Paster infrared receiving head capable of fully shielding light interference

Abstract

The utility model relates to the technical field of patch receiving head design and packaging, and solves the technical problem that an integrated circuit chip cannot effectively shield a light source. The utility model provides a patch infrared receiving head capable of fully shielding light interference, which comprises a support body, a conductive wire and a sealing colloid, and the surface of the support body is provided with two die bonding areas and a plurality of wire bonding areas. According to the utility model, the front surface and the side surface of the integrated circuit chip are wrapped by the light-proof black plastic cement, so that light sources from the front surface and the side surface can be effectively shielded, light rays are prevented from entering the integrated circuit chip, the influence of light interference on the performance of the integrated circuit chip is avoided, and the stability and the reliability of a product are improved; according to the utility model, the interference of a light source is reduced, the integrated circuit chip is ensured not to be influenced by external environmental factors in the working process, the receiving function of the product is optimized, the signal can be processed more accurately, and the overall performance is improved.

Description

Technical Field

[0001] This utility model relates to the field of surface mount receiver design and packaging technology, and in particular to a surface mount infrared receiver that is fully shielded from light interference. Background Technology

[0002] Infrared receiver head products on the market are mainly divided into two types: through-hole and surface mount. With market development, the requirements for the electrical functionality and production efficiency of receiver heads are gradually increasing. Surface mount receiver heads are superior to through-hole receiver heads in terms of production and mounting efficiency, so they are gradually replacing through-hole receiver heads. Currently, there are mature, mass-produced surface mount receiver heads on the market. These receiver heads contain photodiode chips and integrated circuit chips. External light sources have a significant impact on the integrated circuit chips. Under strong light interference, the receiver head's reception function is relatively poor. Therefore, shielding against light interference is an important indicator for evaluating the receiver head's functionality.

[0003] Currently, existing surface-mount infrared receivers shield against light interference by designing a shielding structure on the bracket. This structure is then bent using equipment and positioned directly above the integrated circuit chip to block external light sources. However, this solution only effectively blocks the light source directly above the integrated circuit chip. The sides of the chip remain unshielded, allowing light to still enter and interfere with the product, thus failing to achieve optimal shielding. Therefore, a surface-mount infrared receiver with full light interference shielding is needed. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a patch infrared receiver head that fully shields against light interference. It solves the technical problem that because only the top of the integrated circuit chip is shielded from the light source, while the four sides are not shielded, the light source enters from all four sides and still causes light interference to the product, making it impossible to achieve effective shielding. This invention achieves full shielding of the front and sides of the integrated circuit chip, reducing light interference and improving the product's receiving function.

[0005] To solve the above technical problems, this utility model provides the following technical solution: a patch infrared receiver head that fully shields against light interference, comprising a support body, conductive wires, and an encapsulant. The surface of the support body is provided with two die-bonding areas and multiple wire bonding areas. The top of the two die-bonding areas is respectively provided with a photodiode chip and an integrated circuit chip. The photodiode chip and the integrated circuit chip are respectively connected to the corresponding wire bonding areas through conductive wires.

[0006] In addition, there are through holes on the side of the bracket and solder pads on the back of the bracket.

[0007] Preferably, the encapsulant is composed of encapsulant one, encapsulant two, and encapsulant three. Encapsulant one and encapsulant two are formed by a first molding process. Encapsulant one covers and encapsulates the integrated circuit chip and is molded into a plane. Encapsulant two covers and encapsulates the photodiode chip and is formed into a spherical shape directly above it.

[0008] Preferably, the molding material of the first and second sealant bodies is epoxy resin cake, and the molding material of the third sealant body is opaque black plastic.

[0009] Preferably, the surface of the support body is first molded by sealant body one and sealant body two to form three gap grooves. The three gap grooves are then cut to form two more gap grooves. The gap grooves are composed of gap groove one, gap groove two, gap groove three, gap groove four, and gap groove five.

[0010] Preferably, the sealant body three is formed by a second molding process. The sealant body three fills the first, second, third, fourth, and fifth gap grooves, covers the planar area formed by the first molding process, and completely encapsulates the first sealant body and the second sealant body except for the front ball head.

[0011] Preferably, the bonding area is composed of bonding area one, bonding area two, bonding area three, and bonding area four. Bonding area one is used to connect one electrode of the photodiode chip and the integrated circuit chip. Bonding areas three and four and the front sides of the two die-bonding areas are connected to the pads through through holes.

[0012] By employing the above technical solution, this utility model provides a patch infrared receiver head that fully shields against light interference, which has at least the following beneficial effects:

[0013] 1. This utility model effectively blocks light sources from the front and sides of the integrated circuit chip by wrapping it with opaque black plastic, preventing light from entering the integrated circuit chip and avoiding the impact of light interference on the performance of the integrated circuit chip, thereby improving the stability and reliability of the product.

[0014] 2. By reducing light source interference, this utility model ensures that the integrated circuit chip is not affected by external environmental factors during operation, optimizes the product's receiving function, enables it to process signals more accurately, and improves overall performance. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0016] Figure 1 This is a top view of the structure of this utility model;

[0017] Figure 2 This is a side view of the structure of this utility model;

[0018] Figure 3 This is a front view structural diagram of the present invention;

[0019] Figure 4 This is a schematic diagram of the pad structure of this utility model.

[0020] In the diagram: 1. Support body; 11. Gap groove one; 12. Gap groove two; 13. Gap groove three; 14. Gap groove four; 15. Gap groove five; 2. Conductive wire; 3. Encapsulant; 31. Encapsulant one; 32. Encapsulant two; 33. Encapsulant three; 4. Die bonding area; 5. Wire bonding area; 51. Wire bonding area one; 52. Wire bonding area two; 53. Wire bonding area three; 54. Wire bonding area four; 6. Photodiode chip; 7. Integrated circuit chip; 8. Via; 9. Pad. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Current surface-mount receiver optical interference shielding solutions use a bracket design to block external light sources, which is only effective directly above the integrated circuit chip. However, the solution does not block the sides of the integrated circuit chip, allowing light to still enter from the sides, thus failing to achieve a complete shielding effect.

[0023] To address the technical problem that only the area directly above the integrated circuit chip provides light shielding, while the four sides remain unshielded, allowing light to enter from all sides and still causing light interference to the product, thus failing to achieve effective shielding, please refer to... Figures 1-4 This embodiment proposes a patch infrared receiver head that fully shields against light interference, achieving full shielding of the front and sides of the integrated circuit chip, reducing light interference, and improving the product's receiving function.

[0024] The specific implementation process of this embodiment is as follows: A patch infrared receiver head with full shielding against optical interference includes a support body 1, conductive wires 2, and an encapsulating body 3. The surface of the support body 1 is provided with two die-bonding areas 4 and multiple wire bonding areas 5. A photodiode chip 6 and an integrated circuit chip 7 are respectively disposed on the top of the two die-bonding areas 4. The photodiode chip 6 and the integrated circuit chip 7 are connected to their respective wire bonding areas 5 via the conductive wires 2. The wire bonding areas 5 consist of wire bonding area one 51, wire bonding area two 52, wire bonding area three 53, and wire bonding area four 54. Wire bonding area one 51 is used to connect one electrode of the photodiode chip 6 and the integrated circuit chip 7 for conduction. Through holes 8 are provided on the side of the support body 1, and pads 9 are provided on the back of the support body 1. Wire bonding areas three 53, wire bonding area four 54, and the front sides of the two die-bonding areas 4 are connected to the pads 9 via the through holes 8.

[0025] like Figures 1-2As shown, the existing solution only blocks the light source directly above the integrated circuit chip 7. However, there is no blocking on the side of the integrated circuit chip 7, and the light source can still enter the product through the side of the integrated circuit chip 7, causing light interference. This cannot achieve the best shielding effect. In order to achieve full shielding of the front and side of the integrated circuit chip 7, the following settings are made: the encapsulant 3 is composed of encapsulant 1 31, encapsulant 2 32, and encapsulant 33. Among them, encapsulant 1 31 and encapsulant 2 32 are formed by a first molding process. Encapsulant 1 31 covers and wraps the integrated circuit chip 7 and is molded into a flat surface. Encapsulant 2 32 covers and wraps the photodiode chip 6 and is formed into a spherical shape directly above it. The molding compound material for Encapsulant 1 (31) and Encapsulant 2 (32) is epoxy resin cake. Epoxy resin cake is an adhesive composed of epoxy resin and a curing agent, usually existing in cake or sheet form. It has good adhesion, heat resistance, corrosion resistance, and electrical insulation. It can cure after heating to form a strong adhesive layer, providing reliable performance. The molding compound material for Encapsulant 3 (33) is opaque black plastic. This is to minimize the interference of external light sources on the integrated circuit chip 7. The integrated circuit chip 7 is usually very sensitive to light, and light sources may affect its performance, leading to signal errors or malfunctions. By using opaque material, light can be effectively blocked from entering from the front and sides, ensuring that the integrated circuit chip 7 is not affected by external light during operation, thereby improving its stability and reliability. The surface of the support body 1 is first molded using sealant 1 (31) and sealant 2 (32) to form three slit grooves. These three slit grooves are then cut to create two more slit grooves. These slit grooves consist of slit groove 1 (11), slit groove 2 (12), slit groove 3 (13), slit groove 4 (14), and slit groove 5 (15). Sealant 3 (33) is then molded a second time, filling slit grooves 1 (11), slit groove 2 (12), slit groove 3 (13), slit groove 4 (14), and slit groove 5 (15), covering the planar area formed in the first molding, and completely encapsulating sealant 1 (31) and sealant 2 (32) except for the front ball head. By wrapping the front and sides of the integrated circuit chip 7 with opaque black plastic, external light sources can be blocked from interfering with the product, thereby improving the product's receiving function.

[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A patch infrared receiver head with full shielding against optical interference, comprising a support body (1), conductive wires (2), and an encapsulating body (3), characterized in that, The surface of the support body (1) is provided with two die bonding areas (4) and multiple wire bonding areas (5). The top of the two die bonding areas (4) is provided with a photodiode chip (6) and an integrated circuit chip (7), respectively. The photodiode chip (6) and the integrated circuit chip (7) are connected to the corresponding wire bonding area (5) through conductive wires (2). In addition, through holes (8) are provided on the side of the bracket (1) and pads (9) are provided on the back of the bracket (1). The encapsulant (3) is composed of encapsulant one (31), encapsulant two (32) and encapsulant three (33). Encapsulant one (31) and encapsulant two (32) are formed by a first molding process. Encapsulant one (31) covers and encapsulates the integrated circuit chip (7) and is molded into a plane. Encapsulant two (32) covers and encapsulates the photodiode chip (6) and is formed into a ball shape directly above it. The molding material of the first sealant (31) and the second sealant (32) is epoxy resin cake, and the molding material of the third sealant (33) is opaque black plastic. The sealant body three (33) is formed by a second molding process. The sealant body three (33) fills the first groove (11), the second groove (12), the third groove (13), the fourth groove (14), and the fifth groove (15), and covers the planar area formed by the first molding process, as well as completely wrapping the sealant body one (31) and the sealant body two (32) except for the front ball head.

2. The patch infrared receiver head with full shielding against optical interference according to claim 1, characterized in that, The surface of the support body (1) is formed by the first molding of sealant body one (31) and sealant body two (32) to form three gap grooves. The three gap grooves are further formed by cutting to form two more gap grooves. The gap grooves are composed of gap groove one (11), gap groove two (12), gap groove three (13), gap groove four (14), and gap groove five (15).

3. The patch infrared receiver head with full shielding against optical interference according to claim 1, characterized in that, The bonding area (5) is composed of bonding area one (51), bonding area two (52), bonding area three (53), and bonding area four (54). Bonding area one (51) is used to connect one of the electrodes of the photodiode chip (6) and the integrated circuit chip (7). The front sides of bonding area three (53), bonding area four (54), and the two die bonding areas (4) are connected to the pad (9) through the through hole (8).

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