Flexible circuit board and display device

Abstract

The utility model relates to a flexible circuit board and a display device, the flexible circuit board is used for binding connection with a display panel, the flexible circuit board comprises a main body area and a binding area located at one side of the main body area in a first direction, and the binding area is located at one side of the main body area in the first direction. One side, far away from the main body area, of the binding area is provided with a first extension area, and the first extension area is provided with a first circuit used for providing signals for the display panel; the first extension area is of a multi-layer plate structure and comprises M first metal layers which are arranged in a laminated mode, and M is a positive integer larger than 1 and smaller than or equal to 3.

Description

Flexible circuit boards and display devices Technical Field

[0001] This utility model relates to the field of display product manufacturing technology, and in particular to a flexible circuit board and a display device. Background Technology

[0002] With the arrival of the "flexible era" in display products, flexible OLED has become a new mainstay in the display industry: thinner stacking, simpler structural design, and narrower border bezels all provide a competitive advantage. Among these, the narrower bezels benefit from the COP (Chip On Panel) design. However, a major problem with the COP solution is that the bonding adds a section of panel thickness stacking, and the FPC further occupies the module's thickness space. Therefore, optimizing the structure in this area has become a key focus of flexible projects. To solve this practical problem, a reverse-bonding FPC process has been introduced, allowing the FPC and panel to overlap, which perfectly solves the current problem. However, the resulting larger panel PAD width limits this technology. This is because with reverse bonding, all FPC traces need to be completed above the panel PAD area. However, due to the large number of FPC traces, the PAD area needs to be significantly larger to accommodate the traces, which reduces the overall battery compartment space and becomes the primary bottleneck for improving the module's reverse bonding technology. Summary of the Invention

[0003] To address the aforementioned technical problems, this utility model provides a flexible circuit board and a display device, which solves the problem that when the flexible circuit board and the display panel are reverse-bonded, the battery compartment space is reduced because all the traces on the flexible circuit board are superimposed on the bonding area of ​​the display panel.

[0004] To achieve the above objectives, the technical solution adopted in this utility model embodiment is: a flexible circuit board for bonding and connecting with a display panel. The flexible circuit board includes a main body area and a bonding area located on one side of the main body area in a first direction. In the first direction, a first extension area is provided on the side of the bonding area away from the main body area. The first extension area is provided with a first line for providing a signal to the display panel.

[0005] The first extension region is a multi-layer board structure, and the first extension region includes M layers of first metal layers stacked together, where M is a positive integer greater than 1 and less than or equal to 3.

[0006] Optionally, the flexible circuit board further includes a second extension area formed by extending a portion of the first extension area. A connector for connecting to an external device is provided at one end of the second extension area away from the first extension area. The first circuit includes a first sub-circuit. One end of the first sub-circuit is connected to a bonding terminal of the bonding area, and the other end of the first sub-circuit is connected to the connector via the second extension area.

[0007] Optionally, the first metal layer of layer M includes a first sub-metal layer and a second sub-metal layer stacked together, and the bonding area includes a third sub-metal layer disposed on the same layer as the first sub-metal layer and a fourth sub-metal layer disposed on the same layer as the second sub-metal layer, wherein a plurality of bonding terminals are disposed on the third sub-metal layer;

[0008] The first line also includes a second sub-line, one end of which is connected to the bonding terminal of the bonding area, and the other end of which extends toward the first extension area and extends in the opposite direction to the main body area via the second sub-metal layer, so as to connect with the electronic components of the main body area.

[0009] Optionally, the first sub-metal layer and the second sub-metal layer are disposed adjacent to each other.

[0010] Optionally, a third sub-metal layer is disposed between the first sub-metal layer and the second sub-metal layer.

[0011] Optionally, the main body region includes multiple second metal layers, the multiple second metal layers include an M-layer fifth sub-metal layer disposed in the same layer as the first metal layer, and at least one sixth sub-metal layer stacked with the fifth sub-metal layer, wherein the sixth sub-metal layer on the side away from the fifth sub-metal layer is connected to electronic components.

[0012] Optionally, the main body area is provided with a clearance slot to avoid the driver IC on the display panel.

[0013] Optionally, the plurality of bonding terminals are arranged at intervals along a second direction perpendicular to the first direction, and the width of the second sub-line in the second direction is greater than or equal to the width of the bonding terminal in the second direction;

[0014] In the thickness direction of the first metal layer, the orthogonal projection of the second sub-circuit completely covers at least one of the bonding terminals.

[0015] This utility model embodiment also provides a display device, including a display panel and the aforementioned flexible circuit board bonded to the display panel.

[0016] Optionally, it may also include a battery that covers the first extension area.

[0017] Optionally, a heat dissipation metal layer is provided on the backlight side of the display panel, and at least a portion of the first extension area near the display panel is provided with an exposed copper area, which is electrically connected to the heat dissipation metal layer through a conductive adhesive layer.

[0018] The beneficial effects of this utility model are as follows: The flexible circuit board provided by this utility model includes a main body area and a bonding area located on one side of the main body area in a first direction. In the first direction, a first extension area is provided on the side of the bonding area away from the main body area. Compared with the conventional technology, the flexible circuit board provided by this utility model adds the first extension area and distributes some circuits in the first extension area. The first extension area includes M layers of first metal layers stacked together, where M is a positive integer greater than 1 and less than or equal to 3. That is to say, the overall thickness of the first extension area is thinner, allowing the battery to be covered on it. By setting the first extension area, the wiring of the flexible circuit board is distributed on both sides of the bonding area, reducing the size of the main body area in the first direction, thereby reducing the overall size of the flexible circuit board in the first direction and providing more space for battery accommodation. Attached Figure Description

[0019] Figure 1 shows a schematic diagram of the display device in an embodiment of the present invention;

[0020] Figure 2 shows a schematic diagram of the flexible circuit board in an embodiment of the present invention;

[0021] Figure 3 shows a schematic diagram of the flexible circuit board in an embodiment of the present invention;

[0022] Figure 4 shows a schematic diagram of the bonding connection between the display panel and the flexible circuit board;

[0023] Figure 5 shows a schematic diagram of the bonding connection between the display panel and the flexible circuit board. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0025] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0026] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0027] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0028] As shown in Figures 1-4, this embodiment provides a flexible circuit board for bonding and connecting with a display panel. The flexible circuit board includes a main body area 11 and a bonding area 12 located on one side of the main body area 11 in a first direction. In the first direction, a first extension area 13 is provided on the side of the bonding area 12 away from the main body area 11. The first extension area 13 is provided with a first line for providing a signal to the display panel.

[0029] The first extension region 13 is a multilayer board structure, and the first extension region 13 includes M layers of first metal layers stacked together, where M is a positive integer greater than 1 and less than or equal to 3.

[0030] In conventional technology, a flexible circuit board is stacked on top of the bonding area of ​​the display panel using a reverse bonding method. This provides more space for the battery compartment 2 in the first direction. However, since the flexible circuit board is stacked on top of the bonding area of ​​the display panel, the bonding area of ​​the display panel must have sufficient length in the first direction to accommodate the flexible circuit board. Furthermore, in conventional technology, the flexible circuit board consists of a main body area 11 and a bonding area 12 located on one side of the main body area 11. All the traces of the flexible circuit board are located in the main body area 11, which limits the size of the flexible circuit board and, consequently, limits the size of the bonding area of ​​the display panel in the first direction, preventing the space of the battery compartment 2 in the first direction from being further reduced.

[0031] To address the aforementioned issues, the flexible circuit board provided in this embodiment adds a first extension area 13 to the side of the bonding area 12 away from the main body area 11, distributing the lines of the main body area 11 to the first extension area 13. Wiring is performed on the main body area 11 and the first extension area 13 on opposite sides of the bonding area 12, improving the flexibility of the line distribution of the flexible circuit board. This also reduces the length of the main body area 11 in the first direction, thereby reducing the length of the bonding area of ​​the display panel in the first direction. Furthermore, although the first extension area 13 is configured as a multilayer board structure, the first extension area 13 includes M stacked first metal layers, where M is a positive integer greater than 1 and less than or equal to 3. In other words, the thickness of the first extension area 13 is relatively thin. For example, in some embodiments, M equals 3, that is, the first extension area 13 includes three layers of the first metal layer. The thickness of the first extension area 13 is 0.16mm. The battery compartment 2 can be placed directly above the first extension area 13. That is to say, the setting of the first extension area 13 can not only disperse the lines on the main body area 11, making the size of the main body area 11 in the first direction smaller, thereby making the size of the bonding area of ​​the display panel in the first direction smaller, but also, due to the thinness of the first extension area 13, it will not occupy the space of the battery compartment 2 in the first direction, thereby breaking the limitation on the size of the bonding area of ​​the display panel in the first direction caused by the reverse bonding of the flexible circuit board, and further improving the accommodating space of the battery compartment 2.

[0032] It should be noted that the first extension area 13 is relatively thin, but it still has a certain thickness. In order to avoid interference with the battery compartment 2, a stepped groove can be provided on the side of the outer shell of the battery compartment 2 that is close to the display panel, so that the first extension area 13 is located in the space between the stepped groove and the display panel.

[0033] In an exemplary embodiment, the flexible circuit board further includes a second extension region 14 formed by extending a portion of the first extension region 13. A connector 15 for connecting to an external device is provided at one end of the second extension region 14 away from the first extension region 13. The first circuit includes a first sub-circuit. One end of the first sub-circuit is connected to the bonding terminal 1020 of the bonding region 12, and the other end of the first sub-circuit is connected to the connector 15 via the second extension region 14.

[0034] It should be noted that the second extension area 14 in Figure 3 is located to the left of the first extension area 13, but this is not a limitation. The second extension area 14 can also be located to the right of the first extension area, or the second extension area 14 can also be located below the first extension area 13.

[0035] It should be noted that, in order to avoid the setting of the second extension area 14 affecting the setting of the battery compartment 2, the extension direction of the second extension area 14 can be perpendicular to the first direction.

[0036] In an exemplary embodiment, the first sub-line may be a MIPI (Mobile Industry Processor Interface) signal line and a test signal line, etc. These signal lines do not need to be connected to the electronic components 1001 of the main body area 11. They can be directly wired in the first extension area 13 and directly extended to the second extension area to connect with the connector. They do not need to be set on the main body area 11, thereby reducing the size of the main body area 11 in the first direction.

[0037] Referring to Figures 2-4, in an exemplary embodiment, the first metal layer of layer M includes a first sub-metal layer 101 and a second sub-metal layer 102 stacked together. The bonding area 12 includes a third sub-metal layer disposed on the same layer as the first sub-metal layer 101 and a fourth sub-metal layer disposed on the same layer as the second sub-metal layer 102. A plurality of bonding terminals 1020 are disposed on the third sub-metal layer.

[0038] The first line also includes a second sub-line 1010. One end of the second sub-line 1010 is connected to the bonding terminal 1020 of the bonding area 12, and the other end of the second sub-line 1010 extends toward the first extension area 13 and extends in the opposite direction to the main body area 11 via the second sub-metal layer 102, so as to connect with the electronic component 1001 of the main body area 11. In Figures 2-4, the blue line segment represents the portion of the second sub-line 1010 located on the first sub-metal layer 101 and the metal layer disposed on the same layer as the first sub-metal layer 101; the green line segment represents the portion of the second sub-line 1010 located on the second sub-metal layer 102 and the metal layer disposed on the same layer as the second sub-metal layer 102; the blue and green line segments are connected through vias (the white box in Figure 2 indicates the vias); the red line segment represents the portion of the second sub-line on the corresponding metal layer in the main body area; the red and green line segments are connected through vias.

[0039] The first sub-metal layer 101 and the second sub-metal layer 102 are connected by a via. The second sub-line 1010, which is connected to the bonding terminal 1020, first extends along the first direction away from the main body region 11, then extends through the via between the first sub-metal layer 101 and the second sub-metal layer 102 to the second sub-metal layer 102, and then extends along the first direction towards the main body region 11 and connects to the electronic component 1001 of the main body region 11. This changes the path of the second sub-line 1010, and a portion of the second sub-line 1010 is disposed on the first extension region 13, thereby reducing the size of the main body region 11 in the first direction.

[0040] In an exemplary embodiment, the first sub-metal layer 101 and the second sub-metal layer 102 are disposed adjacent to each other.

[0041] Referring to Figure 2, in an exemplary embodiment, a third sub-metal layer is disposed between the first sub-metal layer 101 and the second sub-metal layer 102. That is, the first sub-metal layer 101 and the second sub-metal layer 102 are separated by a single layer, and the third sub-metal layer between the first sub-metal layer 101 and the second sub-metal layer 102 has no wiring, effectively avoiding signal crosstalk caused by wiring between adjacent metal layers.

[0042] It should be noted that the first metal layer of layer M includes a first sub-metal layer 101 and a second sub-metal layer 102 stacked together. The bonding area 12 includes a third sub-metal layer disposed on the same layer as the first sub-metal layer 101 and a fourth sub-metal layer disposed on the same layer as the second sub-metal layer 102. The bonding area 12 is constructed using a multilayer board. In conventional flexible circuit boards, the bonding area 12 is a single-layer board with a thickness of only 0.07mm. Due to the high temperature caused by the hot pressing and SMT (surface mount technology) processes, the material shrinks after the flexible circuit board undergoes stress release. The resulting single-layer board exhibits a wavy shape with inconsistent shapes, leading to vacuum failure in the equipment after assembly, frequent material rejection, and severely impacting production capacity. In this embodiment, the bonding area 12 is constructed as a multilayer board with a thickness of 0.16mm. The increased thickness of the bonding area 12 improves its strength and effectively alleviates the material rejection problem caused by the warping of the bonding terminal 1020.

[0043] In an exemplary embodiment, the flexible circuit board includes a second circuit, one end of which is connected to the bonding terminal 1020 of the bonding area 12, and the other end of which extends directly into the main body area 11 and is connected to the electronic components 1001 of the main body area 11.

[0044] In some embodiments, the second line includes a touch trace, which does not need to be routed in the first extension area 13. Instead, it can extend directly towards the main body area 11 and connect to the touch IC of the main body area 11. This reduces the size of the first extension area 13 in a third direction, further increasing the storage space of the battery compartment 2. It should be noted that the third direction is perpendicular to the first direction and also perpendicular to the light emission direction of the display panel. The first extension area in Figure 3 has a fan-shaped structure, but this is not a limitation.

[0045] In an exemplary embodiment, the main body region 11 includes multiple layers of second metal layers. These multiple layers include an M-layer fifth sub-metal layer 1003 disposed on the same layer as the first metal layer, and at least one sixth sub-metal layer stacked on top of the fifth sub-metal layer 1003. The sixth sub-metal layer on the side furthest from the fifth sub-metal layer 1003 is connected to an electronic component 1001. That is, the number of metal layers in the main body region 11 is greater than the number of metal layers in the first extension region 13. After the second sub-line 1010 extends to the main body region 11, it can be routed in at least one of the sixth sub-metal layers. When there are at least two sixth sub-metal layers, the second sub-line 1010 can be routed in any layer or at least one of the sixth sub-metal layers, and then connected to the electronic component 1001 in the main body region 11.

[0046] It should be noted that the number of metal layers in the main body region 11 can also be the same as the number of metal layers in the first extension region 13, and there is no limitation here.

[0047] In an exemplary embodiment, the main body area 11 is provided with a clearance slot 1002 for avoiding the driver IC on the display panel.

[0048] The flexible circuit board is reverse-bonded to the display panel, and the driver IC is bonded to the bonding area of ​​the display panel. Therefore, the flexible circuit board needs to be provided with the clearance groove 1002 to avoid the driver IC. In the light emission direction of the display panel, the depth of the clearance groove 1002 can be set according to actual needs. In some embodiments, the depth of the clearance groove 1002 is greater than the thickness of the driver IC, that is, there is a gap between the clearance groove 1002 and the driver IC to avoid damage to the driver IC.

[0049] Referring to Figure 4, in an exemplary embodiment, the bonding terminal 1020 on the flexible circuit board is bonded to the bonding terminal on the display panel (defined here as the second bonding terminal 1030 to distinguish it from the bonding terminal 1020 on the flexible circuit board). The plurality of bonding terminals 1020 are arranged at intervals along a second direction perpendicular to the first direction (refer to the X direction in Figure 4). The width of the second sub-line 1010 in the second direction is greater than or equal to the width of the bonding terminal 1020 in the second direction.

[0050] In the thickness direction of the first metal layer, the orthogonal projection of the second sub-line 1010 completely covers at least one of the bonding terminals 1020.

[0051] As shown in Figure 4, the device pressure head 10 presses down from the side of the fourth sub-metal layer away from the third sub-metal layer, and binds the bonding area 12 of the flexible circuit board and the bonding area of ​​the display panel together through ACF (conductive adhesive). In the bonding area 12, the traces of the third sub-metal layer (i.e., the second sub-line 1010) and the bonding terminals 1020 on the fourth sub-metal layer are PIN-to-PIN traces, using a 1:1 or 1:N method. That is, the width of the traces on the third sub-metal layer is equal to the width of the bonding terminals 1020, or the width of the traces on the third sub-metal layer is N times the width of the bonding terminals 1020, where N is a positive integer greater than 2. This ensures that there are traces above each bonding terminal 1020, avoiding uneven thickness at the bonding terminal 1020 position, which would lead to uneven pressure and thus local weak bonding. In severe cases, it may cause the ACF particles at the local bonding terminal 1020 position to not burst, resulting in signal disconnection; or the number of bursting particles may be small, resulting in poor reliability.

[0052] As shown in Figure 4, when the width of the trace on the third sub-metal layer is N times the width of the bonding terminal 1020, the gap between two adjacent bonding terminals 1020 is the same as the width of the bonding terminal 1020. The first trace on the third sub-metal layer covers two bonding terminals 1020, and the width of the first trace is 3 times the width of the bonding terminal 1020.

[0053] Referring to FIG5, in an exemplary embodiment, the second sub-line 1010 includes a first line segment located in the bonding area 12 and a second line segment other than the first line segment. The first line segment is divided into a plurality of sub-line segments 10111, each of the sub-line segments 10111 corresponding to a bonding terminal 1020, and the orthographic projection of each sub-line segment 10111 on the third sub-metal layer completely coincides with the corresponding bonding terminal 1020.

[0054] It should be noted that some lines in the second sub-line 1010 include the first line segment located in the binding area 12, and the second line segment other than the first line segment. Comparing Figure 5 and Figure 4, the dashed box in Figure 5 represents the first line segment that has been divided into multiple sub-line segments 10111.

[0055] The flexible circuit board includes a PI substrate layer, metal layers are disposed on opposite sides of the PI substrate layer, and CVL cover layers are disposed on the top and bottom of the flexible circuit board.

[0056] This utility model embodiment also provides a display device, including a display panel and the aforementioned flexible circuit board bonded to the display panel.

[0057] In an exemplary embodiment, the display device further includes a battery that covers the first extension area 13.

[0058] It should be noted that the number of metal layers in the first extension region 13 is greater than 1 and less than or equal to 3, that is, the thickness of the first extension region 13 is very thin, for example, it can be 0.16mm. However, the first extension region 13 still has a certain thickness. In order to avoid interference, a stepped groove can be provided on the battery casing to accommodate the first extension region 13.

[0059] In an exemplary embodiment, a heat dissipation metal layer is provided on the backlight side of the display panel, and at least a portion of the first extension area 13 near the side of the display panel is provided with an exposed copper area, which is electrically connected to the heat dissipation metal layer through a conductive adhesive layer.

[0060] In some embodiments, the first extension area 13 has copper fully exposed on the side closest to the display panel, which increases the connection area between the flexible circuit board and the heat dissipation metal layer and effectively improves the anti-static capability of the display device.

[0061] The display device includes, but is not limited to, components such as: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will understand that the above-described structure of the display device does not constitute a limitation on the display device; the display device may include more or fewer of the aforementioned components, or combine certain components, or arrange different components. In embodiments of this utility model, the display device includes, but is not limited to, a monitor, a mobile phone, a tablet computer, a television set, a wearable electronic device, and a navigation display device.

[0062] The display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes a flexible circuit board, a printed circuit board, and a backplate.

[0063] Furthermore, embodiments of this disclosure provide an electronic device including a memory, a processor, and one or more programs stored in the memory and executable on the processor. When the one or more programs are executed by the processor, the electronic device performs the silicon wafer pick-and-place method as described above.

[0064] In one embodiment, this disclosure also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps in the above method embodiments.

[0065] The aforementioned computer-readable storage medium, since the computer program stored in its memory is executed by the processor to implement the steps in the above-described method embodiments, can similarly bring about the beneficial effects of the above-described silicon wafer placement and removal method, which will not be elaborated here.

[0066] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0067] The following points need to be explained:

[0068] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0069] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0070] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0071] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A flexible circuit board for bonding and connecting with a display panel, characterized in that, The flexible circuit board includes a main body area and a bonding area located on one side of the main body area in a first direction. In the first direction, a first extension area is provided on the side of the bonding area away from the main body area. The first extension area is provided with a first line for providing a signal to the display panel. The first extension area is a multilayer board structure. The first extension area includes M stacked first metal layers, where M is a positive integer greater than 1 and less than or equal to 3.

2. The flexible circuit board according to claim 1, characterized in that, It also includes a second extension area formed by extending a portion of the first extension area. The end of the second extension area away from the first extension area is provided with a connector for connecting to an external device. The first line includes a first sub-line. One end of the first sub-line is connected to the bonding terminal of the bonding area, and the other end of the first sub-line is connected to the connector via the second extension area.

3. The flexible circuit board according to claim 1, characterized in that, The first metal layer of layer M includes a first sub-metal layer and a second sub-metal layer stacked together. The bonding area includes a third sub-metal layer disposed on the same layer as the first sub-metal layer and a fourth sub-metal layer disposed on the same layer as the second sub-metal layer. A plurality of bonding terminals are disposed on the third sub-metal layer. The first circuit also includes a second sub-circuit. One end of the second sub-circuit is connected to the bonding terminal of the bonding area, and the other end of the second sub-circuit extends toward the first extension area and extends in the opposite direction through the second sub-metal layer to the main body area to connect with the electronic components of the main body area.

4. The flexible circuit board according to claim 3, characterized in that, The first sub-metal layer and the second sub-metal layer are disposed adjacent to each other.

5. The flexible circuit board according to claim 3, characterized in that, A third sub-metal layer is disposed between the first sub-metal layer and the second sub-metal layer.

6. The flexible circuit board according to claim 3, characterized in that, The main body area includes multiple second metal layers, each second metal layer including a fifth sub-metal layer M disposed on the same layer as the first metal layer, and at least one sixth sub-metal layer stacked on the fifth sub-metal layer. Electronic components are connected to the sixth sub-metal layer on the side of the at least one sixth sub-metal layer away from the fifth sub-metal layer.

7. The flexible circuit board according to claim 6, characterized in that, The main body area is provided with a clearance slot to avoid the driver IC on the display panel.

8. The flexible circuit board according to claim 3, characterized in that, The plurality of bonding terminals are arranged at intervals along a second direction perpendicular to the first direction, and the width of the second sub-line in the second direction is greater than or equal to the width of the bonding terminal in the second direction; in the thickness direction of the first metal layer, the orthographic projection of the second sub-line completely covers at least one bonding terminal.

9. A display device, characterized in that, It includes a display panel and a flexible circuit board as described in any one of claims 1-8, which is bonded to the display panel.

10. The display device according to claim 9, characterized in that, It also includes a battery that covers the first extension area.

11. The display device according to claim 9, characterized in that, A heat dissipation metal layer is provided on the backlight side of the display panel, and at least a portion of the first extension area near the side of the display panel is provided with exposed copper area, which is electrically connected to the heat dissipation metal layer through a conductive adhesive layer.

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