Light emitting diode street lamp
By combining heat-conducting pillars and heat-conducting walls, the problems of heat dissipation and increased weight of LED streetlights are solved, achieving efficient heat dissipation and structural stability while reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DELTA ELECTRONICS INC(CN)
- Filing Date
- 2025-06-10
- Publication Date
- 2026-05-01
AI Technical Summary
Existing LED streetlights face challenges in efficient heat dissipation, leading to accelerated material aging and increased cost and weight.
The structure employs a combination of heat-conducting pillars and heat-conducting walls. The heat-conducting pillars directly contact the light-emitting diodes and conduct heat to the outside of the housing. The heat-conducting walls connect to the heat-conducting pillars to increase structural strength and assist in heat dissipation, while forming hollow areas to reduce weight.
This invention achieves efficient heat dissipation, a robust structure, and reduced costs for LED streetlights, while also prioritizing lightweight design and heat dissipation performance.
Smart Images
Figure CN224188573U_ABST
Abstract
Description
LED streetlights Technical Field
[0001] This disclosure relates to a light-emitting diode street light. Background Technology
[0002] With technological advancements, light-emitting diodes (LEDs) are widely used in various fields, such as street lighting. Because a single LED has relatively low power, a large number of LEDs are needed when used as a street light source to generate sufficient luminous flux to meet lighting requirements. This generates a significant amount of heat. If heat cannot be effectively dissipated, the accumulated heat can accelerate material aging, causing the light source to degrade rapidly. However, currently common high-efficiency heat dissipation structures often significantly increase the weight and manufacturing cost of streetlights.
[0003] Therefore, how to develop a light-emitting diode street light that can solve the above problems is one of the issues that the industry is currently eager to address by investing research and development resources. Summary of the Invention
[0004] In view of this, the purpose of this disclosure is to propose a light-emitting diode street light that can solve the above problems.
[0005] One aspect of this disclosure relates to a light-emitting diode (LED) street light comprising a housing and a circuit board. The housing includes a first thermally conductive wall and a plurality of thermally conductive pillars. The first thermally conductive wall connects adjacent pairs of the plurality of thermally conductive pillars. The circuit board is coupled to the housing and includes a plurality of LEDs. The plurality of LEDs correspond to the plurality of thermally conductive pillars. Each of the plurality of LEDs is in contact with a corresponding one of the plurality of thermally conductive pillars.
[0006] In some implementations, the bottom area of each of the plurality of light-emitting diodes is greater than or substantially equal to the top area of the corresponding one of the plurality of heat-conducting pillars.
[0007] In some implementations, the width of each of the plurality of heat-conducting pillars is greater than the thickness of the first heat-conducting wall.
[0008] In some embodiments, the housing also includes a body. A first thermally conductive wall and the plurality of thermally conductive pillars are connected to the body. The first thermally conductive wall and the plurality of thermally conductive pillars extend from the body toward the circuit board.
[0009] In some embodiments, the main body of the housing includes a first portion, a second portion, and a third portion. The first portion defines a first accommodating space. The second portion defines a second accommodating space. The third portion defines a third accommodating space. The second portion connects the first portion and the third portion. The second accommodating space connects the first accommodating space and the third accommodating space. The depth of the first accommodating space is less than the depth of the third accommodating space.
[0010] In some embodiments, the first heat-conducting wall and the plurality of heat-conducting pillars are located on a first portion. The circuit board is located in a first accommodating space.
[0011] In some embodiments, the LED street light also includes a driver. The driver is located in a third accommodating space and is electrically connected to the plurality of LEDs.
[0012] In some embodiments, the housing also includes a second thermally conductive wall. The second thermally conductive wall is located on the third portion and configured to abut against the driver.
[0013] In some embodiments, the main body of the shell, the first heat-conducting wall, and the plurality of heat-conducting pillars are integrally formed continuous structures.
[0014] In some implementations, the height of one of the plurality of heat-conducting pillars is greater than or substantially equal to the height of the first heat-conducting wall.
[0015] In summary, in some embodiments of the LED streetlights disclosed herein, by setting a heat-conducting structure with a hollowed-out area between the main body of the housing and the main heat source, such as a circuit board, and in contact with the main heat source, efficient heat dissipation and weight reduction can be achieved. Furthermore, the heat-conducting structure includes heat-conducting pillars and heat-conducting walls. By using heat-conducting pillars to correspond one-to-one with and directly contact the LEDs on the circuit board, the heat generated by the LEDs can be conducted to the main body of the housing and then dissipated into the environment, thereby ensuring good heat dissipation. In addition, using heat-conducting walls to connect the heat-conducting pillars can further enhance heat dissipation capacity and increase the overall structural strength of the heat-conducting structure. Compared to common LED streetlights, the LED streetlights disclosed herein, through the aforementioned heat-conducting structure, can achieve lightweight construction and cost reduction while maintaining structural stability and heat dissipation performance.
[0016] These and other aspects of this disclosure will become apparent from the following description of preferred embodiments in conjunction with the accompanying drawings, but variations and modifications may be made therein without departing from the spirit and scope of the novel concept of this disclosure. Attached Figure Description
[0017] The accompanying drawings illustrate one or more embodiments of this disclosure and, together with the written description, serve to explain the principles of this disclosure. Throughout the drawings, the same reference numerals are used wherever possible to refer to similar or identical elements of the embodiments, wherein:
[0018] Figure 1 is a split schematic diagram of a light-emitting diode street lamp according to some embodiments of the present disclosure;
[0019] Figure 2 is a perspective view of the housing of a light-emitting diode street lamp according to some embodiments of the present disclosure;
[0020] Figure 3 is a side view of the housing of a light-emitting diode street lamp according to some embodiments of the present disclosure;
[0021] Figure 4 is a perspective view of the housing of a light-emitting diode street lamp according to some embodiments of the present disclosure;
[0022] Figure 5 is a cross-sectional schematic diagram of a light-emitting diode street lamp according to some embodiments of the present disclosure.
[0023] [Symbol Explanation]
[0024] 10: LED streetlights
[0025] 100: Casing
[0026] 110: Main Body
[0027] 112: First part
[0028] 114: Second part
[0029] 116: Third part
[0030] 118: Connection part
[0031] 120, 120-1, 120-2, 120-3, 120-4: Thermal conductive columns
[0032] 130, 130-1, 130-2, 130-3: Thermal Conductive Wall
[0033] 200: Circuit board
[0034] 210: Light Emitting Diode
[0035] 300: Drive
[0036] 400: Waterproof sealing strip
[0037] 500:Block
[0038] 600: Lamp cover
[0039] 610: Lens
[0040] 620: Cover
[0041] H1, H2: Maximum height
[0042] S1: First accommodating space
[0043] S2: Second accommodating space
[0044] S3: Third Accommodation Space
[0045] X, Y, Z: Direction Detailed Implementation
[0046] To provide a more detailed description of this disclosure, the following is an illustrative description of various embodiments, but this does not limit the embodiments disclosed herein to be the only form. The embodiments disclosed herein may be combined with and / or substituted for each other where advantageous, and other embodiments may be added without further explanation.
[0047] Unless otherwise defined, all terms used herein (including technical and scientific terms) have their ordinary meanings, meanings that are understandable to those skilled in the art. Furthermore, the definitions of the aforementioned terms in commonly used dictionaries should be interpreted in the context of this specification as having the meanings consistent with the relevant field of this disclosure. Unless specifically defined, these terms will not be construed as having idealized or overly formal meanings.
[0048] As used herein, the words “comprising,” “including,” “having,” and similar terms indicate the features, regions, integers, steps, operations, elements, and / or components described herein, but do not exclude one or more other features, regions, integers, steps, operations, elements, components, and / or groups thereof described herein or additionally.
[0049] The terms "approximately," "substantially," and "truly" used in this disclosure include the range of deviations of the stated numerical values (or features) and those understood by one of ordinary skill in the art. For example, considering that numerical values (or features) may have errors, these terms may indicate values within the standard deviation of the stated value (e.g., values within ±30%, ±20%, ±15%, ±10%, or ±5%), or may indicate the deviations covered by the stated feature in practical operation (e.g., the description "truly parallel" may indicate practically close to parallel rather than ideally perfectly parallel). Furthermore, acceptable ranges of deviation may be selected depending on the nature of the measurement or other properties.
[0050] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it may be directly on or connected to the other element, or an intermediate element may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element, no intermediate element is present. As used in this disclosure, "connection" may refer to a physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may mean that other elements exist between the two elements.
[0051] This disclosure aims to provide a light-emitting diode (LED) street light whose housing has heat-conducting pillars and heat-conducting walls. The heat-conducting pillars, corresponding to and in direct contact with the LED, effectively conduct the heat generated by the LED to the outside of the housing. The heat-conducting walls connect the heat-conducting pillars to increase structural strength and aid heat dissipation. This achieves a lightweight and low-cost LED street light while meeting both structural strength and heat dissipation requirements.
[0052] Please refer to Figures 1 through 5 simultaneously. Figure 1 is an exploded view of a light-emitting diode street lamp 10 according to some embodiments of the present disclosure. Figure 2 is a perspective view of the housing 100 of the light-emitting diode street lamp 10. Figure 3 is a side view of the housing 100 of the light-emitting diode street lamp 10. Figure 4 is a perspective view of the housing 100 of the light-emitting diode street lamp 10 drawn from another perspective. Figure 5 is a cross-sectional view of the light-emitting diode street lamp 10.
[0053] As shown in Figure 1, the LED street light 10 includes a housing 100, a circuit board 200, a driver 300, a waterproof strip 400, a baffle 500, and a lamp cover 600.
[0054] First, the structure of the housing 100 will be described in detail.
[0055] The housing 100 includes a main body 110. As shown in FIG2, the main body 110 includes a first portion 112, a second portion 114, a third portion 116, and a connecting portion 118. The second portion 114 connects the first portion 112 and the third portion 116. The connecting portion 118 is connected to the side of the third portion 116 away from the second portion 114 and is configured to connect the housing 100 to a lamp post or bracket (not shown).
[0056] As shown in Figures 2 and 3, the first portion 112, the second portion 114, and the third portion 116 generally have an upwardly convex profile. Furthermore, the bottom edges of the first portion 112, the second portion 114, and the third portion 116 are flush with each other. In some embodiments, as shown in Figure 5, the thickness of the first portion 112, the second portion 114, and the third portion 116 is generally uniform.
[0057] It should be understood that, for the sake of brevity, the upward and outward-facing sides of the first part 112, the second part 114, and the third part 116 of the main body 110 are referred to as the "top surface," while the downward and inward-facing side is referred to as the "bottom surface."
[0058] As shown in Figures 2 and 3, the first portion 112 is convex and has a generally flat portion. The second portion 114 extends upward from its junction with the first portion 112 with a gradually decreasing slope, forming an inclined and convex surface to connect to the higher third portion 116. The third portion 116 extends downward from its junction with the second portion 114 with a gradually steepening slope, forming an inclined and convex surface. In some embodiments, the maximum height H2 of the third portion 116 relative to the bottom edge is greater than the maximum height H1 of the first portion 112 relative to the bottom edge.
[0059] In this way, the top surface of the main body 110 is a generally streamlined and smooth surface, which reduces the accumulation or adhesion of contaminants on the casing 100 and avoids affecting heat dissipation efficiency. At the same time, the streamlined design helps guide airflow, allowing heat to dissipate into the environment more quickly and evenly, thereby improving heat dissipation stability.
[0060] As shown in Figures 4 and 5, the first portion 112 defines a first accommodating space S1, the second portion 114 defines a second accommodating space S2, and the third portion 116 defines a third accommodating space S3. The second accommodating space S2 connects the first accommodating space S1 and the third accommodating space S3. As mentioned earlier, the maximum height H1 of the first portion 112 relative to the bottom edge is less than the maximum height H2 of the third portion 116 relative to the bottom edge; therefore, the depth of the first accommodating space S1 is less than the depth of the third accommodating space S3.
[0061] In this way, in subsequent configurations, the main heat source (e.g., the light-emitting diode 210 on the circuit board 200) can be placed in the first accommodating space S1 to dissipate heat through the flat surface of the first part 112, reducing heat accumulation, and other larger components that generate less heat (e.g., the driver 300 and other electronic components) can be accommodated in the deeper third accommodating space S3.
[0062] As shown in Figures 1 and 4, the housing 100 also includes a heat-conducting structure. More specifically, the heat-conducting structure includes multiple heat-conducting pillars 120 and multiple heat-conducting walls 130, respectively connected to the bottom surface of the main body 110. The heat-conducting pillars 120 and heat-conducting walls 130 may have different connection relationships in different parts of the main body 110. For example, heat-conducting pillars 120-1, 120-2, 120-3, and 120-4 shown in Figure 4 are different embodiments of the heat-conducting pillar 120, and heat-conducting walls 130-1, 130-2, and 130-3 are different embodiments of the heat-conducting wall 130. These will be described in detail later with reference to the accompanying drawings.
[0063] In some embodiments, the body 110, the heat-conducting pillar 120, and the heat-conducting wall 130 are integrally formed as a continuous structure. In some embodiments, the housing 100 is made of die-cast aluminum alloy.
[0064] To effectively dissipate heat, the heat-conducting pillar 120 is a solid pillar and is configured to contact a heat source (e.g., a light-emitting diode 210 on the circuit board 200) to conduct heat to the body 110 and dissipate it into the environment. The heat-conducting pillar 120 can be located on the bottom surface of the first portion 112 and the bottom surface of the second portion 114. For example, heat-conducting pillars 120-1, 120-2, and 120-3 are located on the bottom surface of the first portion 112, and heat-conducting pillar 120-4 is located on the bottom surface of the second portion 114. In some embodiments, the cross-sectional profile of the heat-conducting pillar 120 can be circular, square, or polygonal, but this disclosure is not limited thereto.
[0065] Furthermore, the heat-conducting pillars 120 can correspond one-to-one with and contact the light-emitting diodes 210. Therefore, the heat-conducting pillars 120 can be arranged in an array according to the arrangement of the light-emitting diodes 210. For example, as shown in Figure 4, the heat-conducting pillars 120 are arranged in an array approximately along the X and Y directions.
[0066] The heat-conducting wall 130 is located on the bottom surface of the first portion 112, the second portion 114, and the third portion 116. In some embodiments, the thickness of the heat-conducting wall 130 is substantially uniform.
[0067] As shown in Figure 4, the heat-conducting wall 130-1 is located on the bottom surface of the first part 112. The heat-conducting wall 130-1 is also referred to as the first heat-conducting wall. The heat-conducting wall 130-1 connects two adjacent heat-conducting pillars 120 to assist in heat conduction and increase structural strength, preventing the heat-conducting pillars 120 from tilting or collapsing. For example, the heat-conducting wall 130-1 can connect two adjacent heat-conducting pillars 120 in the X direction or two adjacent heat-conducting pillars 120 in the Y direction.
[0068] In this way, a heat-conducting pillar 120 is connected to at least two heat-conducting walls 130-1, and at most four heat-conducting walls 130-1. For example, as shown in Figure 4, heat-conducting pillars 120-1 and 120-3 are each connected to two heat-conducting walls 130-1, heat-conducting pillar 120-2 is connected to four heat-conducting walls 130-1, and heat-conducting pillar 120-4 is connected to three heat-conducting walls 130-1.
[0069] In some embodiments, the height of the heat-conducting pillar 120 is substantially equal to the height of the heat-conducting wall 130-1. For example, as shown in Figure 4, the height of the heat-conducting pillar 120-1 is substantially equal to the height of the heat-conducting walls 130-1 on both sides thereof. In other embodiments, the height of the heat-conducting pillar 120 is greater than the height of the heat-conducting wall 130-1. For example, as shown in Figure 4, the height of the heat-conducting pillar 120-3 is greater than the height of one side of the heat-conducting wall 130-1.
[0070] In some embodiments, the heat-conducting pillars 120 may have different heights as the contour of the body 110 changes. For example, the height of the heat-conducting pillar 120-1 located at the first portion 112 is less than the height of the heat-conducting pillar 120-4 located at the second portion 114.
[0071] In some embodiments, the width of the heat-conducting pillar 120 is greater than the thickness of the heat-conducting wall 130-1. It is worth noting that since the cross-sectional profile of the heat-conducting pillar 120 can be circular, square, or polygonal, the term "width" here can refer to the diameter of a circle, the side length of a square, or the minimum width of a polygon through its central axis. In these embodiments, viewed from the side, the heat-conducting pillar 120 protrudes beyond the heat-conducting wall 130-1, as shown in Figure 4.
[0072] The heat-conducting wall 130-3 is located on the bottom surface of the third portion 116 and is configured to abut against an element (e.g., driver 300) housed in the third accommodating space S3, so as to conduct the heat generated by the element to the main body 110 and dissipate it to the outside. The heat-conducting wall 130-3 is also referred to as the second heat-conducting wall.
[0073] The heat-conducting wall 130-2 is located on the bottom surface of the second part 114. The heat-conducting wall 130-2 can be connected between the heat-conducting column 120 (such as heat-conducting column 120-4) located in the second part 114 and the heat-conducting wall 130-3 located in the third part 116, or it can be connected between other structures located in the second accommodating space S2 and the heat-conducting wall 130-3 to increase structural strength.
[0074] With this configuration, multiple hollow areas are formed between the heat-conducting pillar 120 and the heat-conducting wall 130, which can reduce the overall weight of the heat-conducting structure and reduce material consumption.
[0075] As shown in Figures 1 and 5, after the LED street light 10 is assembled, the circuit board 200 is located in the first accommodating space S1 and coupled to the housing 100. The circuit board 200 includes a plurality of LEDs 210 arranged in an array. Each LED 210 corresponds one-to-one with a heat-conducting pillar 120. Further, the heat-conducting pillar 120 and the heat-conducting wall 130 are located between the body 110 and the circuit board 200, and extend from the body 110 toward the circuit board 200 (e.g., along direction Z), such that the bottom of each LED 210 contacts the top of its corresponding heat-conducting pillar 120. The light-emitting surface of the LED 210 faces away from the circuit board 200 and the heat-conducting structure. In this way, the heat generated when the LED 210 emits light can be conducted to the body 110 through the heat-conducting pillar 120. In some embodiments, the heat-conducting pillar 120 is perpendicular to the circuit board 200. In some embodiments, the circuit board 200 extends partially into the second accommodating space S2. In some embodiments, the circuit board 200 is coupled to the housing 100 by fasteners such as screws. In some embodiments, the circuit board 200 is a metal core printed circuit board (MCPCB).
[0076] In some implementations, the bottom area of each light-emitting diode 210 is greater than or substantially equal to the top area of its corresponding heat-conducting pillar 120. For example, the ratio between the top area of the heat-conducting pillar 120 and the bottom area of the light-emitting diode 210 is between 58% and 100%.
[0077] Furthermore, in embodiments where the top area of the heat-conducting pillar 120 is smaller than the bottom area of the light-emitting diode 210 and the height of the heat-conducting pillar 120 is substantially equal to the height of the heat-conducting wall 130-1, the heat-conducting wall 130-1 may partially contact the bottom surface of the light-emitting diode 210. In other embodiments, the heat-conducting wall 130-1 may contact other parts of the circuit board 200.
[0078] The driver 300 is located in the third accommodating space S3 and electrically connected to the light-emitting diode 210 on the circuit board 200, configured to supply power to and drive the light-emitting diode 210. In some embodiments, the driver 300 is coupled to the housing 100 by fasteners such as screws. As shown in FIG5, the driver 300 is locked into the housing 100 such that the driver 300 abuts against the thermally conductive wall 130-3.
[0079] A waterproof adhesive strip 400 is coupled to the housing 100 and configured to prevent moisture from seeping into the housing 100 and causing short circuits or component damage. Furthermore, after assembly, the waterproof adhesive strip 400 is located within the housing 100 and surrounds the circuit board 200 and the driver 300. In some embodiments, the waterproof adhesive strip 400 is sandwiched between the housing 100 and the lamp cover 600. In some embodiments, the waterproof adhesive strip 400 is made of ethylene propylene diene monomer (EPDM), silicone rubber, neoprene rubber, or the like.
[0080] The baffle 500 is located in the third accommodating space S3 and below the actuator 300. The baffle 500 is spaced apart from the actuator 300. In some embodiments, the baffle 500 is made of an opaque material. For example, the baffle 500 is made of polyester film (PET film) or the like.
[0081] The lamp cover 600 is located on the side of the circuit board 200 away from the heat-conducting pillar 120. In some embodiments, the lamp cover 600 is made of a light-transmitting material. For example, the lamp cover 600 is made of polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. The lamp cover 600 includes a plurality of lenses 610. Each lens 610 corresponds one-to-one with a light-emitting diode 210 and covers the light-emitting surface of the light-emitting diode 210 to serve as a secondary optical element. In some embodiments, each lens 610 is separate from its corresponding light-emitting diode 210. The lamp cover 600 may also include a cover body 620. The cover body 620 is located below the driver 300 and the stop 500. In some embodiments, the cover body 620 may contact the stop 500. In some embodiments, the lamp cover 600 is coupled to the housing 100 by fasteners such as screws.
[0082] The detailed description of the specific embodiments disclosed above clearly shows that in some embodiments of the LED streetlights disclosed herein, by setting a heat-conducting structure with a hollowed-out area between the main body of the housing and the main heat source, such as a circuit board, and in contact with the main heat source, efficient heat dissipation and weight reduction can be achieved. Furthermore, the heat-conducting structure includes heat-conducting pillars and heat-conducting walls. By using heat-conducting pillars to correspond one-to-one with and directly contact the LEDs on the circuit board, the heat generated by the LEDs can be conducted to the main body of the housing and then dissipated into the environment, thereby ensuring good heat dissipation. In addition, using heat-conducting walls to connect the heat-conducting pillars can further enhance heat dissipation capacity and increase the overall structural strength of the heat-conducting structure. Compared to common LED streetlights, the LED streetlights disclosed herein, through the aforementioned heat-conducting structure, can achieve lightweight construction and cost reduction while maintaining structural stability and heat dissipation performance.
[0083] The foregoing description is only intended to illustrate and describe exemplary embodiments disclosed herein, and is not intended to exhaustively describe or limit the precise forms of the utility model disclosed herein. The above teachings may be modified or varied.
[0084] The selected and illustrated embodiments are intended to explain the content of this disclosure and their practical application, thereby inspiring those skilled in the art to utilize this disclosure and various embodiments, and to make various modifications to suit a particular intended use. Alternative embodiments will be apparent to those skilled in the art without departing from the spirit and scope of this disclosure. Therefore, the scope of this disclosure is determined by the appended utility model claims and not by the foregoing specification and the exemplary embodiments described therein.
Claims
1. A light-emitting diode street light, characterized in that, The device comprises: a housing including a first heat-conducting wall and a plurality of heat-conducting pillars, wherein the first heat-conducting wall connects adjacent pairs of the plurality of heat-conducting pillars; and a circuit board coupled to the housing and including a plurality of light-emitting diodes, wherein the plurality of light-emitting diodes correspond to the plurality of heat-conducting pillars, and each of the plurality of light-emitting diodes is in contact with a corresponding one of the plurality of heat-conducting pillars.
2. The LED street light as described in claim 1, characterized in that, The bottom area of each of the plurality of light-emitting diodes is greater than or substantially equal to the top area of the corresponding one of the plurality of heat-conducting pillars.
3. The LED street light as described in claim 1, characterized in that, The width of each of the plurality of heat-conducting pillars is greater than the thickness of the first heat-conducting wall.
4. The LED street light as described in claim 1, characterized in that, The housing also includes a main body, wherein the first heat-conducting wall and the plurality of heat-conducting pillars are connected to the main body, and the first heat-conducting wall and the plurality of heat-conducting pillars extend from the main body toward the circuit board.
5. The LED street light as described in claim 4, characterized in that, The main body of the housing includes a first portion, a second portion, and a third portion, wherein the first portion defines a first accommodating space, the second portion defines a second accommodating space, and the third portion defines a third accommodating space, wherein the second portion connects the first portion and the third portion, the second accommodating space connects the first accommodating space and the third accommodating space, and the depth of the first accommodating space is less than the depth of the third accommodating space.
6. The LED street light as described in claim 5, characterized in that, The first heat-conducting wall and the plurality of heat-conducting pillars are located on the first part, and the circuit board is located in the first accommodating space.
7. The LED street light as described in claim 5, characterized in that, It also includes a driver located in the third accommodating space and electrically connected to the plurality of light-emitting diodes.
8. The LED street light as described in claim 7, characterized in that, The housing also includes a second thermally conductive wall, which is located on the third portion and configured to abut against the driver.
9. The LED street light as described in claim 5, characterized in that, The main body of the housing, the first heat-conducting wall, and the plurality of heat-conducting pillars are integrally formed as a continuous structure.
10. The LED street light as described in claim 1, characterized in that, One of the plurality of heat-conducting pillars has a height greater than or substantially equal to the height of the first heat-conducting wall.