Ceramic vacuum chuck

Abstract

A ceramic vacuum chuck belongs to the technical field of vacuum chucks, and comprises a mounting seat with a circular cross section, a first microporous ceramic plate and a second microporous ceramic plate are fixedly mounted on the mounting seat, the first microporous ceramic plate and the second microporous ceramic plate are oppositely arranged, an air passage is arranged in the mounting seat, and a vacuum exhaust hole is formed in the side wall of the mounting seat; a positioning installation area is arranged between the first microporous ceramic plate and the second microporous ceramic plate, a stop block is detachably installed at the positioning installation area and used for being in contact with the straight edge of the silicon wafer for limiting, the adsorption uniformity of the silicon wafer is improved through the arrangement of the microporous ceramic plates, the silicon wafer can be limited in an auxiliary mode through the arrangement of the stop block, the adsorption stability of the silicon wafer is improved, and the service life of the silicon wafer is prolonged. And therefore, the processing accuracy and quality are ensured.

Description

Technical Field

[0001] This utility model relates to the field of vacuum suction cup technology, and in particular to a ceramic vacuum suction cup. Background Technology

[0002] Laser direct writing technology is a technique that focuses a laser beam into an extremely small spot to act on photosensitive or thermosensitive thin film materials to directly generate micro-nano patterns. Compared with other micro-nano processing methods, it has many advantages such as low cost, short processing cycle, flexible use, and low environmental requirements.

[0003] To improve the uniformity of adsorption, 3D laser direct writing equipment often uses ceramic vacuum chucks (such as CN222078346U). Ceramic vacuum chucks have the characteristics of uniform adsorption force, good insulation, high cleanliness, and strong high temperature resistance. They are connected to a vacuum pump through the dense holes or channels on the ceramic vacuum chuck. When the vacuum pump is started, a negative pressure is formed inside the chuck, and air is drawn out from the gap between the chuck and the object being adsorbed (such as a silicon wafer), thereby creating a strong pressure difference between the chuck and the surface of the object, achieving firm adsorption.

[0004] Existing ceramic vacuum chucks lack a limiting structure, making it impossible to limit the position of silicon wafers. The silicon wafers rely entirely on vacuum adsorption to adhere to the surface of the ceramic vacuum chuck. In actual operation, vibration can easily cause the position of the silicon wafers to change, affecting the accuracy and quality of processing, and it cannot meet the limiting requirements of silicon wafers of different sizes and shapes. Utility Model Content

[0005] To address the technical problem in the background art where existing ceramic vacuum chucks lack a limiting structure, and silicon wafers rely entirely on vacuum adsorption to adhere to the surface of the ceramic vacuum chuck, making them highly susceptible to positional changes due to vibration, thus affecting processing accuracy and quality, this utility model provides a ceramic vacuum chuck.

[0006] The technical solution of this utility model is as follows:

[0007] This utility model provides a ceramic vacuum chuck, including a mounting base with a circular cross-section. A first microporous ceramic plate and a second microporous ceramic plate are fixedly mounted on the mounting base, and the first and second microporous ceramic plates are arranged opposite to each other. An air channel is provided inside the mounting base, and a vacuum extraction hole is opened on the side wall of the mounting base. A positioning mounting area is provided between the first and second microporous ceramic plates, and a stop block is detachably installed in the positioning mounting area. The stop block is used to limit contact with the straight edge of the silicon wafer. The setting of the microporous ceramic plate improves the uniformity of silicon wafer adsorption, and the setting of the stop block can help limit the silicon wafer to improve the adsorption stability of the silicon wafer, thereby ensuring the accuracy and quality of processing.

[0008] Preferably, the positioning and mounting area is provided with a number of mounting holes at radial intervals along the mounting base. The mounting holes are arranged in two rows. The arrangement of the two rows improves the installation stability of the stop and the radial intervals make it easy to adjust the position of the stop according to the needs of silicon wafers of different sizes.

[0009] Preferably, the bottom of the stop block is fixed with two connecting pins, which are inserted into the mounting holes, facilitating the quick assembly and disassembly of the stop block.

[0010] Preferably, there are two positioning mounting areas, which are at a 90° angle to each other. This can effectively prevent the silicon wafer from rotating or shifting on the chuck, and can significantly improve the accuracy and stability of silicon wafer positioning.

[0011] Preferably, both the first microporous ceramic plate and the second microporous ceramic plate are arc-shaped structures. The number of the first microporous ceramic plate and the second microporous ceramic plate are the same and correspond one-to-one, which realizes the division of the adsorption area and makes it easy to select different adsorption areas according to the silicon wafer specifications.

[0012] Preferably, the outer diameter and inner diameter of the first microporous ceramic plate and the corresponding second microporous ceramic plate are the same, and the curvature of the first microporous ceramic plate is greater than that of the corresponding second microporous ceramic plate, so as to reasonably divide the adsorption area to adapt to the adsorption and positioning requirements of silicon wafers of different specifications.

[0013] Preferably, a plurality of first microporous ceramic plates are provided, and the plurality of first microporous ceramic plates are arranged sequentially at intervals along the radial direction of the mounting base. The arrangement of multiple first microporous ceramic plates at intervals along the radial direction of the mounting base can increase the adsorption range of silicon wafers, make the surface of silicon wafers more uniformly stressed, and effectively improve the adsorption stability. At the same time, the multiple first microporous ceramic plates cooperate with the corresponding second microporous ceramic plates to adsorb silicon wafers from multiple areas, improve the applicability to silicon wafers of different sizes, and meet diverse processing needs.

[0014] Preferably, a circular third microporous ceramic plate is fixedly installed at the center of the mounting base. The third microporous ceramic plate is located within the circular area enclosed by the innermost first and second microporous ceramic plates. It can adsorb the central area of ​​the silicon wafer, making up for the problem of insufficient central support that may exist when relying solely on edge adsorption. This further enhances the overall adsorption effect on the silicon wafer, making the silicon wafer more firmly fixed on the suction cup. Especially for large-sized silicon wafers, it can effectively prevent deformation caused by the silicon wafer being suspended in the center, thus improving processing accuracy.

[0015] Preferably, the mounting base is provided with several bolt holes, which are distributed around the periphery of the third microporous ceramic plate, so as to use bolts to fix the ceramic vacuum chuck as a whole on the laser direct writing equipment.

[0016] Preferably, the mounting base is provided with several vacuum extraction holes, which are connected to the corresponding first microporous ceramic plate, second microporous ceramic plate and third microporous ceramic plate through independent air channels, thereby realizing independent control of the first microporous ceramic plate, second microporous ceramic plate and third microporous ceramic plate to adapt to silicon wafers of different sizes and shapes.

[0017] As can be seen from the above technical solutions, the advantages of this utility model are:

[0018] 1. A positioning and mounting area is provided between the first microporous ceramic plate and the second microporous ceramic plate. A stop block is detachably installed in the positioning and mounting area. The stop block is used to limit the contact with the straight edge of the silicon wafer. The setting of the microporous ceramic plate improves the uniformity of silicon wafer adsorption. The setting of the stop block can help limit the silicon wafer and prevent movement during processing, thereby improving the adsorption stability of the silicon wafer and ensuring the accuracy and quality of processing.

[0019] 2. The first and second microporous ceramic plates are both arc-shaped structures, while the third microporous ceramic plate is circular. Driven by corresponding vacuum extraction holes, the adsorption area is divided, which facilitates the selection of different adsorption areas according to the silicon wafer specifications to adapt to silicon wafers of different sizes and shapes. Attached Figure Description

[0020] To more clearly illustrate the technical solution of this utility model, the drawings used in the description will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of the ceramic vacuum chuck according to one or more embodiments of the present invention;

[0022] Figure 2 This is a schematic diagram of the suction cup body according to one or more embodiments of the present invention;

[0023] Figure 3 This is a structural schematic diagram of a stop block of a first shape according to one or more embodiments of the present invention;

[0024] Figure 4 This is a structural schematic diagram of a second-shaped stop block according to one or more embodiments of the present invention;

[0025] The components represented by the various reference numerals in the diagram are:

[0026] 1. Mounting base; 2. First microporous ceramic plate; 3. Second microporous ceramic plate; 4. Third microporous ceramic plate; 5. Bolt hole; 6. Positioning and mounting area; 7. Mounting hole; 8. Vacuum extraction hole; 9. Stop block; 10. Connecting pin.

[0027] Definitions:

[0028] Microporous ceramic plates are functional ceramic materials with a uniform microporous structure. The pore size typically ranges from 0.1 micrometers to 200 micrometers, and the porosity is generally between 15% and 60%. They are widely used in wafer adsorption, chip packaging, laser direct writing / dicing and other fields. Detailed Implementation

[0029] To make the objectives, features, and advantages of this utility model more apparent and understandable, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings of the specific embodiments. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this patent, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this patent.

[0030] Example 1

[0031] In a typical embodiment of this utility model, such as Figures 1-4 As shown, a ceramic vacuum chuck is proposed, comprising: a mounting base 1, a first microporous ceramic plate 2, a second microporous ceramic plate 3, and a stop block 9. Several first microporous ceramic plates 2 and 3 are provided, and both are fixedly mounted on the mounting base 1. Both first microporous ceramic plates 2 and 3 have an arc-shaped structure, and the number of first microporous ceramic plates 2 and 3 is the same.

[0032] Specifically, the mounting base 1 has a circular cross-section, and several first microporous ceramic plates 2 are arranged sequentially at intervals along the radial direction of the mounting base 1. The second microporous ceramic plates 3 are arranged opposite to the first microporous ceramic plates 2 and correspond one-to-one. The outer diameter and inner diameter of the first microporous ceramic plate 2 and the corresponding second microporous ceramic plate 3 are the same, and the curvature of the first microporous ceramic plate 2 is greater than the curvature of the corresponding second microporous ceramic plate 3.

[0033] In this embodiment, the first microporous ceramic plate 2 and the second microporous ceramic plate 3 are both embedded in the mounting base 1 and fixedly connected to the mounting base 1 by bonding. The upper surfaces of the first microporous ceramic plate 2 and the second microporous ceramic plate 3 are slightly higher than the mounting base 1. The mounting base 1 has an air channel inside, which is located directly below the first microporous ceramic plate 2 and the second microporous ceramic plate 3. A vacuum extraction hole 8 is opened on the side wall of the mounting base 1. The vacuum extraction hole 8 is connected to the air channel and is connected to the micropores on the first microporous ceramic plate 2 and the second microporous ceramic plate 3 through the air channel for vacuuming operation.

[0034] A positioning and mounting area 6 is provided between the first microporous ceramic plate 2 and the second microporous ceramic plate 3. The stop block 9 is detachably installed in the positioning and mounting area 6. Specifically, the positioning and mounting area 6 is provided with a plurality of mounting holes 7 at radial intervals along the mounting base 1. The mounting holes 7 are provided in two rows, and the two rows of mounting holes 7 are arranged opposite each other for the installation of the stop block 9, thereby using the stop block 9 to limit the silicon wafer.

[0035] In practical work, circular silicon wafers may be cut with one or two cuts. A single cut will form a straight edge on the silicon wafer, while two cuts will form a right-angled notch (containing two perpendicular straight edges). Therefore, in order to accommodate the positioning requirements of silicon wafers of different shapes, two positioning installation areas 6 are provided in this embodiment. That is, a positioning installation area 6 is provided between the two ends of the second microporous ceramic plate 3 and the two ends of the first microporous ceramic plate 2, and a stop block 9 can be detachably installed at each positioning installation area 6.

[0036] like Figure 2 As shown, each positioning mounting area 6 is provided with two rows of mounting holes 7 for the detachable installation of the stop block 9. The included angle between the two positioning mounting areas 6 is 90°. When the circular silicon wafer is cut with only one cut, only one stop block 9 needs to be installed at one positioning mounting area 6. When the circular silicon wafer is cut with two cuts, one stop block 9 is installed at each positioning mounting area 6 to achieve the limiting function for silicon wafers of different shapes. Since the mounting holes 7 are arranged radially and spaced along the mounting base 1, the position of the stop block 9 can be adjusted according to actual needs to adapt to the limiting requirements of silicon wafers of different sizes.

[0037] like Figure 3 As shown, the bottom of the stop block 9 is fixedly provided with two connecting pins 10. The distance between the two connecting pins 10 is the same as the distance between the two oppositely arranged mounting holes 7. The connecting pins 10 are used to be inserted into the mounting holes 7 for quick assembly and disassembly of the stop block 9.

[0038] It should be noted that the mounting hole 7 is not connected to the air passage inside the mounting base 1, so as to prevent the mounting hole 7 from affecting the vacuuming operation.

[0039] The stop block 9 can be set into various shapes, such as Figure 3As shown, stop 9 is semi-circular, as... Figure 4 As shown, the stop 9 is rectangular. When the stop 9 is semi-circular, the diameter of the stop 9 is the same as the width of the positioning and mounting area 6. When the stop 9 is rectangular, the length of the stop 9 is the same as the width of the positioning and mounting area 6, so as to fit and limit the straight edge of the cut silicon wafer.

[0040] It is understood that in other embodiments, the stop 9 may also be of other shapes. The specific shape is not limited here. In actual use, the stop 9 of the corresponding shape can be selected according to the needs.

[0041] like Figure 2 As shown, a third microporous ceramic plate 4 is also fixedly installed on the mounting base 1. The third microporous ceramic plate 4 is a circular plate. The third microporous ceramic plate 4 is fixedly installed at the center of the mounting base 1 and is located in the circular area enclosed by the innermost first microporous ceramic plate 2 and the second microporous ceramic plate 3. The third microporous ceramic plate 4 is also connected to the air passage in the mounting base 1.

[0042] In this embodiment, the corresponding air channels of the first microporous ceramic plate 2, the second microporous ceramic plate 3, and the third microporous ceramic plate 4 are independently set, and a plurality of vacuum extraction holes 8 are correspondingly set on the mounting base 1. The vacuum extraction holes 8 are connected to the corresponding air channels, thereby realizing independent control of the first microporous ceramic plate 2, the second microporous ceramic plate 3, and the third microporous ceramic plate 4. This not only adapts to silicon wafers of different sizes, but also effectively reduces energy consumption.

[0043] The mounting base 1 is also provided with several bolt holes 5, which are distributed around the periphery of the third microporous ceramic plate 4. The bolt holes 5 penetrate the mounting base 1 and are not connected to the air passage in the mounting base 1, so as to install bolts, thereby using bolts to fix the ceramic vacuum chuck as a whole on the laser direct writing equipment.

[0044] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A ceramic vacuum suction cup, comprising: The mounting base (1) with a circular cross-section is characterized in that a first microporous ceramic plate (2) and a second microporous ceramic plate (3) are fixedly mounted on the mounting base (1), the first microporous ceramic plate (2) and the second microporous ceramic plate (3) are arranged opposite to each other, the mounting base (1) is provided with an air passage, and a vacuum extraction hole (8) communicating with the air passage is opened on the side wall of the mounting base (1). A positioning and mounting area (6) is provided between the first microporous ceramic plate (2) and the second microporous ceramic plate (3). A stop (9) is detachably installed in the positioning and mounting area (6). The stop (9) is used to limit contact with the straight edge of the silicon wafer.

2. The ceramic vacuum chuck according to claim 1, characterized in that, The positioning installation area (6) is provided with a number of mounting holes (7) at radial intervals along the mounting base (1), and the mounting holes (7) are provided in two rows.

3. The ceramic vacuum chuck according to claim 2, characterized in that, The bottom of the stop block (9) is fixed with two connecting pins (10), which are inserted into the mounting hole (7).

4. The ceramic vacuum chuck according to claim 1, characterized in that, There are two positioning installation areas (6), and the two positioning installation areas (6) are at a 90° angle to each other.

5. The ceramic vacuum chuck according to claim 1, characterized in that, The first microporous ceramic plate (2) and the second microporous ceramic plate (3) are both arc-shaped structures. The number of the first microporous ceramic plate (2) and the second microporous ceramic plate (3) are the same and correspond one-to-one.

6. The ceramic vacuum chuck according to claim 5, characterized in that, The outer diameter and inner diameter of the first microporous ceramic plate (2) are the same as those of the corresponding second microporous ceramic plate (3), and the curvature of the first microporous ceramic plate (2) is greater than that of the corresponding second microporous ceramic plate (3).

7. The ceramic vacuum chuck according to claim 5, characterized in that, There are several first microporous ceramic plates (2), and several first microporous ceramic plates (2) are arranged sequentially at intervals along the radial direction of the mounting base (1).

8. The ceramic vacuum chuck according to claim 7, characterized in that, A circular third microporous ceramic plate (4) is fixedly installed at the center of the mounting base (1). The third microporous ceramic plate (4) is located in the circular area enclosed by the innermost first microporous ceramic plate (2) and the second microporous ceramic plate (3).

9. The ceramic vacuum chuck according to claim 8, characterized in that, The mounting base (1) is provided with several bolt holes (5), which are distributed around the periphery of the third microporous ceramic plate (4).

10. The ceramic vacuum chuck according to claim 8, characterized in that, The mounting base (1) is provided with several vacuum extraction holes (8), which are connected to the corresponding first microporous ceramic plate (2), second microporous ceramic plate (3) and third microporous ceramic plate (4) through independent air channels.

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