Testing machine and resource board card thereof

Abstract

The utility model relates to a testing machine and a resource board card thereof, the resource board card comprises a PE chip, an analog-to-digital converter ADC1 and a cable, the analog-to-digital converter ADC1 is connected with a pin associated with output channel voltage on the PE chip, the cable is connected with each pin of a device to be tested and is also connected with the analog-to-digital converter ADC1, and the PE chip is connected with the cable. The cable transmits voltage signals transmitted by each pin of the to-be-tested device to the analog-to-digital converter ADC1 for measurement; the analog-to-digital converter ADC1 also obtains related voltage signals of the PE chip for analog-to-digital conversion to obtain voltage data for performing DC voltage calibration on the PE chip. The DC voltage calibration of the PE chip and the measurement of all channels of the to-be-tested device can be realized by using the analog-to-digital converter ADC1, the use is more flexible and convenient, the use scene is expanded, and the test convenience is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a testing machine and its resource board. Background Technology

[0002] Semiconductor automated testing refers to the use of automated test equipment (ATE) to inspect various parameters of the device under test (DUT), rejecting defective products to control the quality of semiconductor devices before they leave the factory. Before testing, relevant calibration operations are required to ensure accuracy. Traditional test equipment board calibration methods only provide partial channel BADC (Board ADC) functionality, intermittently selecting voltage signals from only a portion of the DUT's channels for measurement. This limits application scenarios and results in low testing convenience. Utility Model Content

[0003] Therefore, it is necessary to provide a test machine and its resource boards that can improve the convenience of testing in order to address the above problems.

[0004] The first aspect of this application provides a resource board for a test machine, including a PE chip, an analog-to-digital converter (ADC1), and cables. The ADC1 is connected to pins on the PE chip associated with the output channel voltage. The cables are connected to pins of the device under test (DUT) and also to the ADC1. The cables transmit voltage signals from the pins of the DUT to the ADC1 for measurement. The ADC1 also acquires relevant voltage signals from the PE chip and performs analog-to-digital conversion to obtain voltage data for DC voltage calibration of the PE chip.

[0005] In one embodiment, the resource board further includes a high-voltage PIN function circuit, which connects the output channel of the PE chip and the cable, boosts the voltage signal output by the output channel of the PE chip, and transmits the boosted voltage signal to the corresponding pin of the device under test through the cable.

[0006] In one embodiment, the resource board further includes a low-voltage switch, and each output channel of the PE chip is connected to the cable through a corresponding low-voltage switch. The first end of one of the low-voltage switches is connected to the high-voltage PIN function circuit and the output channel of the PE chip, and the second end is connected to the high-voltage PIN function circuit and the cable.

[0007] In one embodiment, the high-voltage PIN functional circuit includes an operational amplifier, resistors R1, R2, and R3, and a high-voltage switch S8. The non-inverting input of the operational amplifier is connected to the first terminal of the low-voltage switch, the inverting input of the operational amplifier is connected to the first terminals of resistors R1 and R2, the output of the operational amplifier is connected to the first terminal of resistor R3, the second terminal of resistor R1 is grounded, the second terminal of resistor R3 is connected to the second terminal of resistor R2 and the first terminal of the high-voltage switch S8, and the second terminal of the high-voltage switch S8 is connected to the second terminal of the low-voltage switch.

[0008] When the low-voltage switch is open and the high-voltage switch S8 is closed, the high-voltage PIN function circuit boosts the voltage signal output by the corresponding output channel of the PE chip and transmits the boosted voltage signal to the corresponding pin of the device under test through the cable.

[0009] In one embodiment, the high-voltage PIN functional circuit further includes a voltage divider component, a switch S9, and a switch S10. The first terminal of the switch S9 is connected to the second terminal of the resistor R3, and the second terminal of the switch S9 is connected to the voltage divider component. The first terminal of the switch S10 is connected to the voltage divider component, and the second terminal of the switch S10 is connected to the analog-to-digital converter ADC1. When the switches S9 and S10 are closed, the boosted voltage signal output by the high-voltage PIN functional circuit is divided by the voltage divider component and then sent to the analog-to-digital converter ADC1 for analog-to-digital conversion to obtain voltage data for calibrating the high-voltage PIN functional circuit.

[0010] In one embodiment, the resource board further includes an AC calibration switch link, an AC calibration link, and an AC calibration switch. The AC calibration link is connected to each output channel of the PE chip via an AC calibration switch. The AC calibration switch link is connected to the AC calibration link for AC link-based calibration.

[0011] In one embodiment, the resource board also includes an analog-to-digital converter (ADC2) and a current calibration module. The current calibration module includes a high-precision resistor array and a digital-to-analog converter (DAC). The high-precision resistor array is connected to the DAC, the ADC2, and a pin on the PE chip associated with the output channel voltage.

[0012] In one embodiment, the high-precision resistor array includes switches S6 and S7 and two or more resistor switching units. Each resistor switching unit is connected in parallel, with one end connected to the analog-to-digital converter ADC2 and the pin on the PE chip associated with the output channel voltage via corresponding analog switches. The other end is connected to the first terminal of switch S6 and the first terminal of switch S7. The second terminal of switch S6 is grounded, and the second terminal of switch S7 is connected to the digital-to-analog converter DAC.

[0013] In one embodiment, the resource board further includes a motherboard and a daughterboard. The PE chip, analog-to-digital converter ADC1, cables, high-voltage PIN functional circuit, low-voltage switch, AC calibration link and AC calibration switch are disposed on the daughterboard, and the AC calibration switch link, analog-to-digital converter ADC2 and current calibration module are disposed on the motherboard.

[0014] A second aspect of this application provides a test machine, including the aforementioned resource board.

[0015] The aforementioned test unit and its resource boards connect to the pins of the device under test (DUT) via cables. The analog-to-digital converter (ADC1) connects to the pins on the PE chip associated with the output channel voltage, along with the cables. The cables transmit the voltage signals from each pin of the DUT to the ADC1 for measurement. The ADC1 also acquires the relevant voltage signals from the PE chip and performs analog-to-digital conversion to obtain voltage data used for DC voltage calibration of the PE chip. Using the ADC1, DC voltage calibration of the PE chip and measurement of all channels of the DUT can be achieved, making it more flexible and convenient, expanding its application scenarios, and improving testing convenience. Attached Figure Description

[0016] Figure 1 This is a structural block diagram of the resource board of a test machine in one embodiment;

[0017] Figure 2 This is a schematic diagram of the resource board of a test machine in one embodiment;

[0018] Figure 3 This is a schematic diagram of the resource board of the test machine in another embodiment. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0021] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0022] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, operations, components, parts, or combinations thereof.

[0023] In one embodiment, such as Figure 1 As shown, a resource board for a test machine is provided, including a PE (Pin Electronic Circuit) chip 8, an analog-to-digital converter (ADC1), and a cable. The ADC1 is connected to the pins on the PE chip 8 associated with the output channel voltage. The cable is connected to each pin of the device under test (DUT) and also to the ADC1. The cable transmits the voltage signals from each pin of the DUT to the ADC1 for measurement. The ADC1 also acquires the relevant voltage signals from the PE chip 8 and performs analog-to-digital conversion to obtain voltage data for DC voltage calibration of the PE chip 8.

[0024] By transmitting the relevant voltage signals from the cable and PE chip 8 to the analog-to-digital converter (ADC1) respectively, DC voltage calibration of the PE chip 8 and measurement of all channels of the device under test can be achieved. This makes the method more flexible and convenient, eliminating the limitation of only certain channels of the device under test supporting BADC functionality, thus expanding the application scenarios and facilitating testing. Specifically, the pins on the PE chip 8 associated with the output channel voltage are connected to the ADC1 via corresponding analog switches, and the cable is also connected to the ADC1 via corresponding analog switches. By controlling the on / off state of the analog switches, the ADC1 is connected to either the PE chip 8 or the cable, receiving the corresponding voltage signals for conversion, thereby obtaining voltage data for DC voltage calibration or voltage data for full-channel BADC measurement.

[0025] Furthermore, the resource board may also include functional modules such as a high-voltage PIN circuit, a low-voltage switch, an AC calibration link, an AC calibration switch, an AC calibration switch link, an analog-to-digital converter (ADC2), and a current calibration module. These functional modules can be located on the same board or on different boards. For example, the resource board may include a motherboard and daughter boards. The PE chip, ADC1, cables, high-voltage PIN circuit, low-voltage switch, AC calibration link, and AC calibration switch are located on the daughter board, while the AC calibration switch link, ADC2, and current calibration module are located on the motherboard. There can be multiple daughter boards, each with the same structure, and the motherboard connects to each daughter board.

[0026] like Figure 2 As shown, the PE chip 8, analog-to-digital converter (ADC1), and cable are all located on daughterboard 1. The PE chip 8 has multiple output channels 9. Pins associated with the voltage of output channels 9 include the MON_0 and EXT_FRC_0 pins. The MON_0 and EXT_FRC_0 pins are connected to the ADC1 via corresponding analog switches 6. The MON_0 pin tracks the voltage of output channels 9 internally within the PE chip 8, and the EXT_FRC_0 pin is directly connected to output channels 9 via an internal switch of the PE chip 8. Therefore, the MON_0 and EXT_FRC_0 pins can send various voltage signals from the PE chip 8 to the ADC1, thereby enabling DC voltage calibration and verification tests to be performed on the daughterboard. By setting up the ADC1 on each daughterboard, each daughterboard 1 can perform voltage calibration and verification tests simultaneously, saving time and improving calibration efficiency.

[0027] The cable is the connection cable between the board and the device under test (DUT). The cable leads out from this board and connects to the load board (LB) or pin card that contacts the pins of the DUT. Each signal on the cable can be connected to the analog-to-digital converter (ADC1) via the analog switch 6 on its right. The ADC1 then functions as a BADC to measure the voltage signal sent from the DUT through the cable, thus enabling the BADC function of all channels.

[0028] In one embodiment, such as Figure 2As shown, the resource board also includes a high-voltage PIN function circuit 14, which is mounted on the daughter board 1. The high-voltage PIN function circuit 14 connects the output channel 9 of the PE chip 8 to the cable, boosting the voltage signal output from the output channel 9 of the PE chip 8, and then transmitting the boosted voltage signal to the corresponding pin of the device under test via the cable. Specifically, the high-voltage PIN function circuit 14 can be configured to boost the output voltage of one channel from the multiple output channels 9 of the PE chip 8 at predetermined intervals. For example, refer to... Figure 2 The output channel 9 of the PE chip 8 includes channels DOUT_0 to DOUT_7. Channel DOUT_1 can be connected to the high-voltage PIN function circuit 14. The high-voltage PIN function circuit 14 is used to boost the voltage signal output from channel DOUT_1, and the boosted voltage signal is transmitted to the corresponding pin of the device under test through the cable CABLE.

[0029] Furthermore, the resource board also includes a low-voltage switch 10. Each output channel 9 of the PE chip 8 is connected to a cable CABLE through a corresponding low-voltage switch 10. The first end of one low-voltage switch 10 is connected to the high-voltage PIN function circuit 14 and the output channel 9 of the PE chip 8, and the second end is connected to the high-voltage PIN function circuit 14 and the cable CABLE.

[0030] Taking the use of the high-voltage PIN function circuit 14 to boost the voltage signal output from channel DOUT_1 as an example, channels DOUT_0 to DOUT_7 of the PE chip 8 are connected to the cable via the corresponding low-voltage switch 10. When measuring the voltage of each pin of the device under test, the low-voltage switch 10 on the left side of the cable is turned off, and the analog switch 6 on the right side of the cable is closed. The cable then transmits the voltage signals from each pin of the device under test to the analog-to-digital converter ADC1 for measurement. When using the PE chip 8 to output voltage to the device under test (DUT), the low-voltage switches 10 corresponding to channels other than DOUT_1 are closed. The output channel 9 of the PE chip 8 outputs a voltage signal (voltage range -1.5V to 5.5V). The voltage signals output from channels other than DOUT_1 are transmitted to the ordinary pins of the DUT via the cable. The voltage signal output from channel DOUT_1 is boosted by the high-voltage PIN function circuit 14 to obtain a boosted voltage signal (voltage range 0V to 13.5V), which is then transmitted to the high-voltage pin of the DUT via the cable, thus achieving high-voltage output to the DUT. For example, if the voltage output from channel DOUT_1 is 5.4V, it will be amplified by the high-voltage PIN function circuit 14 to output 13.5V, thereby realizing the high-voltage PIN function.

[0031] The circuit structure of the high-voltage PIN functional circuit 14 is not unique; in one embodiment, refer to... Figure 2 The high-voltage PIN function circuit 14 includes an operational amplifier U1, resistors R1, R2, and R3, and a high-voltage switch S8. The non-inverting input of operational amplifier U1 is connected to the first terminal of low-voltage switch 10. The inverting input of operational amplifier U1 is connected to the first terminals of resistors R1 and R2. The output of operational amplifier U1 is connected to the first terminal of resistor R3. The second terminal of resistor R1 is grounded. The second terminal of resistor R3 is connected to the second terminal of resistor R2 and the first terminal of high-voltage switch S8. The second terminal of high-voltage switch S8 is connected to the second terminal of low-voltage switch 10. When low-voltage switch 10 is open and high-voltage switch S8 is closed, the high-voltage PIN function circuit 14 boosts the voltage signal output from the corresponding output channel 9 of PE chip 8 and transmits the boosted voltage signal to the corresponding pin of the device under test via cable CABLE.

[0032] In addition, the high-voltage PIN function circuit 14 also includes a voltage divider assembly, a switch S9, and a switch S10. The first end of switch S9 is connected to the second end of resistor R3, and the second end of switch S9 is connected to the voltage divider assembly. The first end of switch S10 is connected to the voltage divider assembly, and the second end of switch S10 is connected to the analog-to-digital converter ADC1. When switches S9 and S10 are closed, the boosted voltage signal output by the high-voltage PIN function circuit 14 is divided by the voltage divider assembly and then sent to the analog-to-digital converter ADC1 for analog-to-digital conversion to obtain voltage data for calibrating the high-voltage PIN function circuit 14.

[0033] Because the high voltage obtained after boosting by the high-voltage PIN function circuit 14 exceeds the range of the analog-to-digital converter ADC1, voltage division is required. When switches S9 and S10 are closed, the boosted voltage signal is sent to the voltage divider component through switch S9 for voltage division. The divided voltage signal is then sent to the analog-to-digital converter ADC1 through switch S10 to obtain voltage data, which is used for calibration of the high-voltage PIN function circuit 14. The voltage divider component may include resistors R4 and R5. The first end of resistor R4 is connected to the second end of switch S9, the second end of resistor R4 is connected to the first end of resistor R5 and the first end of switch S10, and the second end of resistor R5 is grounded.

[0034] In one embodiment, such as Figure 2 As shown, the resource board also includes AC calibration switch link 13, AC calibration link 12, and AC calibration switch. AC calibration link 12 and AC calibration switch are located on sub-board 1, and AC calibration switch link 13 is located on motherboard 2. AC calibration link 12 is connected to each output channel 9 of PE chip 8 through an AC calibration switch; AC calibration switch link 13 is connected to AC calibration link 12 for AC link calibration.

[0035] Specifically, Figure 2 The red section represents the AC internal calibration path. Taking the output channel 9 of PE chip 8, including channels DOUT_0 to DOUT_7, as an example, the AC calibration switches may include switches TC0 to TC7, which are respectively connected to channels DOUT_0 to DOUT_7. Each AC calibration switch can be a relay switch. AC calibration link 12 connects AC calibration switch link 13 and switches TC0 to TC7. AC calibration link 12 includes switches K1, K2, and K3 connected in sequence. AC calibration switch link 13 includes switches K4, K5, and K6 connected in sequence. Switch K4 is also connected to switch K3. Switches K1 to K6 can all be mechanical relays.

[0036] Each output channel 9 of PE chip 8 uses an AC calibration switch to add an AC calibration channel. After all AC calibration channels are connected together, they are further connected together by switches K1, K2, and K3, and then connected to motherboard card 2. On motherboard card 2, switches K4, K5, and K6 aggregate the AC calibration links 12 connected to each sub-board 1, realizing the AC link calibration function within the resource board. Furthermore, switch K6 also connects to the communication board CTI, and AC calibration link 12 is connected to the communication board CTI via AC calibration switch link 13, realizing the AC link calibration function between resource boards, eliminating the need for a separate external AC calibration board.

[0037] In one embodiment, continue to refer to Figure 2 The resource board also includes an analog-to-digital converter (ADC2) and a current calibration module 15, which are mounted on the mainboard 2. The current calibration module 15 is used for current calibration. The current calibration module 15 includes a high-precision resistor array 16 and a digital-to-analog converter (DAC). The high-precision resistor array 16 is connected to the DAC, the ADC2, and the pins on the PE chip 8 associated with the output channel voltage. The DAC provides a voltage bias for current calibration, and a 6.5-digit voltmeter is used to accurately measure the resistance values ​​of each resistor in the high-precision resistor array 16. Then, the current of the PE chip 8 is calibrated based on the high-precision resistor array 16.

[0038] The high-precision resistor array 16 includes switches S6 and S7, and two or more resistor switching units. These units are connected in parallel, with one end connected via analog switches to pins on the analog-to-digital converter (ADC2) and the PE chip 8 associated with the output channel voltage. The other end connects to the first terminals of switches S6 and S7. The second terminal of switch S6 is grounded, and the second terminal of switch S7 is connected to the digital-to-analog converter (DAC). In this embodiment, the high-precision resistor array 16 includes five resistor switching units, each consisting of a switch and a resistor connected in series. Specifically, switch S1 and resistor R6 are connected in series to form one resistor switching unit; switch S2 and resistor R7 are connected in series to form one resistor switching unit; switch S3 and resistor R8 are connected in series to form one resistor switching unit; switch S4 and resistor R9 are connected in series to form one resistor switching unit; and switch S5 and resistor R10 are connected in series to form one resistor switching unit. Resistors R6 to R10 are all high-precision calibration resistors. Each resistor switching unit is connected at one end to the EXT_FRC_0 pin on the analog-to-digital converter ADC2 and the PE chip 8 respectively via a corresponding analog switch, and at the other end to the first terminal of switch S6 and the first terminal of switch S7.

[0039] Specifically, the output voltage of the digital-to-analog converter (DAC) can be configured to provide a voltage bias for current calibration. The high-precision resistor array 16 has five current ranges from 2µA to 50mA, each corresponding to a high-precision calibration resistor. The resistance value of each high-precision calibration resistor is precisely measured using a 6.5-digit voltmeter. During current calibration, the current is output from the EXT_FRC_0 pin of the PE chip 8 on daughterboard 1, passes through analog switch 6, and is sent to the resistor of the corresponding current range in the high-precision resistor array 15 on motherboard 2 to establish a voltage. The analog-to-digital converter (ADC2) measures the voltage across the resistor and combines this with the resistance value measured by the 6.5-digit voltmeter to calculate the current value, thus achieving current calibration.

[0040] It should be noted that, Figure 2 The resource board includes a motherboard 2 and a daughterboard 1. A PE chip 8, an analog-to-digital converter (ADC) 1, a cable, a high-voltage PIN functional circuit 14, a low-voltage switch 10, an AC calibration link 12, and an AC calibration switch are located on the daughterboard 1. An AC calibration switch link 13, an ADC 2, and a current calibration module 15 are located on the motherboard 2. In other embodiments, such as... Figure 3 As shown, the PE chip 8, analog-to-digital converter ADC1, cable, high-voltage PIN function circuit 14, low-voltage switch 10, AC calibration link 12, AC calibration switch, AC calibration switch link 13, analog-to-digital converter ADC2, and current calibration module 15 can all be set on the same board.

[0041] In one embodiment, a test machine is also provided, including the resource board described above.

[0042] The aforementioned testing machine and its resource board integrate multiple topology circuit functions, including DC voltage and current calibration verification items, AC calibration verification items, HVPIN calibration verification items, and BADC, reducing the number of steps and auxiliary boards in the production process and improving production efficiency. This resource board has the following advantages:

[0043] 1. Supports internal AC calibration. No additional external AC calibration card is required, reducing the steps involved in operating the external calibration card and thus improving production efficiency.

[0044] 2. All channels support BADC functionality. This makes it more flexible and convenient for customers to use, and they will not be limited by the fact that only certain channels support BADC functionality.

[0045] 3. Improve the efficiency of voltage calibration and verification tests. Each sub-board has an FE_ADC, and all sub-boards can perform voltage calibration and verification tests simultaneously, saving time and improving production efficiency.

[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A resource board for a testing machine, characterized in that, The device includes a PE chip, an analog-to-digital converter (ADC1), and cables. The ADC1 is connected to a pin on the PE chip associated with the output channel voltage. The cables are connected to each pin of the device under test (DUT) and also to the ADC1. The cables transmit the voltage signals from each pin of the DUT to the ADC1 for measurement. The ADC1 also acquires the relevant voltage signals from the PE chip and performs analog-to-digital conversion to obtain voltage data for DC voltage calibration of the PE chip.

2. The resource board according to claim 1, characterized in that, It also includes a high-voltage PIN function circuit, which connects the output channel of the PE chip and the cable, boosts the voltage signal output by the output channel of the PE chip, and transmits the boosted voltage signal to the corresponding pin of the device under test through the cable.

3. The resource board card of claim 2, wherein, It also includes a low-voltage switch, wherein each output channel of the PE chip is connected to the cable through a corresponding low-voltage switch, wherein the first end of one of the low-voltage switches is connected to the high-voltage PIN functional circuit and the output channel of the PE chip, and the second end is connected to the high-voltage PIN functional circuit and the cable.

4. The resource board card of claim 3, wherein, The high-voltage PIN functional circuit includes an operational amplifier, resistors R1, R2, and R3, and a high-voltage switch S8. The non-inverting input of the operational amplifier is connected to the first terminal of the low-voltage switch, the inverting input of the operational amplifier is connected to the first terminals of resistors R1 and R2, the output of the operational amplifier is connected to the first terminal of resistor R3, the second terminal of resistor R1 is grounded, the second terminal of resistor R3 is connected to the second terminal of resistor R2 and the first terminal of the high-voltage switch S8, and the second terminal of the high-voltage switch S8 is connected to the second terminal of the low-voltage switch. When the low-voltage switch is open and the high-voltage switch S8 is closed, the high-voltage PIN function circuit boosts the voltage signal output by the corresponding output channel of the PE chip and transmits the boosted voltage signal to the corresponding pin of the device under test through the cable.

5. The resource board according to claim 4, characterized in that, The high-voltage PIN functional circuit also includes a voltage divider component, a switch S9, and a switch S10. The first terminal of the switch S9 is connected to the second terminal of the resistor R3, and the second terminal of the switch S9 is connected to the voltage divider component. The first terminal of the switch S10 is connected to the voltage divider component, and the second terminal of the switch S10 is connected to the analog-to-digital converter ADC1. When the switches S9 and S10 are closed, the boosted voltage signal output by the high-voltage PIN functional circuit is divided by the voltage divider component and then sent to the analog-to-digital converter ADC1 for analog-to-digital conversion to obtain voltage data for calibrating the high-voltage PIN functional circuit.

6. The resource board according to any one of claims 1 to 5, characterized in that, It also includes an AC calibration switch link, an AC calibration link, and an AC calibration switch, wherein the AC calibration link is connected to each output channel of the PE chip through one of the AC calibration switches; The AC calibration switch link is connected to the AC calibration link for in-link calibration.

7. The resource board card of claim 6, wherein, It also includes an analog-to-digital converter (ADC2) and a current calibration module. The current calibration module includes a high-precision resistor array and a digital-to-analog converter (DAC). The high-precision resistor array is connected to the DAC, the ADC2, and a pin on the PE chip associated with the output channel voltage.

8. The resource board according to claim 7, characterized in that, The high-precision resistor array includes switches S6 and S7 and two or more resistor switching units. Each resistor switching unit is connected in parallel. One end of each unit is connected to the analog-to-digital converter ADC2 and the pin on the PE chip associated with the output channel voltage through a corresponding analog switch. The other end of each unit is connected to the first terminal of switch S6 and the first terminal of switch S7. The second terminal of switch S6 is grounded, and the second terminal of switch S7 is connected to the digital-to-analog converter DAC.

9. The resource board card according to any one of claims 1 to 5, wherein, It also includes a motherboard and a daughterboard. The PE chip, analog-to-digital converter ADC1, cables, high-voltage PIN function circuit, low-voltage switch, AC calibration link and AC calibration switch are located on the daughterboard, and the AC calibration switch link, analog-to-digital converter ADC2 and current calibration module are located on the motherboard.

10. A testing machine characterized by, Includes the resource board as described in any one of claims 1 to 9.

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