Ultrathin silicon microphone chip packaging equipment

Abstract

The utility model belongs to the technical field of microphone chip packaging, in particular to ultrathin silicon microphone chip packaging equipment, which comprises a packaging workbench, a control panel, a first motor and a shaft seat frame, the control panel is arranged at the side end of the packaging workbench, the first motor is arranged at the inner end of the top of the packaging workbench, and the shaft seat frame is arranged at the side end of the packaging workbench. According to the utility model, the rapid pressing driving mechanism, the cam bar, the driving gear, the driven gear, the linkage frame and the insertion positioning column are arranged, and the first motor and the second motor are controlled through the control panel. And the packaging film is wound around the peripheries of the transmission rollers on the two sides, and the tightness degree of the packaging film is controlled through a second motor. An operator puts a metal gasket for packaging on the bottom of a microphone chip and then places the microphone chip on a packaging workbench below a packaging pressure plate, a first motor is started and controls a driven gear to rotate through a driving gear, the driven gear drives a rapid pressing driving mechanism connected with the driven gear to rotate, and meanwhile, a cam bar rotates synchronously.

Description

Technical Field

[0001] This utility model relates to the field of microphone chip packaging technology, specifically to an ultra-thin silicon microphone chip packaging device. Background Technology

[0002] Ultra-thin silicon microphone chips represent a revolutionary breakthrough in miniaturized acoustic sensing technology. Their core value lies in providing high-performance, miniaturized sound acquisition solutions for smart terminal devices. As consumer electronics evolve towards thinner and more flexible designs, traditional electret microphones, limited by their size and structure, can no longer meet the demands. Silicon microphone chips based on MEMS technology integrate acoustic sensing units within millimeter-scale dimensions using semiconductor technology, becoming key components in products such as TWS earphones, smartwatches, and foldable phones. These chips not only achieve extreme compression of internal device space—for example, reducing the microphone module thickness to less than 0.3 mm—but also significantly improve the signal-to-noise ratio (generally >65dB) and waterproof performance through the stability of silicon materials, enabling voice assistants to accurately recognize commands even in complex environments.

[0003] Ultra-thin silicon microphone chip packaging technology is the core guarantee for miniature acoustic devices. Its core value lies in achieving a dual improvement in chip performance and reliability through precision packaging. The packaging structure protects the micron-sized MEMS diaphragm from dust and moisture corrosion (protection level up to IP68).

[0004] The existing technology has the following shortcomings: In the existing technology, the "Silicon Microphone Packaging Structure" with the publication number CN210629781U "includes a shell and a mounting block, the inner wall of the shell is provided with a microphone device, the microphone device includes a control board, one side wall of the control board is fixedly connected with a processing chip and an IC chip, one side wall of the shell is provided with a venting device, one side inner wall of the mounting block is provided with a positioning device, and one side wall of the control board is fixedly connected with two symmetrically arranged clips, which are inserted into the mounting block."

[0005] The aforementioned structure employs a positioning device, using protrusions to secure the clip and housing, avoiding the inconvenience of traditional welding methods that hinder later maintenance. A protective mesh isolates debris, preventing it from entering the housing and affecting normal operation. However, this device does not improve the specific chip packaging process. Traditional microphone chip packaging uses a cylinder-pressing structure. While this method is powerful, the plastic packaging film is mostly heat-sealed, eliminating the need for high-strength pressing. Using a cylinder as the drive unit actually lengthens the packaging stroke, resulting in slow speed and low efficiency. Utility Model Content

[0006] To address the shortcomings of existing technologies, this invention provides an ultra-thin silicon microphone chip packaging device, which solves the current problems.

[0007] To achieve the above objectives, the present invention provides the following technical solution: an ultra-thin silicon microphone chip packaging device, comprising a packaging workbench, a control panel, a first motor, and a shaft support frame, wherein the control panel is disposed on the side end of the packaging workbench, the first motor is disposed on the inner top end of the packaging workbench, and the shaft support frame is disposed on the side end of the packaging workbench.

[0008] The upper end of the packaging workbench is provided with a high-pressure drive mechanism, the inside of the packaging workbench is provided with a linkage frame, the side end of the packaging workbench is provided with a transmission roller, and the side end of the transmission roller is provided with a second motor.

[0009] The high-pressure drive mechanism also includes a driven gear, a drive gear, and a cam strip. The driven gear is sleeved around the side of the high-pressure drive mechanism. The drive gear has a through shaft in the middle and is movably connected between the packaging workbench and the first motor through the shaft structure. The cam strip is sleeved around the periphery of the high-pressure drive mechanism.

[0010] As a preferred technical solution of this utility model, the body of the high-pressure drive mechanism is a shaft column structure, with its two ends movably connected to the inner wall end faces of both sides of the packaging workbench, and a bearing ring is provided at the connection point around the high-pressure drive mechanism.

[0011] As a preferred technical solution of this utility model, the linkage frame further includes an insertion positioning post, a spring, a sealing pressure plate and a heating wire. The insertion positioning post passes through the interior of the linkage frame and has a disc-shaped cover structure at the top. The spring is sleeved around the insertion positioning post and is sandwiched between the cover and the linkage frame.

[0012] As a preferred embodiment of this utility model, the encapsulation pressure plate is sleeved on the bottom of the insertion positioning post, and a concave columnar groove is provided at the bottom, and the heating wire is coiled around the top of the encapsulation pressure plate.

[0013] As a preferred embodiment of this utility model, the encapsulation pressure plate adopts a copper structure, and the end of the heating wire is connected to electricity and embedded inside the top of the encapsulation pressure plate.

[0014] As a preferred technical solution of this utility model, the side end of the transmission roller passes through the bearing bracket and is inserted into the side end of the second motor at the end. There are two sets of transmission rollers and second motors, and the film wrapped around the periphery for encapsulation is made of polyimide material.

[0015] As a preferred technical solution of this utility model, before the packaging pressure plate encapsulates the microphone chip, a 3cm×3cm stainless steel pad needs to be placed on the bottom of the microphone chip.

[0016] Compared with the prior art, the present invention provides an ultra-thin silicon microphone chip packaging device, which has the following beneficial effects:

[0017] An ultra-thin silicon microphone chip packaging device comprises a high-speed pressure drive mechanism, a cam strip, a drive gear, a driven gear, a linkage frame, and a perforation positioning post. During operation, the operator controls a first motor and a second motor via a control panel. The packaging film is wound around the outer periphery of the two drive rollers, and the tightness of the film is controlled by the second motor. The operator places the microphone chip on a packaging worktable below the packaging pressure plate after placing a metal pad underneath it. The first motor starts and controls the driven gear to rotate, which in turn drives the connected high-speed pressure drive mechanism. Simultaneously, the cam strip rotates synchronously. When the convex side of the cam strip rotates downwards, it presses against the perforation positioning post. The perforation positioning post moves downwards and compresses a spring. At this time, the heating wire is energized and heats the packaging pressure plate. As the perforation positioning post moves downwards, the packaging pressure plate moves downwards synchronously, pressing down the packaging film between the drive rollers until it wraps the microphone chip. The heated packaging pressure plate then heats the periphery of the packaging film onto the pad at the bottom of the microphone chip. Then, as the cam bar continues to rotate, its protruding side rotates to another position. At this time, the upper end of the insertion positioning post loses the compressive force, the spring rebounds and drives the insertion positioning post to move upward and reset.

[0018] Through the above settings and processes, this structure, compared to existing ultra-thin silicon microphone chip packaging equipment, allows for faster packaging by using a combination of a high-pressure drive mechanism, a linkage frame, and transmission rollers to press and heat-seal the packaging film onto the microphone chip. This packaging method allows the packaging frequency to be controlled by the rotation frequency of the cam strip, shortening the packaging stroke and making the packaging speed faster. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the top structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the connection position structure of the drive gear and driven gear of this utility model;

[0022] Figure 4 This is a schematic diagram of the connection position structure of the cam bar and the high-speed pressure drive mechanism of this utility model;

[0023] Figure 5This is a schematic diagram showing the mounting positions of the encapsulation pressure plate and spring of this utility model.

[0024] In the diagram: 1. Packaging workbench; 2. Control panel; 3. First motor; 4. High-speed pressure drive mechanism; 401. Driven gear; 402. Drive gear; 403. Cam rack; 5. Linkage frame; 501. Insertion positioning post; 502. Spring; 503. Packaging pressure plate; 504. Heating wire; 6. Transmission roller; 7. Second motor; 8. Shaft support frame. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] In this embodiment: an ultra-thin silicon microphone chip packaging device includes a packaging workbench 1, a control panel 2, a first motor 3, and a shaft holder 8. The control panel 2 is located on the side of the packaging workbench 1, the first motor 3 is located on the inner top of the packaging workbench 1, and the shaft holder 8 is located on the side of the packaging workbench 1.

[0027] The upper end of the packaging workbench 1 is equipped with a high-pressure drive mechanism 4, the inside of the packaging workbench 1 is equipped with a linkage frame 5, the side end of the packaging workbench 1 is equipped with a transmission roller 6, and the side end of the transmission roller 6 is equipped with a second motor 7.

[0028] The high-pressure drive mechanism 4 also includes a driven gear 401, a drive gear 402, and a cam strip 403. The driven gear 401 is sleeved on the outer periphery of the side end of the high-pressure drive mechanism 4. The drive gear 402 has a through shaft in the middle and is movably connected between the packaging workbench 1 and the first motor 3 through the shaft structure. The cam strip 403 is sleeved on the outer periphery of the high-pressure drive mechanism 4.

[0029] In this embodiment, the main body of the high-pressure drive mechanism 4 is a shaft column structure, with its two ends movably connected to the inner wall end faces of both sides of the packaging workbench 1, and a bearing ring is provided at the connection point around the high-pressure drive mechanism 4; the linkage frame 5 also includes an insertion positioning post 501, a spring 502, a packaging pressure plate 503 and a heating wire 504, the insertion positioning post 501 passes through the interior of the linkage frame 5, and a disc-shaped cover structure is provided on the top of the insertion positioning post 501, the spring 502 is sleeved around the insertion positioning post 501 and is sandwiched between the cover and the linkage frame 5.

[0030] Specifically, such as Figure 4 and Figure 5As shown, the disc-shaped cap at the top of the insertion positioning post 501 clamps the spring 502 in the middle and controls the pressure on the spring 502 when the insertion positioning post 501 moves up and down, so that the spring 502 can lift the insertion positioning post 501 to complete the reset.

[0031] In this embodiment, the encapsulation pressure plate 503 is sleeved on the bottom of the insertion positioning post 501, and the bottom is provided with a concave columnar groove. The heating wire 504 is coiled around the top of the encapsulation pressure plate 503. The encapsulation pressure plate 503 is made of copper, and the end of the heating wire 504 is connected to electricity and embedded inside the top of the encapsulation pressure plate 503.

[0032] Specifically, such as Figure 5 As shown, the heating wire 504 heats up after being connected to electricity and heats the copper encapsulation plate 503. The embedded design can increase the contact area between the heating wire 504 and the encapsulation plate 503, thereby improving the heating speed.

[0033] In this embodiment, the side end of the transmission roller 6 passes through the bearing bracket 8 and is inserted into the side end of the second motor 7 at the end. There are two sets of transmission roller 6 and second motor 7, and the film wrapped around the periphery for encapsulation is made of polyimide material. Before encapsulating the microphone chip, the encapsulation pressure plate 503 needs to place a 3cm×3cm stainless steel pad on the bottom of the microphone chip.

[0034] The working principle and usage process of this utility model are as follows: When using this equipment, the operator controls the first motor 3 and the second motor 7 through the control panel 2. The encapsulation film is wrapped around the outer periphery of the two transmission rollers 6, and the tightness of the encapsulation film is controlled by the second motor 7. After the operator places the microphone chip with a metal pad for encapsulation on the bottom, it is placed on the encapsulation workbench 1 below the encapsulation pressure plate 503. The first motor 3 starts and controls the driven gear 401 to rotate through the drive gear 402. The driven gear 401 drives the connected high-pressure drive mechanism 4 to rotate, and at the same time, the cam strip 403 rotates synchronously. When the convex side of the cam strip 403 rotates to face downwards, it presses the insertion positioning post 501. The insertion positioning post 501 moves down and compresses the spring 502. At this time, the heating wire 504 is energized and heats the encapsulation pressure plate 503. During the downward movement of the insertion positioning post 501, the encapsulation pressure plate 503 moves down synchronously and presses down the encapsulation film between the transmission rollers 6 until it wraps the microphone chip. The heated encapsulation pressure plate 503 then heats the periphery of the encapsulation film onto the pad at the bottom of the microphone chip. Then, as the cam bar 403 continues to rotate, its protruding side rotates to another position. At this time, the upper end of the insertion positioning post 501 loses the compressive force, the spring 502 rebounds and drives the insertion positioning post 501 to move upward and reset.

[0035] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An ultra-thin silicon microphone chip packaging device, comprising a packaging worktable (1), a control panel (2), a first motor (3), and a shaft holder (8), wherein the control panel (2) is disposed on the side of the packaging worktable (1), the first motor (3) is disposed on the inner top of the packaging worktable (1), and the shaft holder (8) is disposed on the side of the packaging worktable (1), characterized in that: The upper end of the packaging workbench (1) is provided with a high-pressure drive mechanism (4), the inside of the packaging workbench (1) is provided with a linkage frame (5), the side end of the packaging workbench (1) is provided with a transmission roller (6), and the side end of the transmission roller (6) is provided with a second motor (7). The high-pressure drive mechanism (4) further includes a driven gear (401), a drive gear (402), and a cam strip (403). The driven gear (401) is sleeved on the outer periphery of the side end of the high-pressure drive mechanism (4). The drive gear (402) has a through shaft in the middle, and is movably connected between the packaging workbench (1) and the first motor (3) through the shaft structure. The cam strip (403) is sleeved on the outer periphery of the high-pressure drive mechanism (4).

2. The ultra-thin silicon microphone chip packaging device according to claim 1, characterized in that: The main body of the high-pressure drive mechanism (4) is a shaft column structure, and its two ends are movably connected to the inner wall end faces of the two sides of the packaging workbench (1), and a bearing ring is provided at the connection point around the high-pressure drive mechanism (4).

3. The ultra-thin silicon microphone chip packaging device according to claim 1, characterized in that: The linkage frame (5) also includes an insertion positioning post (501), a spring (502), a sealing pressure plate (503), and a heating wire (504). The insertion positioning post (501) passes through the interior of the linkage frame (5), and a disc-shaped cover structure is provided on the top of the insertion positioning post (501). The spring (502) is sleeved around the insertion positioning post (501) and is sandwiched between the cover and the linkage frame (5).

4. The ultra-thin silicon microphone chip packaging device according to claim 3, characterized in that: The encapsulation plate (503) is sleeved on the bottom of the insertion positioning post (501), and the bottom is provided with a concave columnar groove. The heating wire (504) is coiled around the top of the encapsulation plate (503).

5. The ultra-thin silicon microphone chip packaging device according to claim 3, characterized in that: The encapsulation pressure plate (503) is made of copper, and the end of the heating wire (504) is connected to electricity and embedded inside the top of the encapsulation pressure plate (503).

6. The ultra-thin silicon microphone chip packaging device according to claim 1, characterized in that: The transmission roller (6) passes through the bearing bracket (8) at one end and is inserted into the side of the second motor (7) at the other end. There are two sets of transmission roller (6) and second motor (7), and the film wrapped around the periphery for encapsulation is made of polyimide material.

7. The ultra-thin silicon microphone chip packaging device according to claim 3, characterized in that: Before encapsulating the microphone chip, the encapsulation plate (503) needs to place a 3cm×3cm stainless steel pad on the bottom of the microphone chip.

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