Low-temperature rapid curing device for epoxy structural adhesive

CN224181211UActive Publication Date: 2026-05-01威海佳美化工有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
威海佳美化工有限公司
Filing Date
2025-04-08
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

Existing low-temperature curing devices for epoxy structural adhesives suffer from limited curing range, low efficiency, and inability to be operated with one hand.

Method used

A low-temperature rapid curing device was designed, comprising a handle, gun base, curing mechanism, and dispensing mechanism. The device generates airflow by driving a motor to drive fan blades and uses resistance wire for heating. Combined with an adjustable conduit and a quantitative extrusion mechanism, it achieves rapid curing and quantitative coating of epoxy structural adhesive.

Benefits of technology

It enables rapid curing of epoxy structural adhesives at low temperatures, avoiding both uncured and over-cured conditions, and allows for one-handed operation, improving curing efficiency and flexibility.

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Abstract

The utility model relates to the technical field of gluing and curing, and discloses a low-temperature rapid curing device for epoxy structural adhesive, which comprises a grab handle and an adhesive cylinder, a gun seat is fixedly mounted on the grab handle, and a curing mechanism is arranged on the gun seat; the trigger is pressed and matched with the second spring to make the trigger move back and forth in the grab handle, when the trigger moves backwards, the positioning shaft rotates and enables the push rod to move forwards, when the trigger resets forwards, the positioning shaft is static under the action of the buckle seat, and then the push rod can continuously move forwards. The glue barrel is embedded into the gun seat and fixed by the positioning seat, the epoxy structural adhesive in the glue barrel can be extruded out by repeatedly pressing the trigger, the fan blades are controlled to rotate according to requirements, the resistance wire is used for heating, and meanwhile, the air outlet of the guide pipe is adjusted, so that the device can accelerate the curing of the epoxy structural adhesive and also can accelerate the curing of the epoxy structural adhesive. And the epoxy structural adhesive cured at the front end of the adhesive cylinder can be melted.
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Citation Information

Patent Citations

  • Gluing and curing device

    CN221733893U