Slurry thickness online detection mechanism for chip capacitor end sealing

Abstract

The utility model discloses a slurry thickness on-line detection mechanism for chip capacitor end sealing. The slurry thickness on-line detection mechanism comprises a slurry disc, a mounting bracket and a laser detector, the installation support comprises two supporting frames and a back plate, the two supporting frames are arranged on the two sides of the slurry disc in a protruding mode respectively, the rotating end of the back plate is rotationally connected to one supporting frame through a bearing seat, the adjusting end of the back plate is detachably installed on the other supporting frame, and the laser detector can be movably installed on the back face of the back plate in the length direction of the back plate. In order to accurately detect the thickness of a slurry layer in the slurry plate, a laser detector for detecting the thickness of the slurry layer is mounted on the side wall of the mounting bracket. In order to improve the detection precision of the laser detector and ensure the horizontal movement of the laser detector on the back plate, the mounting structure of the back plate is optimized, and the back plate is mounted in a manner of matching a bearing seat and a screw, so that the horizontal arrangement of the back plate is favorably adjusted and realized, and the horizontal movement of the laser detector on the back plate is further ensured.

Description

An online slurry thickness detection mechanism for chip capacitor end caps Technical Field

[0001] This utility model relates to the technical field of chip capacitor production equipment, and in particular to an online detection mechanism for the thickness of the slurry used for sealing chip capacitors. Background Technology

[0002] Traditional surface mount capacitor (SMT) end-sealing slurry spreading equipment simply spreads the slurry evenly and performs the sealing process. The spreading process involves: first, a scraper leveling the slurry in the slurry tray; then, a screw drives the slurry tray beneath the scraper to move back and forth while the scraper remains stationary. Because the gap between the scraper and the slurry tray is very small, the relative movement between them ensures a uniform slurry thickness on the tray surface.

[0003] In the existing process of sealing surface mount capacitors, a common method for applying the sealing paste involves neatly fixing multiple surface mount capacitors onto a carrier plate, ensuring that the ends of all capacitors to be sealed protrude neatly from one side of the carrier plate. The carrier plate is then pressed down onto the top of the paste in the paste tray, causing the ends of the surface mount capacitors to become coated with paste. However, in this method, some surface mount capacitors may fall into the paste tray during the dipping process, or even remain in the gap between the scraper and the paste tray. This results in uneven paste thickness on the tray, which can negatively impact the production of surface mount capacitors. Summary of the Invention

[0004] The purpose of this invention is to propose an online slurry thickness detection mechanism for sealing chip capacitors, which can effectively and accurately detect the thickness of the slurry layer in the slurry tray, thereby overcoming the shortcomings of the prior art.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] An online slurry thickness detection mechanism for sealing chip capacitors includes a slurry tray, a mounting bracket, and a laser detector; the mounting bracket is mounted on top of the slurry tray, and the slurry tray can move horizontally relative to the mounting bracket; the laser detector is disposed on the side wall of the mounting bracket.

[0007] The slurry tray is used to hold the slurry, and the laser detector is used to detect the thickness of the slurry layer;

[0008] The mounting bracket includes two support frames and a back plate. The two support frames are respectively protrudingly disposed on both sides of the paddle tray. The rotating end of the back plate is rotatably connected to one of the support frames through a bearing seat. The adjusting end of the back plate is detachably mounted to the other support frame through screws. The laser detector is movable along the length direction of the back plate and mounted behind the back plate.

[0009] Preferably, the mounting bracket further includes an adjustment micrometer head and a compression spring;

[0010] The adjusting micrometer head and the compression spring are mounted vertically opposite to each other on a support frame connected to the adjusting end of the back plate;

[0011] The adjustment micro head is located above the back plate, and the adjustment micro head can move up and down relative to the support frame, with the end of the adjustment micro head abutting against the top of the back plate;

[0012] The compression spring is located below the back plate and rests between the back plate and the support frame.

[0013] Preferably, the bottom of the adjustment end of the back plate and the surface of the support frame opposite to the bottom are both provided with mounting countersunk holes, which are used to accommodate the compression spring.

[0014] Preferably, the mounting bracket further includes a slide rail, which is projected onto the back of the back plate, and the extension direction of the slide rail is parallel to the length direction of the back plate.

[0015] The laser detector is slidably mounted on the slide rail.

[0016] Preferably, the mounting bracket further includes an adjusting block, which is detachably mounted on the back of the back plate and located on top of the slide rail; the adjusting block abuts against the slide rail.

[0017] Preferably, multiple adjusting blocks are provided.

[0018] The technical solution provided by this utility model can include the following beneficial effects:

[0019] To effectively and accurately detect the thickness of the slurry layer in the slurry tray, this solution incorporates a laser detector for slurry layer thickness detection mounted on the side wall of the mounting bracket, thereby enhancing the controllability of slurry thickness detection. Furthermore, to improve the detection accuracy of the laser detector and ensure its horizontal movement on the backplate, this solution optimizes the backplate's mounting structure. The backplate is installed using a combination of bearing seats and screws, facilitating adjustment and achieving a horizontal setting of the backplate, thus ensuring the horizontal movement of the laser detector on the backplate. Attached Figure Description

[0020] Figure 1 is a schematic diagram of the structure of an online slurry thickness detection mechanism for the sealing end of a chip capacitor according to the present invention.

[0021] Figure 2 is a partial structural schematic diagram of an online slurry thickness detection mechanism for chip capacitor end capping according to the present invention.

[0022] Among them: paddle tray 512, mounting bracket 518, support frame 5181, back plate 5182, bearing seat 5183, screw 5184, adjusting micrometer head 5185, mounting countersunk hole 5186, slide rail 5187, adjusting pressure block 5188, laser detector 519. Detailed Implementation

[0023] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0024] This technical solution provides an online slurry thickness detection mechanism for end capping of chip capacitors, including a slurry tray 512, a mounting bracket 518, and a laser detector 519; the mounting bracket 518 is mounted on the top of the slurry tray 512, and the slurry tray 512 can move horizontally relative to the mounting bracket 518; the laser detector 519 is disposed on the side wall of the mounting bracket 518.

[0025] The slurry tray 512 is used to hold the slurry, and the laser detector 519 is used to detect the thickness of the slurry layer;

[0026] The mounting bracket 518 includes two support frames 5181 and a back plate 5182. The two support frames 5181 are respectively protruding on both sides of the paddle tray 512. The rotating end of the back plate 5182 is rotatably connected to one of the support frames 5181 through a bearing seat 5183. The adjusting end of the back plate 5182 is detachably mounted to the other support frame 5181 through a screw 5184. The laser detector 519 is movably mounted behind the back plate 5182 along the length direction of the back plate 5182.

[0027] To effectively and accurately detect the thickness of the slurry layer in the slurry tray 512, this design includes a laser detector 519 for detecting the slurry layer thickness mounted on the side wall of the mounting bracket 518, thereby improving the controllability of slurry thickness detection. Furthermore, to enhance the detection accuracy of the laser detector 519 and ensure its horizontal movement on the back plate 5182, this design optimizes the mounting structure of the back plate 5182. As shown in Figure 1-2, the back plate 5182 is installed using a combination of bearing housing 5183 and screws 5184, which facilitates adjustment and horizontal setting of the back plate 5182, thus ensuring the horizontal movement of the laser detector 519 on the back plate 5182.

[0028] Furthermore, the mounting bracket 518 also includes an adjustment micrometer head 5185 and a compression spring;

[0029] The adjusting micrometer head 5185 and the compression spring are mounted vertically opposite to each other on the support frame 5181, which is connected to the adjusting end of the back plate 5182.

[0030] The adjustment micro head 5185 is located above the back plate 5182, and the adjustment micro head 5185 can move up and down relative to the support frame 5181. The end of the adjustment micro head 5185 abuts against the top of the back plate 5182.

[0031] The compression spring is located below the back plate 5182, and the compression spring abuts between the back plate 5182 and the support frame 5181.

[0032] In a preferred embodiment of this technical solution, the solution adds an adjustment micrometer head 5185 and a compression spring (not shown in the figure) to the adjustment end of the back plate 5182 to jointly achieve the adjustment of the level of the back plate 5182, which is more conducive to further improving the detection accuracy of the laser detector 519.

[0033] To further explain, the bottom of the adjustment end of the back plate 5182 and the surface of the support frame 5181 opposite to the bottom are both provided with mounting countersunk holes 5186, which are used to accommodate the compression spring.

[0034] This effectively prevents the compression spring from detaching from the mounting bracket 518.

[0035] Furthermore, the mounting bracket 518 also includes a slide rail 5187, which is protrudingly mounted on the back plate 5182, and the extending direction of the slide rail 5187 is parallel to the length direction of the back plate 5182.

[0036] The laser detector 519 is slidably mounted on the slide rail 5187.

[0037] Furthermore, the mounting bracket 518 also includes an adjusting block 5188, which is detachably mounted on the back of the back plate 5182 and located on top of the slide rail 5187; the adjusting block 5188 abuts against the slide rail 5187.

[0038] Since there may be tolerances in the production of slide rail 5187, in order to further ensure the horizontal movement of laser detector 519 and improve its detection accuracy, this solution also adds an adjustment block 5188 behind the back plate 5182. By adjusting the block 5188 against the slide rail 5187, the local levelness of the slide rail 5187 can be finely adjusted.

[0039] To further explain, multiple adjusting blocks 5188 are provided.

[0040] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0041] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0042] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0043] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0044] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0045] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0046] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. An online paste thickness detection mechanism for the sealing terminals of surface mount capacitors, characterized in that: The device includes a slurry tray, a mounting bracket, and a laser detector. The mounting bracket is mounted on top of the slurry tray, and the slurry tray is horizontally movable relative to the mounting bracket. The laser detector is disposed on the side wall of the mounting bracket. The slurry tray is used to hold slurry, and the laser detector is used to detect the thickness of the slurry layer. The mounting bracket includes two support frames and a back plate. The two support frames are respectively protrudingly disposed on both sides of the slurry tray. The rotating end of the back plate is rotatably connected to one of the support frames via a bearing seat. The adjusting end of the back plate is detachably mounted to the other support frame via screws. The laser detector is movable along the length direction of the back plate and mounted behind the back plate.

2. The online slurry thickness detection mechanism for chip capacitor end capping according to claim 1, characterized in that: The mounting bracket further includes an adjusting microhead and a compression spring; the adjusting microhead and the compression spring are vertically mounted opposite each other on a support frame connected to the adjusting end of the back plate; the adjusting microhead is located above the back plate and moves up and down relative to the support frame, with the end of the adjusting microhead abutting against the top of the back plate; the compression spring is located below the back plate and abuts against the back plate and the support frame.

3. The online slurry thickness detection mechanism for chip capacitor end capping according to claim 2, characterized in that: The bottom of the adjustment end of the back plate and the surface of the support frame opposite to the bottom are both provided with mounting countersunk holes, which are used to accommodate the compression spring.

4. The online slurry thickness detection mechanism for chip capacitor end capping according to claim 1, characterized in that: The mounting bracket also includes a slide rail, which is projected onto the back of the back plate and extends in a direction parallel to the length of the back plate; the laser detector is slidably mounted on the slide rail.

5. The online paste thickness detection mechanism for chip capacitor end caps according to claim 4, characterized in that: The mounting bracket further includes an adjusting block, which is detachably mounted on the back of the back plate and located on top of the slide rail; the adjusting block abuts against the slide rail.

6. The online paste thickness detection mechanism for chip capacitor end capping according to claim 5, characterized in that: Multiple adjusting blocks are provided.

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