Timbre card

Abstract

The utility model discloses a timbre card, which comprises a connecting end, a microcontroller and a memory chip, and is characterized in that the connecting end comprises a serial bus interface pin and an audio bus interface pin; the microcontroller is connected with the serial bus interface pin and the audio bus interface pin of the connecting end, and is connected with external equipment through the connecting end; and the storage chip is connected with the microcontroller and is used for storing sound source data. According to the timbre card provided by the invention, the serial bus interface pin and the audio bus interface pin are arranged, and the writing and reading of the sound source data are processed through different interfaces, so that the transmission efficiency is improved, and the scene requirement of low time delay of audio transmission is met.

Description

Technical Field

[0001] This application relates to the field of audio equipment technology, and more specifically, to a sound card. Background Technology

[0002] A tone card is a device or software plugin used to adjust and change the tone effect of an instrument or sound. Currently, the sound source data of the relevant tone is usually written to the commonly used Micro SD card. However, Micro SD, as a conventional storage medium, cannot meet the requirements of low latency audio transmission. Utility Model Content

[0003] This application provides a sound card to solve at least one of the aforementioned technical problems.

[0004] The timbre card of this application includes:

[0005] The connection ends include serial bus interface pins and audio bus interface pins;

[0006] A microcontroller, wherein the microcontroller is connected to the serial bus interface pins and audio bus interface pins of the connection terminal, and is connected to an external device through the connection terminal;

[0007] A storage chip, which is connected to the microcontroller, is used to store audio source data.

[0008] The sound card provided in this application, by setting serial bus interface pins and audio bus interface pins, separates the writing and reading of sound source data into different interface processes, thereby improving transmission efficiency and meeting the requirements of low latency scenarios for audio transmission.

[0009] In some embodiments, the serial bus interface pin is an SPI pin, the audio bus interface pin is an I2S pin, and the SPI pin and the I2S pin are connected to the microcontroller.

[0010] Thus, connecting to the microcontroller using SPI and I2S pins facilitates high-speed synchronous communication and the transmission of high-quality audio data.

[0011] In some embodiments, the number of SPI pins is 4 or 8, and the number of I2S pins is 5, with the 4 SPI pins and 5 I2S pins respectively centrally located.

[0012] In this way, placing similar pins close together makes pin identification easier.

[0013] In some embodiments, the connection terminal further includes a power supply pin, which is located on the side of the serial bus interface pin away from the audio bus interface pin, and the power supply pin is connected to the microcontroller and the memory chip respectively.

[0014] Thus, the power supply pins are used to connect to an external power source, thereby powering the microcontroller and memory chips.

[0015] In some embodiments, the sound card further includes a power chip, with power pins connected to the power chip, and the power chip being connected to the microcontroller and the memory chip, respectively.

[0016] In this way, the power supply chip can convert the input power supply voltage and adjust it to the stable voltage range required by the microcontroller and memory chip. Furthermore, the power supply chip can provide a stable output voltage, which helps to reduce the impact of voltage fluctuations on the microcontroller and memory chip.

[0017] In some embodiments, the connection terminal further includes a ground pin, which is disposed between the power supply pin and the serial bus interface pin.

[0018] Thus, by providing a common potential reference point, the ground pin helps reduce the coupling between signal and power supply noise, thereby reducing the impact of noise on circuit performance. In addition, the ground pin can conduct excess current to ground, thereby preventing damage to the device.

[0019] In some embodiments, the connection end further includes an insertion detection pin.

[0020] Thus, the insertion of the detection pin is used to monitor whether the sound card is connected, ensuring proper connection and communication between devices.

[0021] In some embodiments, the insertion detection pin is located between the serial bus interface pin and the audio bus interface pin.

[0022] This makes it easier to distinguish between serial bus interface pins and audio bus interface pins.

[0023] In some embodiments, the memory chip is an EMMC.

[0024] Therefore, choosing eMMC for memory chips is beneficial for improving the read and write performance of memory chips.

[0025] In some embodiments, the memory chip is connected to the microcontroller via an SDIO interface.

[0026] Thus, the SDIO interface supports high-speed data transmission mode, which is beneficial for improving data transmission speed.

[0027] Additional aspects and advantages of embodiments of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of this application. Attached Figure Description

[0028] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein:

[0029] Figure 1 This is a schematic diagram of the topology of the sound card according to an embodiment of this application;

[0030] Figure 2 This is a schematic diagram of the connection end of the sound card according to the embodiment of this application;

[0031] Figure 3 This is a schematic diagram of the microcontroller of the sound card according to the embodiments of this application;

[0032] Figure 4 This is a schematic diagram of the storage chip of the sound card according to the embodiments of this application.

[0033] Key component symbol descriptions: Sound card 100, Connection terminal 10, Serial bus interface pin 11, SPI2_CS output pin 111, SPI2_D output pin 112, SPI2_CK output pin 113, SPI2_Q output pin 114, Audio bus interface pin 12, I2S_MCLK input pin 121, I2S_SCLK input pin 122, I2S_LRCK input pin 123, I2S_SDATA_DI input pin 124, I2S_SDATA_DO input pin 125, Insert Detection pin 13, power supply pin 14, ground pin 15, microcontroller 20, SPI2_CS input pin 21, SPI2_D input pin 22, SPI2_CK input pin 23, SPI2_Q input pin 24, I2S_MCLK output pin 25, I2S_SCLK output pin 26, I2S_LRCK output pin 27, I2S_SDATA_DI output pin 28, I2S_SDATA_DO output pin 29, memory chip 30, SDIO interface, power supply chip 50, computer 200. Detailed Implementation

[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this utility model. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0035] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] This disclosure provides many different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described herein. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0038] A tone card is a device or software plugin used to adjust and change the tone effect of an instrument or sound. Currently, the source data of the relevant tone is usually written to a commonly used Micro SD card. However, Micro SD, as a conventional storage medium, cannot meet the requirements of low latency audio transmission.

[0039] Please see Figures 1 to 4 The sound card 100 of this application includes a connection terminal 10, a microcontroller 20, and a storage chip 30. The connection terminal 10 includes a serial bus interface pin 11 and an audio bus interface pin 12. The microcontroller 20 is connected to the serial bus interface pin 11 and the audio bus interface pin 12 of the connection terminal 10, and is also connected to an external device 200 through the connection terminal 10. The storage chip 30 is connected to the microcontroller 20 and is used to store sound source data. The sound source data can be sound sampling data of different timbres, such as samples of individual notes or chords produced by a piano, samples of individual notes or chords produced by a guitar, samples of individual notes or chords produced by other instruments, samples of musical sound fragments produced by special rhythmic patterns, etc.

[0040] The sound card 100 provided in this application, by setting the serial bus interface pin 11 and the audio bus interface pin 12, separates the writing and reading of sound source data into different interfaces, thereby improving transmission efficiency and meeting the requirements of low latency scenarios for audio transmission.

[0041] In addition, the sound card 100 has a storage chip 30 inside. The sound source data can be transmitted to the storage chip 30 through the microcontroller 20 and stored in the storage chip 30. This allows users to save the sound source data without relying on other devices, which helps to simplify the user's usage process and reduce the cost of use.

[0042] Specifically, connection terminal 10 refers to the part of the sound card 100 used to connect with other devices or components. Commonly used connection terminals 10 include USB interfaces, Type-C interfaces, or other professional audio interfaces. In this embodiment, connection terminal 10 is a USB interface, which has multiple pins for connecting with external device 200 and transmitting data. In this embodiment, external device 200 is typically a computer.

[0043] The microcontroller 20 is a highly integrated microcomputer system. The microcontroller 20 integrates a processor core, memory, input / output interfaces, and possibly other peripheral devices (such as timers, analog-to-digital converters, etc.) onto a single integrated circuit chip. This highly integrated design makes the microcontroller 20 small in size, low in power consumption, and highly efficient. In this embodiment, the microcontroller 20 is used to process audio source data stored in the storage chip 30 and output it to an external device 200, such as a computer, via the connection terminal 10, or to receive audio information from an external source and input it to the storage chip 30.

[0044] The memory chip 30, also known as a semiconductor memory, is a digital chip used to store data in an integrated circuit. The memory chip 30 uses electrical energy to store information, and its storage and retrieval process involves the storage or release of electrons. In this embodiment, the main function of the memory chip 30 is to save audio source data, ensuring that the audio source data can be accurately read and written when needed.

[0045] Please see Figure 1 and Figure 3 In some embodiments, the microcontroller 20 is an ESP32-P4.

[0046] Thus, the ESP32-P4 is able to handle more complex computing tasks, which is conducive to achieving faster processing speeds.

[0047] Specifically, the ESP32-P4 is a high-performance, dual-core RISC-V microcontroller. The ESP32-P4's dual-core RISC-V processor has a clock speed of 400MHz, capable of handling various complex algorithms and real-time data processing needs. Furthermore, the ESP32-P4 provides a variety of interfaces, including display interfaces, camera interfaces, audio interfaces, network communication interfaces, and multiple programmable GPIOs, meeting various peripheral connection and data transmission requirements.

[0048] It's important to note that while the ESP32-P4 boasts low power consumption, careful power management is still necessary during use. Especially in battery-powered applications, it's crucial to configure the power mode and power budget appropriately to extend the device's lifespan. Additionally, due to the ESP32-P4's high performance, it may generate heat during prolonged high-load operation. To ensure stable operation, proper heat dissipation is essential to prevent overheating that could lead to performance degradation or damage.

[0049] In other embodiments, the microcontroller 20 may be selected from other types and models, which can be selected according to actual needs, and will not be elaborated on here.

[0050] Please see Figure 1 and Figure 2 In some embodiments, serial bus interface pin 11 is an SPI pin, audio bus interface pin 12 is an I2S pin, and the SPI pin and I2S pin are connected to the microcontroller 20.

[0051] Thus, connecting to the microcontroller 20 using SPI and I2S pins facilitates high-speed synchronous communication and the transmission of high-quality audio data.

[0052] Specifically, SPI (Serial Peripheral Interface) is a serial peripheral interface mainly used for data transmission between the host controller and the memory chip 30. In this embodiment, the SPI pin is used for memory management, responsible for writing and updating audio source data in the memory chip 30. Its transmission rate can reach up to 50MB / s, which is beneficial for ensuring fast loading of large audio source files.

[0053] I2S (Inter-IC Sound, also known as IIS) is an audio data transmission protocol used for data interaction between the main control chip and the audio playback unit. In this embodiment, the I2S pin is used for audio playback, that is, to transmit audio data stored in the storage chip 30 to the computer. It features low-latency audio data transmission, reducing audio playback stuttering. The I2S pin uses a 16-bit / 44.1kHz sampling rate, which is beneficial for improving sound quality.

[0054] In some embodiments, the number of SPI pins is 4 or 8, and the number of I2S pins is 5, with the 4 SPI pins and 5 I2S pins being centrally located.

[0055] In this way, placing similar pins close together makes pin identification easier.

[0056] Furthermore, in this embodiment, the connection terminal 10 is provided with 12 pins, including 4 SPI pins, 5 I2S pins, 1 DET insertion detection pin 13, 1 power supply pin 14, and 1 ground pin 15.

[0057] The four parallel SPI pins include SPI2_CS output pin 111, SPI2_D output pin 112, SPI2_CK output pin 113 and SPI2_Q output pin 114, which are used to connect to the SPI2_CS input pin 21, SPI2_D input pin 22, SPI2_CK input pin 23 and SPI2_Q input pin 24 of the ESP32-P4, respectively.

[0058] The SPI2_CS output pin 111 is used to select or activate the sound card 100. The external device 200 selects which sound card 100 to communicate with by controlling the CS signal. When the CS signal is low, the corresponding sound card 100 is selected and activated, and data communication with the external device 200 can begin.

[0059] The SPI2_D output pin 112 is used to transmit data between the external device 200 and the sound card 100. It typically has two data lines: MOSI (Master Out Slave In, external device 200 output, sound card 100 input) and MISO (Master In Slave Out, external device 200 input, sound card 100 output). The MOSI line is used for the external device 200 to send data to the sound card 100, while the MISO line is used for the sound card 100 to send data to the external device 200.

[0060] The SPI2_CK output pin 113 is used to synchronize data transmission between the external device 200 and the sound card 100. The frequency, polarity (level during idle state), and phase (data sampling time) of the clock signal can be configured according to specific application requirements. During data transmission, the external device 200 sends and receives data according to the rhythm of the clock signal, while the sound card 100 synchronizes its own data transmission operations according to the clock signal.

[0061] The SPI2_Q output pin 114 is an additional signal line introduced to the sound card 100 to transmit more data between the external device 200 and the sound card 100, thereby increasing the data transfer rate.

[0062] The five I2S pins include I2S_MCLK input pin 121, I2S_SCLK input pin 122, I2S_LRCK input pin 123, I2S_SDATA_DI input pin 124, and I2S_SDATA_DO input pin 125, which are used to connect to the ESP32-P4's I2S_MCLK output pin 25, I2S_SCLK output pin 26, I2S_LRCK output pin 27, I2S_SDATA_DI output pin 28, and I2S_SDATA_DO output pin 29, respectively.

[0063] The I2S_MCLK input pin 121 provides a synchronization clock signal to the external device 200 and the sound card 100, ensuring that both can transmit data at a unified clock frequency. The MCLK frequency is typically a multiple of the sampling frequency, such as 128, 256, or 512 times. The MCLK signal is generated by the external device 200 and transmitted to the sound card 100 (e.g., an audio codec). The sound card 100 uses the MCLK signal to synchronize its internal clock and process data.

[0064] The I2S_SCLK input pin 122, also known as the BCLK pin (Bit Clock), provides a clock signal for each bit of audio data to synchronize data transmission. The SCLK signal ensures that data is transmitted at the same rate between the transmitter and receiver. During each SCLK clock cycle, the transmitter sends one bit of audio data to the data line, and the receiver samples the data on the data line on the corresponding clock edge (usually the rising edge).

[0065] The I2S_LRCK input pin 123 is used to indicate whether data is currently being transmitted from the left or right channel. Changes in the LRCK signal mark the start and end of an audio data frame. When LRCK is high, it indicates that data from the right channel is being transmitted; when LRCK is low, it indicates that data from the left channel is being transmitted. In this way, the receiver can correctly distinguish between the left and right channel data.

[0066] The I2S_SDATA_DI input pin 124 is used by the sound card 100 (such as an audio codec) to send audio data to the external device 200 (in some configurations, the external device 200 may also send data to the sound card 100, but I2S_SDATA_DI is more commonly used to indicate data transfer from the sound card 100 to the external device 200). Under SCLK synchronization, the sound card 100 sends the audio data bit by bit to the SDATA_DI data line, and the external device 200 samples this data on the corresponding clock edge.

[0067] The I2S_SDATA_DO input pin 125 is used by external device 200 to send audio data to sound card 100 (the opposite of I2S_SDATA_DI). In some configurations, SDATA_DO can also be used by sound card 100 to send data to external device 200 (but this is usually not its primary purpose). Similar to SDATA_DI, but data is transmitted in the opposite direction. External device 200 sends audio data bit by bit to the SDATA_DO data line in synchronization with SCLK, and sound card 100 samples this data on the corresponding clock edge.

[0068] In some embodiments, the number of SPI pins may also be 8. The specific number of SPI pins can be selected according to actual needs, which will not be elaborated here.

[0069] Please see Figure 1 and Figure 4 In some embodiments, the memory chip 30 is an EMMC.

[0070] Therefore, choosing eMMC for memory chip 30 is beneficial to improving the read and write performance of memory chip 30.

[0071] Specifically, EMMC (Embedded MultiMediaCard) is an embedded multimedia card, mainly composed of flash memory, a flash memory controller, and an EMMC protocol interface, packaged together in BGA form. It is an extension of MMC (MultiMediaCard), with advantages such as small size, low power consumption, and large capacity, making it very suitable for use as a storage medium in consumer electronic devices such as smartphones, tablets, and mobile internet devices.

[0072] EMMC storage technology uses high-speed serial interfaces, such as HS400 or HS200, providing data transfer speeds of up to 400MB / s. It is suitable for applications requiring fast data read / write speeds, such as high-definition video playback, loading of large games, and rapid application startup. Furthermore, EMMC memory offers high reliability and low power consumption in standby mode, helping to extend device battery life.

[0073] It's important to note that unlike external memory cards, eMMC memory is integrated into the device, meaning that once the device is manufactured, its storage capacity cannot be increased. This can limit the long-term availability of the device, especially for users who need to store large amounts of data.

[0074] Furthermore, in this embodiment, the sound card 100 uses an ESP32-P4 as the microcontroller 20, incorporates an EMMC memory chip 30, and communicates with the external device 200 via a serial bus interface pin 11. Simultaneously, it utilizes an audio bus interface pin 12 to achieve high-speed audio data transmission. Moreover, both the ESP32-P4 and EMMC contribute to the miniaturization of the sound card 100, facilitate structural optimization, ensure optimized data transmission quality within a limited PCB space, and reduce signal loss and interference.

[0075] In other embodiments, the memory chip 30 may be selected from other types and models, which can be selected according to actual needs, and will not be elaborated on here.

[0076] In some embodiments, the capacity of the memory chip 30 is greater than or equal to 8G.

[0077] Thus, 8GB of storage capacity can meet the storage needs of most devices, and the 8GB version is more cost-effective while providing sufficient storage space, making it a high-performance, cost-effective option.

[0078] Specifically, the storage chip 30 has a variety of optional capacity specifications. Taking EMMC as an example, commonly used capacity specifications include 4GB, 8GB, 16GB, 32GB, 64GB, and 128GB. In this embodiment, the EMMC capacity specification is selected as 8GB. The 8GB storage capacity can meet the storage needs of most devices while saving costs.

[0079] Please see Figure 1 In some embodiments, the memory chip 30 is connected to the microcontroller 20 via an SDIO interface.

[0080] Thus, the SDIO interface supports high-speed data transmission mode, which is beneficial for improving data transmission speed.

[0081] Specifically, the SDIO (Secure Digital Input and Output) interface is a peripheral interface standard. It is compatible not only with older SD memory cards but also with devices that use the SDIO interface.

[0082] The SDIO interface supports high-speed data transmission, making it ideal for applications requiring rapid data exchange. Designed with power consumption in mind, the SDIO interface supports multiple power-saving modes, such as sleep mode and low-power mode. This makes it well-suited for battery-powered portable devices. Furthermore, the SDIO interface supports hot-swapping, allowing users to insert or remove peripherals without shutting down the system, thus enhancing system flexibility and ease of use.

[0083] It's important to note that SDIO devices typically have multiple operating modes, including normal mode, sleep mode, and power-down mode. Properly utilizing these modes can effectively reduce power consumption and extend battery life. Therefore, when using SDIO interfaces, attention should be paid to power management, and the appropriate operating mode should be selected based on actual needs.

[0084] In other embodiments, the memory chip 30 and the microcontroller 20 can also be connected in other ways, depending on the actual needs, which will not be elaborated here.

[0085] Please see Figure 1 and Figure 2 In some embodiments, the connection terminal 10 further includes a power supply pin 14, which is located on the side of the serial bus interface pin 11 away from the audio bus interface pin 12. The power supply pin 14 is connected to the microcontroller 20 and the memory chip 30, respectively.

[0086] Thus, power pin 14 is used to connect an external power source to power the microcontroller 20 and the memory chip 30.

[0087] Specifically, in this embodiment, the power supply pin 14 is integrated into the connection terminal 10 and electrically connected to the microcontroller 20 and the storage chip respectively. The power supply pin 14 is connected to a 5V power supply from the external device 200 and is used to power the microcontroller 20 and the storage chip 30.

[0088] In some embodiments, the sound card 100 also includes a power chip 50, with power pin 14 connected to the power chip 50, which is connected to the microcontroller 20 and the memory chip 30 respectively.

[0089] In this way, the power chip 50 can convert the input power supply voltage and adjust it to the stable voltage range required by the microcontroller 20 and the memory chip 30. In addition, the power chip 50 can provide a stable output voltage, which helps to reduce the impact of voltage fluctuations on the microcontroller 20 and the memory chip 30.

[0090] Specifically, power chip 50 refers to an integrated circuit chip that transforms or controls the power supply to provide the appropriate voltage or current for the load to operate normally.

[0091] In this embodiment, power pin 14 transmits an external 5V voltage to power chip 50, which then decomposes it into multiple branches with different voltages to meet the different voltage requirements of microcontroller 20 and memory chip 30.

[0092] In some embodiments, the power chip 50 is model TLV62569DBVR.

[0093] Thus, the TLV62569DBVR has higher efficiency, which helps reduce energy waste, lowers equipment heat generation, and extends the service life of the equipment.

[0094] Specifically, the TLV62569DBVR is a synchronous buck DC / DC converter regulator chip. Optimized for high efficiency and compact solutions, the TLV62569DBVR operates by converting a higher input voltage to a lower output voltage through high-frequency switching. The integrated switch provides up to 2A of output current and features low RDS(ON), switching between 100mΩ and 60mΩ. Furthermore, the TLV62569DBVR is housed in a small SOT-23 package, making it ideal for space-constrained designs.

[0095] The TLV62569DBVR can provide higher current output while reducing losses at high load currents, achieving an efficiency of up to 95%. This effectively reduces energy waste and device heat generation during long-term power supply applications. Furthermore, the TLV62569DBVR has a quiescent current of only 40μA, minimizing battery consumption in standby or low-power modes.

[0096] It's important to note that the output voltage of the TLV62569DBVR can be adjusted using an external resistor divider. Therefore, an appropriate voltage divider resistor must be selected based on actual requirements to ensure output voltage stability. Furthermore, although the TLV62569DBVR is highly efficient, it may still generate some heat under high loads or prolonged operation. Therefore, appropriate heat dissipation measures, such as adding heat sinks or using a fan, should be considered during the design phase.

[0097] In this embodiment, the TLV62569DBVR provides two voltages to the ESP32-P4, namely 3.3V and 1.2V, and provides a voltage of 3.3V to the EMMC.

[0098] Furthermore, in this embodiment, the EMMC requires two sets of voltages, but to simplify the internal circuit layout of the tone card 100, the other 1.8V voltage required by the EMMC is provided by the ESP32-P4.

[0099] It should be noted that when the microcontroller 20 is of other types or models, the microcontroller 20 may not be able to provide a 1.8V voltage to the EMMC. In this case, an additional branch should be drawn from the power chip 50 to provide a 1.8V voltage to the EMMC.

[0100] In other embodiments, both sets of voltages required by the EMMC can also be provided by the TLV62569DBVR.

[0101] In other embodiments, the power chip 50 may also select other types of connection methods, which can be selected according to actual needs, and will not be elaborated on here.

[0102] In some embodiments, the connection terminal 10 further includes a ground pin 15, which is disposed between the power supply pin 14 and the serial bus interface pin 11.

[0103] Thus, by providing a common potential reference point, ground pin 15 helps reduce the coupling between signal and power supply noise, thereby reducing the impact of noise on circuit performance. In addition, ground pin 15 can conduct excess current to ground, thereby preventing damage to the device.

[0104] Please see Figure 1 and Figure 2 In some embodiments, the connection end 10 further includes an insertion detection pin 13.

[0105] Thus, the insertion detection pin 13 is used to monitor whether the tone card 100 is connected, so as to ensure the correct connection and communication between the devices.

[0106] Specifically, Insertion Detection Pin 13 is used to detect whether the sound card 100 is correctly connected to the external device 200. The principle of Insertion Detection Pin 13 is primarily based on changes in electrical characteristics. When the external device 200 or component is inserted into the interface, it forms an electrical connection with Insertion Detection Pin 13. This connection causes changes in the voltage, current, or signal waveform on the pin. By detecting these changes, the electronic device can determine whether the external device 200 or component has been correctly inserted.

[0107] When the sound card 100 is connected to the external device 200, the electronic device begins monitoring signal changes on the insertion detection pin 13. This typically involves reading the pin's voltage level, measuring the current, or analyzing the signal waveform. Based on the detected signal changes, the electronic device can determine whether the external device 200 has been correctly inserted. If the expected signal change is detected, the device may enter the corresponding operating mode or perform a specific function. Once it is determined that the external device 200 has been inserted, the electronic device can take appropriate responsive actions. For example, it may initiate a communication protocol, load necessary drivers, or provide user feedback (such as illuminating an indicator light).

[0108] In some embodiments, the insertion detection pin 13 is positioned between the serial bus interface pin 11 and the audio bus interface pin 12.

[0109] This makes it easy to distinguish between serial bus interface pin 11 and audio bus interface pin 12.

[0110] In the description of this specification, the references to "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0111] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the stated features. In the description of this application, "multiple" means at least two, such as two or three, unless otherwise explicitly specified.

[0112] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A sound card, characterized in that, include: The connection ends include serial bus interface pins and audio bus interface pins; A microcontroller, wherein the microcontroller is connected to the serial bus interface pins and audio bus interface pins of the connection terminal, and is connected to an external device through the connection terminal; A storage chip, which is connected to the microcontroller, is used to store audio source data.

2. The tone card according to claim 1, characterized in that, The serial bus interface pin is an SPI pin, and the audio bus interface pin is an I2S pin. The SPI pin and the I2S pin are connected to the microcontroller.

3. The tone card according to claim 2, characterized in that, The number of SPI pins is 4 or 8, and the number of I2S pins is 5. The 4 SPI pins and the 5 I2S pins are respectively centrally located.

4. The tone card according to claim 2, characterized in that, The connection terminal also includes a power pin, which is located on the side of the serial bus interface pin away from the audio bus interface pin, and the power pin is connected to the microcontroller and the memory chip respectively.

5. The tone card according to claim 4, characterized in that, The sound card also includes a power chip, and the power pins are connected to the power chip. The power chip is connected to the microcontroller and the memory chip respectively.

6. The tone card according to claim 4, characterized in that, The connection terminal also includes a ground pin, which is disposed between the power supply pin and the serial bus interface pin.

7. The tone card according to claim 2, characterized in that, The connection terminal also includes an insertion detection pin.

8. The tone card according to claim 7, characterized in that, The insertion detection pin is located between the serial bus interface pin and the audio bus interface pin.

9. The tone card according to claim 1, characterized in that, The memory chip is an EMMC.

10. The tone card according to claim 1, characterized in that, The memory chip is connected to the microcontroller via an SDIO interface.

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