Heat dissipation device of closed high-voltage frequency converter
By combining a multi-fin structure and a coolant circulation system with fan-assisted heat dissipation, the problem of insufficient heat dissipation in sealed high-voltage frequency converters under high power density or high temperature environments is solved, achieving efficient heat dissipation and equipment stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIAOZUO HUAFEI ELECTRONIC & ELECTRIC CO LTD
- Filing Date
- 2025-05-14
- Publication Date
- 2026-04-24
AI Technical Summary
The heat dissipation structure of existing sealed high-voltage frequency converters is difficult to dissipate heat effectively in high power density or high temperature environments, which leads to an increase in the internal temperature of the equipment and affects its performance and reliability.
It adopts a multi-fin structure combined with a coolant circulation system and fan-assisted heat dissipation design. The heat dissipation area is increased by using L-shaped, U-shaped and rectangular fins, and the coolant is circulated by the coolant tank and pump body. Combined with a semiconductor cooler and fan, the heat dissipation efficiency is improved. At the same time, the design of easy-to-disassemble components facilitates the removal and cleaning of the dust filter.
It effectively improves heat dissipation performance under high power density and high temperature environments, ensures stable operation of the equipment, avoids the problem of heat dissipation performance being affected by dust accumulation, and improves the sealing performance and overall stability of the device.
Smart Images

Figure CN224165019U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of frequency converter equipment technology, specifically a heat dissipation device for a sealed high-voltage frequency converter. Background Technology
[0002] A hermetically sealed high-voltage frequency converter is a power electronic device used for industrial motor control. It contains key components such as a power unit, control circuitry, and protection devices. The power unit, as the core of the high-voltage frequency converter, is responsible for converting the input high-voltage electrical energy into frequency-adjustable output electrical energy to meet different load demands. However, the power unit generates a significant amount of heat during operation, especially during high power density or prolonged full-load operation. The accumulation of heat directly impacts the performance and reliability of the equipment. Therefore, efficient heat dissipation design is a crucial issue in the research and application of hermetically sealed high-voltage frequency converters.
[0003] In existing technologies, the heat dissipation structure of some hermetically sealed high-voltage frequency converters is relatively simple, mainly relying on cooling fans for air cooling. This method can meet basic heat dissipation needs when the power unit generates little heat or the ambient temperature is low. However, when the power unit generates a lot of heat or in high-temperature environments such as summer, simple air cooling is often insufficient to cope with the high-temperature challenge, resulting in inadequate cooling. This not only causes the internal temperature of the equipment to rise, affecting the performance and lifespan of power devices, but may also trigger problems such as overheating protection or unstable operation. Therefore, this utility model proposes a heat dissipation device for hermetically sealed high-voltage frequency converters to solve the above problems. Utility Model Content
[0004] The purpose of this invention is to provide a heat dissipation device for a sealed high-voltage frequency converter to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation device for a sealed high-voltage frequency converter, comprising: a sealed high-voltage frequency converter body and a power unit fixedly installed inside the sealed high-voltage frequency converter body, wherein the two side walls of the outer shell of the power unit abut against L-shaped fins, U-shaped fins are fixedly connected to the side of the L-shaped fins, the U-shaped fins abut against the rear side of the outer shell of the power unit, the top of the L-shaped fins is fixedly connected to the upper surface of a rectangular fin, the lower surface of the rectangular fins abuts against the upper surface of a heat-conducting plate, and the lower surface of the heat-conducting plate is fixedly connected to the upper surface of the outer shell of the power unit;
[0006] L-shaped fins, U-shaped fins, and rectangular fins are arranged in a linear array. Several of the rectangular fins have serpentine conduits running through them. One end of the conduit is connected to the coolant tank, and the other end is connected to the pump input. The pump output is connected to the coolant tank. A fan is installed on the upper side of the rectangular fins, and a dust baffle is installed on the upper side of the fan. The dust baffle is detachably connected to the top of the sealed high-voltage frequency converter body.
[0007] Preferably, the conduit is fixedly sleeved on both sides inside the support frame, the support frame is symmetrically arranged about the upper surface of the power unit's outer shell, and the support frame is fixedly connected to the top of the power unit's outer shell.
[0008] Preferably, a semiconductor cooler is fixedly installed at the bottom of the coolant tank, a fan is fixedly installed inside the partition, the partition is fixedly connected to the inner wall of the sealed high-voltage frequency converter body, and a sealing strip is provided on the upper side of the partition, which is slidably inserted into the bottom of the dust baffle.
[0009] Preferably, the dust filter screen has limit holes on both sides of the top, and a disassembly assembly is provided on one side of the limit hole. The disassembly assembly includes a U-shaped frame, and the lower surface of the U-shaped frame is fixedly connected to the top of the sealed high-voltage frequency converter body.
[0010] Preferably, a sloping push-pull rod is slidably installed on one side of the U-shaped frame. Two threaded holes are opened on the side wall of one end of the sloping push-pull rod. Both threaded holes are threadedly connected to the adjusting rod. The adjusting rod is sleeved inside the U-shaped frame. The other end of the sloping push-pull rod is slidably connected to the sloping hole opened in the middle of the limiting rod.
[0011] Preferably, one end of the limiting rod is slidably inserted into the limiting hole, and the other end of the limiting rod is fixedly connected to the U-shaped frame through a return spring.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] 1. By combining a multi-fin structure (L-shaped fins, U-shaped fins, and rectangular fins) with a coolant circulation system and fan-assisted heat dissipation, the heat dissipation efficiency of the power unit is effectively improved, ensuring the stable operation of the sealed high-voltage frequency converter, especially its heat dissipation performance in high power density or high temperature environments.
[0014] 2. Through the optimized design of easily detachable components (U-shaped frame, inclined push-pull rod, adjusting rod, limiting rod, etc.), the dust screen plate is more convenient to disassemble and install, avoiding the problem of heat dissipation performance being affected by dust accumulation, while improving the sealing performance and overall stability of the device. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0016] Figure 2 This is a top view of the internal structure of this utility model;
[0017] Figure 3 This is a side view of the internal structure of this utility model;
[0018] Figure 4 This is a rear view schematic diagram of the internal structure of this utility model.
[0019] In the diagram: 1. Sealed high-voltage frequency converter body; 2. Power unit; 3. L-shaped fins; 4. U-shaped fins; 5. Rectangular fins; 6. Heat-conducting plate; 7. Pipe; 8. Coolant tank; 9. Pump body; 10. Fan; 11. Dustproof screen; 12. Support frame; 13. Semiconductor cooler; 14. Partition plate; 15. Sealing strip; 16. Limiting hole; 17. U-shaped frame; 18. Angled push-pull rod; 19. Adjusting rod; 20. Limiting rod; 21. Angled hole; 22. Return spring; 23. Threaded hole. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of this utility model, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0021] Example 1: Please refer to Figures 1 to 4This utility model provides a technical solution: a heat dissipation device for a sealed high-voltage frequency converter, comprising: a sealed high-voltage frequency converter body 1 and a power unit 2 fixedly installed inside the sealed high-voltage frequency converter body 1. The power unit 2, as the core part of the sealed high-voltage frequency converter body 1, is responsible for converting the input high-voltage electrical energy into frequency-adjustable output electrical energy. During this process, the power unit 2 generates a large amount of heat. The two side walls of the outer shell of the power unit 2 abut against L-shaped fins 3. U-shaped fins 4 are fixedly connected to the side of the L-shaped fins 3. The U-shaped fins 4 abut against the rear side of the outer shell of the power unit 2. The top of the L-shaped fins 3 is fixedly connected to the upper surface of a rectangular fin 5. The lower surface of the rectangular fin 5 abuts against the upper surface of a heat-conducting plate 6. The lower surface of the heat-conducting plate 6 is fixedly connected to the upper surface of the outer shell of the power unit 2. The two side walls of the outer shell of the power unit 2 abut against the L-shaped fins 3, and its rear side abuts against the U-shaped fins 4, while its top side abuts against the L-shaped fins 3. The heat-conducting plate 6 abuts against the rectangular fins 5. The L-shaped fins 3, U-shaped fins 4, and rectangular fins 5 are all arranged in a linear array. A serpentine conduit 7 runs through several of the rectangular fins 5. One end of the conduit 7 is connected to the coolant tank 8, which is used to hold coolant. The other end of the conduit 7 is connected to the input end of the pump body 9. The pump body 9 is electrically connected to an external terminal control device. The output end of the pump body 9 is connected to the coolant tank 8. A fan 10 is installed on the upper side of the rectangular fins 5. The fan 10 is electrically connected to the external terminal control device. A dust baffle 11 is provided on the upper side of the fan 10. The dust baffle 11 is designed to prevent external dust from entering when the fan 10 is dissipating heat. The dust baffle 11 is detachably connected to the top of the sealed high-voltage inverter body 1, which facilitates the subsequent removal and cleaning of the dust baffle 11 and prevents dust from accumulating on the dust baffle 11 after long-term use, thus affecting the internal heat dissipation of the sealed high-voltage inverter body 1.
[0022] During operation, power unit 2 converts the input high-voltage electrical energy into frequency-adjustable output electrical energy, while simultaneously generating a large amount of heat. This heat is transferred through the outer shell of power unit 2 to the L-shaped fins 3, U-shaped fins 4, and rectangular fins 5 that come into contact with them. The L-shaped fins 3 and U-shaped fins 4 enhance natural heat dissipation by increasing their surface area and air contact area; while the rectangular fins 5, through the heat-conducting plate 6, are in close contact with the upper surface of the outer shell of power unit 2, further absorbing heat. At the same time, the suction effect of fan 10 can draw the heat from the outer shell of power unit 2 outward, thereby accelerating the heat dissipation of the L-shaped fins 3, U-shaped fins 4, and rectangular fins 5 themselves, and thus improving the continuous heat dissipation efficiency of these fins. In addition, the coolant in the coolant tank 8 circulates through the conduit 7 under the action of pump body 9, passing through the serpentine conduit 7 inside several rectangular fins 5, absorbing the heat transferred by the fins and dissipating it to the outside, forming a highly efficient liquid cooling system. A dust filter 11 is mounted on the upper side of the fan 10 and is detachably connected to the top of the sealed high-voltage inverter body 1. This effectively prevents external dust from entering, ensuring the cleanliness of the heat dissipation process. Simultaneously, its detachable design facilitates regular cleaning of accumulated dust, preventing any impact on heat dissipation performance. Through the combination of a multi-fin structure, a coolant circulation system, and fan 10 for auxiliary heat dissipation, this device can efficiently dissipate the heat generated by the power unit 2, ensuring the stable operation of the sealed high-voltage inverter.
[0023] Example 2: Based on Example 1, the conduit 7 is fixedly sleeved on both sides within the support frame 12. The support frame 12 is symmetrically arranged about the upper surface of the power unit 2's outer shell, and is fixedly connected to the top of the power unit 2's outer shell. This fixed connection provides stable support for the conduit 7. A semiconductor cooler 13 is fixedly installed at the bottom of the coolant tank 8. The semiconductor cooler 13 is electrically connected to an external terminal control device. The semiconductor cooler 13 consists of a screw compressor, evaporator, and condenser connected sequentially by copper pipes, forming a loop structure. The copper pipes are filled with refrigerant. The refrigerant is compressed into vapor in the screw compressor and then condensed in the condenser. The condensed refrigerant then passes through the evaporator, where it evaporates. During evaporation, it absorbs heat from the surrounding environment, thus lowering the ambient air temperature. Simultaneously, the refrigerant passes through the copper pipes... The cooling water in the coolant tank 8 undergoes rapid heat exchange and cooling. The refrigerant vapor, after absorbing heat, is then compressed by the compressor to complete a cycle. This ensures that the coolant flowing in the duct 7 of the rectangular fin 5 has a low temperature, improving the heat dissipation efficiency of the rectangular fin 5 and indirectly improving the heat dissipation effect of the L-shaped fin 3 and U-shaped fin 4. The fan 10 is fixedly installed inside the partition 14, and the partition 14 fixes the fan 10. Several fans 10 are provided to further improve the heat dissipation efficiency. The partition 14 is fixedly connected to the inner wall of the sealed high-voltage inverter body 1. A sealing strip 15 is provided on the upper side of the partition 14. The sealing strip 15 is slidably inserted into the bottom of the dust baffle plate 11. When the dust baffle plate 11 is installed on the top of the sealed high-voltage inverter body 1, its bottom is inserted into the sealing strip 15, thereby improving the sealing of the connection between the sealed high-voltage inverter body 1 and the dust baffle plate 11.
[0024] The conduit 7 is fixedly fitted on both sides within the support frame 12. The support frame 12 is symmetrically arranged about the upper surface of the power unit 2's outer shell and is fixedly connected to the top of the power unit 2's outer shell, thus providing stable support for the conduit 7 and preventing deformation or loosening due to vibration or thermal expansion and contraction during operation. A semiconductor cooler 13 is fixedly installed at the bottom of the coolant tank 8. The semiconductor cooler 13 is electrically connected to an external terminal control device and is connected in sequence through a screw compressor, evaporator, and condenser via copper pipes, forming a loop structure. The copper pipes are filled with refrigerant. The refrigerant is compressed into vapor in the screw compressor, then condensed in the condenser. The condensed refrigerant then passes through the evaporator, where it evaporates, absorbing heat from the surrounding environment during evaporation, thereby lowering the temperature of the surrounding air. Meanwhile, the refrigerant rapidly exchanges heat with and cools the cooling water in the coolant tank 8 through copper pipes. The refrigerant vapor, after absorbing heat, is then compressed by the compressor, completing a cycle. This ensures that the coolant flowing in the duct 7 of the rectangular fin 5 maintains a low temperature, improving the heat dissipation efficiency of the rectangular fin 5 and indirectly enhancing the heat dissipation effect of the L-shaped fin 3 and the U-shaped fin 4. The fan 10 is fixedly installed inside the partition 14, securing it in place. Several fans 10 are provided to further improve heat dissipation efficiency. The partition 14 is fixedly connected to the inner wall of the sealed high-voltage inverter body 1. A sealing strip 15 is provided on the upper side of the partition 14. The sealing strip 15 is slidably inserted into the bottom of the dust baffle 11. When the dust baffle 11 is installed on the top of the sealed high-voltage inverter body 1, its bottom is inserted into the sealing strip 15, thereby improving the sealing performance of the connection between the sealed high-voltage inverter body 1 and the dust baffle 11, preventing external air and impurities from entering the device, and facilitating the disassembly and cleaning of the dust baffle 11. Through the stable support of the duct 7 by the support frame 12, the rapid cooling of the coolant by the semiconductor cooler 13, and the optimized design of the fan 10 and the partition 14, the heat dissipation efficiency and overall stability of the device are further improved.
[0025] Example 3: Based on Example 2, to facilitate the disassembly of the dust filter 11, limit holes 16 are provided on both sides of the top of the dust filter 11. A disassembly assembly is provided on one side of the limit holes 16. By providing the disassembly assembly, the ease of disassembly of the dust filter 11 is improved. The disassembly assembly includes a U-shaped frame 17. The lower surface of the U-shaped frame 17 is fixedly connected to the top of the sealed high-voltage frequency converter body 1. A sloping push-pull rod 18 is slidably installed on one side of the U-shaped frame 17. Two threaded holes 23 are provided on the side wall of one end of the sloping push-pull rod 18. Both threaded holes 23 are threadedly connected to the adjusting rod 19. The adjusting rod 19 is sleeved through the rod. Inside the U-shaped frame 17, in the initial state, the adjusting rod 19 is threaded into the threaded hole 23 away from the limiting hole 16. After the dust screen plate 11 is fixed and limited, the adjusting rod 19 is threaded into the threaded hole 23 near the limiting hole 16. The other end of the inclined push-pull rod 18 is slidably connected to the inclined hole 21 opened in the middle of the limiting rod 20. Through the compression between the inclined surface of the inclined push-pull rod 18 and the inclined surface of the inclined hole 21, the limiting rod 20 and the inclined push-pull rod 18 slide together. One end of the limiting rod 20 is slidably inserted into the limiting hole 16, and the other end of the limiting rod 20 is fixedly connected to the U-shaped frame 17 through the return spring 22.
[0026] In the initial state, the bottom of the dust filter 11 is inserted into the sealing strip 15, and a limiting rod 20 is inserted into the limiting hole 16. At this time, the adjusting rod 19 is threaded into the threaded hole 23 near the limiting hole 16, and the return spring 22 is in a compressed state. When the dust filter 11 needs to be disassembled for maintenance, the adjusting rod 19 is twisted out of the threaded hole 23 near the limiting hole 16. At this time, under the reverse elastic force of the return spring 22, the limiting rod 20 is ejected from the limiting hole 16. As the limiting rod 20 slides out of the limiting hole 16, it is simultaneously pushed out by... The pressure between the inclined hole 21 and the inclined surface of the inclined push-pull rod 18 causes the inclined push-pull rod 18 to move away from the limiting rod 20 under the limitation of the U-shaped frame 17. Then, the adjusting rod 19 is twisted into the threaded hole 23 away from the limiting hole 16, so that the dust screen plate 11 can be disassembled. When it is necessary to install the dust screen plate 11, the inclined push-pull rod 18 is pushed towards the limiting rod 20, so that the limiting rod 20 can be indirectly inserted into the limiting hole 16 opened in the dust screen plate 11, thereby improving the convenience of installation and disassembly.
[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation device for a sealed high-voltage frequency converter, comprising a sealed high-voltage frequency converter body (1) and a power unit (2) fixedly installed inside the sealed high-voltage frequency converter body (1), characterized in that: The two side walls of the outer shell of the power unit (2) abut against the L-shaped fin (3). A U-shaped fin (4) is fixedly connected to the side of the L-shaped fin (3). The U-shaped fin (4) abuts against the rear side of the outer shell of the power unit (2). The top of the L-shaped fin (3) is fixedly connected to the upper surface of the rectangular fin (5). The lower surface of the rectangular fin (5) abuts against the upper surface of the heat-conducting plate (6). The lower surface of the heat-conducting plate (6) is fixedly connected to the upper surface of the outer shell of the power unit (2). L-shaped fins (3), U-shaped fins (4), and rectangular fins (5) are arranged in a linear array. A serpentine conduit (7) runs through several of the rectangular fins (5). One end of the conduit (7) is connected to the coolant tank (8), and the other end of the conduit (7) is connected to the input end of the pump body (9). The output end of the pump body (9) is connected to the coolant tank (8). A fan (10) is installed on the upper side of the rectangular fins (5), and a dust baffle (11) is provided on the upper side of the fan (10). The dust baffle (11) is detachably connected to the top of the sealed high-voltage inverter body (1).
2. The heat dissipation device for a sealed high-voltage frequency converter according to claim 1, characterized in that: The conduit (7) is fixedly sleeved on both sides inside the support frame (12). The support frame (12) is symmetrically arranged about the upper surface of the outer shell of the power unit (2), and the support frame (12) is fixedly connected to the top of the outer shell of the power unit (2).
3. The heat dissipation device for a sealed high-voltage frequency converter according to claim 1, characterized in that: A semiconductor cooler (13) is fixedly installed at the bottom of the coolant tank (8), and a fan (10) is fixedly installed inside the partition (14). The partition (14) is fixedly connected to the inner wall of the sealed high voltage inverter body (1). A sealing strip (15) is provided on the upper side of the partition (14), and the sealing strip (15) is slidably inserted into the bottom of the dust filter plate (11).
4. The heat dissipation device for a sealed high-voltage frequency converter according to claim 3, characterized in that: The dustproof mesh plate (11) has limit holes (16) on both sides of the top. A disassembly assembly is provided on one side of the limit hole (16). The disassembly assembly includes a U-shaped frame (17). The lower surface of the U-shaped frame (17) is fixedly connected to the top of the sealed high voltage frequency converter body (1).
5. The heat dissipation device for a sealed high-voltage frequency converter according to claim 4, characterized in that: A sloping push-pull rod (18) is slidably installed on one side of the U-shaped frame (17). Two threaded holes (23) are opened on the side wall of one end of the sloping push-pull rod (18). Both threaded holes (23) are threadedly connected to the adjusting rod (19). The adjusting rod (19) is sleeved inside the U-shaped frame (17). The other end of the sloping push-pull rod (18) is slidably connected to the sloping hole (21) opened in the middle of the limiting rod (20).
6. The heat dissipation device for a sealed high-voltage frequency converter according to claim 5, characterized in that: One end of the limiting rod (20) is slidably inserted into the limiting hole (16), and the other end of the limiting rod (20) is fixedly connected to the U-shaped frame (17) through the return spring (22).