Display device

Abstract

The embodiment of the utility model belongs to the display technology, and provides a display device which can comprise a backboard, a mainboard and a grounding elastic piece. The mainboard is arranged on the backboard. The grounding elastic piece is arranged on the mainboard and electrically connected with the mainboard, the grounding elastic piece is provided with a free part, and the free part is configured to be connected with the backboard so that the mainboard can be electrically connected with the backboard. The display device can solve the problem that the connection reliability of a grounding structure in the related art is low.

Description

Technical Field

[0001] This application relates to display technology, and more particularly to a display device. Background Technology

[0002] Flat panel displays, televisions, and other display devices include components such as display panels, backplane assemblies, and motherboards. The backplane of the backplane assembly serves as a support component, supporting the display panel, motherboard, and other components. The backplane is made of a conductive metal material, and the ground network on the motherboard can be connected to the backplane via mounting feet, allowing the backplane to act as a large ground plane. The backplane makes a significant contribution to EMC (electromagnetic compatibility) and ESD (electrostatic discharge) suppression.

[0003] To achieve good EMC performance and pass EMC testing, conductive foam is used between the motherboard and the backplane in related technologies. The height of the conductive foam is greater than the distance between the motherboard and the backplane, so that when the motherboard is locked to the backplane along its thickness direction, the conductive foam can be pressed tightly between the motherboard and the backplane. Ground return current enters the conductive metal backplane through the exposed copper on the motherboard and the conductive layer of the conductive foam. The connection of the conductive foam can shorten the return path of high-frequency current, reduce high-frequency radiation, and facilitate passing EMC testing.

[0004] However, when the motherboard slides into the slot on the backplate parallel to the backplate, the conductive foam is pre-attached to the bottom of the motherboard. The forces exerted on the conductive foam by the motherboard and backplate are not aligned, which can easily cause the conductive foam to twist. For example, the conductive foam may be pushed over or even detach, leading to a short circuit between the motherboard and other components on the backplate. Utility Model Content

[0005] This application provides a display device that can solve the problem of low connection reliability of grounding structures in related technologies.

[0006] In a first aspect, embodiments of this application provide a display device, which includes:

[0007] Back panel;

[0008] The motherboard is located on the back panel;

[0009] A grounding spring is disposed on the motherboard and electrically connected to the motherboard. The grounding spring has a free portion, which is configured to be connected to the backplane so that the motherboard and the backplane are electrically connected.

[0010] In this embodiment, a grounding spring is provided on the motherboard, and its free portion abuts against the backplate to achieve ground return current for the motherboard. When the motherboard slides into the slot on the backplate in a direction parallel to the backplate, or when the motherboard is locked to the backplate along its own thickness direction, the grounding spring can undergo elastic deformation. Simultaneously, the grounding spring can also apply a reaction force to the motherboard and the backplate to maintain electrical connection between the grounding spring and the backplate. Under force, the grounding spring can fit more tightly against the backplate, thereby achieving ground return current for the motherboard. The connection of the grounding spring can shorten the return path of high-frequency current, which helps reduce high-frequency radiation and meets EMC testing requirements.

[0011] In some embodiments of this application, the free portion includes a first body and a second body, wherein the second body is obliquely disposed at one end of the first body to form an abutment portion for abutting the back plate.

[0012] Since the abutment part can be used to abut the backplate, by setting the second body and the first body at an angle, a smooth abutment part can be formed, so that the smooth abutment part is less likely to scratch the backplate during the installation process of the motherboard sliding into the backplate slot.

[0013] In some embodiments of this application, the grounding spring includes a base connected to the free portion, the base being configured to be connected to the motherboard;

[0014] The grounding spring is connected to the base through the first body. The first body is inclinedly disposed on the base so that the inclination angle between the first body and the base can be variable when the grounding spring is subjected to force, and the distance between the base and the abutment portion can be adjusted.

[0015] When the grounding spring is applied between motherboards and backplanes with different pitches, the grounding spring can be subjected to the force of at least one of the motherboards and backplanes. At this time, the tilt angle between the first body and the base can be varied, so that the grounding spring can meet the application between motherboards and backplanes with different pitches, without the need to equip different specifications of grounding springs for motherboards and backplanes with different pitches, which helps to reduce materials and reduce maintenance difficulty.

[0016] In some embodiments of this application, the abutting portion abuts against the surface of the back plate facing the motherboard along the thickness direction of the back plate.

[0017] In some embodiments of this application, the free portion may be disposed on the motherboard, such that at least a portion of the free portion is located between the motherboard and the backplate.

[0018] In some embodiments of this application, along the thickness direction of the backplate, the abutting portion abuts against the surface of the backplate facing away from the motherboard.

[0019] In this embodiment, the abutting portion can also apply a force toward the motherboard to the backplate to improve the connection reliability between the motherboard and the backplate.

[0020] In some embodiments of this application, a portion of the substrate may be disposed on the back plate so that the free portion is located on the side of the back plate facing away from the motherboard.

[0021] In this embodiment, since the grounding spring is elastic, when the free part is located on the side of the back plate facing away from the motherboard, the free part can exert a force on the back plate towards the motherboard under the elastic force, so that the motherboard and the back plate can be grounded and connected through the grounding spring.

[0022] In some embodiments of this application, the grounding spring includes a connecting portion disposed on the substrate, the main board is provided with a conductive through hole into which the connecting portion can be inserted, and the grounding spring is electrically connected to the main board through the connecting portion.

[0023] The grounding spring can be inserted into the conductive via of the motherboard via its connecting part to achieve electrical connection between the grounding spring and the motherboard. Furthermore, the free part of the grounding spring can abut against the backplate, thereby enabling ground return current to the motherboard.

[0024] In some embodiments of this application, the grounding spring includes a plurality of connecting portions, which are respectively disposed on two opposite sides of the substrate.

[0025] By setting multiple connection parts, the connection area between the connection part and the motherboard can be increased, which is beneficial to improving the reliability of the electrical connection between the grounding spring and the motherboard.

[0026] In some embodiments of this application, along the thickness direction of the back plate, there is a gap between the motherboard and the back plate, and a portion of the free portion is located within the gap;

[0027] The motherboard is provided with a clearance hole, and the free part of the grounding spring can pass through the clearance hole to be located within the interval and abut against the back plate. The clearance hole allows the second body to pass through from one side of the back plate toward the motherboard.

[0028] By providing clearance holes, a second body can be avoided. At least part of the second body can be located within the clearance holes to prevent the second body from contacting the motherboard's surface facing the backplate, thus avoiding affecting the motherboard's fixation.

[0029] In some embodiments of this application, the grounding spring further includes a reinforcing portion, which is configured to connect the connecting portion and the base;

[0030] The connecting part is inserted into the conductive through hole, and the reinforcing part abuts against the surface of the motherboard facing away from the back plate.

[0031] By adding a reinforcing section, the structural strength of the connection can be improved, reducing the possibility that the deformation of the connection during the stress process of the grounding spring will affect the reliability of the electrical connection between the grounding spring and the motherboard.

[0032] In some embodiments of this application, along the thickness direction of the back plate, the main board has a first side and a second side opposite to each other, the substrate is located on one side of the first side, the first side is provided with a first conductor, the second side is provided with a second conductor, and the conductive through hole passes through the first conductor and the second conductor;

[0033] Along the thickness direction of the back plate, the orthographic projection of the second conductor is located inside the orthographic projection of the first conductor.

[0034] The reinforcing and connecting parts allow the grounding spring to be connected to the first conductor, the inner wall of the conductive through hole, and the second conductor, which helps to improve the reliability of the electrical connection between the grounding spring and the motherboard.

[0035] In some embodiments of this application, the thickness of the grounding spring is between 0.12 mm and 0.2 mm.

[0036] When the thickness of the grounding spring is too large, its overall strength increases, requiring a greater force to produce elastic deformation. This can easily increase the connection force between the motherboard and the backplane, increasing assembly difficulty. Furthermore, the grounding spring can also exert a large reverse force on the backplane and motherboard, causing deformation or even damage to the motherboard or backplane. When the thickness of the grounding spring is too small, its strength is low, and it is easily deformed under stress, thus affecting the subsequent grounding effect. Therefore, setting the thickness of the grounding spring between 0.12mm and 0.2mm solves the above technical problems.

[0037] In some embodiments of this application, the value of the first preset included angle is between 30 degrees and 100 degrees.

[0038] When the first preset angle is large, the size of the clearance hole on the motherboard also needs to be large so that it can avoid the second body when the free part undergoes large elastic deformation. However, increasing the size of the clearance hole can easily occupy a larger area of ​​the motherboard, which is not conducive to improving the space utilization of the motherboard. Therefore, the value of the first preset angle can be set to be between 30 degrees and 100 degrees.

[0039] In some embodiments of this application, the value of the second preset included angle is between 30 degrees and 60 degrees.

[0040] The angle of the second preset angle can affect the size of the grounding spring in its natural state. Setting the angle of the second preset angle between 30 degrees and 60 degrees can meet the installation spacing requirements of most motherboards and backplanes.

[0041] Secondly, embodiments of this application provide a display device, which includes a back panel, a main board, and a grounding spring. The main board is disposed on the back panel, and the grounding spring is disposed on the main board and electrically connected to the main board. The grounding spring has a free portion, which is connected to the back panel, and the grounding spring electrically connects the main board and the back panel through the free portion. Attached Figure Description

[0042] To more clearly illustrate the implementation methods in the embodiments of this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0043] Figure 1 This is a schematic diagram of a conductive foam as a ground return current method for a motherboard in an embodiment of the related technology.

[0044] Figure 2a This is a three-dimensional structural diagram of a display device according to an embodiment of this application;

[0045] Figure 2b This is an exploded view of a display device according to an embodiment of this application;

[0046] Figure 2c This is a side view of a display device according to an embodiment of this application;

[0047] Figure 2d for Figure 2a A schematic diagram of the cross-sectional structure along the MM direction;

[0048] Figure 2e for Figure 2a A schematic diagram of the cross-sectional structure along the NN direction;

[0049] Figure 3 This is a three-dimensional structural schematic diagram of a grounding spring according to an embodiment of this application;

[0050] Figure 4 This is a schematic diagram of the front view structure of a grounding spring according to an embodiment of this application;

[0051] Figure 5 This is a schematic diagram of the structure of a grounding spring connecting to a motherboard according to an embodiment of this application;

[0052] Figure 6 This is a schematic diagram of the structure of a grounding spring for ground return between the motherboard and the backplane according to another embodiment of this application;

[0053] Figure 7 This is a three-dimensional structural diagram of a grounding spring according to another embodiment of this application;

[0054] Figure 8 This is a schematic diagram of the structure of a grounding spring connecting to a motherboard according to an embodiment of this application from another perspective;

[0055] Figure 9 This is a schematic diagram of the structure of a grounding spring according to another embodiment of this application;

[0056] Figure 10 This is a schematic diagram of the unfolded structure of a grounding spring according to an embodiment of this application;

[0057] Figure 11 This is a schematic diagram of the structure of a grounding spring connecting to the motherboard according to another embodiment of this application;

[0058] Figure 12 This is a partial structural diagram of a motherboard according to an embodiment of this application;

[0059] Figure 13 This is a schematic diagram showing the mating dimensions of the connection portion of the grounding spring and the conductive through hole according to an embodiment of this application.

[0060] Explanation of reference numerals in the attached figures:

[0061] 10-Motherboard;

[0062] 20-Conductive foam;

[0063] 100 - Backplate; 100a - Card slot; 110 - Support platform;

[0064] 200 - Mainboard; 200a - Clearance hole; 200b - First side; 200c - Second side;

[0065] 210 - Conductive via; 220 - First conductor; 230 - Second conductor;

[0066] 300-Grounding spring;

[0067] 310 - Free part; 310a - Contact part; 311 - First body; 312 - Second body;

[0068] 320-matrix;

[0069] 330 - Connecting part;

[0070] 340 - Reinforced Department. Detailed Implementation

[0071] To make the objectives, implementation methods and advantages of this application clearer, the exemplary implementation methods of this application will be clearly and completely described below with reference to the accompanying drawings of the exemplary embodiments of this application. Obviously, the described exemplary embodiments are only some embodiments of this application, and not all embodiments.

[0072] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0073] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclusively include, for example, a product or device that includes a series of components is not necessarily limited to those that are explicitly listed, but may include other components that are not explicitly listed or that are inherent to such product or device.

[0074] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0075] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0076] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0077] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0078] Flat panel displays, televisions, and other display devices can be used to display images. Taking liquid crystal displays (LCDs) as an example, LCD devices mainly consist of functional modules such as a backlight module, a liquid crystal panel, and a driving circuit. The liquid crystal panel, as the display panel, does not emit light itself; it relies on the light source provided by the optical elements in the backlight module to achieve brightness display. The display principle of an LCD is to place liquid crystal between two conductive glass plates. Driven by the electric field between two electrodes, the liquid crystal molecules undergo a twisting nematic electric field effect, controlling the transmission or blocking function of the backlight, thereby displaying the image. Adding a color filter allows for the display of color images.

[0079] Display devices may also include a backplane. The backplane can be configured to support components such as the motherboard and optical elements, and also serves a heat dissipation function. Furthermore, the backplane is made of a conductive metal material, and the ground network on the motherboard can be connected to the backplane via mounting feet, allowing the backplane to act as a larger ground plane. The backplane makes a significant contribution to EMC (electromagnetic compatibility) and ESD (electrostatic discharge) suppression.

[0080] To achieve good EMC performance and pass EMC testing, conductive foam is used between the motherboard and the backplane in related technologies. The height of the conductive foam can be greater than the distance between the motherboard and the backplane, so that when the motherboard and backplane are pressed together along the thickness direction of the motherboard, the conductive foam can be pressed firmly between the motherboard and the backplane. Ground return current enters the metal conductive material backplane through the exposed copper on the motherboard and the conductive layer of the conductive foam. The connection of the conductive foam can shorten the return path of high-frequency current, reduce high-frequency radiation, and facilitate passing EMC testing.

[0081] Figure 1 This is a schematic diagram of a ground return current method using conductive foam as the main board in related technologies.

[0082] However, see Figure 1As shown, when the motherboard 10 is fixed using a screwless method, due to the absence of screws, the motherboard 10 is typically slid laterally in a direction parallel to the backplate 100. Specifically, the motherboard 10 slides laterally into a slot 100a provided on the backplate 100 in a direction parallel to the backplate 100 to be fixed. Because the conductive foam 20 is pre-attached to the bottom of the motherboard 10, the forces exerted on the conductive foam 20 by the motherboard 10 and the backplate 100 are not in the same direction, which can easily cause the conductive foam 20 to twist. For example, the uneven force on the conductive foam 20 may cause it to be pushed over or even fall off, resulting in a short circuit between the motherboard 10 and other components on the backplate 100.

[0083] Therefore, when the motherboard is fixed to the backplate 100 using a screwless method by sliding laterally into the slot 100a on the backplate 100, the grounding structure of the conductive foam 20 in related technologies is difficult to apply. If a rigid and non-deformable grounding structure is used for grounding, the rigid structure is prone to scratching the backplate 100 or the motherboard 10 during the process of sliding into the slot 100a of the backplate 100. Furthermore, the rigid grounding structure is only suitable when the distance between the motherboard 10 and the backplate 100 is fixed. When applying grounding return current to motherboards 10 and backplates 100 with different distances, it is necessary to replace the grounding structure with one of different specifications and sizes, which brings inconvenience to installation and maintenance.

[0084] Based on the aforementioned technical problems, the applicant provides a display device. See [link to relevant documentation]. Figures 2a to 2e As shown, Figure 2a This is a three-dimensional structural diagram of a display device provided in this application. Figure 2b This is an exploded view of a display device provided in this application. Figure 2c This is a side view structural diagram of a display device provided in this application. Figure 2d for Figure 2a A schematic diagram of the cross-sectional structure along the MM direction. Figure 2e for Figure 2a A cross-sectional view along the NN direction is shown. The grounding spring 300 allows the motherboard 200 to return to ground when it slides into the slot 100a on the backplate 100 in a direction parallel to the backplate 100. It should be noted that the grounding spring 300 can also be used to fix the motherboard 200 to the backplate 100 by screws along its thickness direction.

[0085] In this embodiment, the grounding spring 300 can be disposed on the motherboard 200 and electrically connected to the motherboard 200. The grounding spring 300 is elastic, and its free portion 310 can connect to the backplate 100 when subjected to force. Specifically, when the motherboard 200 slides into the slot 100a on the backplate 100 in a direction parallel to the backplate 100, or when the motherboard 200 is locked to the backplate 100 along its own thickness direction, the grounding spring 300 can undergo elastic deformation. At the same time, the grounding spring 300 can also apply a reaction force to the motherboard 200 and the backplate 100 to maintain the electrical connection between the grounding spring 300 and the backplate 100. After being subjected to force, the grounding spring 300 can fit more tightly against the backplate 100, thereby realizing the ground return current of the motherboard 200. The connection of the grounding spring 300 can shorten the return path of high-frequency current, which is beneficial to reducing high-frequency radiation and meeting EMC testing requirements.

[0086] The structure of the display device provided in this application will be further described below with reference to the accompanying drawings.

[0087] Figure 3 A three-dimensional structural diagram of a grounding spring 300 provided in this application. Figure 4 This is a schematic diagram of the main structure of a grounding spring 300 provided in this application. Figure 5 This is a schematic diagram of a grounding spring 300 connected to a motherboard 200, as provided in this application.

[0088] See Figure 2a As shown, this application provides a display device, which may include a back panel 100.

[0089] The backplate 100 can be mounted on the display panel and configured to support various components.

[0090] In some examples, the display device may include a motherboard 200. For example, a backplate 100 may be used to support the motherboard 200.

[0091] In some examples, the backplane 100 may be made of a conductive metal material so that the ground network on the motherboard 200 can be connected to the backplane 100, thereby enabling ground return of the motherboard 200.

[0092] In some examples, a support platform 110 for supporting the motherboard 200 may be provided on one side surface of the backplate 100. The support platform 110 may protrude from the surface of the backplate 100 to support the motherboard 200 at a certain height so that the motherboard 200 and the backplate 100 are not in contact, thereby preventing the components on the motherboard 200 from being electrically connected to the backplate 100 and causing a short circuit.

[0093] In some examples, the support platform 110 may be provided with a slot 100a. The motherboard 200 can slide into the slot 100a on the support platform 110 in a direction parallel to the back plate 100 to fix the motherboard 200 to the back plate 100.

[0094] In some examples, the shape of the back panel 100 may be, but is not limited to, rectangular.

[0095] In some examples, the motherboard 200 of this application embodiment may be disposed on the side of the back panel 100 facing away from the display panel.

[0096] See also some of the possible implementation methods. Figures 2a to 5 As shown, the display device in this embodiment may further include a grounding spring 300. The grounding spring 300 may be disposed on the motherboard 200 and electrically connected to the motherboard 200.

[0097] In some examples, the grounding spring 300 of this application embodiment can be located on either side of the motherboard 200. Exemplarily, at least a portion of the grounding spring 300 can be located between the motherboard 200 and the backplane 100, or at least a portion of the grounding spring 300 can be located on the side of the motherboard 200 facing away from the backplane 100, which is not limited in this embodiment.

[0098] In some examples, the grounding spring 300 and the motherboard 200 can be an integral structure, so that when the motherboard 200 is installed on the backplane 100, the grounding spring 300 can achieve electrical conductivity with the backplane 100. Here, an integral structure can mean that the grounding spring 300 is formed into a whole with the motherboard 200 by means of crimping, welding or other methods.

[0099] In other examples, the grounding spring 300 and the motherboard 200 can also be separate structures. The grounding spring 300 can be detachably connected to the motherboard 200. During the installation of the motherboard 200 on the backplate 100, the grounding spring 300 can be connected to both the motherboard 200 and the backplate 100.

[0100] See also some of the possible implementation methods. Figure 2a As shown, the grounding spring 300 in this embodiment may have a free portion 310. The free portion 310 may be configured to be connected to the backplate 100 so that the main board 200 and the backplate 100 are electrically connected.

[0101] In this embodiment, the free portion 310 can extend beyond the surface of the motherboard 200 facing the backplate 100, so that the end of the free portion 310 away from the motherboard 200 can abut against the backplate 100. Since the grounding spring 300 is elastic and can undergo elastic deformation, the height of the free portion 310 extending beyond the surface of the motherboard 200 changes when the grounding spring 300 is subjected to force. When subjected to force, the free portion 310 can fit tightly against the backplate 100, thereby achieving an electrical connection between the free portion 310 of the grounding spring 300 and the backplate 100, realizing the ground return current of the motherboard 200.

[0102] See in some examples Figure 2a and Figure 2c As shown, at least a portion of the free part 310 can be located between the motherboard 200 and the backplate 100. The distance between the motherboard 200 and the backplate 100 can be less than or equal to the size of the grounding spring 300 in its natural state. When the motherboard 200 is fixed to the backplate 100, the grounding spring 300 can be subjected to the mutual pressing force between the motherboard 200 and the backplate 100, so that the free part 310 can abut against the surface of the backplate 100 facing the motherboard 200, and the free part 310 and the backplate 100 can be tightly connected.

[0103] Figure 6 A schematic diagram of another grounding spring 300 provided in this application for grounding connection between motherboard 200 and backplane 100. Figure 7 A three-dimensional structural schematic diagram of another grounding spring 300 provided in this application.

[0104] In other examples, see Figure 6 and Figure 7 As shown, a gap for accommodating the backplate 100 can be formed between the free portion 310 and the motherboard 200. The abutting portion 310a can abut against the surface of the backplate 100 facing away from the motherboard 200. At this time, the abutting portion 310a can also apply a force toward the motherboard 200 to the backplate 100 to improve the connection reliability between the motherboard 200 and the backplate 100.

[0105] In some implementations, a portion of the substrate 320 may be inserted through the backplate 100 so that the free portion 310 is located on the side of the backplate 100 facing away from the motherboard 200.

[0106] In some examples, the grounding spring 300 is elastic. Therefore, when the free part 310 is located on the side of the back plate 100 facing away from the motherboard 200, the free part 310 can exert a force on the back plate 100 towards the motherboard 200 under the elastic force, so that the motherboard 200 and the back plate 100 can be grounded and connected through the grounding spring 300.

[0107] See also some of the possible implementation methods. Figure 4 As shown, the free portion 310 in this embodiment may include a first body 311 and a second body 312. The second body 312 may be disposed at one end of the first body 311 at an angle to form an abutment portion 310a for abutting against the back plate 100.

[0108] In this embodiment, since the abutting part 310a can be used to abut the back plate 100, the abutting part 310a with a smooth transition can be formed by the second body 312 and the first body 311 being inclined. So that during the installation process of the motherboard 200 sliding into the slot 100a of the back plate 100, the abutting part 310a with a smooth transition is less likely to scratch the back plate 100.

[0109] Specifically, during the installation process of the motherboard 200 sliding into the slot 100a of the backplate 100, the free part 310 of the grounding spring 300 is compressed. When the abutting part 310a contacts the backplate 100 and applies a reverse force to the backplate 100, the smoothly rounded abutting part 310a can easily scratch the backplate 100.

[0110] During the installation process of the motherboard 200 sliding into the slot 100a of the backplate 100, the abutting part 310a can slide on the surface of the backplate 100 facing the motherboard 200 and apply an abutting force to the backplate 100. The smooth surface of the abutting part 310a can reduce the resistance of the abutting part 310a sliding on the backplate 100.

[0111] Furthermore, the connection between the first body 311 and the second body 312 to form a first preset included angle m can also help improve the structural strength of the free part 310, reduce the possibility that the grounding spring 300 will deform under long-term stress and fail to return to its original position, thereby affecting the reuse of the grounding spring 300.

[0112] It should be noted that the tilting of the first body 311 and the second body 312 can mean that there is a first preset angle m between the first body 311 and the second body 312.

[0113] In some examples, the first body 311 and the second body 312 may be plate-like structures. The shapes of the first body 311 and the second body 312 are not limited in this application.

[0114] See also some of the possible implementation methods. Figures 3 to 5 As shown, the grounding spring 300 in this embodiment may include a base 320 connected to the free portion 310. The base 320 may be configured to be connected to the mainboard 200.

[0115] In this embodiment, the grounding spring 300 can be connected to the motherboard 200 via the base 320. The base 320 can be fixed to the motherboard 200 to improve the connection reliability between the grounding spring 300 and the motherboard 200.

[0116] The substrate 320 can be disposed on the side of the motherboard 200 facing the backplate 100, or the substrate 320 can be disposed on the surface of the motherboard 200 facing away from the backplate 100, which is not limited in this embodiment.

[0117] See also some of the possible implementation methods. Figure 4 As shown, the grounding spring 300 can be connected to the base 320 via the first body 311. The first body 311 can be tilted on the base 320 so that when the grounding spring 300 is subjected to force, the tilt angle between the first body 311 and the base 320 is variable, and the distance between the base 320 and the abutment portion 310a is adjustable.

[0118] In this embodiment, when the grounding spring 300 is applied between the motherboard 200 and the backplane 100 with different spacings, the grounding spring 300 can be subjected to the force of at least one of the motherboard 200 and the backplane 100. At this time, the tilt angle between the first body 311 and the base 320 is variable, so that the grounding spring 300 can meet the application requirements between the motherboard 200 and the backplane 100 with different spacings, without the need to equip different specifications of grounding springs 300 for motherboards 200 and backplanes 100 with different spacings, which helps to reduce materials and reduce maintenance difficulty.

[0119] In some examples, the tilting arrangement between the first body 311 and the base 320 can refer to the formation of a second preset angle n between them. The angle n can be the natural size of the grounding spring 300. Therefore, by setting the angle n, the grounding spring 300 can be adapted to application scenarios with different intervals between the motherboard 200 and the backplane 100, which facilitates the versatility of the grounding spring 300 and helps reduce costs.

[0120] In some examples, the substrate 320 can also be a plate-like structure.

[0121] In some examples, the angle n of the second preset angle between the first body 311 and the base 320 can be an acute angle or an obtuse angle. The angle m of the first preset angle between the second body 312 and the first body 311 can be an acute angle or an obtuse angle, and is not limited in this embodiment.

[0122] Specifically, see Figure 2c and Figure 4As shown, during the installation of the motherboard 200 and the backplate 100, the grounding spring 300 can undergo elastic deformation after being subjected to force. The free part 310 can deflect relative to the connection between the free part 310 and the base 320. The abutting part 310a can gradually move closer to the base 320. When the angle m of the first preset included angle between the second body 312 and the first body 311 is an obtuse angle, there can be a large distance between the end of the second body 312 away from the first body 311 and the base 320. This provides a margin of movement for the elastic deformation of the grounding spring 300 when it is compressed, and prevents the end of the second body 312 away from the first body 311 from contacting the surface of the motherboard 200 facing the backplate 100, which would prevent the grounding spring 300 from being compressed further and affect the installation of the motherboard 200 and the backplate 100.

[0123] When the angle m between the second body 312 and the first body 311 is an acute angle, the second body 312 is closer to the first body 311. Along the thickness direction of the back plate 100, the orthographic projection of the second body 312 can occupy a small space on the horizontal plane. Therefore, when the grounding spring 300 is subjected to force and passes through the surface of the motherboard 200 facing away from the back plate 100, the size of the hole opened on the motherboard 200 can be set to be small enough to allow the second body 312 to pass through, which helps to reduce the possibility that the hole size on the motherboard 200 is large and occupies the layout space of the motherboard 200.

[0124] See also some of the possible implementation methods. Figures 3 to 5 As shown, the grounding spring 300 may include a connecting portion 330. The connecting portion 330 may be disposed on the base 320. The main board 200 may be provided with a conductive through hole 210 into which the connecting portion 330 can be inserted. The grounding spring 300 can be electrically connected to the main board 200 through the connecting portion 330.

[0125] In this embodiment, the grounding spring 300 can be inserted into the conductive through-hole 210 of the motherboard 200 via the connecting portion 330 to achieve an electrical connection between the grounding spring 300 and the motherboard 200. Furthermore, the free portion 310 of the grounding spring 300 can abut against the backplate 100, thereby enabling ground return current of the motherboard 200 through the grounding spring 300.

[0126] In some examples, the connecting portion 330 may also be a plate-like structure. The inner wall of the conductive via 210 may be made of a metallic conductive material. The plate-like connecting portion 330 and the conductive via 210 may have a large contact area, so that the connecting portion 330 and the inner wall of the conductive via 210 are electrically connected.

[0127] See also some of the possible implementation methods. Figure 3 and Figure 5As shown, the grounding spring 300 of this embodiment may include a plurality of connecting portions 330. The plurality of connecting portions 330 may be respectively disposed on two opposite sides of the base 320.

[0128] In this embodiment, by providing multiple connecting parts 330, the connection area between the connecting parts 330 and the motherboard 200 can be increased, which is beneficial to improving the reliability of the electrical connection between the grounding spring 300 and the motherboard 200.

[0129] In some examples, the substrate 320 may include two sets of opposing sides. One of the opposing sides in one set may be used to connect to the first plate. Two connecting portions 330 may be provided on each of the other opposing sides. Correspondingly, the main board 200 may have four conductive vias 210.

[0130] In some examples, a stress chamfer may be provided at the connection between the base 320 and the first body 311 of the free part 310 to reduce the possibility of stress concentration at the connection between the base 320 and the free part 310 when the free part 310 undergoes elastic compression.

[0131] Figure 8 This is a three-dimensional structural diagram of a grounding spring 300 connected to a motherboard 200, provided in an embodiment of this application.

[0132] See also some of the possible implementation methods. Figure 2c and Figure 8 As shown, there may be a gap between the main board 200 and the back plate 100 along the thickness direction of the back plate 100. A portion of the free part 310 may be located within the gap.

[0133] The motherboard 200 may be provided with a clearance hole 200a. The free part 310 of the grounding spring 300 may pass through the clearance hole 200a to be located within the gap and abut against the back plate 100. The clearance hole 200a allows the second body 312 to pass through from one side of the back plate 100 toward the motherboard 200.

[0134] In this embodiment, the base 320 and a portion of the free portion 310 can be located on opposite sides of the motherboard 200. The base 320 can be connected to the motherboard 200. The free portion 310 can be connected to the backplate 100. When the gap between the motherboard 200 and the backplate 100 is small, the free portion 310 is elastically compressed by the forces exerted by the motherboard 200 and the backplate 100, causing the second body 312 to move toward the motherboard 200. Therefore, the clearance hole 200a in this embodiment can be used to avoid the second body 312. At least a portion of the second body 312 can be located within the clearance hole 200a to prevent the second body 312 from contacting the surface of the motherboard 200 facing the backplate 100, thus avoiding affecting the fixation of the motherboard 200.

[0135] Specifically, during the installation process of the motherboard 200 fixed to the backplate 100, the free portion 310 of the grounding spring 300 can undergo compressive deformation under the force of the motherboard 200 and the backplate 100. When the compressive deformation is large, the second body 312 may come into contact with the motherboard 200. At this time, a triangular support structure can be formed between the first body 311, the second body 312, and the motherboard 200, and the free portion 310 cannot continue to compress. However, at this time, the gap between the motherboard 200 and the backplate 100 does not meet the installation conditions of the motherboard 200 and the backplate 100. Therefore, by providing a clearance hole 200a, the second body 312 of the free portion 310 can pass through the clearance hole 200a. The free portion 310 can continue to compress and deform, so that the ground return current of the motherboard 200 can be realized while meeting the installation gap between the motherboard 200 and the backplate 100.

[0136] In some examples, the conductive via 210 can be located on both sides of the clearance hole 200a. When the connecting part 330 is electrically connected to the conductive via 210, the substrate 320 can partially cover the clearance hole 200a.

[0137] See also some of the possible implementation methods. Figure 5 As shown, the grounding spring 300 may further include a reinforcing portion 340. The reinforcing portion 340 may be configured to connect the base 320 and the connecting portion 330. The connecting portion 330 may be inserted into the conductive through hole 210. The reinforcing portion 340 may abut against the surface of the motherboard 200 facing away from the backplate 100.

[0138] In this embodiment, the reinforcement 340 can be used to improve the structural strength of the connection 330 and reduce the possibility that the connection 330 will deform during the stress process of the grounding spring 300, thereby affecting the reliability of the electrical connection between the grounding spring 300 and the motherboard 200.

[0139] In some examples, the width of the reinforcing part 340 may be greater than the width of the connecting part 330.

[0140] Figure 9 This is a schematic diagram of another grounding spring 300 provided in the embodiments of this application. Figure 10 This is a schematic diagram of the unfolded structure of a grounding spring 300 provided in an embodiment of this application.

[0141] See in some examples Figure 4 As shown, the connecting part 330 can be centrally located in the middle of the connecting part 330, or, see... Figure 9 As shown, the connecting part 330 may also be provided on the side close to the connecting part 330, which is not limited in this embodiment.

[0142] In some examples, the reinforcing part 340 may be a plate-like structure. The base 320, the first body 311, the second body 312, the reinforcing part 340, and the connecting part 330 may form an integral grounding spring 300. For example, see Figure 10 As shown, the grounding spring 300 can be formed by bending sheet metal.

[0143] Figure 11 This is a schematic diagram of the structure of a grounding spring 300 connected to a motherboard 200 from another perspective, as provided in an embodiment of this application. Figure 12 This is a partial structural diagram of a motherboard 200 provided in an embodiment of this application.

[0144] See also some of the possible implementation methods. Figure 11 and Figure 12 As shown, along the thickness direction of the backplate 100, the main board 200 has a first surface 200b and a second surface 200c facing each other. The substrate 320 can be located on one side of the first surface 200b. A first conductor 220 can be provided on the first surface 200b. A second conductor 230 can be provided on the second surface 200c. A conductive via 210 can pass through the first conductor 220 and the second conductor 230.

[0145] In this embodiment, when the connecting portion 330 of the grounding spring 300 is inserted into the conductive through hole 210, the reinforcing portion 340 can abut against the first conductor 220, so that the reinforcing portion 340 and the first conductor 220 can also be electrically connected. The connecting portion 330 can pass through the conductive through hole 210, so that the end of the connecting portion 330 can protrude from the second surface 200c. At this time, the connecting portion 330 can also be electrically connected to the second conductor 230. Therefore, through the reinforcing portion 340 and the connecting portion 330, the grounding spring 300 can be connected to the first conductor 220, the inner wall of the conductive through hole 210, and the second conductor 230, which is beneficial to improving the reliability of the electrical connection between the grounding spring 300 and the main board 200.

[0146] See also some of the possible implementation methods. Figure 12 As shown, along the thickness direction of the back plate 100, the orthographic projection of the second conductor 230 can be located inside the orthographic projection of the first conductor 220.

[0147] In this embodiment, the connecting portion 330 of the grounding spring 300 can be electrically connected to the conductive through-hole 210 by welding. During welding, conductive welding material can enter the conductive through-hole 210. The conductive welding material can flow along the inner wall of the conductive through-hole 210 to the second conductor 230. By setting the area of ​​the second conductor 230 to be smaller than the area of ​​the first conductor 220, the possibility that the continuous flow of conductive welding material towards the second conductor 230 will result in less conductive welding material at the first conductor 220, making it difficult to meet the IPC welding standard can be reduced.

[0148] Specifically, the conductive solder can be tin. The reinforcing part 340 can abut against the surface of the first conductor 220. After soldering, the solder can reach upwards to cover the surface of the reinforcing part 340 to achieve a better soldering effect, thereby increasing the tensile strength of the grounding spring 300. It also prevents non-ground network traces from accidentally entering the connection part 330 and causing a short circuit during routing design. Therefore, setting the area of ​​the lower second conductor 230 to a smaller size can avoid the possibility that the second conductor 230 will steal solder during the soldering process, resulting in insufficient solder on the reinforcing part 340 and making it difficult to meet IPC soldering standards.

[0149] In some examples, the solder height of the reinforcement 340 may be greater than or equal to 75% of the length of the conductive via 210.

[0150] In some feasible ways, the thickness of the grounding spring 300 can range from 0.12 mm to 0.2 mm.

[0151] When the thickness of the grounding spring 300 is large, its overall strength increases. Therefore, the grounding spring 300 requires a larger force to undergo elastic deformation, which can easily increase the connection force between the motherboard 200 and the backplate 100, increasing assembly difficulty. Furthermore, correspondingly, the grounding spring 300 can also exert a large reverse force on the backplate 100 and the motherboard 200, causing deformation or even damage to either the motherboard 200 or the backplate 100.

[0152] When the thickness of the grounding spring 300 is small, the strength of the grounding spring 300 is low, and it is easy to deform under stress, which will affect the subsequent grounding effect.

[0153] In summary, the above-mentioned technical problems can be solved by setting the thickness of the grounding spring 300 to between 0.12 mm and 0.2 mm. For example, the thickness of the grounding spring 300 in the embodiments of this application may be, but is not limited to, 0.15 mm, 0.16 mm, and 0.18 mm.

[0154] See also some of the possible implementation methods. Figure 4 As shown, the value of the first preset included angle m can be between 30 degrees and 100 degrees.

[0155] Since a large first preset angle m necessitates a larger size for the clearance hole 200a on the motherboard 200, it is necessary to ensure that the clearance hole 200a can accommodate the second body 312 when the free part 310 undergoes significant elastic deformation. However, increasing the size of the clearance hole 200a can occupy a larger area of ​​the motherboard 200, hindering the improvement of the motherboard 200's space utilization. Therefore, the first preset angle m can be set to a range between 30 degrees and 100 degrees.

[0156] In some examples, the first preset included angle m can be, but is not limited to, 45 degrees, 55 degrees, or 70 degrees.

[0157] See also some of the possible implementation methods. Figure 4 As shown, the value of the second preset included angle n ranges from 30 degrees to 60 degrees.

[0158] The angle of the second preset included angle n can affect the size of the grounding spring 300 in its natural state. Setting the angle of the second preset included angle n between 30 degrees and 60 degrees can meet the usage requirements of most installation intervals between the motherboard 200 and the backplate 100.

[0159] In some examples, the second preset included angle n can be, but is not limited to, 40 degrees, 45 degrees, or 55 degrees.

[0160] In some examples, when the thickness of the grounding spring 300 is 1.5 mm and the second preset included angle n is 55 degrees, the height of the grounding spring 300 in its natural state is provided to be 8.3 mm. The range of elastic deformation that the grounding spring 300 can produce can be 1.7 mm to 7.6 mm.

[0161] In some examples, the installation direction of the grounding spring 300 can be set according to the direction in which the motherboard 200 slides into the slot 100a of the backplate 100 in a direction parallel to the backplate 100.

[0162] For example, refer to Figure 2c As shown, the motherboard 200 slides from right to left into the slot 100a. At this time, the direction of the compression deformation of the free part 310 can be counterclockwise relative to the connection point with the base 320.

[0163] Figure 13 This is a schematic diagram showing the mating dimensions of the connecting portion 330 and the conductive through hole 210 of a grounding spring 300 provided in an embodiment of this application.

[0164] In some feasible implementations, the size of the conductive via 210 can be calculated based on the size of the connecting portion 330. When the size of the conductive via 210 is large, the gap between the inner wall of the conductive via 210 and the connecting portion 330 is large, resulting in lower connection reliability between the connecting portion 330 and the conductive via 210, and the connecting portion 330 is prone to shifting or collapsing. Furthermore, a large size of the conductive via 210 can also easily lead to insufficient solder filling during the soldering process between the connecting portion 330 and the conductive via 210. When the size of the conductive via 210 is small, it can easily lead to the connecting portion 330 being inserted too tightly into the conductive via 210. Therefore, this application provides a conductive via 210 that can ensure the connection reliability between the connecting portion 330 and the conductive via 210.

[0165] See in some examples Figure 13 As shown, when the cross-sectional shape of the connecting portion 330 is rectangular, the conductive through hole 210 can be an oval hole. Specifically, the thickness of the connecting portion 330 is 'a', and the width of the connecting portion 330 is 'b'. The opening size of the conductive through hole 210 can be length c × width d. Where, c = 1.414a + 0.3 mm, and d = b - a + c.

[0166] Therefore, with the thickness of the connecting part 330 being a = 0.15 mm and the width being 1.6 mm, the following data was obtained through calculation:

[0167] c=1.414a+0.3mm=1.414×0.15mm+0.3mm=0.5121mm≈0.5mm;

[0168] d=b-a+c=1.6mm-0.15mm+0.5121mm=1.9621mm≈1.95mm.

[0169] Therefore, the through hole can be an oval hole with a length of 1.95 mm and a width of 0.5 mm.

[0170] At this point, the difference between the length and width dimensions of the through hole and the length and width dimensions of the connecting part 330 can satisfy the amount of welding material filling and can meet the processing conditions of a general-purpose drill bit (in 0.05mm steps).

[0171] In some examples, when the width of the base 320 is 4.5 mm, the width of the clearance hole 200a can be 6 mm. For example, the length × width of the clearance hole 200a can be 11.5 mm × 6 mm.

[0172] In some examples, the first conductor 220 can be in the form of a ring. The inner contour dimensions of the first conductor 220 can be the same as the dimensions of the conductive via 210. The outer contour dimensions of the first conductor 220 can be 3.2 mm × 1 mm.

[0173] In some examples, the second conductor 230 can be in the form of a ring. The inner contour dimensions of the second conductor 230 can be the same as the dimensions of the conductive via 210. The outer contour dimensions of the first conductor 220 can be 2.35 mm × 0.9 mm.

[0174] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0175] For ease of explanation, the above description has been provided in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Various modifications and variations can be obtained based on the above teachings. The selection and description of the above embodiments are for the purpose of better explaining the principles and practical applications, thereby enabling those skilled in the art to better utilize the described embodiments and various different variations of embodiments suitable for specific use considerations.

Claims

1. A display device, characterized in that, The display device includes: Back panel; The motherboard is located on the back panel; A grounding spring is disposed on the motherboard and electrically connected to the motherboard. The grounding spring has a free portion, which is configured to be connected to the backplate so that the motherboard and the backplate are electrically connected. The free part includes a first body and a second body. The second body is inclinedly disposed at one end of the first body and connected to the first body. The connection between the first body and the second body forms an abutment portion for abutting the back plate. The abutment portion has a smooth transition. Along the thickness direction of the back plate, there is a gap between the main board and the back plate, and a portion of the free portion is located within the gap; The motherboard is provided with a clearance hole, and the free part of the grounding spring can pass through the clearance hole to be located within the interval and abut against the back plate. The clearance hole allows the second body to pass through from one side of the back plate toward the motherboard.

2. The display device according to claim 1, characterized in that, The grounding spring includes a base connected to the free portion, and the base is configured to be connected to the main board; The grounding spring is connected to the base through the first body. The first body is inclinedly disposed on the base so that the inclination angle between the first body and the base can be variable when the grounding spring is subjected to force, and the distance between the base and the abutment portion can be adjusted.

3. The display device according to claim 2, characterized in that, Along the thickness direction of the back plate, the abutting portion abuts against the surface of the back plate facing the motherboard.

4. The display device according to claim 3, characterized in that, The free portion may be disposed on the motherboard such that at least a portion of the free portion is located between the motherboard and the backplate.

5. The display device according to claim 2, characterized in that, Along the thickness direction of the back plate, the abutting portion abuts against the surface of the back plate facing away from the motherboard.

6. The display device according to claim 5, characterized in that, A portion of the substrate may be inserted into the back plate so that the free portion is located on the side of the back plate facing away from the motherboard.

7. The display device according to claim 2, characterized in that, The grounding spring includes a connecting portion disposed on the base. The main board has a conductive through hole into which the connecting portion can be inserted. The grounding spring is electrically connected to the main board through the connecting portion.

8. The display device according to claim 7, characterized in that, The grounding spring includes a plurality of connecting parts, which are respectively disposed on two opposite sides of the base.

9. The display device according to claim 7, characterized in that, The grounding spring also includes a reinforcing portion, which is configured to connect the connecting portion and the base. The connecting part is inserted into the conductive through hole, and the reinforcing part abuts against the surface of the motherboard facing away from the back plate.

10. The display device according to claim 7, characterized in that, Along the thickness direction of the back plate, the motherboard has a first side and a second side opposite to each other, the substrate is located on one side of the first side, the first side is provided with a first conductor, the second side is provided with a second conductor, and the conductive through hole passes through the first conductor and the second conductor; Along the thickness direction of the back plate, the orthographic projection of the second conductor is located inside the orthographic projection of the first conductor.

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