LED circuit board with water-cooling heat exchange mechanism

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, and discloses an LED circuit board with a water-cooling heat exchange mechanism, which comprises a circuit board, an insulating heat conduction assembly, a heat exchange assembly and a heat dissipation assembly, the bottom end of the circuit board is fixedly provided with an insulation heat conduction assembly, the insulation heat conduction assembly is fixedly provided with a heat exchange assembly, and the heat exchange assembly is provided with a heat dissipation assembly. The spiral raised heads and the spiral grooves are arranged on the inner wall of the heat exchange tube, cold water flows into the heat exchange tube from the water tank, the spiral raised heads block and divide water flow, change the flow direction of the water flow, prolong the retention time, improve the heat exchange efficiency and quickly take away heat of the circuit board, and the insulation heat conduction assembly enables the storage box to be installed at the bottom end of the circuit board. The ceramic substrate isolates electrical interference between a circuit and a water cooling component, heat of the circuit board is transferred to the heat exchange assembly, heat dissipation fins of the heat dissipation assembly are evenly distributed on the outer side of a heat exchange tube, the contact area with air is increased, heat dissipation is achieved through air convection, and the heat dissipation requirement is met.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, specifically to an LED circuit board with a water-cooled heat exchange mechanism. Background Technology

[0002] A patent document with publication number CN219494020U discloses a circuit board structure for an LED lamp. It includes a lamp board body, multiple heat-conducting pillars, a heat-absorbing plate, and a water-cooling mechanism. The water-cooling mechanism includes four legs, a heat insulation plate, a water tank, a water pump, a circulating heat exchange pipeline, and heat dissipation fins. When the lamp board body is installed inside the lamp housing, the heat insulation plate separates the lamp board body from the heat-absorbing plate. The heat generated by the lamp board body during operation is transferred to the heat-absorbing plate via the heat-conducting pillars, and then to the heat dissipation fins. A semiconductor cooling chip is activated to cool the water in the water tank. The water pump is activated to deliver the cold water from the water tank to the circulating heat exchange pipeline. Because the circulating heat exchange pipeline is partially embedded between the heat dissipation fins, the cold water in the circulating heat exchange pipeline fully exchanges heat with the heat dissipation fins, maintaining good heat dissipation performance and improving the heat dissipation effect on the lamp board body.

[0003] However, the above-mentioned solutions and existing technologies mostly adopt a relatively simple straight-line design for conventional circulating heat exchange pipelines. After the cold water flows in from the inlet, it flows directly towards the outlet. The water flow velocity is relatively fast and the residence time is relatively short. The inner wall of the channel is usually smooth and flat, lacking a structure that can increase water flow disturbance and prolong the residence time of cold water. This results in a limited contact area between the cold water and the inner wall of the heat exchange pipeline, which may reduce the heat exchange efficiency. Improvements and optimizations are needed.

[0004] Therefore, this utility model proposes an LED circuit board with a water-cooled heat exchange mechanism to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide an LED circuit board with a water-cooled heat exchange mechanism to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an LED circuit board with a water-cooled heat exchange mechanism, comprising a circuit board, an insulating heat-conducting component, a heat exchange component, and a heat dissipation component;

[0007] An insulating heat-conducting component is fixedly installed at the bottom of the circuit board, a heat exchange component is fixedly installed on the insulating heat-conducting component, and a heat dissipation component is installed on the heat exchange component.

[0008] Preferably, the storage box in the insulating and heat-conducting assembly is provided with a fixing protrusion at its end, the fixing protrusion is fixed to the bottom of the circuit board by screws, and a ceramic substrate is fitted and snapped into the storage box.

[0009] Preferably, the heat exchange tube in the heat exchange assembly is fixedly installed at the bottom end of the storage box, and a water tank is connected to one end of the heat exchange tube.

[0010] Preferably, the heat exchange tubes in the heat exchange assembly are uniformly provided with spiral protrusions on their inner walls, and spiral grooves are provided between the spiral protrusions.

[0011] Preferably, the heat dissipation fins in the heat dissipation assembly are evenly arranged on the outside of the heat exchange tube, and the heat dissipation fins are provided with snap-fit ​​holes.

[0012] Preferably, one end of the heat dissipation fin is fixedly disposed inside the fixing groove, and the fixing groove is evenly disposed at the bottom end of the storage box.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: By uniformly setting spiral protrusions and spiral grooves on the inner wall of the heat exchange tube, cold water flows into the heat exchange tube from the water tank. The spiral protrusions block and divert the water flow, changing the direction of the water flow. The water flows around in the tube, extending the residence time, improving the heat exchange efficiency, and quickly removing the heat from the circuit board. The insulating heat-conducting component is fixed to the bottom of the circuit board with a storage box, a fixing protrusion, and screws. The ceramic substrate isolates the electrical interference between the circuit and the water-cooling components, preventing short circuits and transferring the heat from the circuit board to the heat exchange component. The heat dissipation fins of the heat dissipation component are evenly distributed on the outside of the heat exchange tube. One end of the fin is fixed in the fixing groove at the bottom of the storage box and is provided with a snap-fit ​​hole to enhance the connection stability and increase the contact area with air. Heat dissipation is achieved by air convection, which, together with water cooling, further dissipates heat and meets the heat dissipation requirements. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a structural disassembly diagram of the present invention;

[0016] Figure 3 This is a partially enlarged schematic diagram of section A of this utility model;

[0017] Figure 4 This is a schematic diagram showing the internal details of the heat exchange tube of this utility model.

[0018] In the diagram: Circuit board 1, Insulating heat conduction component 2, Heat exchange component 3, Heat dissipation component 4, Storage box 201, Fixing protrusion 202, Screw 203, Ceramic substrate 204, Heat exchange tube 301, Water tank 302, Spiral protrusion 303, Spiral groove 304, Heat dissipation fin 401, Snap-fit ​​hole 402, Fixing groove 403. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some embodiments of this utility model, not all embodiments, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. The technical solutions in the embodiments of this utility model will be clearly and completely described below.

[0020] Example 1: Please refer to Figures 1 to 2 It includes a circuit board 1, an insulating and thermally conductive component 2, a heat exchange component 3, and a heat dissipation component 4;

[0021] An insulating heat-conducting component 2 is fixedly installed at the bottom of the circuit board 1. A heat exchange component 3 is fixedly installed on the insulating heat-conducting component 2. A heat dissipation component 4 is installed on the heat exchange component 3.

[0022] The storage box 201 in the insulating and heat-conducting assembly 2 is provided with a fixing protrusion 202 at its end. The fixing protrusion 202 is fixed to the bottom of the circuit board 1 by screws 203. A ceramic substrate 204 is fitted and snapped into the storage box 201.

[0023] In use, first precisely insert the ceramic substrate 204 into the storage box 201, ensuring a tight and seamless fit to fully utilize the insulating and thermally conductive properties of the ceramic substrate 204. Then, align the fixing protrusion 202 at the end of the storage box 201 with the corresponding position at the bottom of the circuit board 1, and slowly screw in the screw 203 to secure it. During the screw tightening process, the force should be carefully controlled to ensure that the storage box 201 and the circuit board 1 are firmly connected and will not loosen or fall off due to minor daily vibrations, while also avoiding damage to the circuit board 1 or the structure of the storage box 201 due to excessive force. In this way, the storage box 201 provides a basic framework for the subsequent installation of the heat exchange component 3, and the ceramic substrate 204 begins to isolate electrical interference between the circuit and the water-cooling components to prevent short circuits. At the same time, it begins to initially guide the heat generated by the circuit board 1 downwards, preparing to transfer it to the heat exchange component 3.

[0024] Example 2: Based on Example 1, please refer to... Figures 2 to 4 The heat exchange tube 301 in the heat exchange assembly 3 is fixedly installed at the bottom end of the storage box 201, and a water tank 302 is connected to one end of the heat exchange tube 301.

[0025] Spiral protrusions 303 are evenly arranged on the inner wall of the heat exchange tube 301 in the heat exchange assembly 3, and spiral grooves 304 are arranged between the spiral protrusions 303.

[0026] During use, the heat exchange tube 301 is tightly fixed to the bottom end of the storage box 201 to ensure a good seal at the connection point and no risk of coolant leakage. The water tank 302 is connected to one end of the heat exchange tube 301, and the connection point is also sealed and reinforced. When the heat dissipation process is started, when cold water flows from the water tank 302 into the heat exchange tube 301, the spiral protrusion 303 immediately plays its role, effectively blocking and diverting the water flow, forcing the coolant to change direction continuously, meandering through the heat exchange tube 301 along the spiral groove 304. Compared with the traditional heat exchange tube with a smooth inner wall, this greatly extends the residence time of the coolant in the tube, allowing it to fully absorb the heat conducted from the circuit board 1, significantly improving the heat exchange efficiency, efficiently removing the heat from the circuit board 1, and maintaining the circuit board 1 in a suitable operating temperature range.

[0027] Example 3: Based on Example 2, please refer to... Figures 3 to 4 The heat dissipation fins 401 in the heat dissipation assembly 4 are evenly arranged on the outside of the heat exchange tube 301, and the heat dissipation fins 401 are provided with snap-fit ​​holes 402.

[0028] One end of the heat dissipation fin 401 is fixedly installed inside the fixing groove 403, and the fixing groove 403 is evenly distributed at the bottom end of the storage box 201.

[0029] In use, first align the side of the heat dissipation fin 401 with the snap-fit ​​hole 402 with the fixing groove 403 to ensure that the heat dissipation fin 401 and the fixing groove 403 fit precisely and are firmly connected without shaking or shifting. The heat dissipation fin 401, which is evenly distributed on the outside of the heat exchange tube 301, has a large contact area with the air. Based on water cooling, it cleverly uses air convection to further dissipate heat. When the coolant in the heat exchange tube 301 absorbs heat and heats up, some of the heat is conducted to the heat dissipation fin 401. The surrounding airflow quickly carries away this heat, forming a highly efficient heat dissipation mode that combines water cooling and air cooling. This fully meets the heat dissipation needs of the circuit board 1 and effectively avoids problems such as brightness decay and abnormal color rendering of LED beads due to poor heat dissipation.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An LED circuit board with a water-cooled heat exchange mechanism, characterized in that: It includes a circuit board (1), an insulating and heat-conducting assembly (2), a heat exchange assembly (3), and a heat dissipation assembly (4); An insulating heat-conducting component (2) is fixedly installed at the bottom of the circuit board (1), a heat exchange component (3) is fixedly installed on the insulating heat-conducting component (2), and a heat dissipation component (4) is installed on the heat exchange component (3).

2. The LED circuit board with a water-cooled heat exchange mechanism according to claim 1, characterized in that: The storage box (201) in the insulating heat-conducting assembly (2) is provided with a fixing protrusion (202) at its end. The fixing protrusion (202) is fixed to the bottom of the circuit board (1) by screws (203). A ceramic substrate (204) is fitted and snapped into the storage box (201).

3. The LED circuit board with a water-cooled heat exchange mechanism according to claim 1, characterized in that: The heat exchange tube (301) in the heat exchange assembly (3) is fixedly installed at the bottom end of the storage box (201), and a water tank (302) is connected to one end of the heat exchange tube (301).

4. The LED circuit board with a water-cooled heat exchange mechanism according to claim 3, characterized in that: The heat exchange tube (301) in the heat exchange assembly (3) is uniformly provided with spiral protrusions (303) on its inner wall, and spiral grooves (304) are provided between the spiral protrusions (303).

5. The LED circuit board with a water-cooled heat exchange mechanism according to claim 1, characterized in that: The heat dissipation fins (401) in the heat dissipation assembly (4) are evenly arranged on the outside of the heat exchange tube (301), and the heat dissipation fins (401) are provided with snap-fit ​​holes (402).

6. The LED circuit board with a water-cooled heat exchange mechanism according to claim 5, characterized in that: One end of the heat dissipation fin (401) is fixedly disposed inside the fixing groove (403), and the fixing groove (403) is evenly disposed at the bottom end of the storage box (201).

Images