Microphone and electronic equipment

Abstract

The utility model discloses a microphone and electronic equipment. The microphone comprises a first processing chip and a second processing chip, wherein the first processing chip is configured to be capable of converting an acoustic signal into an electric signal; the second processing chip is configured to have an audio processing function; the signal output end of the first processing chip is connected with the input end of the second processing chip in parallel. According to the microphone provided by the embodiment of the invention, a more flexible audio processing scheme can be provided, and the requirements of different application scenes can be met. The arrangement of the second processing chip can improve the flexibility and efficiency of audio processing, so that the microphone can adapt to more diversified audio processing requirements.

Description

A microphone and electronic device Technical Field

[0001] This application relates to the field of electronic product technology, and more specifically, to a microphone and electronic device. Background Technology

[0002] With the development of science and technology and the improvement of living standards, various electronic products have gradually entered thousands of households and become necessities for people's lives; people's requirements for the performance of electronic products are also getting higher and higher.

[0003] Microphones are installed in many electronic products, such as mobile phones, tablets, and smartwatches. Microphone performance has become one of the indicators for measuring the quality of electronic products; traditional microphones often lack audio processing capabilities, thus limiting the improvement of the user experience.

[0004] In view of this, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention

[0005] One objective of this application is to provide a new technical solution for microphones and electronic devices.

[0006] According to a first aspect of this application, a microphone is provided, the microphone comprising:

[0007] A first processing chip, configured to convert acoustic signals into electrical signals;

[0008] A second processing chip, configured to have audio processing capabilities;

[0009] The signal output terminal of the first processing chip is connected in parallel with the input terminal of the second processing chip.

[0010] Optionally, the microphone includes a first power supply and a second power supply, wherein the first power supply powers the first processing chip and the second power supply powers the second processing chip.

[0011] Optionally, the microphone includes a housing with an accommodating space inside, and both the first processing chip and the second processing chip are disposed within the accommodating space.

[0012] Optionally, the outer casing includes a housing and a substrate, one end of the housing is closed and the other end has an opening; the substrate is connected to the housing and seals the opening, and the housing and the substrate enclose the accommodating space.

[0013] Optionally, both the first processing chip and the second processing chip are disposed on the surface of the substrate facing the accommodating space.

[0014] Optionally, the first processing chip is disposed on the surface of the substrate facing the accommodating space, and the second processing chip is stacked on the surface of the first processing chip facing away from the substrate.

[0015] Optionally, the first processing chip is electrically connected to the substrate via a first wire, the second processing chip is electrically connected to the first processing chip via a second wire, and the second processing chip is electrically connected to the substrate via a third wire.

[0016] Optionally, the microphone further includes a MEMS chip, the output of which is connected to the input of the first processing chip.

[0017] Optionally, the microphone includes a housing and a base plate that are interconnected;

[0018] The MEMS chip is connected to the substrate; the substrate has an acoustic hole, and the MEMS chip is arranged corresponding to the acoustic hole.

[0019] Optionally, the MEMS chip includes a support and a diaphragm, one end of the support is connected to the substrate, the diaphragm is connected to the other end of the support, and the diaphragm is disposed corresponding to the acoustic hole.

[0020] Optionally, the second processing chip has an audio interface communication function.

[0021] According to a second aspect of this application, an electronic device is provided, the electronic device including a microphone as described in the first aspect.

[0022] The microphone provided in this application embodiment has both a first processing chip and a second processing chip, which supports both analog or PDM signal output from conventional microphones and soundwire signal output; thus, it can provide a more flexible audio processing solution to meet the needs of different application scenarios. The inclusion of the second processing chip can improve the flexibility and efficiency of audio processing, enabling the microphone to adapt to more diverse audio processing requirements.

[0023] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0025] Figure 1 is a schematic diagram of the structure of a microphone according to an embodiment of this application;

[0026] Figure 2 is a schematic diagram of the structure of a microphone according to an embodiment of this application.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Microphone; 11. First processing chip; 12. Second processing chip; 13. Housing; 130. Accommodation space; 131. Shell; 132. Substrate; 1320. Sound hole; 14. MEMS chip; 141. Support; 142. Diaphragm. Detailed Implementation

[0029] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0030] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0031] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0032] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0033] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0034] Referring to Figures 1 and 2, according to one embodiment of this application, a microphone 1 is provided. The microphone 1 includes a first processing chip 11 and a second processing chip 12. The first processing chip 11 is configured to convert acoustic signals into electrical signals; the second processing chip 12 is configured to have audio processing functions; the signal output terminal of the first processing chip 11 is connected in parallel with the input terminal of the second processing chip 12. Furthermore, the microphone 1 also includes a MEMS chip 14.

[0035] In the microphone 1 provided in this application embodiment, the first processing chip 11 can convert acoustic signals into electrical signals. This function is one of the core functions of the microphone. Through the first processing chip 11, the microphone can convert external sound signals into electrical signals for subsequent processing. For example, the first processing chip 11 is responsible for converting the weak acoustic signals (capacitance or voltage changes) captured by the MEMS chip 14 into processable electrical signals and amplifying them. The first processing chip 11 focuses on the conversion of acoustic signals and can provide higher conversion efficiency and more accurate signal output.

[0036] The second processing chip 12 is mainly responsible for audio processing of electrical signals, such as noise reduction, gain control, and echo cancellation. The second processing chip 12 has a soundwire interface communication function, thereby enabling the expansion of communication methods.

[0037] The microphone 1 provided in this embodiment of the application has both a first processing chip 11 and a second processing chip 12, which supports both analog signal or PDM signal output of conventional microphones and soundwire signal output; thus, it can provide a more flexible audio processing solution to meet the needs of different application scenarios. The setting of the second processing chip 12 can improve the flexibility and efficiency of audio processing, enabling the microphone 1 to adapt to more diverse audio processing needs.

[0038] In addition, the signal output terminal of the first processing chip 11 is connected in parallel with the input terminal of the second processing chip 12 to form a signal transmission path; thereby ensuring that the electrical signal after acoustic signal conversion can be smoothly transmitted to the second processing chip 12 for further processing.

[0039] In one embodiment, the microphone includes a first power supply and a second power supply, wherein the first power supply powers the first processing chip 11 and the second power supply powers the second processing chip 12.

[0040] In this specific example, the second processing chip 12 has an independent power supply. By controlling the second power supply, the soundwire function can be turned on or off, making it more flexible and convenient to use.

[0041] Referring to Figures 1 and 2, in one embodiment, the microphone includes a housing 13, which has an accommodating space 130, and the first processing chip 11 and the second processing chip 12 are both disposed within the accommodating space 130.

[0042] In this specific example, the housing 13 is a protective structure for the microphone 1. The first processing chip 11 and the second processing chip 12 are both housed in the accommodating space 130 inside the housing 13, thus being protected by the housing 13. The housing 13 provides mechanical protection and electromagnetic shielding, ensuring that the chips and circuits inside the microphone 1 are protected from external interference and damage.

[0043] Referring to Figures 1 and 2, in one embodiment, the outer casing 13 includes a housing 131 and a substrate 132. One end of the housing 131 is closed and the other end has an opening. The substrate 132 is connected to the housing 131 and seals the opening. The housing 131 and the substrate 132 enclose the accommodating space 130.

[0044] In this specific example, the outer casing 13 includes a housing 131 and a substrate 132; wherein, the housing 131 includes a side wall and a bottom wall, a first end of the side wall is connected to the bottom wall to form a closed end of the housing 131, and a second end of the side wall forms an opening of the housing 131; the substrate 132 is connected to the second end of the side wall to seal the opening; the housing 131 and the substrate 132 enclose a receiving space 130.

[0045] For example, the housing 131 is made of metal, which has excellent electromagnetic shielding performance and high mechanical strength, and also has good heat dissipation performance. Optionally, the housing 131 is welded or bonded to the substrate 132.

[0046] Referring to FIG1, in one embodiment, the first processing chip 11 and the second processing chip 12 are both disposed on the surface of the substrate 132 facing the accommodating space 130.

[0047] This embodiment represents a first layout of the first processing chip 11 and the second processing chip 12. In this layout, both the first processing chip 11 and the second processing chip 12 are disposed on the surface of the substrate 132 facing the accommodating space 130; that is, the first processing chip 11 and the second processing chip 12 are arranged side by side. This layout is simple and direct, facilitating the installation and connection of the first processing chip 11 and the second processing chip 12.

[0048] Referring to FIG2, in one embodiment, the first processing chip 11 is disposed on the surface of the substrate 132 facing the accommodating space 130, and the second processing chip 12 is stacked on the surface of the first processing chip 11 facing away from the substrate 132.

[0049] This embodiment represents a second layout of the first processing chip 11 and the second processing chip 12. In this layout, the first processing chip 11 is disposed on the surface of the substrate 132 facing the accommodating space 130, while the second processing chip 12 is stacked on the surface of the first processing chip 11 facing away from the substrate 132; that is, the first processing chip 11 and the second processing chip 12 are stacked. This layout can save the space occupied by the first processing chip 11 and the second processing chip 12, making the structure of the microphone 1 more compact, thereby facilitating the miniaturization design of electronic devices.

[0050] Referring to Figures 1 and 2, in one embodiment, the first processing chip 11 is electrically connected to the substrate 132 via a first wire, the second processing chip 12 is electrically connected to the first processing chip 11 via a second wire, and the second processing chip 12 is electrically connected to the substrate 132 via a third wire.

[0051] In this specific example, regardless of whether the first or second layout method is used, the first processing chip 11 is electrically connected to the substrate 132 via a first wire, and the second processing chip 12 is electrically connected to the first processing chip 11 via a second wire and to the substrate 132 via a third wire. This electrical connection method ensures signal transmission and power supply between the first processing chip 11 and the second processing chip 12, thereby providing a reliable signal transmission path and ensuring the normal operation of the microphone 1.

[0052] Referring to Figures 1 and 2, in one embodiment, the microphone further includes a MEMS chip 14, the output of which is connected to the input of the first processing chip 11.

[0053] In this specific example, the microphone 1 also includes a MEMS chip 14, the output of which is connected to the input of the first processing chip 11 to form an acoustic signal acquisition path. The MEMS chip 14 can convert acoustic signals into electrical signals for subsequent processing by the first processing chip 11.

[0054] Referring to Figures 1 and 2, in one embodiment, the microphone includes a housing 131 and a substrate 132 connected to each other;

[0055] The MEMS chip 14 is connected to the substrate 132; the substrate 132 has a sound hole 1320, and the MEMS chip 14 is correspondingly arranged with the sound hole 1320.

[0056] Furthermore, the MEMS chip 14 includes a support 141 and a diaphragm 142. One end of the support 141 is connected to the substrate 132, and the diaphragm 142 is connected to the other end of the support 141. The diaphragm 142 is correspondingly disposed with respect to the acoustic hole 1320.

[0057] In this specific example, the MEMS chip 14 is connected to the substrate 132 via a support 141, and the diaphragm 142 is connected to the other end of the support 141 and is correspondingly positioned with respect to the acoustic aperture 1320 on the substrate 132. When external sound acts on the diaphragm 142 through the acoustic aperture 1320, the diaphragm 142 vibrates, thereby generating an electrical signal. The MEMS chip 14 provides high sensitivity and high precision acoustic signal acquisition capabilities, improving the audio acquisition quality of the microphone 1.

[0058] According to another embodiment of this application, an electronic device is provided, which includes a microphone 1 as described above. Because the microphone 1 possesses high performance and flexible audio processing capabilities, this electronic device is able to provide a superior audio experience.

[0059] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0060] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A microphone, characterized in that, The microphone includes: a first processing chip (11) configured to convert acoustic signals into electrical signals; a second processing chip (12) configured to have audio processing functions; and the signal output terminal of the first processing chip (11) and the input terminal of the second processing chip (12) are connected in parallel.

2. The microphone according to claim 1, characterized in that, The microphone includes a first power supply and a second power supply. The first power supply powers the first processing chip (11), and the second power supply powers the second processing chip (12).

3. The microphone according to claim 1, characterized in that, The microphone includes a housing (13) with an accommodating space (130) inside, and the first processing chip (11) and the second processing chip (12) are both disposed in the accommodating space (130).

4. The microphone according to claim 3, characterized in that, The outer casing (13) includes a shell (131) and a substrate (132). One end of the shell (131) is closed and the other end has an opening. The substrate (132) is connected to the shell (131) and seals the opening. The shell (131) and the substrate (132) enclose the accommodating space (130).

5. The microphone according to claim 4, characterized in that, The first processing chip (11) and the second processing chip (12) are both disposed on the surface of the substrate (132) facing the accommodating space (130).

6. The microphone according to claim 4, characterized in that, The first processing chip (11) is disposed on the surface of the substrate (132) facing the accommodating space (130), and the second processing chip (12) is stacked on the surface of the first processing chip (11) facing away from the substrate (132).

7. The microphone according to claim 5 or 6, characterized in that, The first processing chip (11) is electrically connected to the substrate (132) via a first wire, the second processing chip (12) is electrically connected to the first processing chip (11) via a second wire, and the second processing chip (12) is electrically connected to the substrate (132) via a third wire.

8. The microphone according to claim 1, characterized in that, The microphone also includes a MEMS chip (14), the output of which is connected to the input of the first processing chip (11).

9. The microphone according to claim 8, characterized in that, The microphone includes a housing (131) and a substrate (132) connected to each other; the MEMS chip (14) is connected to the substrate (132); the substrate (132) has a sound hole (1320), and the MEMS chip (14) is correspondingly arranged with the sound hole (1320).

10. The microphone according to claim 9, characterized in that, The MEMS chip (14) includes a support (141) and a diaphragm (142). One end of the support (141) is connected to the substrate (132), and the diaphragm (142) is connected to the other end of the support (141). The diaphragm (142) is correspondingly arranged with the acoustic hole (1320).

11. The microphone according to claim 1, characterized in that, The second processing chip (12) has an audio interface communication function.

12. An electronic device, characterized in that, The electronic device includes a microphone (1) as claimed in any one of claims 1-11.

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