Storage chip packaging device

Abstract

The utility model discloses a storage chip packaging device, which comprises a packaging mechanism and a placing box, the placing box is inserted into the packaging mechanism, the placing box is provided with a plurality of first grooves, the bottom ends of the plurality of first grooves are provided with placing grooves, the bottom ends of the placing grooves are provided with through grooves penetrating to the bottom of the placing box, and the placing grooves are provided with through holes penetrating to the bottom of the placing box. A bottom plate is placed in the placing groove, a top column is fixedly connected to the bottom end of the bottom plate, the top column is inserted into the through groove, a sealing cover is inserted into the first groove, two notches are symmetrically formed in the sealing cover, elastic plates are fixedly connected to the interiors of the two notches, and clamping strips are fixedly connected to the side ends of the two elastic plates; and a clamping groove matched with the clamping strip is formed in the side end of the first groove, so that the chip can be conveniently taken out from the interior of the placement groove, and the use practicability of the storage box is improved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and more specifically, to a memory chip packaging device. Background Technology

[0002] With the development of technology, people's understanding of the semiconductor field has become more and more comprehensive. Chips belong to semiconductors, which are silicon wafers containing integrated circuits. They are small in size and are often part of computers or other electronic devices. After chips are manufactured, they are generally protected by packaging devices to prevent them from getting damp and damaged, and to facilitate transportation and storage.

[0003] A search revealed that Chinese utility model patent application number CN202420045590.9 discloses a mobile phone storage chip packaging device, including a base, a stabilizing component fixedly connected to the bottom of the base, a protective component threadedly connected to one side of the base, a packaging mechanism snapped onto the top of the base, a placement component fixedly connected to the inner wall of the packaging mechanism, a handle fixedly connected to one side of the placement component, and a separator component slidably connected to the inner wall of the placement component.

[0004] When in use, the chip is placed inside the placement box. To prevent the chip from moving inside the placement box, the size of the chip is usually made to match the size of the space inside the placement box. However, it is not convenient to remove the chip from the inside of the placement box. In addition, its sealing effect is poor, and water can easily enter the inside of the placement box. Water can easily come into contact with the chip and cause damage to the chip. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] To address the problems existing in the prior art, this utility model provides a memory chip packaging device to solve the technical problem mentioned in the background art where the size of the chip is the same as the size of the chip placement space inside the placement box, but it is inconvenient to remove the chip from the inside of the placement box.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: a memory chip packaging device, comprising a packaging mechanism and a placement box, wherein the placement box is inserted into the packaging mechanism, the placement box is provided with a plurality of first grooves, each of the first grooves having a placement slot at its bottom end, the placement slot having a through slot extending to the bottom of the placement box at its bottom end, a base plate being placed inside the placement slot, a top post being fixedly connected to the bottom end of the base plate, the top post being inserted into the through slot, a cover being inserted into the first groove, the cover having two symmetrical notches, each of the two notches having an elastic plate fixedly connected inside, each of the two elastic plates having a locking strip fixedly connected to its side end, and the side end of the first groove having a locking slot adapted to the locking strip, facilitating the removal of the chip from the placement slot and improving its practicality.

[0009] The present invention is further configured such that a first annular groove is provided on the outside of the top column, and a sealing ring is provided inside the first annular groove to ensure the sealing between the top column and the placement box.

[0010] The present invention is further provided that a sealing gasket is fixedly connected to the bottom end of the cover to ensure the airtightness between the cover and the placement box.

[0011] The present invention is further provided that the top of the cap is provided with two second grooves, and the inside of each of the two second grooves is rotatably connected to a handle, so as to facilitate lifting the cap out of the inside of the first groove.

[0012] The present invention is further provided that a second annular groove is provided on the outer front side of the placement box, and a sealing ring is provided inside the second annular groove to ensure the sealing between the placement box and the packaging mechanism.

[0013] The present invention is further configured such that the rear end of the placement box is provided with a threaded groove, the rear end of the packaging mechanism is provided with a circular groove, a rotating column is rotatably connected inside the circular groove, and a screw adapted to the threaded groove is fixedly connected to the side end of the rotating column, so as to facilitate fixing the placement box inside the packaging mechanism.

[0014] The present invention is further configured such that a handle is fixedly connected to the side end of the rotating column, and the handle is located inside the circular groove, which facilitates fixing the rotating column.

[0015] The present invention is further configured such that four support columns are fixedly connected to the bottom end of the packaging mechanism, and four slots adapted to the support columns are provided at the top end of the packaging mechanism, so as to facilitate the placement of multiple packaging mechanisms together.

[0016] (III) Beneficial Effects

[0017] Compared with the prior art, the present invention provides a memory chip packaging device, which has the following advantages:

[0018] 1. Pull the cap out from the inside of the first groove, then push the top post upward with your finger. The top post will move the bottom plate upward, and the bottom plate will push the chip to the upper side of the placement slot, making it easier to pick up the chip and remove the chip from the placement slot.

[0019] 2. By setting a first annular groove on the outside of the top post, and setting a sealing ring inside the first annular groove, the sealing between the top post and the through groove can be guaranteed. By setting a sealing gasket, the sealing between the cover and the placement box can be guaranteed, preventing water from entering the interior of the placement groove, preventing water from contacting the chip, and preventing chip damage.

[0020] 3. Insert the placement box into the packaging mechanism, so that the screw is inserted into the threaded groove. Then rotate the rotating column and the screw clockwise. The screw is screwed into the threaded groove, so that the side end of the placement box is pressed against the inner wall of the packaging mechanism, thereby making it easy to fix the placement box stably inside the packaging mechanism. Attached Figure Description

[0021] Figure 1 This is a front view of a memory chip packaging device according to the present invention.

[0022] Figure 2 This is a schematic diagram of the rear structure of a memory chip packaging device according to the present invention;

[0023] Figure 3 This is a structural diagram showing the arrangement of the box, rotating column, and screw in this utility model.

[0024] Figure 4 This is a structural diagram showing the combination of the box and the lid in this utility model;

[0025] Figure 5 This is a schematic diagram of the structure of the box in this utility model;

[0026] Figure 6 This is a structural diagram showing the connection between the bottom plate, top column, and sealing ring in this utility model;

[0027] Figure 7 This is a structural diagram showing the connection between the cover, elastic plate, locking strip, and sealing gasket in this utility model.

[0028] In the diagram: 1. Packaging mechanism; 2. Placement box; 3. First groove; 4. Placement slot; 5. Through slot; 6. Base plate; 7. Top post; 8. Cover; 9. Notch; 10. Elastic plate; 11. Locking strip; 12. Locking groove; 13. First annular groove; 14. Sealing ring; 15. Sealing gasket; 16. Second groove; 17. Handle; 18. Second annular groove; 19. Sealing ring; 20. Threaded groove; 21. Circular groove; 22. Rotating post; 23. Screw; 24. Rotating handle; 25. Support post; 26. Slot. Detailed Implementation

[0029] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0030] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0031] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0032] Please see Figures 1-7 A memory chip packaging device includes a packaging mechanism 1 and a placement box 2. Four support pillars 25 are fixedly connected to the bottom of the packaging mechanism 1, and four slots 26 adapted to the support pillars 25 are provided at the top of the packaging mechanism 1 to facilitate the placement of multiple packaging mechanisms 1 together. The placement box 2 is inserted into the interior of the packaging mechanism 1. The placement box 2 has multiple first grooves 3, and each of the first grooves 3 has a placement groove 4 at its bottom. A through groove 5 extending to the bottom of the placement box 2 is provided at the bottom of the placement groove 4. A base plate 6 is placed inside the placement groove 4, and a top pillar 7 is fixedly connected to the bottom of the base plate 6. The top pillar 7 is inserted into the through groove 5. A [missing information - likely a component or part] is inserted into the interior of the first grooves 3. The cover 8 has two symmetrical notches 9, and each notch 9 has an elastic plate 10 fixedly connected inside. Each elastic plate 10 has a locking strip 11 fixedly connected to its side end. The side end of the first groove 3 has a locking groove 12 that matches the locking strip 11. The locking strip 11 is locked inside the locking groove 12, which makes it easy to fix the cover 8 inside the first groove 3. The top of the cover 8 has two second grooves 16, and each second groove 16 has a handle 17 rotatably connected inside. By pulling the cover 8 upward with the handle 17, when a certain pulling force is reached, the locking strip 11 will slide out from inside the locking groove 12, thereby pulling the cover 8 out from inside the first groove 3.

[0033] Specifically, the cap 8 is pulled out from inside the first groove 3, and then the top post 7 is pushed upward with a finger. The top post 7 drives the bottom plate 6 to move upward, and the chip is pushed to the upper side of the placement groove 4 through the bottom plate 6, so as to facilitate the chip to be picked up and the chip inside the placement groove 4 to be taken out.

[0034] Please see Figure 6 and Figure 7 The top column 7 has a first annular groove 13 on its outside and a sealing ring 14 inside the first annular groove 13 to ensure the sealing between the top column 7 and the placement box 2. The bottom end of the cover 8 is fixedly connected with a sealing gasket 15 to ensure the sealing between the cover 8 and the placement box 2.

[0035] Specifically, by setting a first annular groove 13 on the outside of the top post 7, and a sealing ring 14 inside the first annular groove 13, the sealing between the top post 7 and the through groove 5 can be guaranteed. By setting a sealing gasket 15, the sealing between the cover 8 and the placement box 2 can be guaranteed, preventing water from entering the interior of the placement groove 4, preventing water from contacting the chip, and preventing chip damage.

[0036] Please see Figures 2-4 The outer front side of the placement box 2 is provided with a second annular groove 18, and the inside of the second annular groove 18 is provided with a sealing ring 19 to ensure the sealing between the placement box 2 and the packaging mechanism 1. The rear end of the placement box 2 is provided with a threaded groove 20, and the rear end of the packaging mechanism 1 is provided with a circular groove 21. A rotating column 22 is rotatably connected inside the circular groove 21. There is a small gap between the rotating column 22 and the placement box 2, which facilitates the expulsion of internal air during the movement of the placement box 2 into the packaging mechanism 1. In order to ensure the sealing between the placement box 2 and the packaging mechanism 1, a sealing gasket 15 can be fixedly connected to the end of the placement box 2 inserted into the packaging mechanism 1. A screw 23 that matches the threaded groove 20 is fixedly connected to the side end of the rotating column 22 to facilitate the fixing of the placement box 2 inside the packaging mechanism 1. A rotating handle 24 is fixedly connected to the side end of the rotating column 22. The rotating handle 24 is located inside the circular groove 21 to facilitate the fixing of the rotating column 22.

[0037] Specifically, the placement box 2 is inserted into the packaging mechanism 1, and the screw 23 is inserted into the threaded groove 20. Then, the rotating column 22 and the screw 23 are rotated clockwise. The screw 23 is screwed into the threaded groove 20, so that the side end of the placement box 2 is pressed against the inner wall of the packaging mechanism 1, thereby facilitating the stable fixing of the placement box 2 inside the packaging mechanism 1.

[0038] In summary, when using the overall equipment:

[0039] The chip is placed inside the corresponding placement slot 4, and then the cover 8 is inserted into the first groove 3. The elastic plate 10 causes the clip 11 to be inserted into the slot 26, fixing the cover 8 inside the first groove 3. At this time, the sealing gasket 15 is in a tight state. Then, the placement box 2 is inserted into the packaging mechanism 1, and the screw 23 is inserted into the threaded groove 20. Then, the rotating column 22 and the screw 23 are rotated clockwise. The screw 23 is screwed into the threaded groove 20, so that the side end of the placement box 2 is pressed against the inner wall of the packaging mechanism 1, and the placement box 2 is stably fixed inside the packaging mechanism 1.

[0040] Of all the solutions mentioned above, those involving the connection between two components can be selected according to the actual situation, such as welding, bolt and nut connection, bolt or screw connection, or other known connection methods, which will not be elaborated here. For all the fixed connections mentioned above, welding is preferred. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents.

Claims

1. A memory chip packaging device, comprising a packaging mechanism (1) and a placement box (2), characterized in that: The placement box (2) is inserted into the packaging mechanism (1). The placement box (2) is provided with a plurality of first grooves (3). The bottom end of each of the plurality of first grooves (3) is provided with a placement groove (4). The bottom end of the placement groove (4) is provided with a through groove (5) that extends to the bottom of the placement box (2). The placement groove (4) is provided with a base plate (6). The bottom end of the base plate (6) is fixedly connected with a top post (7). The top post (7) is inserted into the through groove (5). The first groove (3) is inserted with a cover (8). The cover (8) is symmetrically provided with two notches (9). The two notches (9) are fixedly connected with elastic plates (10). The side ends of the two elastic plates (10) are fixedly connected with clips (11). The side ends of the first groove (3) are provided with clips (12) that are compatible with the clips (11).

2. The memory chip packaging device according to claim 1, characterized in that: The top column (7) is provided with a first annular groove (13) on the outside, and a sealing ring (14) is provided inside the first annular groove (13).

3. A memory chip packaging device according to claim 1, characterized in that: A sealing gasket (15) is fixedly connected to the bottom end of the cover (8).

4. A memory chip packaging device according to claim 1, characterized in that: The top of the cover (8) is provided with two second grooves (16), and the inside of each of the two second grooves (16) is rotatably connected to a handle (17).

5. A memory chip packaging device according to claim 1, characterized in that: The outer front side of the placement box (2) is provided with a second annular groove (18), and a sealing ring (19) is provided inside the second annular groove (18).

6. A memory chip packaging device according to claim 1, characterized in that: The rear end of the placement box (2) is provided with a threaded groove (20), and the rear end of the packaging mechanism (1) is provided with a circular groove (21). A rotating column (22) is rotatably connected inside the circular groove (21), and a screw (23) that is compatible with the threaded groove (20) is fixedly connected to the side end of the rotating column (22).

7. A memory chip packaging device according to claim 6, characterized in that: The rotating column (22) is fixedly connected to a rotating handle (24) at its side end, and the rotating handle (24) is located inside the circular groove (21).

8. A memory chip packaging device according to claim 1, characterized in that: The bottom end of the packaging mechanism (1) is fixedly connected with four support columns (25), and the top end of the packaging mechanism (1) is provided with four slots (26) that are adapted to the support columns (25).

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