Semiconductor frame feeding frame with positioning and fixing functions

Abstract

The utility model discloses a semiconductor frame feeding rack with positioning and fixing functions, and relates to the technical field of semiconductor processing. When the device is used, a semiconductor frame is firstly placed in the limiting groove in the front face of the carrier plate, then the pull rod is pushed or pulled to enable the rack to move, so that the gears on the two sides of the limiting groove are driven to rotate synchronously, one end of the limiting barrier strip rotates to the position over the limiting groove, and therefore the semiconductor frame in the limiting groove is fixed. In the process that the semiconductor frame enters the die, the semiconductor frame cannot fall off after the carrier plate is turned over, after the semiconductor frame reaches the position, the pull rod is pulled or pushed to drive the rack and the gear to be in meshing transmission, one end of the limiting barrier strip leaves the position over the limiting groove, and therefore the semiconductor frame accurately falls into the die, manual feeding into the die is avoided, and the production efficiency is improved. The problems of dislocation and deformation of the lead frame caused by manual feeding are avoided, the product quality is improved, and the probability that personnel are scalded by the high-temperature lead frame is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically a semiconductor frame loading rack with positioning and fixing functions. Background Technology

[0002] In the semiconductor device manufacturing process, the semiconductor frame is the main component of the semiconductor device. During production, multiple semiconductor products arranged in rows are usually packaged on the semiconductor frame.

[0003] In the semiconductor device molding process, the lead frame needs to be placed into the molding machine mold and molded with epoxy resin. The lead frame is placed entirely by hand, which is extremely inconvenient and prone to problems such as lead frame misalignment and deformation. There is also the possibility of touching the bonding wires of the lead frame, which may affect product quality. Personnel are also prone to being burned by the high temperature of the lead frame.

[0004] In view of this, there is an urgent need for a semiconductor frame feeder with positioning and fixing functions to solve the above problems. Utility Model Content

[0005] To address the problems existing in the prior art, this utility model solves the problem using the following technical structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A semiconductor frame loading rack with positioning and fixing functions includes: a carrier plate, on which two limiting mechanisms are provided, each limiting mechanism including a limiting groove opened on the front side of the carrier plate, a plurality of limiting bars rotatably disposed on the front side of the carrier plate, and a driving component, wherein the plurality of limiting bars are in two groups, and the two groups of limiting bars are respectively disposed on both sides of the opening of the limiting groove.

[0008] The drive assembly includes several gears, several racks, and a pull rod. Several gears are disposed on the back of the carrier plate, and several gears correspond one-to-one with several limiting stops. The gears are connected to the corresponding limiting stops through a rotating shaft. The pull rod is slidably disposed on the back of the carrier plate and is disposed between two sets of limiting stops. Several racks are disposed on the pull rod, and the two ends of the racks mesh with the gears on both sides respectively.

[0009] When the gear rotates, one end of the limiting stop bar rotates to be directly above the limiting groove or moves away from the directly above the limiting groove.

[0010] The limiting mechanism also includes a synchronization plate, which is connected to two pull rods.

[0011] The synchronizing plate is connected to one end of the pull rod, and a drive rod is provided on the side of the synchronizing plate away from the pull rod.

[0012] The back of the carrier plate is provided with two limiting plates, and the limiting plates are provided with two limiting holes. The two pull rods are respectively inserted through the two limiting holes.

[0013] Several positioning pins are provided on both sides of the limiting groove.

[0014] The limiting groove opening is provided with frame limiting blocks on both sides of the extension direction of the tie rod.

[0015] The back of the carrier plate has several perforated holes.

[0016] The carrier plate is provided with fixing plates on both sides.

[0017] Two handles are provided on one side of the carrier plate.

[0018] Two fixing blocks are provided on the back of the carrier plate, and the two handles are respectively fixed on the two fixing blocks.

[0019] The above-described structure of this utility model can achieve the following beneficial effects:

[0020] In use, the bonded semiconductor frame is first placed in the limiting groove on the front of the carrier board. Then, the pull rod is pushed or pulled to move the rack, which in turn drives the gears on both sides of the limiting groove to rotate synchronously. This causes one end of the limiting stop to rotate to the top of the limiting groove, thus fixing the semiconductor frame in the limiting groove. This prevents the semiconductor frame from falling off after the carrier board is flipped during the process of entering the mold. Once it reaches the position, the pull rod is pulled or pushed to drive the rack and gears to mesh and drive the limiting stop away from the top of the limiting groove. This allows the semiconductor frame to fall accurately into the mold. This avoids the problem of lead frame misalignment and deformation caused by manual loading into the mold, improves product quality, and reduces the probability of personnel being burned by the high temperature of the lead frame. Attached Figure Description

[0021] Figure 1 This is a front view of the structure in this embodiment;

[0022] Figure 2 This is a schematic diagram of the rear structure of this embodiment.

[0023] In the diagram: 1. Carrier plate; 11. Limiting groove; 12. Limiting plate; 13. Hollow hole; 14. Handle; 2. Limiting stop bar; 3. Gear; 4. Rack; 5. Pull rod; 6. Positioning pin; 7. Frame limiting block; 8. Fixing plate; 9. Synchronization plate; 91. Drive rod. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0025] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification, claims and accompanying drawings of this utility model are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products or devices.

[0026] The following is in conjunction with the appendix Figures 1-2 This application will be described in further detail.

[0027] like Figures 1-2 As shown, a semiconductor frame loading rack with positioning and fixing functions includes: a carrier plate 1, on which two limiting mechanisms are provided. The limiting mechanism includes a limiting groove 11 opened on the front of the carrier plate 1, a plurality of limiting bars 2 rotatably disposed on the front of the carrier plate 1, and a driving component. The plurality of limiting bars 2 are in two groups, and the two groups of limiting bars 2 are respectively disposed on both sides of the opening of the limiting groove 11.

[0028] The drive assembly includes several gears 3, several racks 4, and a pull rod 5. Several gears 3 are disposed on the back of the carrier plate 1, and several gears 3 correspond one-to-one with several limiting bars 2. The gears 3 are connected to the corresponding limiting bars 2 through a rotating shaft. The pull rod 5 is slidably disposed on the back of the carrier plate 1 and is disposed between two sets of limiting bars 2. Several racks 4 are disposed on the pull rod 5, and the two ends of the racks 4 mesh with the gears 3 on both sides respectively.

[0029] When gear 3 rotates, one end of the limiting stop bar 2 rotates to or away from the limiting groove 11.

[0030] Based on the above structure, in use, the bonded semiconductor frame is first placed in the limiting groove 11 on the front of the carrier plate 1. Then, the pull rod 5 is pushed or pulled to move the rack 4, thereby driving the gears 3 on both sides of the limiting groove 11 to rotate synchronously. This causes one end of the limiting stop 2 to rotate directly above the limiting groove 11 (that is, to rotate the limiting stop 2 from a state parallel to the pull rod 5 to a state perpendicular to the pull rod 5), thereby fixing the semiconductor frame at the limiting groove 11. During the process of the semiconductor frame entering the mold, the semiconductor frame is rotated after the carrier plate 1 is flipped. The frame will not fall off. Once it reaches the desired position, pulling or pushing the lever 5 will cause the rack 4 and gear 3 to mesh and drive, causing one end of the limiting stop 2 to leave the top of the limiting groove 11 (that is, rotating the limiting stop 2 from a state perpendicular to the lever 5 to a state horizontal to the lever 5). This allows the semiconductor frame to fall accurately into the mold, thus avoiding manual feeding into the mold and preventing problems such as misalignment and deformation of the lead frame caused by manual feeding. This improves product quality and reduces the probability of personnel being burned by the high temperature of the lead frame.

[0031] like Figure 1 As shown, since the carrier plate 1 is provided with two limiting grooves 11, in order to improve the convenience of operation, the limiting mechanism also includes a synchronization plate 9, and the synchronization plate 9 is connected to the same end of the two pull rods 5. A drive rod 91 is provided on the side of the synchronization plate 9 away from the pull rods 5. In this way, by pushing or pulling the drive rod 91, the two pull rods 5 are operated synchronously to synchronously limit or unload the semiconductor frames in the two limiting grooves 11.

[0032] like Figure 2 As shown, in order to guide the installation and movement of the two tie rods 5, two limiting plates 12 are provided on the back of the carrier plate 1. The limiting plates 12 are provided with two limiting holes. The two tie rods 5 are respectively inserted through the two limiting holes, so that the tie rods 5 can be installed and move along the axial direction.

[0033] like Figure 1 As shown, several positioning pins 6 are provided on both sides of the limiting groove 11; and frame limiting blocks 7 are provided on both sides of the opening of the limiting groove 11 in the extension direction of the pull rod 5. In this way, the several positioning pins 6 and the frame limiting blocks 7 ensure that the semiconductor frame can be accurately positioned, thereby improving work efficiency.

[0034] like Figure 1 As shown, in order to reduce the weight and material cost of the carrier plate 1, several perforated holes 13 are provided on the back of the carrier plate 1.

[0035] like Figure 2 As shown, fixing plates 8 are provided on both sides of the carrier plate 1 (in actual use, fixing plates 8 can also be provided in the middle of the four sides of the carrier plate 1). These fixing plates 8 cooperate with the positioning blocks in the mold to ensure that the semiconductor frame enters the mold more accurately.

[0036] like Figure 1 and Figure 2 As shown, in order to facilitate holding the carrier plate 1, two fixing blocks are provided on the back of the carrier plate 1, and a handle 14 is fixed on each of the two fixing blocks. The carrier plate 1 can be held stably by the handle 14, which makes it easy to move the carrier plate 1.

[0037] In summary, during use, the bonded semiconductor frame is first placed in the limiting groove 11 on the front of the carrier plate 1. Then, the pull rod 5 is pushed or pulled to move the rack 4, thereby driving the gears 3 on both sides of the limiting groove 11 to rotate synchronously. This causes one end of the limiting stop 2 to rotate directly above the limiting groove 11, thus fixing the semiconductor frame at the limiting groove 11. This prevents the semiconductor frame from falling off after the carrier plate 1 is flipped during the process of entering the mold. After reaching the position, the pull rod 5 is pulled or pushed to drive the rack 4 and gears 3 to mesh and transmit power, causing one end of the limiting stop 2 to leave directly above the limiting groove 11. This allows the semiconductor frame to fall accurately into the mold. This avoids the need for manual feeding into the mold, preventing the lead frame from being misaligned or deformed due to manual feeding, improving product quality, and reducing the probability of personnel being burned by the high temperature of the lead frame.

[0038] The above are merely preferred embodiments of this application, and the present invention is not limited to the above embodiments. It is understood that other improvements and variations that can be directly derived or conceived by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included within the protection scope of the present invention.

Claims

1. A semiconductor frame feeder with positioning and fixing functions, characterized in that, include: The carrier plate (1) is provided with two limiting mechanisms. The limiting mechanism includes a limiting groove (11) opened on the front of the carrier plate (1), a plurality of limiting bars (2) rotatably disposed on the front of the carrier plate (1), and a driving component. The plurality of limiting bars (2) are in two groups, and the two groups of limiting bars (2) are respectively disposed on both sides of the opening of the limiting groove (11). The drive assembly includes several gears (3), several racks (4), and a pull rod (5). Several gears (3) are disposed on the back of the carrier plate (1). Several gears (3) correspond one-to-one with several limiting bars (2). The gears (3) are connected to the corresponding limiting bars (2) through a rotating shaft. The pull rod (5) is slidably disposed on the back of the carrier plate (1). The pull rod (5) is disposed between two sets of limiting bars (2). Several racks (4) are disposed on the pull rod (5). The two ends of the racks (4) mesh with the gears (3) on both sides respectively. When the gear (3) rotates, one end of the limiting stop bar (2) rotates to be directly above the limiting groove (11) or away from the limiting groove (11).

2. The semiconductor frame loading rack with positioning and fixing functions according to claim 1, characterized in that: The limiting mechanism also includes a synchronization plate (9), which is connected to two pull rods (5).

3. A semiconductor frame feeder with positioning and fixing functions according to claim 2, characterized in that: The synchronization plate (9) is connected to one end of the pull rod (5), and a drive rod (91) is provided on the side of the synchronization plate (9) away from the pull rod (5).

4. A semiconductor frame loading rack with positioning and fixing functions according to claim 1, characterized in that: The back of the carrier plate (1) is provided with two limiting plates (12), and the limiting plates (12) are provided with two limiting holes. The two pull rods (5) are respectively inserted through the two limiting holes.

5. A semiconductor frame loading rack with positioning and fixing functions according to claim 1, characterized in that: Several positioning pins (6) are provided on both sides of the limiting groove (11).

6. A semiconductor frame feeder with positioning and fixing functions according to claim 1, characterized in that: The limiting groove (11) has frame limiting blocks (7) on both sides of the opening in the extension direction of the pull rod (5).

7. A semiconductor frame feeder with positioning and fixing functions according to claim 1, characterized in that: The back of the carrier plate (1) is provided with several perforated holes (13).

8. A semiconductor frame feeder with positioning and fixing functions according to claim 1, characterized in that: Fixing plates (8) are provided on both sides of the carrier plate (1).

9. A semiconductor frame feeder with positioning and fixing functions according to claim 1, characterized in that: Two handles (14) are provided on one side of the carrier plate (1).

10. A semiconductor frame feeder with positioning and fixing functions according to claim 9, characterized in that: Two fixing blocks are provided on the back of the carrier plate (1), and the two handles (14) are respectively fixed on the two fixing blocks.

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