Resin array dust collection structure for semiconductor packaging equipment

Abstract

The utility model discloses a resin array dust collection structure for semiconductor packaging equipment, which relates to the technical field of semiconductor packaging and comprises an array table bottom plate, an exhaust pipe and a long strip arranged at the upper end of the array table bottom plate, and a dust collection groove is arranged at the lower end of the long strip. An inner cavity of the dust collection groove is provided with two groups of guide inclined planes which are arranged in a splayed shape, and an inner groove is formed in the top of the dust collection groove; an L-shaped air exhaust hole is formed in the alignment table bottom plate, the air exhaust pipe is installed at the side end of the alignment table bottom plate and communicated with an inner cavity of an air outlet of the L-shaped air exhaust hole, and an air inlet of the L-shaped air exhaust hole is communicated with an inner cavity of the U-shaped groove. The design of the dust collection structure can effectively reduce retention and adhesion of dust.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a resin-lined dust collection structure for semiconductor packaging equipment. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product model and functional requirements. Semiconductor packaging is a crucial step in semiconductor device manufacturing, aiming to protect the chip from external environmental influences while enabling the chip to connect to external circuits. Specifically, the packaging process includes dicing the wafer into small wafers, then fixing these wafers to a substrate using specific methods (such as adhesive bonding), and connecting the wafer's bonding pads to the corresponding pins on the substrate using metal wires or conductive resin to form the required circuit. Finally, the individual wafers are encapsulated and protected with a plastic shell or other materials to achieve physical protection, electrical connection, and thermal management.

[0003] Semiconductor packaging can be categorized into various types based on packaging methods and technological advancements. For example, based on the materials used, it can be classified as metal packaging, ceramic packaging, metal-ceramic packaging, and plastic packaging. Based on different packaging technologies, it can also be divided into traditional packaging and wafer-level packaging. Wafer-level packaging is an advanced technology that involves partially or completely packaging on a wafer before dicing it into individual components, thereby improving packaging efficiency and reducing costs.

[0004] In plastic encapsulation, a dust collection system is an indispensable part of an automated encapsulation system. Existing dust collection systems include a horizontally arranged, elongated base plate with a strip stacked on top of the base plate, parallel to the base plate. A U-shaped groove is provided at the lower end of the strip, and an air extraction hole is provided on the inner wall of the sealed end of the U-shaped groove. The air extraction hole is connected to an air pump. When the material on the base plate moves laterally and passes through the U-shaped groove, the dust on the material is sucked into the air extraction hole and discharged. In actual use, dust tends to accumulate in the corners of the U-shaped groove and adhere to the inner wall of the U-shaped groove, resulting in incomplete dust cleaning. Therefore, this application provides a resin-aligned dust collection structure for semiconductor packaging equipment to meet the requirements. Utility Model Content

[0005] The purpose of this application is to provide a resin-lined dust collection structure for semiconductor packaging equipment, which solves the technical problem that existing dust collection systems are prone to dust accumulation in the corners of the U-shaped groove and adhesion to the inner wall of the U-shaped groove during use.

[0006] To achieve the above objectives, this application provides the following technical solution: a resin-lined dust collection structure for semiconductor packaging equipment, comprising a line-up base plate and an exhaust pipe, characterized in that: it further comprises a long strip disposed on the upper end of the line-up base plate, the lower end of the long strip is provided with a dust collection groove, and the inner cavity of the dust collection groove is provided with two sets of guide slopes arranged in a figure-eight shape, and the top of the dust collection groove is provided with an inner groove.

[0007] The base plate of the row platform is provided with an L-shaped air extraction hole. The air extraction pipe is installed on the side end of the base plate of the row platform and communicates with the air outlet cavity of the L-shaped air extraction hole. The air inlet of the L-shaped air extraction hole communicates with the cavity of the U-shaped groove.

[0008] In a preferred embodiment of this invention, the inner surface of the groove is densely covered with multiple inner pits.

[0009] In a preferred embodiment of this invention, the depth of each recess is 2-5 mm and the spacing is 10-15 mm.

[0010] In a preferred embodiment of this invention, the outward tilt angle of the two guide ramps is controlled between 30° and 60°.

[0011] In a preferred embodiment of this invention, the guide slope on the left is a short slope with an inclination angle controlled between 35° and 45°, and the guide slope on the right is a long slope with an inclination angle controlled between 55° and 60°.

[0012] In summary, the technical effects and advantages of this utility model are as follows:

[0013] This utility model has a reasonable structure, and the design of this dust collection structure can effectively reduce dust retention and adhesion.

[0014] In this invention, the inner surface of the groove is densely covered with multiple inner pits. The inner pits can form a local Venturi effect, which increases the airflow speed and enhances the dust carrying capacity. The local high-speed airflow formed by the small inner surface can lift dust particles from the material surface, increase the suspension time, and increase the probability of being removed.

[0015] In this invention, the guide slope on the left is a short slope, and the guide slope on the right is a long slope. The long slope has a larger outward opening angle, which can guide more airflow into the U-shaped groove and expand the coverage of the negative pressure area. The short slope has a smaller angle, which can reduce inlet turbulence, ensure that the airflow enters smoothly, and prevent dust from being rolled up by turbulence and then redeposited. The asymmetrical slope design can reduce the dust retention rate and improve the capture rate of large dust particles. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 for Figure 1 Schematic diagram of the partial split structure in the middle;

[0019] Figure 3 for Figure 2 Schematic diagram of the medium-length strip structure viewed from below;

[0020] Figure 4 This is a schematic diagram showing the feeding direction and the direction of resin material movement.

[0021] In the diagram: 1. Base plate of the entire row; 2. Air extraction pipe; 3. Long strip; 4. L-shaped air extraction hole; 5. Dust collection groove; 6. Guide slope; 7. Inner groove; 8. Inner recess. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example: Reference Figure 1-4 The resin-lined dust collection structure for semiconductor packaging equipment shown includes a line-up base plate 1, an air extraction pipe 2, and a long strip 3 disposed on the upper end of the line-up base plate 1. The lower end of the long strip 3 is provided with a dust collection groove 5, and the inner cavity of the dust collection groove 5 is provided with two sets of guide slopes 6 arranged in a figure-eight shape. The top of the dust collection groove 5 is provided with an inner groove 7.

[0024] The base plate 1 of the aligning table is provided with an L-shaped air extraction hole 4. The air extraction pipe 2 is installed on the side end of the base plate 1 of the aligning table and communicates with the inner cavity of the air outlet of the L-shaped air extraction hole 4. The air inlet of the L-shaped air extraction hole 4 communicates with the inner cavity of the U-shaped groove 5.

[0025] The air extraction hole is located on the bottom plate 1 of the entire row and is connected to the inner cavity of the dust collection slot 5, forming a uniformly distributed negative pressure field (the uniform negative pressure field can prolong the suspension time of dust, making it easier to be extracted). The negative pressure covers the entire bottom of the dust collection slot 5, and the dust is within the suction range from the inlet to the outlet. The air extraction of the bottom plate 1 of the entire row can improve the uniformity of negative pressure in the slot by more than 30%, significantly reducing the dust stagnation area.

[0026] The design of the top recessed groove 7 reduces the direct friction between airflow and the dust surface, reducing the risk of dust electrostatic adsorption;

[0027] The guide slope 6 and inner groove 7 in this design reduce the vortex intensity by 40%-50% by smoothing the airflow path, thus reducing the secondary stirring of dust.

[0028] This suction structure effectively reduces dust retention and adhesion.

[0029] In a preferred embodiment of this invention, the inner surface of the groove 7 is densely covered with multiple inner pits 8.

[0030] The concave pit 8 can create a local Venturi effect, increase airflow speed, enhance dust carrying capacity, and the local high-speed airflow formed by the small concave surface can lift dust particles from the material surface, increase suspension time, and increase the probability of being removed.

[0031] As a preferred embodiment of this example, Figure 3 As shown, the depth of each of the recesses 8 is 2~5mm, and the spacing is 10~15mm.

[0032] If the depth is too small (<2mm): an effective Venturi effect cannot be formed, the airflow acceleration is not obvious, and the dust suspension capacity is only slightly improved; if the depth is too large (>5mm): it may cause airflow separation, generate local eddies, increase turbulence intensity, and reduce dust capture efficiency; therefore, the effect is best when the depth is 2~5mm.

[0033] Too small a spacing (<10mm): Increased airflow interference between the small concave surfaces may lead to airflow turbulence and reduce dust capture efficiency; Too large a spacing (>15mm): Uneven distribution of airflow acceleration area and weakened dust suspension effect; A spacing of 10-15mm can minimize airflow interference between the small concave surfaces, ensure uniform airflow distribution, and ensure that each small concave surface can play an effective role, thereby improving the overall dust capture efficiency.

[0034] As a preferred embodiment of this example, Figure 3 As shown, the outward tilt angle of the two guide ramps 6 is controlled between 30° and 60°.

[0035] If the angle is too small (<30°): the slope is too gentle, the airflow diffusion is insufficient, which may lead to excessively fast inlet velocity and increased turbulence; if the angle is too large (>60°): the slope is too steep, the airflow diffusion is too fast, which may lead to uneven coverage of the negative pressure zone and reduced dust capture efficiency; therefore, within the range of 30°~60°, the airflow diffusion is gentle, the negative pressure uniformity is optimal, and the dust retention rate is lowest.

[0036] As a preferred embodiment of this example, Figure 3 As shown, the guide slope 6 on the left is a short slope with an inclination angle controlled between 35° and 45°, while the guide slope 6 on the right is a long slope with an inclination angle controlled between 55° and 60°.

[0037] The long slope has a larger outward opening angle, which can guide more airflow into the U-shaped groove and expand the coverage of the negative pressure area. The short slope has a smaller angle, which can reduce inlet turbulence, ensure smooth airflow, and prevent dust from being rolled up by turbulence and redeposited. The asymmetrical slope design can reduce dust retention rate and improve the capture rate of large dust particles.

[0038] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A resin-lined dust collection structure for semiconductor packaging equipment, comprising a base plate (1) and an extraction pipe (2), characterized in that: It also includes a long strip (3) set on the upper end of the entire table base plate (1), the lower end of the long strip (3) is provided with a dust collection groove (5), and the inner cavity of the dust collection groove (5) is provided with two sets of guide slopes (6) arranged in a figure-eight shape, and the top of the dust collection groove (5) is provided with an inner groove (7). The base plate (1) of the row platform is provided with an L-shaped air extraction hole (4). The air extraction pipe (2) is installed on the side end of the base plate (1) of the row platform and communicates with the air outlet cavity of the L-shaped air extraction hole (4). The air inlet of the L-shaped air extraction hole (4) communicates with the cavity of the U-shaped groove (5).

2. The resin-lined dust-collecting structure for semiconductor packaging equipment according to claim 1, characterized in that: The inner surface of the groove (7) is densely covered with multiple inner pits (8).

3. The resin-lined dust-collecting structure for semiconductor packaging equipment according to claim 2, characterized in that: The depth of each of the said recesses (8) is 2~5mm, and the spacing is 10~15mm.

4. The resin-lined dust-collecting structure for semiconductor packaging equipment according to claim 1, characterized in that: The outward tilt angle of the two guide ramps (6) is controlled between 30° and 60°.

5. The resin-lined dust-collecting structure for semiconductor packaging equipment according to claim 4, characterized in that: The guide slope (6) on the left is a short slope with an inclination angle controlled between 35° and 45°, while the guide slope (6) on the right is a long slope with an inclination angle controlled between 55° and 60°.

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