High-precision embedded BMC mainboard

Abstract

The utility model relates to the field of server management and monitoring hardware, in particular to a high-precision embedded BMC (baseboard management controller) mainboard. The utility model provides a high-precision embedded BMC mainboard, which comprises a BMC daughter card, a CPU, a mounting rack, threaded rods and the like, the CPU is mounted on the BMC daughter card, the upper side of the CPU is in threaded connection with a plurality of threaded rods, and the mounting rack is slidably connected among the plurality of threaded rods. Through the design of the copper-based cooling fins, heat generated by the CPU during operation can be efficiently conducted to the copper-based cooling fins, the heat from the CPU can be rapidly absorbed and uniformly dispersed, the problem of local overheating is effectively avoided, in addition, operation of the fan in the host and the copper-based cooling fins supplement each other, the fan rotates to blow air to the copper-based cooling fins, and the heat dissipation efficiency is improved. The speed of dissipating heat from the surface of the copper-based cooling fin to the surrounding environment is further accelerated, and the synergistic effect not only ensures that the CPU can stably operate within a safe working temperature range, but also greatly prolongs the service life of the CPU and other key hardware.

Description

Technical Field

[0001] This utility model relates to the field of server management and monitoring hardware, and in particular to a high-precision embedded BMC motherboard. Background Technology

[0002] High-precision embedded BMC motherboards are management controllers used in servers or high-end computing platforms, integrating high-performance hardware monitoring and management systems. As an independent subsystem on the server motherboard, the BMC greatly enhances system reliability and maintainability by providing detailed hardware status monitoring, remote management, and fault diagnosis capabilities.

[0003] In current embedded BMC motherboard applications, with the continuous improvement of CPU performance, the heat generated during its operation is also increasing. This phenomenon has become a significant challenge in design and use. High-density integration and high-performance requirements cause the CPU on the motherboard to release a large amount of heat energy during operation. If this heat cannot be effectively dissipated, it will cause the temperature of the CPU and its surrounding components to rise, which may trigger overheat protection mechanisms, such as frequency reduction or shutdown, to avoid hardware damage. This situation not only affects the stability and reliability of the system, but may also shorten the lifespan of related hardware.

[0004] To address the above issues, a high-precision embedded BMC motherboard capable of timely cooling of the CPU needs to be designed. Utility Model Content

[0005] To overcome the drawback that if this heat cannot be effectively dissipated, the temperature of the CPU and its surrounding components will rise, which may trigger overheat protection mechanisms such as frequency reduction or shutdown, this utility model provides a high-precision embedded BMC motherboard.

[0006] The technical solution of this utility model is as follows: a high-precision embedded BMC motherboard, including a BMC daughter card, a CPU, a mounting bracket, threaded rods, a copper-based heat sink and a heat dissipation frame. The CPU is mounted on the BMC daughter card. Multiple threaded rods are threadedly connected to the upper side of the CPU. The mounting bracket is slidably connected between the multiple threaded rods. A copper-based heat sink is installed inside the mounting bracket. A heat dissipation frame is connected to the lower side of the mounting bracket.

[0007] As an improvement to the above solution, it also includes support frames, mounting rods, locking blocks, and elastic elements. Support frames are symmetrically connected to the left and right sides of the BMC sub-card, mounting rods are inserted symmetrically on the left and right sides of the lower side of the BMC sub-card, locking blocks are slidably connected to the left and right sides of each support frame, each pair of locking blocks contacts and cooperates with the corresponding mounting rod, and an elastic element is connected between each locking block and the corresponding support frame.

[0008] As an improvement to the above solution, a first soft pad is also included, with a first soft pad placed on each mounting rod, and each first soft pad located on the upper surface of the BMC sub-card.

[0009] As an improvement to the above solution, the BMC daughter card has multiple preset mounting holes.

[0010] As an improvement to the above solution, filters are installed around the heat dissipation frame.

[0011] As an improvement to the above solution, a second soft pad is also included, with a second soft pad placed on each mounting rod, and each second soft pad located on the lower surface of the BMC sub-card.

[0012] The beneficial effects of this invention are as follows: Through the design of the copper-based heat sink, the heat generated by the CPU during operation can be efficiently conducted to the copper-based heat sink, which quickly absorbs and evenly distributes the heat from the CPU, effectively avoiding the problem of local overheating. In addition, the operation of the fan inside the host complements the copper-based heat sink. The fan rotation blows air toward the copper-based heat sink, further accelerating the speed at which heat is dissipated from the surface of the copper-based heat sink to the surrounding environment. This synergistic effect not only ensures that the CPU can operate stably within a safe operating temperature range, but also greatly extends the service life of the CPU and other key hardware. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2 This is a three-dimensional structural diagram of the BMC daughter card and CPU of this utility model.

[0015] Figure 3 This is a three-dimensional structural diagram of the mounting bracket, threaded rod, and copper-based heat sink of this utility model.

[0016] Figure 4 This is a cross-sectional view of the mounting bracket of this utility model.

[0017] Figure 5 This is a three-dimensional structural diagram of the support frame, mounting rod, and locking block of this utility model.

[0018] Figure 6 This is a cross-sectional view of the support frame of this utility model.

[0019] Figure 7 This is a three-dimensional structural diagram of the card block, the first soft pad, and the second soft pad of this utility model.

[0020] The labels in the diagram are as follows: 1-BMC daughter card, 101-CPU, 2-mounting bracket, 3-threaded rod, 4-copper-based heat sink, 5-heat sink frame, 6-support bracket, 7-mounting rod, 8-block, 81-elastic element, 9-first soft pad, 10-second soft pad. Detailed Implementation

[0021] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0022] Example: A high-precision embedded BMC motherboard, such as Figures 1-7 As shown, the system includes a BMC daughter card 1, a CPU 101, a mounting bracket 2, threaded rods 3, a copper-based heatsink 4, a heatsink frame 5, a support bracket 6, a mounting rod 7, a locking block 8, an elastic element 81, a first soft pad 9, and a second soft pad 10. The BMC daughter card 1 has multiple pre-set mounting holes. The CPU 101 is mounted on the BMC daughter card 1. Multiple threaded rods 3 are threadedly connected to the upper side of the CPU 101. The mounting bracket 2 is slidably connected between the multiple threaded rods 3. A copper-based heatsink 4 is installed inside the mounting bracket 2. The copper-based heatsink 4 can quickly absorb and dissipate the heat generated by the CPU 101, ensuring its operating temperature remains within a safe range. A heatsink frame 5 is connected to the lower side of the mounting bracket 2. Filter screens are installed around the heatsink frame 5. The filter screen prevents dust from entering. Support frames 6 are symmetrically connected to the left and right sides of the BMC sub-card 1. Mounting rods 7 are symmetrically inserted on the left and right sides of the lower side of the BMC sub-card 1. Each support frame 6 is slidably connected to a locking block 8 on the left and right sides. Every two locking blocks 8 contact and cooperate with the corresponding mounting rods 7. The two locking blocks 8 can fix the mounting rods 7. An elastic element 81 is connected between each locking block 8 and the corresponding support frame 6. A first soft pad 9 is placed on each mounting rod 7. Each first soft pad 9 is located on the upper surface of the BMC sub-card 1. The first soft pad 9 plays a buffering role and reduces the impact of vibration on the components. A second soft pad 10 is placed on each mounting rod 7. Each second soft pad 10 is located on the lower surface of the BMC sub-card 1.

[0023] During installation, firstly, the required CPU101 and other electronic components are installed on the BMC daughter card 1, ensuring that all components are correctly installed in their designated positions and that electrical connections are secure. Next, the mounting bracket 2 is placed above the installed CPU101. Then, multiple threaded rods 3 are placed at the corresponding positions on the four ends of the mounting bracket 2, and the multiple threaded rods 3 are rotated until they reach the appropriate positions. Rotation is then stopped, and the positions are maintained to secure the mounting bracket 2. Subsequently, the assembled BMC daughter card 1 is carefully inserted into the corresponding slot on the server motherboard, ensuring a gentle and stable insertion process to avoid damaging the pins. Then, multiple mounting rods 7 are sequentially passed through the slots and corresponding mounting holes on the motherboard. During this process, the multiple mounting rods 7 apply pressure to the corresponding two locking blocks 8, compressing multiple elastic elements 81. Multiple mounting rods 7 are further advanced until they are completely positioned between their corresponding two latches 8. At this point, the counterforce provided by multiple elastic elements 81 helps to lock the mounting rods 7 in place, completing the fixation. Next, the server motherboard is carefully placed into the chassis and secured to the chassis with screws, ensuring that all I / O ports on the motherboard are correctly aligned with the openings at the rear of the chassis for subsequent connection of external devices. During the operation of the CPU 101, a large amount of heat is generated. To ensure that the CPU 101 operates within a safe operating temperature range, the copper-based heatsink 4 can quickly conduct the heat generated by the CPU 101 to itself. At the same time, the fan inside the host starts, and the fan rotates to blow air toward the copper-based heatsink 4, thereby accelerating the dissipation of heat from the copper-based heatsink 4 into the surrounding air, achieving an efficient heat dissipation effect and ensuring that the CPU 101 can continue to operate efficiently under suitable temperature conditions.

[0024] Although this disclosure has been shown and described with reference to specific exemplary embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made to this disclosure without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents. Therefore, the scope of this disclosure should not be limited to the above embodiments, but should be defined not only by the appended claims, but also by their equivalents.

Claims

1. A high-precision embedded BMC motherboard, characterized in that it includes: The device includes a BMC daughter card (1), a CPU (101), a mounting bracket (2), threaded rods (3), a copper-based heat sink (4), and a heat sink frame (5). The CPU (101) is mounted on the BMC daughter card (1). Multiple threaded rods (3) are threadedly connected to the upper side of the CPU (101). The mounting bracket (2) is slidably connected between the multiple threaded rods (3). The copper-based heat sink (4) is installed inside the mounting bracket (2). The heat sink frame (5) is fixedly connected to the lower side of the mounting bracket (2).

2. The high-precision embedded BMC motherboard as described in claim 1, characterized in that, It also includes a support frame (6), a mounting rod (7), a locking block (8) and an elastic element (81). The support frame (6) is fixedly connected to the left and right sides of the BMC sub-card (1). The mounting rod (7) is inserted into the left and right sides of the lower side of the BMC sub-card (1). The locking block (8) is slidably connected to the left and right sides of each support frame (6). Every two locking blocks (8) are in contact with the corresponding mounting rod (7). An elastic element (81) is provided between each locking block (8) and the corresponding support frame (6).

3. A high-precision embedded BMC motherboard as described in claim 2, characterized in that, It also includes a first pad (9), with a first pad (9) placed on each mounting rod (7), and each first pad (9) located on the upper surface of the BMC sub-card (1).

4. A high-precision embedded BMC motherboard as described in claim 3, characterized in that, The BMC sub-card (1) has multiple preset mounting holes.

5. A high-precision embedded BMC motherboard as described in claim 4, characterized in that, The heat dissipation frame (5) is equipped with a filter screen on all four sides.

6. A high-precision embedded BMC motherboard as described in claim 5, characterized in that, It also includes a second pad (10), with a second pad (10) placed on each mounting rod (7), and each second pad (10) located on the lower surface of the BMC sub-card (1).

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