Thermoelectric separation filled and electroplated double-sided metal substrate

Abstract

The utility model provides a double-sided metal substrate for thermoelectric separation filling and electroplating, and relates to the technical field of metal substrates. The double-sided metal substrate for thermoelectric separation filling and electroplating comprises a substrate body, a plurality of electronic elements are arranged at the upper end of the substrate body, a plurality of grooves are formed in the lower end of the substrate body, heat-conducting double-sided adhesive tapes are pasted on the two sides of the substrate body, and cooling fins are pasted on the other sides of the two heat-conducting double-sided adhesive tapes. Sliding grooves are formed in the four corners of the base plate body, a connecting structure is arranged on the inner wall of each sliding groove, and a bottom plate is arranged on each connecting structure. According to the double-sided metal substrate for thermoelectric separation filling and electroplating, through the multiple grooves formed in the substrate body, the effect of rapid heat dissipation is achieved, then the effect of improving the using effect of the metal substrate is achieved, the bottom plate is driven to move through equipment vibration, the effect of stress buffering is achieved, and the effect of improving the using protection performance of the metal substrate is achieved.

Description

Technical Field

[0001] This utility model relates to a double-sided metal substrate with thermoelectric separation and leveling electroplating, belonging to the field of metal substrate technology. Background Technology

[0002] Thermoelectric separation of double-sided metal substrates refers to a thermoelectric separation process in the fabrication of double-sided metal substrates. The circuitry and thermal layers of the substrate are located on different circuit layers, with the thermal layer directly contacting the heat dissipation components of the LED chips, achieving optimal heat dissipation and conduction. Thermoelectric separation double-sided metal substrates have a thermal conductivity of 400W / MK, overcoming the shortcomings of insufficient heat conduction and dissipation in existing double-sided metal substrates. This process directly conducts the heat generated by electronic components through the heat dissipation zone, significantly improving heat dissipation. During the fabrication of double-sided metal substrates, vias are typically required. Resin-filled vias simply involve plating copper on the via walls, filling the vias with epoxy resin, and then plating copper on the surface. Using this resin-filled via process, the surface of the double-sided metal substrate is free of dents, the vias are conductive, and soldering is not affected.

[0003] Currently used metal substrates have some significant limitations in practical applications. In terms of heat dissipation, they primarily rely on the surface area of ​​the metal substrate for natural cooling. This method is inefficient, leading to a large accumulation of heat on the metal panel. This can easily damage electronic components due to high temperatures, severely impacting the performance of the metal substrate and resulting in insufficient protection during use. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] This invention provides a double-sided metal substrate with thermoelectric separation and leveling electroplating to solve the problems of insufficient performance and inadequate protection of metal substrates in the prior art.

[0006] (II) Technical Solution

[0007] This utility model is achieved through the following technical solution: a double-sided metal substrate with thermoelectric separation and leveling electroplating, including a substrate body, a plurality of electronic components are disposed on the upper end of the substrate body, a plurality of grooves are opened on the lower end of the substrate body, thermally conductive double-sided adhesive is pasted on both sides of the substrate body, and heat dissipation fins are pasted on the other side of the two thermally conductive double-sided adhesives.

[0008] The substrate body has grooves at all four corners, and each groove has a connecting structure on its inner wall. A base plate is provided on the connecting structure. The connecting structure can slide along the length of the groove with the base plate to provide a buffer space.

[0009] Preferably, the connecting structure includes a slide, a spring is fixed to the upper end of the slide, a fixing rod is fixed to the lower end of the slide, and a base plate is fixed to the lower end of the four fixing rods. Each base plate has a reserved hole at each of its four corners.

[0010] Preferably, the outer surface of each slide is slidably connected to the inner wall of each slide groove, and the cross-section of each slide is circular.

[0011] Preferably, the upper end of each spring is fixed to the inner wall of the upper end of each slide groove, and the lower end of each spring is fixed to the upper end of each slide plate.

[0012] Preferably, the upper end of each fixing rod is fixed to the middle of the lower end of each slide, and the lower end of each fixing rod is fixed to a corner of the base plate.

[0013] Preferably, a plurality of the grooves are formed at the lower end of the substrate body, and the vertical cross-section of the substrate body is T-shaped.

[0014] Preferably, the two thermally conductive double-sided adhesives are attached to the adjacent sides of the substrate body, and the two thermally conductive double-sided adhesives are attached to the adjacent sides of the two heat dissipation fins.

[0015] This invention provides a double-sided metal substrate with thermoelectric separation and leveling electroplating, which has the following beneficial effects:

[0016] (1) The thermoelectric separation filler plated double-sided metal substrate, through several grooves opened in the substrate body, enables the substrate body, grooves, thermally conductive double-sided adhesive and heat dissipation fins to work together to achieve the effect of rapid heat dissipation, effectively prevent heat accumulation and high temperature, avoid the damage of electronic components on the substrate due to high temperature, and thus improve the performance of the metal substrate.

[0017] (2) The thermoelectric separation filler electroplated double-sided metal substrate moves the base plate through equipment vibration, so that the slide, slide plate, spring, fixing rod and base plate work together to achieve the effect of force buffering, avoiding the impact force from acting directly on the metal substrate and the electronic components installed on it, preventing the two from being damaged by impact, thereby improving the protective function of the metal substrate. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a partial cross-sectional view of the present invention;

[0020] Figure 3 This utility model Figure 2 Enlarged view of the A-section structure;

[0021] Figure 4 This is a partial structural schematic diagram of the present invention.

[0022] [Explanation of Key Component Symbols]

[0023] 1. Substrate body; 2. Electronic components; 3. Groove; 4. Thermally conductive double-sided adhesive; 5. Heat dissipation fins; 6. Slide groove; 7. Slide plate; 8. Spring; 9. Fixing rod; 10. Base plate; 11. Reserved hole. Detailed Implementation

[0024] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0025] Example 1

[0026] This utility model embodiment provides a double-sided metal substrate with thermoelectric separation and leveling electroplating.

[0027] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 The system includes a substrate body 1, which is a metal substrate body 1. Several electronic components 2 are disposed on the upper end of the substrate body 1. Several grooves 3 are formed on the lower end of the substrate body 1. Thermally conductive double-sided adhesive 4 is attached to both sides of the substrate body 1. Heat dissipation fins 5 are attached to the other side of each of the two thermally conductive double-sided adhesive 4. Several grooves 3 are formed on the lower end of the substrate body 1. The vertical cross-section of the substrate body 1 is T-shaped. The two thermally conductive double-sided adhesive 4 are attached to the sides of the substrate body 1 with their adjacent sides, and the two thermally conductive double-sided adhesive 4 are attached to the sides of the two heat dissipation fins 5 with their opposing sides. The heat dissipation fins 5 further increase the heat dissipation area and assist in heat dissipation.

[0028] In use, this invention features several grooves 3 formed in the substrate body 1, significantly increasing the heat dissipation area of ​​the substrate body 1. During operation, the substrate body 1 conducts heat to the thermally conductive double-sided adhesive 4, which then transfers the heat to the heat dissipation fins 5. The heat dissipation fins 5 further expand the heat dissipation area, enabling more efficient heat dissipation and achieving rapid heat dissipation. This effectively prevents heat accumulation and high temperatures, avoiding damage to the electronic components 2 on the substrate due to high temperatures, thereby improving the performance of the metal substrate.

[0029] Example 2

[0030] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 Based on Embodiment 1, a force-bearing buffer function has been added;

[0031] Please refer to it again. Figure 1 , Figure 2 , Figure 3 and Figure 4 It is worth noting that the substrate body 1 has a sliding groove 6 at each of its four corners. Each sliding groove 6 has a connecting structure on its inner wall. The connecting structure includes a sliding plate 7. A spring 8 is fixed to the upper end of the sliding plate 7. A fixing rod 9 is fixed to the lower end of the sliding plate 7. A base plate 10 is fixed to the lower end of the four fixing rods 9. Each base plate 10 has a reserved hole 11 at each of its four corners.

[0032] Please refer to it again. Figure 1 , Figure 2 , Figure 3 and Figure 4 It is worth noting that the outer surface of each slide plate 7 is slidably connected to the inner wall of each slide groove 6, the cross-section of each slide plate 7 is circular, the upper end of each spring 8 is fixed to the upper inner wall of each slide groove 6, the lower end of each spring 8 is fixed to the upper end of each slide plate 7, the upper end of each fixing rod 9 is fixed to the middle of the lower end of each slide plate 7, and the lower end of each fixing rod 9 is fixed to a corner of the base plate 10.

[0033] In use, this invention works as follows: the base plate 10 moves due to equipment vibration. Since the four corners of the fixing rod 9 are fixed to the base plate 10, the movement of the base plate 10 causes the fixing rod 9 to move synchronously. At this time, the four sliding discs 7 located at the upper end of the fixing rod 9 can only slide along the sliding grooves 6 under the limiting constraints of the four sliding grooves 6. During the sliding process, the sliding discs 7 apply pressure to the springs 8 fixed at their upper ends, causing the springs 8 to be compressed. The springs 8 generate elastic force during the compression process. This elastic force can effectively buffer the impact force brought by vibration, achieving the effect of force buffering, avoiding the impact force from directly acting on the metal substrate and the electronic components 2 installed on it, preventing damage to both due to impact, and thus improving the protective performance of the metal substrate.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A double-sided metal substrate with thermoelectric separation and leveling plating, comprising a substrate body (1), characterized in that: The upper end of the substrate body (1) is provided with several electronic components (2), the lower end of the substrate body (1) is provided with several grooves (3), both sides of the substrate body (1) are attached with thermally conductive double-sided adhesive (4), and the other side of the two thermally conductive double-sided adhesives (4) is attached with heat dissipation fins (5). The substrate body (1) has grooves (6) at each of its four corners. Each groove (6) has a connecting structure on its inner wall and a base plate (10) on the connecting structure. The connecting structure can slide along the length of the groove (6) with the base plate (10) to provide a buffer space.

2. The double-sided metal substrate with thermoelectric separation and leveling electroplating according to claim 1, characterized in that: The connection structure includes a slide (7), a spring (8) is fixed at the upper end of the slide (7), a fixing rod (9) is fixed at the lower end of the slide (7), and a base plate (10) is fixed at the lower end of the four fixing rods (9). Each base plate (10) has a reserved hole (11) at each of its four corners.

3. The double-sided metal substrate with thermoelectric separation and leveling electroplating according to claim 2, characterized in that: The outer surface of each slide (7) is slidably connected to the inner wall of each slide groove (6), and the cross-section of each slide (7) is circular.

4. The double-sided metal substrate with thermoelectric separation and leveling electroplating according to claim 2, characterized in that: The upper end of each spring (8) is fixed to the inner wall of the upper end of each slide groove (6), and the lower end of each spring (8) is fixed to the upper end of each slide plate (7).

5. The double-sided metal substrate with thermoelectric separation and leveling electroplating according to claim 2, characterized in that: The upper end of each of the fixed rods (9) is fixed to the middle of the lower end of each slide (7), and the lower end of each of the fixed rods (9) is fixed to a corner of the base plate (10).

6. The double-sided metal substrate with thermoelectric separation and leveling electroplating according to claim 1, characterized in that: Several grooves (3) are formed at the lower end of the substrate body (1), and the vertical section of the substrate body (1) is T-shaped.

7. The double-sided metal substrate with thermoelectric separation and leveling electroplating according to claim 1, characterized in that: The two thermally conductive double-sided adhesives (4) are pasted on the sides of the substrate body (1) with their adjacent sides together, and the two thermally conductive double-sided adhesives (4) are pasted on the sides of the two heat dissipation fins (5) with their opposite sides together.

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