movable pin assembly 5 includes: a limiting pin, a second elastic element, and a screw; the elastic element is disposed between the limiting pin and the screw, the limiting pin protrudes from the pin hole 201 and enters the through cavity, and the screw is fixed to the side of the switch base 2.
[0042] A limit pin is located within the pin hole 201 of the switch base 2, with one end protruding from the pin hole 201 and entering the through cavity. This pin mechanically limits the movement of the actuator 4 to prevent it from exceeding its set range of motion. A second elastic element is located between the limit pin and the screw, providing elastic restoring force so that the limit pin maintains its initial position when not subjected to external force and springs back to its original position after being subjected to force. The screw is fixed to the side of the switch base 2 to stabilize the installation position of the limit pin and, by applying a preload, ensures the effective function of the elastic element, preventing the limit pin from loosening due to vibration or external interference.
[0043] As an optional implementation, there are at least two first elastic elements, which are evenly distributed along the same circumference on the top of the switch base 2. The first elastic element is a spring; the second elastic element is a spring.
[0044] There are at least two first elastic elements, which are evenly distributed along the same circumference on the top of the switch base 2 to ensure that the receiving box 1 can maintain a stable stress state when subjected to force, and to avoid tilting or uneven operation caused by single-point force.
[0045] The first elastic element is a spring, whose elastic recovery characteristics can provide continuous support force, so that the receiving box 1 can maintain its initial position when it is not subjected to external force, and can smoothly rebound to its original position after being subjected to force.
[0046] The second elastic element is a spring, which acts between the limit pin and the screw to provide elastic restoring force to the limit pin, so as to ensure that the limit pin can automatically return to its initial position when the external force disappears after it has been moved by force.
[0047] As an optional implementation, there are at least two pin holes 201, located at the same height on the switch base 2, and each pin hole 201 is provided with a movable pin assembly 5.
[0048] There are at least two pin holes 201, and they are located at the same height on the switch base 2, so that the pin holes 201 are arranged on the same horizontal plane to ensure that the movable pin assembly 5 is subjected to uniform force and to ensure the stability of the movement of the actuator 4 in the through cavity. Each pin hole 201 is provided with a movable pin assembly 5, and multiple assemblies cooperate to limit the movement of the actuator 4.
[0049] As an alternative implementation, the action element 4 is a sphere.
[0050] The actuating component 4 is a steel ball. The spherical structure can move flexibly in multiple directions when subjected to force, reducing frictional resistance and ensuring smoother movement within the through cavity.
[0051] As an optional implementation, the feed power block 8 is connected to a terminal block; the conductive surface of the feed power block 8 is in contact with the conductive surface of the on / off block 7 on the same side when it is not under stress, and the on / off block 7 on the same side is connected to a terminal block.
[0052] The feeding power supply block 8 is connected to terminals for electrical connection with an external feeding circuit to ensure stable power signal transmission. Correspondingly, the on / off block 7 on this side also has terminals for electrical connection with the external feeding circuit. When the conductive surfaces are in contact, both terminals are simultaneously connected to the feeding circuit; this contact is equivalent to a closed switch, enabling the feeding circuit to conduct. Figure 5 As shown, the peripheral surface of the circular opening of the feed power block 8 is the feed power block conductive surface 801, which is used to connect the wiring terminals. The bottom of the groove 102 is the feed power block conductive surface 801, which can contact the top conductive surface of the conductive block on this side to realize the circuit connection.
[0053] As an optional implementation, the temperature control power block 9 is connected to a terminal block; the top surface of the temperature control power block 9 is a conductive surface. Under stress, the conductive surface of the switch block on this side contacts the conductive surface 901 of the temperature control power block, and the switch block 7 on this side is provided with a terminal block.
[0054] The temperature control power supply block 9 is connected to terminals for electrical connection with an external temperature control circuit to ensure stable power signal transmission. Correspondingly, the on / off block 7 on this side is also equipped with terminals for electrical connection with the external temperature control circuit. When the conductive surfaces are in contact, both terminals are simultaneously connected to the temperature control circuit. The contact of the conductive surfaces is equivalent to closing a switch, making the temperature control circuit conductive.
[0055] like Figure 6 As shown, the top of the temperature control power block 9 is the temperature control power block conductive surface 901, which is used to contact the bottom conductive surface of the side switch block 7 to realize circuit connection. The peripheral surface of the circular opening of the temperature control power block 9 is the temperature control power block conductive surface 901, which is used to connect the wiring terminal.
[0056] As an optional implementation, the feed power block 8, temperature control power block 9, and switching block 7 are all oxidized surfaces except for the conductive surface.
[0057] To ensure the continuity of the feed power supply block 8, the temperature control power supply block 9, and the switching block 7, all surfaces except the conductive surfaces are oxidized.
[0058] like Figure 7 As shown, terminal a is the on / off switch terminal, terminal b is the feed power supply terminal, and terminal c is the temperature control power supply terminal. Figure 7This is a schematic diagram showing the contact surface of the switching block with the contact surface of the feeding power block. End a is connected to end b, which connects the control circuit of the feeding device. When one side of the switching block is not connected to the feeding power block, while the other side of the switching block is connected to the temperature control power block, end a is connected to end c, which connects the circuit of the constant temperature control system.
[0059] This utility model embodiment also provides a solder replenishment system, which uses the aforementioned solder replenishment liquid level mechanical control device 100 for replenishment control, such as... Figure 8 As shown, the system includes: a feeding device 500, a solder bath 200, a temperature control device, and a solder replenishment liquid level mechanical control device 100; the solder bath 200 has an overflow port 400 at a specified liquid level of 300; the receiving box of the solder replenishment liquid level mechanical control device 100 corresponds to the overflow port; the feeding device 500 is connected to the inlet of the solder bath 200 and is electrically connected to the feeding power supply block of the solder replenishment liquid level mechanical control device 100; the temperature control device is used to control the temperature of the solder bath and is electrically connected to the temperature control power supply block of the solder replenishment liquid level mechanical control device 100.
[0060] The solder bath method, applicable to component solderability testing, requires a consistent solder level in the solder bath to ensure optimal test results. Therefore, a mechanical control device for the solder level during replenishment is designed to control the solder level. The process is described below:
[0061] a) Due to the thermal expansion and contraction characteristics of materials, based on the capacity of the solder in the solder bath, an indicator line (specified liquid level height) is marked at the position of the overflow outlet of the solder bath inside the solder bath to remind the user to replenish the solder. The power supply of the feeding device is only started when the solder liquid level is lower than the specified liquid level height to avoid waste of replenishing the solder.
[0062] b) When the solder overflows, the mechanical control device for the solder replenishment liquid level starts working and switches the power supply of the feeding device to the power supply of the temperature control system. This operation sequence is to avoid the feeding process affecting the immersion effect. The overflow outlet size of the solder tank should be compatible with the receiving box in the mechanical control device for the solder replenishment liquid level.
[0063] c) During the heating process, a small amount of solder will overflow due to thermal expansion and contraction. However, since the solder can be collected in the receiving box in the liquid level mechanical control structure and does not affect the power switch status, the collected solder can be reused.
[0064] The above technical solution has the following beneficial effects: the switching of the control circuit through the mechanical structure is more accurate and suitable for immersion experiments, and can meet the needs of various tests; the control system is separated from the solder bath, which does not affect the solder composition and avoids the impact of high temperature environment on equipment life; the mechanical structure can be automatically or manually reset and can be reused multiple times; the liquid in the receiving box can be reused, improving the solder utilization rate and avoiding resource waste.
[0065] The above-described specific embodiments of the utility model further illustrate the purpose, technical solution, and beneficial effects of the utility model. It should be understood that the above content is only a specific embodiment of the utility model and is not intended to limit the scope of protection of the utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the utility model should be included within the scope of protection of the utility model.
Claims
1. A mechanical control device for solder replenishment liquid level height, characterized in that, include: The receiving box has an inlet at the top and a liquid-containing chamber inside for receiving solder overflowing from the soldering tank. A switch base, wherein a through cavity is provided in the middle along the axial direction, a pin hole is provided in the radial direction, and axially extending positioning grooves are respectively provided on the opposite side walls. A first elastic element is provided between the bottom of the receiving box and the top of the switch base. A pressure block, wherein the pressure block is disposed inside the through cavity; In the non-stressed state, the actuating component is located at the top of the through cavity and is limited by the movable pin assembly in the pin holes on both sides. The connecting rod and the through-block are provided at both ends of the connecting rod. The connecting rod passes through the positioning groove, the pressure block and the positioning groove on the other side in sequence. The feeding power block and the temperature control power block are respectively set with two on / off blocks. Under normal conditions, one of the on / off blocks is in contact with the feeding power block. Under the force condition, the receiving box pushes the action of the pressing block, thereby causing the on / off block on one side to leave the feeding power block to disconnect the feeding circuit, and the on / off block on the other side to contact the temperature control power block to connect the temperature control circuit.
2. The mechanical control device for solder replenishment liquid level height according to claim 1, characterized in that: The through cavity has a limiting concave surface, which is used to limit the movement of the actuator when it moves to the limiting concave surface.
3. The mechanical control device for solder replenishment liquid level height according to claim 1, characterized in that, The movable pin assembly includes: Limit pin, second elastic element and screw; The elastic element is disposed between the limiting pin and the screw. The limiting pin protrudes from the pin hole and enters the through cavity. The screw is fixed to the side of the switch base.
4. The mechanical control device for solder replenishment liquid level height according to claim 3, characterized in that: There are at least two first elastic elements, which are evenly distributed along the same circumference on the top of the switch base. The first elastic element is a spring. The second elastic element is a spring.
5. The mechanical control device for solder replenishment liquid level height according to claim 1, characterized in that: There are at least two pin holes, located at the same height on the switch base, and each pin hole contains a movable pin assembly.
6. The mechanical control device for solder replenishment liquid level height according to claim 1, characterized in that: The actuator is a sphere.
7. The mechanical control device for solder replenishment liquid level height according to claim 1, characterized in that: The feed power block is connected to a terminal block; The conductive surface of the feed power block is in contact with the conductive surface of the on / off block on the same side when it is not under stress, and the on / off block on the same side is connected to a terminal block.
8. The mechanical control device for solder replenishment liquid level height according to claim 1, characterized in that: The temperature control power supply block is connected to a terminal block; The top surface of the temperature control power block is a conductive surface. Under stress, the conductive surface of the on / off block on this side contacts the conductive surface of the temperature control power block, and the on / off block on this side is provided with wiring terminals.
9. The mechanical control device for solder replenishment liquid level height according to any one of claims 7-8, characterized in that: Except for the conductive surface, all other surfaces of the feed power block, temperature control power block, and switching block are oxidized surfaces.
10. A solder replenishment system, characterized in that, The solder replenishment control is performed using the mechanical control device for solder replenishment level height as described in any one of claims 1-9, including: Feeding device, welding tank, temperature control device, and mechanical control device for welding replenishment liquid level; The welding tank is provided with an overflow outlet at a specified height of the liquid level; The receiving box of the solder replenishment liquid level mechanical control device corresponds to the overflow port; The feeding device is connected to the inlet of the welding tank and is electrically connected to the feeding power block of the mechanical control device for the welding material replenishment liquid level height. The temperature control device is used to control the temperature of the welding tank and is electrically connected to the temperature control power block of the mechanical control device for the welding flux replenishment liquid level height.