Low-power-consumption type solid state disk heat dissipation structure

Abstract

The utility model provides a low-power-consumption type solid state disk heat dissipation structure, which belongs to the technical field of hard disks and comprises a main heat dissipation component, a heat dissipation component, a heat dissipation component, a heat dissipation component, a heat dissipation component, a heat dissipation component, a heat dissipation component and a heat dissipation component. The auxiliary heat dissipation component comprises an auxiliary shell fixedly connected to the side wall of the main shell, a heat pipe inserted into the center of the auxiliary shell and auxiliary fins packaged on the side wall of the auxiliary shell. The heat dissipation device has the advantages that the main heat dissipation component and the auxiliary heat dissipation component work cooperatively, the main fins and the auxiliary fins are of an auxiliary heat dissipation structure, the efficient heat transfer capacity of the heat pipes is combined, heat generated by the solid state disk can be dissipated quickly and effectively, the heat dissipation efficiency is improved, and the service life of the solid state disk is prolonged. The risk of performance reduction or failure caused by overheating of the solid state disk is reduced, additional active heat dissipation equipment is not needed, and therefore power consumption of the whole system is reduced, and the use requirement of the low-power-consumption solid state disk is met.

Description

A low-power solid-state drive heat dissipation structure Technical Field

[0001] This utility model belongs to the field of hard disk technology, specifically relating to a low-power solid-state drive heat dissipation structure. Background Technology

[0002] With the rapid development of information technology, solid-state drives (SSDs) have become widely used in consumer electronics, data centers, and cloud computing due to their advantages such as fast read / write speeds, strong shock resistance, and low power consumption. To meet users' ever-increasing demands for data storage capacity and read / write performance, SSDs are constantly evolving towards higher capacity and higher performance. However, this also leads to a significant increase in the heat generated during operation. Excessive temperature can cause SSDs to experience performance degradation, shortened lifespan, and even data loss. Therefore, effective heat dissipation design has become a key factor in ensuring the stable operation of SSDs.

[0003] In numerous application scenarios, the demand for low power consumption is becoming increasingly prominent. For example, in portable mobile devices, IoT terminals, and embedded systems, devices are extremely sensitive to energy consumption. Traditional high-power cooling solutions, such as high-power fans for forced cooling, not only increase the overall power consumption of the device but also occupy a lot of space, failing to meet the usage requirements of these scenarios. Summary of the Invention

[0004] The purpose of this invention is to provide a low-power solid-state drive heat dissipation structure, which aims to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A low-power solid-state drive heat dissipation structure includes,

[0007] The main heat dissipation component includes a main housing, a copper core fixedly connected inside the main housing, and main fins fixedly connected outside the main housing, wherein the main fins are symmetrically installed on the outside of the copper core;

[0008] The secondary heat dissipation component includes a secondary housing fixedly connected to the side wall of the main housing, a heat pipe inserted into the center of the secondary housing, and secondary fins encapsulated in the side wall of the secondary housing. The secondary fins cooperate with the main fins, and the inner wall of the secondary housing is in close contact with the side wall of the copper core.

[0009] In a preferred embodiment of this utility model, the main fin is mounted on the side wall of the secondary housing, and the end side wall of the main fin has an arc-shaped edge structure.

[0010] As a preferred embodiment of this utility model, the heat pipe has a cavity structure inside, and a plug is sealed at the end of the heat pipe.

[0011] As a preferred embodiment of this utility model, the heat pipe is tightly inserted into the inner wall of the sub-shell, and the end side wall of the heat pipe is provided with an arc-shaped edge structure that cooperates with the inner wall of the sub-shell.

[0012] As a preferred embodiment of the present invention, the main heat dissipation component further includes a hard disk connection plate fixedly connected to the bottom of the main housing. The hard disk connection plate has mounting holes on its side wall, and the central groove of the hard disk connection plate is engaged with the side wall of the copper core.

[0013] In a preferred embodiment of this utility model, the bottom width of the sub-shell is greater than the width of the copper core, and the sidewall of the copper core is flush with the bottom sidewall of the hard disk connection board.

[0014] As a preferred embodiment of the present invention, the main heat dissipation component further includes a set screw threaded to the side wall of the main housing, and the end of the set screw is inserted into the side wall of the copper core.

[0015] Compared with the prior art, the beneficial effects of this utility model are: the coordinated work of the main heat dissipation component and the secondary heat dissipation component, as well as the large-area design of the main fins and the secondary fins and the optimized airflow structure, combined with the efficient heat transfer capability of the heat pipe, can quickly and effectively dissipate the heat generated by the solid-state drive, improve heat dissipation efficiency, reduce the risk of performance degradation or failure of the solid-state drive due to overheating, eliminate the need for additional active cooling equipment, thereby reducing the power consumption of the entire system and meeting the usage requirements of low-power solid-state drives. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0017] Figure 1 is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 is a schematic diagram of the bottom structure of this utility model;

[0019] Figure 3 is a top view of the structure of this utility model;

[0020] Figure 4 is a side view of the present invention.

[0021] In the diagram: 100, main heat dissipation component; 101, main housing; 102, copper core; 103, main fins; 104, hard disk connection board; 105, set screw; 200, secondary heat dissipation component; 201, secondary housing; 202, heat pipe; 203, secondary fins; 204, plug. Detailed Implementation

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0025] Example

[0026] Referring to Figures 1-4, an embodiment of the present invention is provided, which offers a low-power solid-state drive heat dissipation structure, including:

[0027] The main heat dissipation component 100 includes a main housing 101, a copper core 102 fixedly connected inside the main housing 101, and main fins 103 fixedly connected outside the main housing 101. The main fins 103 are symmetrically installed on the outside of the copper core 102.

[0028] The secondary heat dissipation component 200 includes a secondary housing 201 fixedly connected to the side wall of the main housing 101, a heat pipe 202 inserted into the center of the secondary housing 201, and a secondary fin 203 encapsulated in the side wall of the secondary housing 201. The secondary fin 203 is used in conjunction with the main fin 103, and the inner wall of the secondary housing 201 is in close contact with the side wall of the copper core 102.

[0029] The main heat dissipation component 100, as the core basic unit of the heat dissipation system, consists of a main housing 101, a copper core 102, main fins 103, a hard drive connection plate 104, and set screws 105. The main housing 101 is made of a high-strength material with good thermal conductivity, providing a stable mounting frame and physical protection for the internal components. The copper core 102 is fixedly connected inside the main housing 101; copper has excellent thermal conductivity, enabling it to quickly absorb the heat generated by the solid-state drive during operation. The main fins 103 are symmetrically mounted on the outside of the copper core 102 and are installed on the side wall of the secondary housing 201, improving heat dissipation efficiency. The secondary heat dissipation component 200 plays an auxiliary and enhanced role in heat dissipation, consisting of a secondary housing 201, heat pipes 202, and secondary fins 203. The secondary housing 201 is fixedly connected to the side wall of the main housing 101, and its inner wall is in close contact with the side wall of the copper core 102, ensuring that the heat absorbed by the copper core 102 can be quickly transferred to the secondary housing 201. The heat pipe 202 utilizes the phase change principle of its internal working medium to achieve efficient heat transfer. The heat pipe 202 is tightly inserted into the inner wall of the sub-casing 201, and its end sidewall has an arc-shaped edge structure that mates with the inner wall of the sub-casing 201. This tight fit and arc-shaped edge design effectively enhances the contact area and heat conduction efficiency between the heat pipe 202 and the sub-casing 201. The sub-fins 203 are encapsulated in the sidewall of the sub-casing 201 and work in conjunction with the main fins 103, further expanding the contact area between the entire heat dissipation structure and the air, forming a more efficient heat dissipation network.

[0030] Specifically, the main fin 103 is installed on the side wall of the secondary housing 201, and the end side wall of the main fin 103 is provided with an arc-shaped edge structure.

[0031] The main fin 103 is mounted on the side wall of the secondary shell 201, and its end side wall has an arc-shaped edge structure. This symmetrical distribution and arc-shaped edge design not only increases the contact area between the main fin 103 and the air, but also optimizes the airflow path.

[0032] Furthermore, the heat pipe 202 has an internal cavity structure, and a plug 204 is sealed at the end of the heat pipe 202.

[0033] The plug 204 allows for easy opening of the heat pipe 202, replenishment of the heat pipe 202 with heat-conducting liquid, and facilitates heat dissipation and maintenance of the heat pipe 202.

[0034] Furthermore, the heat pipe 202 is tightly inserted into the inner wall of the sub-casing 201, and the end side wall of the heat pipe 202 is provided with an arc-shaped edge structure that cooperates with the inner wall of the sub-casing 201.

[0035] The heat pipe 202 is tightly inserted into the inner wall of the sub-shell 201, and the end side wall is provided with an arc-shaped edge structure that cooperates with the inner wall of the sub-shell 201. This tight fit and arc-shaped edge design can effectively enhance the contact area and heat conduction efficiency between the heat pipe 202 and the sub-shell 201.

[0036] Preferably, the main heat dissipation component 100 also includes a hard disk connection plate 104 fixedly connected to the bottom of the main housing 101. The hard disk connection plate 104 has mounting holes on its side wall, and the central groove of the hard disk connection plate 104 is engaged with the side wall of the copper core 102. The bottom width of the sub-housing 201 is greater than the width of the copper core 102, and the side wall of the copper core 102 is flush with the bottom side wall of the hard disk connection plate 104.

[0037] The hard drive connection plate 104 is fixedly connected to the bottom of the main housing 101. The mounting holes on its side wall are used to fix the solid-state drive and the heat dissipation structure. The central groove is precisely engaged with the side wall of the copper core 102 to ensure that the heat generated by the solid-state drive can be quickly conducted to the copper core 102. The bottom width of the sub-housing 201 is greater than the width of the copper core 102, and the side wall of the copper core 102 is flush with the bottom side wall of the hard drive connection plate 104. This design ensures good heat conduction performance and structural stability between the sub-heat dissipation component 200 and the main heat dissipation component 100.

[0038] Preferably, the main heat dissipation component 100 further includes a set screw 105 threaded to the side wall of the main housing 101, with the end of the set screw 105 inserted into the side wall of the copper core 102.

[0039] The set screw 105 is threaded to the side wall of the main housing 101, and its end is inserted into the side wall of the copper core 102. By tightening the set screw 105, the copper core 102 can be further fixed, enhancing the connection stability between the copper core 102 and the main housing 101 and the hard disk connection board 104, and ensuring smooth heat conduction.

[0040] During operation, the low-power solid-state drive (SSD) generates heat, which is first transferred to the copper core 102 via the drive connection plate 104. Due to the excellent thermal conductivity of the copper core 102, the heat dissipates rapidly. Part of the heat is exchanged with the surrounding air through the main fins 103. The arc-shaped edge structure of the main fins 103 guides airflow more smoothly across the fin surface, accelerating heat dissipation. Another portion of the heat is transferred to the sub-casing 201, and then conducted to the heat pipe 202. The working medium inside the heat pipe 202 absorbs heat and changes from a liquid to a gaseous state. The gaseous working medium rises to the cooler end inside the heat pipe 202, where it cools and condenses back into a liquid state at the plug 204. It then flows back to the heat-absorbing part due to gravity, and this cycle repeats, rapidly transferring heat to the sub-fins 203. The secondary fin 203 works in conjunction with the main fin 103 to dissipate heat into the surrounding environment, thereby achieving effective heat dissipation for the solid-state drive and ensuring that the solid-state drive operates stably within a suitable temperature range.

[0041] In summary, the coordinated operation of the main heat dissipation component 100 and the secondary heat dissipation component 200, along with the large-area design of the main fins 103 and the secondary fins 203 and the optimized airflow structure, combined with the efficient heat transfer capability of the heat pipe 202, can quickly and effectively dissipate the heat generated by the solid-state drive. Compared with traditional heat dissipation structures, this significantly improves heat dissipation efficiency and reduces the risk of performance degradation or failure of the solid-state drive due to overheating. The design of this heat dissipation structure fully considers the characteristics of low-power solid-state drives. While ensuring efficient heat dissipation, it avoids additional power consumption due to excessive heat dissipation through reasonable structural layout and material selection. For example, the efficient heat transfer characteristics of the heat pipe 202 enable rapid heat transfer even at low temperature differences, eliminating the need for additional active cooling devices (such as fans), thereby reducing the power consumption of the entire system and meeting the usage requirements of low-power solid-state drives.

[0042] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0043] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0044] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0045] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A low-power solid-state drive heat dissipation structure, characterized in that: include, The main heat dissipation component (100) includes a main housing (101), a copper core (102) fixedly connected inside the main housing (101), and main fins (103) fixedly connected outside the main housing (101). The main fins (103) are symmetrically installed outside the copper core (102). The secondary heat dissipation component (200) includes a secondary housing (201) fixedly connected to the side wall of the main housing (101), a heat pipe (202) inserted into the center of the secondary housing (201), and secondary fins (203) encapsulated on the side wall of the secondary housing (201). The secondary fins (203) cooperate with the main fins (103), and the inner wall of the secondary housing (201) is in close contact with the side wall of the copper core (102).

2. The low-power solid-state drive heat dissipation structure according to claim 1, characterized in that: The main fin (103) is mounted on the side wall of the sub-shell (201), and the end side wall of the main fin (103) is provided with an arc-shaped edge structure.

3. The low-power solid-state drive heat dissipation structure according to claim 2, characterized in that: The heat pipe (202) has a cavity structure inside, and a plug (204) is sealed at the end of the heat pipe (202).

4. The low-power solid-state drive heat dissipation structure according to claim 3, characterized in that: The heat pipe (202) is tightly inserted into the inner wall of the sub-shell (201), and the end side wall of the heat pipe (202) is provided with an arc-shaped edge structure that cooperates with the inner wall of the sub-shell (201).

5. The low-power solid-state drive heat dissipation structure according to claim 4, characterized in that: The main heat dissipation component (100) also includes a hard disk connection plate (104) fixedly connected to the bottom of the main housing (101). The hard disk connection plate (104) has mounting holes on its side wall, and the central groove of the hard disk connection plate (104) is engaged with the side wall of the copper core (102).

6. The low-power solid-state drive heat dissipation structure according to claim 5, characterized in that: The bottom width of the sub-shell (201) is greater than the width of the copper core (102), and the sidewall of the copper core (102) is flush with the bottom sidewall of the hard disk connection board (104).

7. The low-power solid-state drive heat dissipation structure according to claim 6, characterized in that: The main heat dissipation component (100) also includes a set screw (105) threaded to the side wall of the main housing (101), the end of the set screw (105) being inserted into the side wall of the copper core (102).

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