Wafer deposition device and wafer deposition equipment

Abstract

The utility model discloses a wafer deposition device and wafer deposition equipment, and relates to the technical field of wafer deposition, the wafer deposition device comprises a deposition rotating platform, a plurality of wafer deposition platforms, a movable support and a mechanical arm, the plurality of wafer deposition platforms are arranged on the periphery of the deposition rotating platform; the plurality of wafer deposition platforms are used for placing different process chambers; the movable bracket is detachably arranged on one of the wafer deposition platforms, and the movable bracket is used for bearing a to-be-deposited wafer; and the mechanical arm is arranged on the deposition rotating platform, is detachably connected to the movable bracket and is used for moving the movable bracket among the plurality of wafer deposition platforms. Compared with the prior art, according to the embodiment of the utility model, the mechanical arm and the movable bracket are matched to transfer the wafer, the wafer damage caused by direct contact of the mechanical arm with the wafer is avoided, and different deposition processes are realized on the wafers on different wafer deposition platforms by using different process chambers, so that the cavity pollution can be effectively avoided.

Description

Technical Field

[0001] This utility model relates to the field of wafer deposition technology, and more specifically, to a wafer deposition apparatus and wafer deposition equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, chemical vapor deposition (CVD) technology is often used to achieve wafer deposition. CVD is a chemical technology that mainly uses one or more gaseous compounds or elements containing thin film elements to chemically react on the substrate surface to generate thin films.

[0003] In conventional technologies, different deposition processes are typically performed within the same process chamber. However, during deposition, byproducts of gaseous reactions can exist within the process chamber, easily leading to wafer contamination. Furthermore, existing deposition equipment often uses robotic arms to directly contact and transport the wafer, which can easily cause wafer damage and breakage. Utility Model Content

[0004] The purpose of this invention is to provide a wafer deposition apparatus and wafer deposition equipment that can avoid cavity contamination and prevent the robotic arm from directly contacting the wafer, thus avoiding wafer breakage and damage during handling.

[0005] The embodiments of this utility model are implemented as follows:

[0006] In one aspect, embodiments of the present invention provide a wafer deposition apparatus, comprising:

[0007] Deposition rotating platform;

[0008] Multiple wafer deposition platforms are arranged around the periphery of the deposition rotary platform, and the multiple wafer deposition platforms are used to place different process chambers;

[0009] A movable support detachably mounted on one of the wafer deposition platforms, the movable support being used to carry the wafer to be deposited;

[0010] A robotic arm is mounted on the deposition rotary platform and is detachably connected to the movable support for moving the movable support between multiple wafer deposition platforms.

[0011] In an optional embodiment, the wafer deposition platform is provided with a placement slot, and the movable support is movably mounted in the placement slot so that the surface of the wafer on the movable support is exposed, and the placement slot is used to deposit on the surface of the wafer.

[0012] In an optional embodiment, the movable support includes a wafer protection ring and a wafer beam. The wafer beam is radially disposed within the wafer protection ring. The wafer protection ring is adapted to the placement slot, and both ends of the wafer beam are connected to the wafer protection ring. The robotic arm is detachably connected to the wafer beam. The wafer beam is used to support the wafer, and the wafer protection ring is used to accommodate the wafer.

[0013] In an optional embodiment, the edge of the wafer protection ring is further provided with an upwardly protruding retaining ring, which is used to shield the sidewall of the wafer and position the wafer.

[0014] In an optional embodiment, a positioning hole is provided in the placement slot, a lifting shaft is provided in the positioning hole, and a mounting boss is provided at the bottom of the wafer beam. The mounting boss is correspondingly assembled to the lifting shaft and is used to drive the movable support to rise or fall under the drive of the lifting shaft.

[0015] In an optional embodiment, the bottom end of the mounting boss is provided with an assembly hole, and the lifting shaft is correspondingly assembled in the assembly hole for positioning the mounting boss.

[0016] In an optional embodiment, the positioning hole is located at the center of the placement slot, and the mounting boss is located at the middle of the wafer crossbeam and protrudes downward.

[0017] In an optional embodiment, the robotic arm includes a lifting rotating seat and a transfer arm. The lifting rotating seat is located at the center of the deposition rotating platform and is rotatable relative to the center of the deposition rotating platform. One end of the transfer arm is connected to the lifting rotating seat, and the other end extends toward the wafer deposition platform and is detachably connected to the movable support.

[0018] In an optional embodiment, the deposition rotary platform is hexagonal, and six wafer deposition platforms are arranged around the periphery of the deposition rotary platform.

[0019] In another aspect, this utility model provides a wafer deposition apparatus, including multiple process chambers and the aforementioned wafer deposition device, wherein multiple wafer deposition platforms are correspondingly disposed within the multiple process chambers.

[0020] The beneficial effects of this utility model embodiment include:

[0021] This invention provides a wafer deposition apparatus and device. Multiple wafer deposition platforms are arranged around the periphery of a deposition rotary platform. These platforms are used to place wafers into different process chambers. A movable support is detachably mounted on one of the wafer deposition platforms to support the wafer to be deposited. A robotic arm is also mounted on the deposition rotary platform and detachably connected to the movable support, thereby moving the movable support. During actual deposition, the wafer can be placed on the movable support, and the robotic arm moves the movable support to the corresponding wafer deposition platform, where a deposition process is completed. Then, the robotic arm moves the movable support to another wafer deposition platform to complete another deposition process. Compared to existing technologies, this invention uses a robotic arm and movable support in conjunction to transfer the wafer, avoiding direct contact between the robotic arm and the wafer and potential damage. Furthermore, by utilizing different process chambers to perform different deposition processes on wafers on different deposition platforms, chamber contamination can be effectively avoided. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of the wafer deposition apparatus provided in an embodiment of the present invention;

[0024] Figure 2 A schematic diagram of the assembly structure of the wafer deposition apparatus and the wafer provided in this embodiment of the utility model;

[0025] Figure 3 for Figure 1 Schematic diagram of the deposition state on the mid-wafer deposition platform;

[0026] Figure 4 for Figure 1 A first-view assembly diagram of the mobile support frame and wafer deposition platform;

[0027] Figure 5 for Figure 1 A second-view assembly diagram of the mobile support and the wafer deposition platform;

[0028] Figure 6 for Figure 1 A schematic diagram of the connection structure of the robotic arm.

[0029] icon:

[0030] 100-Wafer deposition apparatus; 110-Deposition rotary platform; 130-Wafer deposition platform; 131-Placement slot; 150-Moving support; 151-Wafer protection ring; 153-Wafer crossbeam; 154-Mounting boss; 1541-Assembly hole; 155-Retaining ring; 157-Positioning hole; 159-Lifting shaft; 160-Robotic arm; 161-Lifting rotary seat; 163-Transfer arm; 200-Wafer. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0033] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0034] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0035] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but can be slightly tilted.

[0036] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] See Figures 1 to 6 This utility model provides a wafer deposition apparatus 100 that can avoid cavity contamination and prevent the robotic arm 160 from directly contacting the wafer 200, thus avoiding damage to the wafer 200 during handling.

[0038] The wafer deposition apparatus 100 provided in this embodiment includes a deposition rotary platform 110, a wafer deposition platform 130, a movable support 150, and a robotic arm 160. Multiple wafer deposition platforms 130 are disposed around the periphery of the deposition rotary platform 110 and are used to place different process chambers. The movable support 150 is detachably mounted on one of the wafer deposition platforms 130 and is used to carry the wafer 200 to be deposited. The robotic arm 160 is mounted on the deposition rotary platform 110 and is detachably connected to the movable support 150 for moving the movable support 150 between the multiple wafer deposition platforms 130.

[0039] It should be noted that during actual deposition, the wafer 200 can be placed on the movable support 150, and a robotic arm 160 moves the movable support 150 to the corresponding wafer deposition platform 130, where a deposition process is completed. Then, the robotic arm 160 moves the movable support 150 to another wafer deposition platform 130 to complete another deposition process. Compared to existing technologies, this embodiment of the invention uses a robotic arm 160 and a movable support 150 to transfer the wafer 200, avoiding direct contact between the robotic arm 160 and the wafer 200, which could cause damage. Furthermore, by utilizing different process chambers to perform different deposition processes on wafers 200 on different wafer deposition platforms 130, chamber contamination can be effectively avoided.

[0040] In some embodiments, a placement groove 131 is provided on the wafer deposition platform 130, and a movable support 150 is movably mounted in the placement groove 131 so that the surface of the wafer 200 on the movable support 150 is exposed. The placement groove 131 is used to deposit on the surface of the wafer 200. Specifically, the placement groove 131 can accommodate the movable support 150, and the wafer 200 to be deposited is mounted on the movable support 150. The placement groove 131 can position and accommodate the movable support 150. By providing the placement groove 131, displacement of the movable support 150 during the deposition process can be avoided, ensuring the deposition effect.

[0041] Furthermore, the movable support 150 includes a wafer protection ring 151 and a wafer crossbeam 153. The wafer crossbeam 153 is radially disposed within the wafer protection ring 151. The wafer protection ring 151 is adapted to the placement slot 131, and both ends of the wafer crossbeam 153 are connected to the wafer protection ring 151. The robotic arm 160 is detachably connected to the wafer crossbeam 153. The wafer crossbeam 153 is used to support the wafer 200, and the wafer protection ring 151 is used to accommodate the wafer 200. Specifically, the wafer protection ring 151 is annular, and the wafer crossbeams 153 are distributed diametrically within the wafer protection ring 151. After the wafer 200 is placed in the wafer protection ring 151, it can be supported by the wafer crossbeams 153. The robotic arm 160 can apply force to the wafer crossbeam 153 to realize the movement of the entire movable support 150, effectively avoiding direct contact between the robotic arm 160 and the wafer 200, thus preventing damage to the wafer 200.

[0042] It should be noted that there is only one wafer crossbeam 153 here, and the extension direction of the wafer crossbeam 153 is perpendicular to the extension direction of the robotic arm 160, thereby ensuring a good support and movement effect. In other preferred embodiments of this utility model, there may be multiple wafer crossbeams 153, which are distributed in a divergent manner, such as in a cross shape or a star shape. Multiple wafer crossbeams 153 can provide better support for the wafer 200.

[0043] In some embodiments, the edge of the wafer protection ring 151 is further provided with an upwardly protruding retaining ring 155, which is used to shield the sidewalls of the wafer 200 and to position the wafer 200. Specifically, the retaining ring 155 can protrude upward relative to the wafer protection ring 151, thereby achieving shielding in the direction of the sidewalls of the wafer 200 and preventing deposited particles from penetrating to the sidewalls and bottom of the wafer 200 during thin film / metal deposition.

[0044] In some embodiments, a positioning hole 157 is provided in the placement slot 131, and a lifting shaft 159 is provided in the positioning hole 157. A mounting boss 154 is provided at the bottom of the wafer crossbeam 153. The mounting boss 154 is correspondingly mounted to the lifting shaft 159 and is used to drive the moving bracket 150 to rise or fall under the drive of the lifting shaft 159. Specifically, the lifting shaft 159 can be driven by a lifting motor or lifting cylinder at the bottom. The lifting shaft 159 can apply force to the mounting boss 154, thereby driving the moving bracket 150 to rise or fall, realizing the assembly and removal of the wafer 200.

[0045] In some embodiments, the bottom end of the mounting boss 154 has a mounting hole 1541, and the lifting shaft 159 is correspondingly mounted in the mounting hole 1541 for positioning the mounting boss 154. Specifically, the size of the lifting shaft 159 is slightly smaller than the mounting hole 1541, so that the lifting shaft 159 can be aligned and mounted in the mounting hole 1541. At the same time, the size of the mounting boss 154 is slightly smaller than the size of the positioning hole 157, so that the mounting boss 154 can be correspondingly mounted in the positioning hole 157.

[0046] During actual installation, driven by the robotic arm 160, the movable bracket 150 is first aligned into the placement slot 131, so that the assembly hole 1541 at the bottom of the mounting boss 154 aligns with the lifting shaft 159 in the positioning hole 157. After the lifting shaft 159 is aligned and inserted into the assembly hole 1541, the robotic arm 160 can disconnect from the movable bracket 150 and remove it. The lifting shaft 159 descends and drives the movable bracket 150 to be assembled in the placement slot 131, realizing deposition. After deposition is completed, the lifting shaft 159 can be used again to rise and drive the movable bracket 150 to move upward. At this time, the robotic arm 160 can extend under the movable bracket 150 again and contact the bottom side of the wafer crossbeam 153, thereby supporting the movable bracket 150 again. After the lifting shaft 159 descends, the movable bracket 150 is released from the limitation of the wafer deposition platform 130, which facilitates the robotic arm 160 to transfer the movable bracket 150 and the wafer 200 to the next wafer deposition platform 130.

[0047] In some embodiments, the positioning hole 157 is located at the center of the placement groove 131, and the mounting boss is located at the middle of the wafer crossbeam 153 and protrudes downward. Specifically, the mounting boss is cylindrical and protrudes downward, thereby facilitating its corresponding assembly with the lifting shaft 159.

[0048] Furthermore, the robotic arm 160 includes a lifting rotary seat 161 and a transfer arm 163. The lifting rotary seat 161 is located at the center of the deposition rotary platform 110 and can rotate relative to the center of the deposition rotary platform 110. One end of the transfer arm 163 is connected to the lifting rotary seat 161, and the other end extends toward the wafer deposition platform 130 and is detachably connected to the movable support 150. The lifting rotary seat 161 can perform vertical lifting movements, specifically achieved by a lifting motor or lifting cylinder at its bottom. The transfer arm 163 can perform telescopic or horizontal movement functions, thereby extending into or out of the movable support 150 for convenient transfer and deposition, specifically achieved by a telescopic cylinder or telescopic motor. Of course, other types of wafer 200 transport robotic arms can also be used for the robotic arm 160; please refer to relevant descriptions in the prior art for details.

[0049] In some embodiments, the deposition rotary platform 110 is hexagonal, and six wafer deposition platforms 130 are provided around its periphery. By providing six wafer deposition platforms 130, various deposition processes can be implemented, effectively avoiding cavity contamination.

[0050] The wafer deposition apparatus 100 provided in this embodiment of the present invention operates as follows: First, a wafer 200 is placed into a movable support 150, and the movable support 150 is connected to a robotic arm 160. The robotic arm 160 carries the movable support 150 and moves it to the first wafer deposition platform 130, where the movable support 150 corresponds to the placement slot 131. The mounting hole 1541 at the bottom of the mounting boss 154 aligns with the lifting shaft 159 in the positioning hole 157. Then, the lifting shaft 159 rises, aligns with the mounting hole 1541, and the robotic arm 160 can disconnect the movable support 150 and remove it (retracting and moving it out of the placement slot 131). Then, the lifting shaft 159 descends and moves the movable support 150 into the placement slot 131 for deposition. After deposition is complete, the lifting shaft 159 can be used again to raise the moving support 150, allowing the robotic arm 160 to extend under the moving support 150 and contact the bottom of the wafer beam 153, thus providing support for the moving support 150 again. After the lifting shaft 159 descends, the moving support 150 is released from its position relative to the wafer deposition platform 130, facilitating the transfer of the moving support 150 and the wafer 200 to the next wafer deposition platform 130 by the robotic arm 160. During transfer, the deposition rotary platform 110 can rotate while the robotic arm 160 remains fixed, or the robotic arm 160 can rotate while the deposition rotary platform 110 remains fixed, enabling the moving support 150 to be transferred between different wafer deposition platforms 130.

[0051] This embodiment of the invention also provides a wafer 200 deposition apparatus, including multiple process chambers and the aforementioned wafer deposition device 100. The wafer deposition device 100 includes a deposition rotary platform 110, wafer deposition platforms 130, a moving support 150, and a robotic arm 160. Multiple wafer deposition platforms 130 are disposed around the periphery of the deposition rotary platform 110 and are used to be placed in different process chambers. The moving support 150 is detachably mounted on one of the wafer deposition platforms 130 and is used to carry the wafer 200 to be deposited. The robotic arm 160 is mounted on the deposition rotary platform 110 and is detachably connected to the moving support 150 for moving the moving support 150 between the multiple wafer deposition platforms 130. The multiple wafer deposition platforms 130 are correspondingly disposed within multiple process chambers.

[0052] In summary, this embodiment of the invention provides a wafer deposition apparatus 100 and device. Multiple wafer deposition platforms 130 are arranged around the periphery of a deposition rotary platform 110. These platforms 130 are used to place wafers into different process chambers. A movable support 150 is detachably mounted on one of the wafer deposition platforms 130 to support the wafer 200 to be deposited. A robotic arm 160 is also mounted on the deposition rotary platform 110 and detachably connected to the movable support 150, thereby moving the movable support 150. During actual deposition, the wafer 200 can be placed on the movable support 150, and the robotic arm 160 moves the movable support 150 to the corresponding wafer deposition platform 130, where a deposition process is completed. Then, the robotic arm 160 moves the movable support 150 to another wafer deposition platform 130 to complete another deposition process. Compared with the prior art, this utility model embodiment uses a robotic arm 160 and a moving support 150 to transfer the wafer 200, avoiding direct contact between the robotic arm 160 and the wafer 200 and causing damage to the wafer 200. At the same time, different process chambers are used to perform different deposition processes on the wafers 200 on different wafer deposition platforms 130, thus effectively avoiding chamber contamination.

[0053] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer deposition apparatus, characterized in that, include: Deposition rotating platform; Multiple wafer deposition platforms are arranged around the periphery of the deposition rotary platform, and the multiple wafer deposition platforms are used to place different process chambers; A movable support detachably mounted on one of the wafer deposition platforms, the movable support being used to carry the wafer to be deposited; A robotic arm is mounted on the deposition rotary platform and is detachably connected to the movable support for moving the movable support between multiple wafer deposition platforms.

2. The wafer deposition apparatus according to claim 1, characterized in that, The wafer deposition platform is provided with a placement slot, and the movable support is movably mounted in the placement slot so that the surface of the wafer on the movable support is exposed. The placement slot is used to deposit on the surface of the wafer.

3. The wafer deposition apparatus according to claim 2, characterized in that, The movable support includes a wafer protection ring and a wafer crossbeam. The wafer crossbeam is radially disposed within the wafer protection ring. The wafer protection ring is adapted to the placement slot, and both ends of the wafer crossbeam are connected to the wafer protection ring. The robotic arm is detachably connected to the wafer crossbeam. The wafer crossbeam is used to support the wafer, and the wafer protection ring is used to accommodate the wafer.

4. The wafer deposition apparatus according to claim 3, characterized in that, The edge of the wafer protection ring is also provided with an upwardly protruding retaining ring, which is used to shield the sidewall of the wafer and position the wafer.

5. The wafer deposition apparatus according to claim 3, characterized in that, The placement slot is provided with a positioning hole, and a lifting shaft is provided in the positioning hole. The bottom of the wafer beam is provided with a mounting boss, which is correspondingly assembled to the lifting shaft and is used to drive the moving support to rise or fall under the drive of the lifting shaft.

6. The wafer deposition apparatus according to claim 5, characterized in that, The mounting boss has an assembly hole at its bottom end, and the lifting shaft is correspondingly assembled in the assembly hole to position the mounting boss.

7. The wafer deposition apparatus according to claim 6, characterized in that, The positioning hole is located at the center of the placement slot, and the mounting boss is located in the middle of the wafer crossbeam and protrudes downward.

8. The wafer deposition apparatus according to claim 1, characterized in that, The robotic arm includes a lifting rotating seat and a transfer arm. The lifting rotating seat is located at the center of the deposition rotating platform and can rotate relative to the center of the deposition rotating platform. One end of the transfer arm is connected to the lifting rotating seat, and the other end extends toward the wafer deposition platform and is detachably connected to the movable support.

9. The wafer deposition apparatus according to claim 1, characterized in that, The deposition rotating platform is hexagonal, and six wafer deposition platforms are arranged around its perimeter.

10. A wafer deposition apparatus, characterized in that, It includes multiple process chambers and a wafer deposition apparatus as described in any one of claims 1-9, wherein multiple wafer deposition platforms are correspondingly disposed within the multiple process chambers.

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