Miniaturized unified Ka frequency band up-conversion channel convenient to disassemble

Abstract

The utility model provides a miniaturized unified Ka frequency band up-conversion channel convenient to disassemble, which comprises a packaged structural member, an upper cover plate, and a radio frequency module, a frequency conversion module, an intermediate frequency module and a Ka frequency band filter which are connected in the structural member, and the structural member is provided with a unified area and a filter area. According to the utility model, the broadband harmonic mixing chip, the numerical control attenuator chip and the amplifier chip which can cover all Ka frequency bands are selected, the Ka up-conversion module is divided into a filter area and a unified area, variables caused by all customized up-conversion channels are concentrated in the filter area, and the filters are replaced by being connected with the unified area through the gold wires, so that the replacement efficiency is improved. The model selection of each chip, the design of a printed board, the position of an external interface and the like of a unified region are not influenced; the radio frequency interface, the intermediate frequency interface and the local oscillator interface are SMP interfaces, outlets of the low-frequency connector and the intermediate-frequency SMP connector face downwards, and SMP-KK can be directly used for direct insertion during follow-up assembly and test, so that assembly and test are facilitated.

Description

Technical Field

[0001] This utility model relates to the field of electronic component technology, specifically to a miniaturized, easily detachable, standardized Ka-band upconversion channel. Background Technology

[0002] Radio frequency (RF) channels are divided into receiving channels and transmitting channels. The former downconverts the RF signal from the antenna to an intermediate frequency (IF) signal that can be processed by the digital baseband module, while the latter upconverts the IF signal from the digital baseband module to an RF signal and cascades it with the transmitting antenna to achieve communication in space.

[0003] Currently, the frequencies of radio frequency signals used in space communication vary, and the required output frequency range of upconversion channels also varies. Although ultra-wideband upconversion channels can make the channel bandwidth larger, they cannot meet the high harmonic noise suppression requirements of most upconversion channels.

[0004] Given the varying frequency requirements of radio frequency channels and the different applicable radio and intermediate frequency bands, existing upconversion channels are often presented as customized modules to meet the requirements of high harmonic noise suppression. However, the problem with customized modules is that when the applicable frequency changes, the physical interface, electrical interface, and radio frequency interface of the radio frequency channel will all change. This poses difficulties for standardized design, mass automated production and testing of channel modules, and cost reduction.

[0005] Therefore, there is a need for a miniaturized, easily detachable, unified upconversion channel that can comprehensively consider the frequency requirements of various Ka-band models. Utility Model Content

[0006] This invention addresses the issue of customized RF channels by providing a miniaturized, easily disassembled, standardized Ka-band upconversion channel. It utilizes broadband harmonic mixer chips, digitally controlled attenuator chips, and amplifier chips capable of covering all Ka-band frequencies. The Ka upconversion module is divided into a "filter area" and a "standardized area." All variables arising from customized upconversion channels are concentrated in the filter replacement within the "filter area," connected to the "standardized area" via gold wires. This connection does not affect the selection of individual chips, PCB design, or external interface locations within the "standardized area." The RF, IF, and local oscillator interfaces use SMP interfaces. The low-frequency and IF SMP connectors have their outlets facing downwards, allowing for direct insertion using SMP-KK connectors during assembly and testing, facilitating both processes.

[0007] This utility model provides a miniaturized and easily disassembled unified Ka-band upconversion channel, including an encapsulated structural component, a top cover plate, a radio frequency module, an upconversion module, an intermediate frequency module connected in the structural component, and a Ka-band filter that is connected to the radio frequency module and the upconversion module by gold wire bonding. The upconversion module and the intermediate frequency module are interconnected.

[0008] The structural component includes the structural component body and the unified area and filter area connected in the structural component body;

[0009] The unified area is set on both sides of the filter area. The RF module, frequency conversion module and intermediate frequency module are connected in the unified area, and the Ka-band filter is connected in the filter area.

[0010] The radio frequency module includes a radio frequency printed circuit board and radio frequency signal components connected to the radio frequency printed circuit board; the frequency conversion module includes a frequency conversion printed circuit board and frequency conversion components connected to the frequency conversion printed circuit board.

[0011] One end of the Ka-band filter is connected to the microstrip line of the RF printed circuit board via gold wire bonding, and the other end is connected to the microstrip line of the frequency converter printed circuit board via gold wire bonding.

[0012] The miniaturized, easily detachable, modular Ka-band upconversion channel of this utility model, as a preferred embodiment, includes a radio frequency signal component comprising a digitally controlled attenuator and a low-noise amplifier connected and interconnected on a radio frequency printed circuit board.

[0013] The unified area includes an RF signal cavity connected to the structural body and located on one side of the filter area. The RF printed circuit board is bonded to the inner bottom surface of the RF signal cavity. The digitally controlled attenuator is connected to one end of the Ka-band filter through the microstrip line of the RF printed circuit board.

[0014] In a preferred embodiment of the miniaturized, easily detachable, unified Ka-band upconversion channel described in this utility model, the radio frequency signal component further includes a radio frequency connector connected to the output of a low-noise amplifier. The radio frequency connector is sintered onto the structural body and is an SMP connector.

[0015] The radio frequency signal isolation cavity has a groove structure and a raised rib on one side edge. The rib is flush with the upper surface of the inner cavity of the structural component body. After encapsulation, the rib rests on the lower surface of the upper cover plate.

[0016] The radio frequency printed circuit board is bonded to the radio frequency signal cavity;

[0017] The radio frequency signal assembly also includes a detector connected in the radio frequency signal cavity;

[0018] The frequency range of the digitally controlled attenuator is 0.5GHz to 40GHz, and the frequency range of the low-noise amplifier is 26GHz to 40GHz.

[0019] The miniaturized, easily detachable, integrated Ka-band upconversion channel of this utility model, as a preferred embodiment, includes a frequency conversion component comprising a harmonic mixer and a local oscillator filter connected and interconnected on a frequency conversion printed circuit board.

[0020] The system area also includes a frequency conversion signal isolation cavity connected to the structural component body and located on the other side of the filter area. The frequency conversion printed circuit board is bonded to the frequency conversion signal isolation cavity. The harmonic mixer and the local oscillator filter are both connected to the frequency conversion printed circuit board. One end of the harmonic mixer is connected to the intermediate frequency module, and the other end is connected to the Ka-band filter through the microstrip line of the frequency conversion printed circuit board.

[0021] In a preferred embodiment of the miniaturized, easily detachable, integrated Ka-band upconversion channel described in this utility model, the upconversion component further includes a local oscillator SMP interface sintered on the structural body. The local oscillator SMP interface is located on the side of the structural body and connected to the local oscillator filter.

[0022] The frequency conversion signal isolation cavity has a groove structure and a raised rib is provided on one side edge. The rib is flush with the upper surface of the inner cavity of the structural component body. After encapsulation, the rib rests on the lower surface of the upper cover plate.

[0023] The harmonic mixer has a radio frequency range of 24GHz to 50GHz, a local oscillator frequency range of 12GHz to 25GHz, and an intermediate frequency range of DC to 5GHz.

[0024] The miniaturized, easily detachable, unified Ka-band upconversion channel of this utility model, as a preferred embodiment, further includes an intermediate frequency signal isolation cavity connected to the structural body and located on one side of the frequency conversion signal isolation cavity in the unified area.

[0025] The intermediate frequency module includes an intermediate frequency printed circuit board bonded in the intermediate frequency signal cavity and intermediate frequency components connected to and interconnected on the intermediate frequency printed circuit board, such as an intermediate frequency low-noise amplifier and an intermediate frequency low-pass filter. The intermediate frequency low-pass filter is connected to the input terminal of the harmonic mixer.

[0026] In a preferred embodiment of the miniaturized, easily detachable, standardized Ka-band upconversion channel described in this invention, the intermediate frequency module further includes a temperature-compensated attenuator connected to the intermediate frequency printed circuit board and connected to one end of the low-noise amplifier of the intermediate frequency component.

[0027] In a preferred embodiment of the miniaturized, easily detachable, standardized Ka-band upconversion channel described in this utility model, the intermediate frequency module further includes an intermediate frequency SMP input connector connected to the structural body.

[0028] The input terminals of the intermediate frequency SMP input connector are all located at the bottom of the structural component body, and the intermediate frequency SMP input connector is connected to the input port of the temperature compensation attenuator.

[0029] The miniaturized, easily detachable, standardized Ka-band upconversion channel of this utility model, as a preferred embodiment, further includes a DC printed circuit board, a low-frequency connector, and a DC connector connected to the structural component body. The low-frequency connector is sintered on the structural component body and its input end is located at the bottom of the structural component body. The DC connector is sintered on the structural component body and connected to the DC printed circuit board.

[0030] In a preferred embodiment of the miniaturized, easily detachable, standardized Ka-band upconversion channel described in this utility model, the structural components and the top cover are connected by adhesive bonding and screw fixing; the main body of the structural component is a block structure with mounting holes at the four corners, and the top cover is a plate structure.

[0031] The SMP connectors for RF modules, frequency converters, and intermediate frequency modules can all cover frequencies from 0 to 40 GHz;

[0032] Ka-band filters are bare chips that are glued to the filter area.

[0033] This invention is applied in a transceiver data processing unit to process intermediate frequency signals from a digital baseband module and upconvert them to the Ka band.

[0034] One of the technical solutions of this utility model is as follows: Broadband harmonic mixer chips, digitally controlled attenuator chips, and amplifier chips that can cover all Ka bands are selected, and their models are fixed. The key feature is that all active chips, including the harmonic mixer chip, digitally controlled attenuator chip, and amplifier chip, are broadband chips, providing broad coverage for intermediate frequency and radio frequency signals before and after frequency conversion. Regardless of changes in the applicable frequency of the customized upconversion channel, the specifications and models of all active chips remain unchanged. The design of the low-frequency power supply printed circuit board driving these active devices, as well as the low-frequency connectors serving as external electrical interfaces (including power supply and control), are also standardized. That is, for all customized Ka upconversion channels, as the applicable frequency changes, only the Ka band filter needs to be changed to meet the high harmonic distortion suppression requirement. The selection, design, assembly methods, electrical interface definitions of the low-frequency connectors, and the mechanical positions of the radio frequency connectors are all fixed and do not need to be changed with changes in the applicable frequency.

[0035] The principle of the above scheme is as follows: a broadband harmonic mixer chip is used as the core to achieve up-conversion; a broadband low-noise amplifier chip is used to meet the gain requirements; a digitally controlled attenuator chip is used to meet the dynamic range requirements of the channel and regulate the small signal gain; and the design of the remaining low-frequency and high-frequency printed circuit boards and electrical interfaces serves these three types of active chips, realizing the standardization of active chips, low-frequency and high-frequency printed circuit boards in terms of selection, design, assembly methods, electrical interfaces, and mechanical interfaces.

[0036] The second technical solution of this utility model is as follows: Based on the fixed selection, design, and assembly methods of active chips, low-frequency and high-frequency printed circuit boards, a "filter area" is created within the module. This area is used to house Ka filters and is connected to other areas within the module via microstrip lines bonded with gold wire. To meet the harmonic distortion requirements of various operating frequencies, the variation in Ka upconversion channels at different operating frequencies is concentrated on changing the filter model in the Ka band. Therefore, when the applicable frequency changes, only the filter model and specifications within the "filter area" need to be changed within the Ka upconversion module; the remaining areas, as the "standardized area," remain unaffected. A series of standardized Ka filters are used, ensuring no deviation in package size, bonding points, etc., between different passband filters, and the gold wire bonding connection between the "filter area" and the "standardized area" remains unaffected. From the user's perspective, although the electrical performance of all Ka upconversion channels at different applicable frequencies differs, the interface positions remain unchanged from a macroscopic external perspective, thus facilitating higher-level application design.

[0037] The principle of the above scheme is as follows: the Ka upconversion module is divided into a "filter area" and a "standardized area." All variables caused by customized upconversion channels are concentrated in the replacement of filters within the "filter area," which is connected to the "standardized area" via gold wires. This connection does not affect the selection of individual chips, printed circuit board design, or the location of external interfaces within the "standardized area." Using a broadband harmonic mixer chip as the core, relevant bare-chip filters are added to the RF and IF bands according to the specific project's frequency requirements. For the RF band, which has a wide coverage, MMIC filters are selected, specifically the NC6668C series bare-chip filters from the 13th Research Institute of China Electronics Technology Group Corporation (CETC). For the IF band, low-pass LC filters are chosen. Different projects only require changing the Ka filter. Changing the model of the Ka band filter is used to accommodate the high harmonic distortion suppression requirements at various frequencies.

[0038] The third technical solution of this utility model is: the radio frequency, intermediate frequency and local oscillator interfaces use SMP interfaces. The feature is that: the Ka upconversion module is used as a radio frequency three-port network. The external interfaces of the three radio frequency ports are all SMP connectors. During subsequent assembly and testing, SMP-KK can be directly plugged in, which is convenient for assembly and testing.

[0039] The principle behind the above solution is as follows: SMP connectors cover a frequency range of 0–40 GHz and have advantages such as compact structure, high operating frequency, fast connection, and strong shock resistance. All RF, IF, and local oscillator input / output ports of the entire frequency conversion channel are transmitted by SMP. When connecting to the baseband printed circuit board, SMP-KK can be used for direct insertion, which is more convenient for mass production, use, and testing.

[0040] The fourth technical solution of this utility model is as follows: the outlet orientation of both the low-frequency connector and the intermediate-frequency SMP connector is bottom-down. The key feature is that the electrical and control signals required by the Ka upconverter module and supplied by other modules are transmitted through the low-frequency connector; the required intermediate-frequency input signals are transmitted through the intermediate-frequency SMP connector. Both are signal input interfaces for the Ka upconverter module. By orienting both connectors bottom-down, matching sockets can be directly installed on the printed circuit board, replacing traditional flying wires, pins, and other connection methods with a direct insertion into the printed circuit board, while also saving space.

[0041] The principle of the above scheme is as follows: the low-frequency connector of the Ka upconverter module uses a customized end-face bonding connector, so that the low-frequency connector is oriented vertically and the interface faces downward. The intermediate frequency SMP interface of the Ka upconverter module faces downward. The two serve as the electrical and intermediate frequency input interfaces of the Ka upconverter module, with the same orientation, effectively utilizing the vertical space and changing the connection form with the external driver printed circuit board circuit.

[0042] This utility model has the following advantages:

[0043] (1) Compared with the existing Ka upconversion channel design ideas, this utility model takes into account the harmonic suppression index requirements of each frequency point in a comprehensive manner. With the first harmonic mixer as the core, while realizing frequency conversion, the Ka upconversion channel is divided into "filter area" and "standardization area". The "standardization area" ensures the standardization of various interfaces of the Ka upconversion channel for various applicable frequencies; the "filter area" focuses on handling various changes brought about by customization, i.e., filter modification.

[0044] (2) This utility model controls the difference between non-standard frequency conversion channels of different frequencies within the range of bare chip filters in the module, standardizes the external interface, realizes standardized design, and optimizes the design cost in the subsequent process of cooperation with baseband and antenna.

[0045] (3) Compared with the existing low-frequency connectors and intermediate frequency input interfaces of the Ka upconverter channel, the orientation of the low-frequency connectors and intermediate frequency input interfaces of this utility model is no longer horizontal, but rather bottom-down. The advantage of bottom-down orientation is that it can change the traditional connection method between the Ka upconverter module and the peripheral printed circuit board circuit. It can change the connection with the printed circuit board from the original flying wire form to the direct plug-in form, which can greatly save space in user applications. Attached Figure Description

[0046] Figure 1 A three-dimensional outline of a miniaturized, easily disassembled, modular Ka-band upconversion channel;

[0047] Figure 2A model layout diagram of a miniaturized, easily disassembled, standardized Ka-band upconversion channel;

[0048] Figure 3 This is a schematic diagram showing the connection between the "filter region" and the "systematic region" of a miniaturized, easily detachable, standardized Ka-band upconversion channel;

[0049] Figure 4 A link block diagram of a miniaturized, easily disassembled, standardized Ka-band upconversion channel;

[0050] Figure 5 This is a schematic diagram of the assembly of low-frequency and intermediate-frequency connectors for a miniaturized, easily detachable, standardized Ka-band upconversion channel.

[0051] Figure label:

[0052] 1. Structural components; 11. Structural component body; 111. Mounting holes; 12. Standardized area; 121. RF signal isolation cavity; 122. Frequency conversion signal isolation cavity; 123. Intermediate frequency signal isolation cavity; 13. Filter area; 2. Top cover plate; 3. RF module; 31. RF printed circuit board; 32. RF signal assembly; 321. Digitally controlled attenuator; 322. Low noise amplifier; 323. Detector; 4. Frequency conversion module; 41. Frequency conversion printed circuit board; 42. Frequency conversion assembly; 421. Harmonic mixer; 422. Local oscillator filter; 423. Local oscillator SMP interface; 5. Intermediate frequency module; 51. Intermediate frequency printed circuit board; 52. Intermediate frequency module low noise amplifier; 53. Intermediate frequency low-pass filter; 54. Temperature-compensated attenuator; 55. Intermediate frequency SMP input connector; 6. Ka-band filter; 7. DC printed circuit board; 8. Low frequency connector. Detailed Implementation

[0053] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0054] Example 1

[0055] like Figures 1-5 As shown, a miniaturized, easily detachable, modular Ka-band upconversion channel includes an encapsulated structural component 1, an upper cover plate 2, a radio frequency module 3, a frequency conversion module 4, and an intermediate frequency module 5 connected in the structural component 1, a Ka-band filter 6 connected to the radio frequency module 3 and the frequency conversion module 4 via gold wire bonding, a DC printed circuit board 7, a low-frequency connector 8, and a DC connector connected to the structural component 1, and the frequency conversion module 4 and the intermediate frequency module 5 interconnected.

[0056] Structural component 1 includes a structural component body 11 and a uniform region 12 and a filter region 13 connected in the structural component body 11;

[0057] The standardized area 12 is set on both sides of the filter area 13. The radio frequency module 3, the frequency conversion module 4 and the intermediate frequency module 5 are connected in the standardized area 12, and the Ka band filter 6 is connected in the filter area 13.

[0058] The system area 12 includes a radio frequency signal isolation cavity 121 connected to the structural body 11 and disposed on one side of the filter area 13, a frequency conversion signal isolation cavity 122 connected to the structural body 11 and located on the other side of the filter area 13, and an intermediate frequency signal isolation cavity 123 connected to the structural body 11 and located on one side of the frequency conversion signal isolation cavity 122.

[0059] In this embodiment, the bottom of the radio frequency signal isolation cavity 121, the frequency conversion signal isolation cavity 122, and the filter region 13 are connected;

[0060] The radio frequency module 3 includes a radio frequency printed circuit board 31 and a radio frequency signal component 32 connected to the radio frequency printed circuit board 31. The frequency conversion module 4 includes a frequency conversion printed circuit board 41 and a frequency conversion component 42 connected to the frequency conversion printed circuit board 41.

[0061] One end of the Ka-band filter 6 is connected to the microstrip line of the RF printed circuit board 31 by gold wire bonding, and the other end is connected to the microstrip line of the frequency converter printed circuit board 41 by gold wire bonding.

[0062] The radio frequency signal assembly 32 includes a digitally controlled attenuator 321 connected to and interconnected on the radio frequency printed circuit board 31, a low noise amplifier 322, a radio frequency connector connected to the output of the low noise amplifier 322, and a detector 323 connected in the radio frequency signal cavity 121.

[0063] The radio frequency printed circuit board 31 is bonded to the inner bottom surface of the radio frequency signal isolation cavity 121, and the digitally controlled attenuator 321 is connected to one end of the Ka band filter 6 through the microstrip line of the radio frequency printed circuit board 31.

[0064] The radio frequency connector is sintered onto the structural component body 11, and the radio frequency connector is an SMP connector.

[0065] The radio frequency signal isolation cavity 121 has a groove structure and a raised rib is provided on one side edge. The rib is flush with the upper surface of the inner cavity of the structural body 11. After encapsulation, the rib rests on the lower surface of the upper cover plate 2.

[0066] The radio frequency printed circuit board 31 is bonded to the radio frequency signal cavity 121;

[0067] The frequency converter assembly 42 includes a harmonic mixer 421 connected to and interconnected on the frequency converter printed circuit board 41, a local oscillator filter 422, and a local oscillator SMP interface 423 sintered on the structural body 11.

[0068] The frequency converter printed circuit board 41 is bonded in the frequency converter signal isolation cavity 122. The harmonic mixer 421 and the local oscillator filter 422 are both connected to the frequency converter printed circuit board 41. One end of the harmonic mixer 421 is connected to the intermediate frequency module 5, and the other end is connected to the Ka band filter 6 through the microstrip line of the frequency converter printed circuit board 41.

[0069] The local oscillator SMP interface 423 is located on the side of the structural body 11 and is connected to the local oscillator filter 422;

[0070] The frequency conversion signal isolation cavity 122 has a groove structure and a raised rib is provided on one side edge. The rib is flush with the upper surface of the inner cavity of the structural component body 11. After encapsulation, the rib rests on the lower surface of the upper cover plate 2.

[0071] The upper surface of the RF printed circuit board 31 and the upper surface of the frequency conversion printed circuit board 41 are higher than the bottom of the filter region 13;

[0072] The intermediate frequency module 5 includes an intermediate frequency printed circuit board 51 bonded in the intermediate frequency signal cavity 123, an intermediate frequency component low noise amplifier 52 and an intermediate frequency low-pass filter 53 connected to and interconnected on the intermediate frequency printed circuit board 51, a temperature compensation attenuator 54 connected to the intermediate frequency printed circuit board 51 and connected to one end of the intermediate frequency component low noise amplifier 52, and an intermediate frequency SMP input connector 55 connected to the structural body 11.

[0073] The intermediate frequency low-pass filter 53 is connected to the input terminal of the harmonic mixer 421. The input terminals of the intermediate frequency SMP input connector 55 are all located at the bottom of the structural body 11. The intermediate frequency SMP input connector 55 is connected to the input port of the temperature compensation attenuator 54.

[0074] The low-frequency connector 8 is sintered on the structural component body 11 and its input end is located at the bottom of the structural component body 11. The DC connector is sintered on the structural component body 11 and connected to the DC printed circuit board 7.

[0075] Structural component 1 and upper cover plate 2 are connected by adhesive and screw fixing; the structural component body 11 is a block structure with mounting holes 111 at the four corners, and the upper cover plate 2 is a plate structure.

[0076] The SMP connectors for RF module 3, frequency conversion module 4, and intermediate frequency module 5 can all cover frequencies from 0 to 40 GHz;

[0077] Ka-band filter 6 is a bare chip, bonded to filter region 13.

[0078] like Figure 1 The image shown is the final three-dimensional appearance of this invention. It can be seen that regardless of changes in the applicable frequency, this invention only alters... Figure 3 Bare-chip filter 6 in filter region 13, Figure 1The three-dimensional shape and various interfaces remain unchanged, achieving miniaturization, standardized shape and interfaces, and easy disassembly and use.

[0079] like Figure 2 The diagram shows the internal layout of the module of this utility model. The entire Ka-band upconversion channel module consists of a structural body 11, an RF printed circuit board 31, a DC printed circuit board 7, DC connectors, RF connectors, and a bare chip 6. Within the module, the assembly of the "standardized area 12" is completed by bonding the RF printed circuit board 31, the DC printed circuit board 7, and the bare chip 6. The DC connector 8 and the RF connector are sintered onto the structure, serving as external input and output interfaces. Both are standardized structural components; the former is a J30J series 15-pin connector, and the latter is an SMP connector, facilitating disassembly and use.

[0080] like Figure 3 As shown Figure 2 A partial magnification of the "filter region" 13. The "filter region" 13, serving as a variable for different frequency applications in this invention, consists of a customized bare-chip filter 6 and a carrier, connected externally via gold wire bonding through the input and output port pads. When the applicable frequency changes, only the bare-chip filter 6 in the "filter region" needs to be replaced, without affecting... Figure 3 Other parts of the module besides the above.

[0081] like Figure 4 The diagram shown is a link block diagram of this utility model, which is the basic form of this utility model. It consists of a temperature-compensated attenuator 54, a low-noise amplifier 52, a filter 53, a mixer 421, and a digitally controlled attenuator 321. Except for the "Ka filter 6" part, which is the filter region 13, the rest is the unified region 12.

[0082] like Figure 5 The diagram shows the assembly of the low-frequency connector 8 and the intermediate-frequency connector 55 of this utility model. Both are oriented with the bottom surface of the Ka inverter module facing downwards. In subsequent applications, users can install the corresponding connectors on the driver printed circuit board based on this feature and connect them to the external printed circuit board circuit in a direct-plug form.

[0083] In this embodiment, the harmonic mixer 421 has a radio frequency range of 24GHz to 50GHz, a local oscillator frequency range of 12GHz to 25GHz, an intermediate frequency range of DC to 5GHz, an isolation of 6dB between the local oscillator and the radio frequency signal, an isolation of 4dB between the local oscillator and the intermediate frequency signal, and an isolation of 18dB between the radio frequency and the intermediate frequency signal.

[0084] The cutoff frequency of the intermediate frequency low-pass filter 53 is 5GHz, the frequency range of the digitally controlled attenuator 321 is 0.5GHz to 40GHz, the frequency range of the low noise amplifier 322 is 26GHz to 40GHz, and the frequency range of the detector 323 is 12GHz to 40GHz.

[0085] Ka-band filter 6 is an MMIC filter, which is a bare-chip filter.

[0086] The method of using this utility model is as follows: After the intermediate frequency signal is input through the intermediate frequency SMP input connector 55, it passes through the temperature-compensated attenuator 54, the intermediate frequency module low-noise amplifier 52, and the intermediate frequency low-pass filter 53 in sequence before entering the harmonic mixer 421. The local oscillator signal enters through the local oscillator SMP interface 423 and then passes through the local oscillator filter 422 before entering the mixer harmonic 421. The mixer harmonic 421 performs up-conversion to reduce the intermediate frequency signal to a Ka-band radio frequency signal. The Ka-band radio frequency signal enters the Ka-band filter 6 for filtering and then passes through the digitally controlled attenuator 321 and the low-noise amplifier 322 in sequence before outputting the radio frequency signal. The detector 323 senses the radio frequency signal and outputs it. The low-frequency connector 8 inputs power supply and control signals, and the DC printed circuit board 7 provides power.

[0087] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A miniaturized, easily detachable, modular Ka-band upconversion channel, characterized in that: The package includes a packaged structural component (1), a top cover plate (2), a radio frequency module (3), a frequency conversion module (4), an intermediate frequency module (5) connected in the structural component (1), and a Ka-band filter (6) that is connected to the radio frequency module (3) and the frequency conversion module (4) by gold wire bonding. The frequency conversion module (4) is interconnected with the intermediate frequency module (5). The structural component (1) includes a structural component body (11) and a uniform region (12) and a filter region (13) connected in the structural component body (11); The uniform region (12) is located on both sides of the filter region (13), the radio frequency module (3), the frequency conversion module (4) and the intermediate frequency module (5) are connected in the uniform region (12), and the Ka band filter (6) is connected in the filter region (13). The radio frequency module (3) includes a radio frequency printed circuit board (31) and a radio frequency signal component (32) connected to the radio frequency printed circuit board (31). The frequency conversion module (4) includes a frequency conversion printed circuit board (41) and a frequency conversion component (42) connected to the frequency conversion printed circuit board (41). One end of the Ka-band filter (6) is connected to the microstrip line of the radio frequency printed circuit board (31) by gold wire bonding, and the other end is connected to the microstrip line of the frequency conversion printed circuit board (41) by gold wire bonding.

2. The miniaturized, easily detachable, modular Ka-band upconversion channel according to claim 1, characterized in that: The radio frequency signal component (32) includes a digitally controlled attenuator (321) and a low-noise amplifier (322) connected to and interconnected on the radio frequency printed circuit board (31); The unified area (12) includes a radio frequency signal isolation cavity (121) connected in the structural body (11) and disposed on one side of the filter area (13). The radio frequency printed circuit board (31) is bonded to the inner bottom surface of the radio frequency signal isolation cavity (121). The digitally controlled attenuator (321) is connected to one end of the Ka band filter (6) through the microstrip line of the radio frequency printed circuit board (31).

3. The miniaturized, easily detachable, standardized Ka-band upconversion channel according to claim 2, characterized in that: The radio frequency signal component (32) also includes a radio frequency connector connected to the output terminal of the low noise amplifier (322). The radio frequency connector is sintered on the structural body (11) and is an SMP connector. The radio frequency signal isolation cavity (121) has a groove structure and a raised rib is provided on one side edge. The rib is flush with the upper surface of the inner cavity of the structural body (11). After encapsulation, the rib is on the lower surface of the upper cover plate (2). The radio frequency printed circuit board (31) is bonded to the radio frequency signal cavity (121); The radio frequency signal assembly (32) also includes a detector (323) connected in the radio frequency signal cavity (121); The frequency range of the digitally controlled attenuator (321) is 0.5 GHz to 40 GHz, and the frequency range of the low-noise amplifier (322) is 26 GHz to 40 GHz.

4. The miniaturized, easily detachable, standardized Ka-band upconversion channel according to claim 1, characterized in that: The frequency conversion component (42) includes a harmonic mixer (421) and a local oscillator filter (422) connected to and interconnected on the frequency conversion printed circuit board (41); The unified area (12) also includes a frequency conversion signal cavity (122) connected in the structural body (11) and located on the other side of the filter area (13). The frequency conversion printed circuit board (41) is bonded in the frequency conversion signal cavity (122). The harmonic mixer (421) and the local oscillator filter (422) are both connected to the frequency conversion printed circuit board (41). One end of the harmonic mixer (421) is connected to the intermediate frequency module (5), and the other end is connected to the Ka band filter (6) through the microstrip line of the frequency conversion printed circuit board (41).

5. A miniaturized, easily detachable, modular Ka-band upconversion channel according to claim 4, characterized in that: The frequency conversion component (42) also includes a local oscillator SMP interface (423) sintered on the structural body (11), the local oscillator SMP interface (423) being located on the side of the structural body (11) and connected to the local oscillator filter (422); The frequency conversion signal isolation cavity (122) has a groove structure and a raised rib is provided on one side edge. The rib is flush with the upper surface of the inner cavity of the structural body (11). After encapsulation, the rib is on the lower surface of the upper cover plate (2). The harmonic mixer (421) has a radio frequency range of 24GHz to 50GHz, a local oscillator frequency range of 12GHz to 25GHz, and an intermediate frequency range of DC to 5GHz.

6. A miniaturized, easily detachable, modular Ka-band upconversion channel according to claim 5, characterized in that: The unified area (12) also includes an intermediate frequency signal isolation cavity (123) connected in the structural body (11) and located on one side of the frequency conversion signal isolation cavity (122); The intermediate frequency module (5) includes an intermediate frequency printed circuit board (51) bonded in the intermediate frequency signal cavity (123) and an intermediate frequency component low noise amplifier (52) and an intermediate frequency low-pass filter (53) connected to and interconnected on the intermediate frequency printed circuit board (51). The intermediate frequency low-pass filter (53) is connected to the input terminal of the harmonic mixer (421).

7. A miniaturized, easily detachable, modular Ka-band upconversion channel according to claim 6, characterized in that: The intermediate frequency module (5) also includes a temperature-compensated attenuator (54) connected to the intermediate frequency printed circuit board (51) and connected to one end of the low-noise amplifier (52) of the intermediate frequency component.

8. A miniaturized, easily detachable, standardized Ka-band upconversion channel according to claim 7, characterized in that: The intermediate frequency module (5) also includes an intermediate frequency SMP input connector (55) connected to the structural body (11); The input terminals of the intermediate frequency SMP input connector (55) are all located at the bottom of the structural body (11), and the intermediate frequency SMP input connector (55) is connected to the input port of the temperature compensation attenuator (54).

9. A miniaturized, easily detachable, modular Ka-band upconversion channel according to claim 7, characterized in that: It also includes a DC printed circuit board (7), a low-frequency connector (8) and a DC connector connected to the structural body (11). The low-frequency connector (8) is sintered on the structural body (11) and its input end is located at the bottom of the structural body (11). The DC connector is sintered on the structural body (11) and connected to the DC printed circuit board (7).

10. A miniaturized, easily detachable, modular Ka-band upconversion channel according to claim 1, characterized in that: The structural component (1) and the upper cover plate (2) are connected by adhesive and screw fixing; the main body (11) of the structural component is a block structure and has mounting holes (111) at the four corners, and the upper cover plate (2) is a plate structure; The SMP connectors of the radio frequency module (3), the frequency conversion module (4), and the intermediate frequency module (5) can all cover frequencies from 0 to 40 GHz; The Ka-band filter (6) is a bare chip bonded to the filter region (13).

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