Wafer turnover device

Abstract

The utility model belongs to the technical field of semiconductor material processing equipment, and discloses a wafer turnover device. The wafer turnover device comprises a vacuum chamber, a clamping turnover mechanism and a detection mechanism, and the cavity wall of the vacuum chamber is provided with at least two vacuum windows; the clamping and overturning mechanism is fixed in the vacuum chamber in a penetrating manner, the output end of the clamping and overturning mechanism is located in the vacuum chamber and used for clamping and overturning wafers, and the clamping and overturning mechanism is provided with at least two clamping positions and used for correspondingly clamping wafers of at least two sizes; the detection mechanism comprises at least two sensing parts, the at least two sensing parts are located outside the vacuum cavity, the at least two sensing parts are arranged in one-to-one correspondence with the at least two clamping positions and in one-to-one correspondence with the at least two vacuum windows, and detection light of the sensing parts can penetrate through the corresponding vacuum windows to be emitted into the vacuum cavity and can be emitted to the corresponding clamping positions. The wafer size identification device can be applied to a vacuum environment, and can avoid confusion of subsequent processes caused by wrong wafer size identification.

Description

A wafer flipping device Technical Field

[0001] This utility model relates to the field of semiconductor material processing equipment technology, and in particular to a wafer flipping device. Background Technology

[0002] A wafer is a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. In some semiconductor manufacturing processes, both sides of the wafer need to be processed in a vacuum environment. After processing the front side, the wafer needs to be flipped to process the back side.

[0003] Existing wafer flipping devices are not suitable for vacuum environments, and because they lack a detection mechanism during the clamping and flipping of wafers, they suffer from problems such as incorrect wafer size identification leading to errors in subsequent processes. Therefore, there is an urgent need for a wafer flipping device to solve the above-mentioned technical problems. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer flipping device that can be applied in a vacuum environment and can avoid subsequent process errors caused by incorrect wafer size identification.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A wafer flipping device, comprising:

[0007] A vacuum chamber, wherein the chamber wall is provided with at least two vacuum viewing windows;

[0008] A clamping and flipping mechanism is inserted and fixed in the vacuum chamber. The output end of the clamping and flipping mechanism is located in the vacuum chamber and is used to clamp and flip the wafer. The clamping and flipping mechanism has at least two clamping positions for correspondingly clamping at least two sizes of the wafer.

[0009] The detection mechanism includes at least two sensors, both of which are located outside the vacuum chamber. The at least two sensors are configured to correspond one-to-one with at least two clamping positions and one-to-one with at least two vacuum windows. The detection light of the sensors can pass through the corresponding vacuum windows and enter the vacuum chamber, and can reach the corresponding clamping position to detect whether the clamping and flipping mechanism is located at the corresponding clamping position.

[0010] In some possible implementations, the clamping and flipping mechanism includes a drive assembly and two clamping arms. The drive assembly is fixed outside the vacuum chamber, and its output end is located inside the vacuum chamber. It is used to drive the two clamping arms to move toward each other or away to clamp the wafer, and can drive the wafer to flip. The clamping arms can be located at the clamping position.

[0011] In some possible implementations, the drive assembly includes a flipping drive component and two sets of clamping drive components. The flipping drive component includes a drive member and a rotating base. The drive member is fixed outside the vacuum chamber, and its output end extends into the vacuum chamber and is fixedly connected to the rotating base for driving the rotating base to rotate. Both clamping arms are slidably connected to the rotating base and can slide towards or away from each other. Each clamping arm is connected to the rotating base with an elastic element.

[0012] Both sets of clamping drive components are installed in the vacuum chamber. The two sets of clamping drive components are arranged in one-to-one correspondence with the two clamping arms. The clamping drive components can move the clamping arms so that the clamping arms slide away from the other clamping arm.

[0013] In some possible implementations, the detection mechanism further includes a third sensor located outside the vacuum chamber. The detection light of the third sensor is transmitted through the corresponding vacuum window into the vacuum chamber to detect whether the clamped wafer is in a horizontal position.

[0014] In some possible implementations, the detection mechanism further includes two sensors detachably connected to opposite end faces of the rotating seat and arranged opposite each other. Each sensor has a channel, and the center lines of the two channels are on the same straight line. When the rotating seat is in a horizontal position, the detection light from the third sensor can selectively pass through the two channels and be projected onto the bottom wall of the corresponding channel.

[0015] In some possible implementations, the center lines of the two channels lie on the same straight line perpendicular to the rotating base, the third sensor is disposed on the top wall of the vacuum chamber, and the detection light of the third sensor can pass through the vacuum window and selectively pass through the two channels and be projected onto the bottom wall of the corresponding channel.

[0016] In some possible implementations, the sensing element includes two L-shaped plates configured to be spaced apart and disposed opposite to the rotating base, the two L-shaped plates and the rotating base together forming the channel.

[0017] In some possible implementations, the detection mechanism further includes a fourth sensor located outside the vacuum chamber. The detection light from the fourth sensor can pass through the vacuum window into the vacuum chamber and can be directed to the wafer clamping area to detect whether the wafer is located in the wafer clamping area.

[0018] In some possible implementations, the sensing element is a light reflection sensor.

[0019] In some possible implementations, a sealing structure is provided at the connection between the vacuum window and the wall of the vacuum chamber.

[0020] The beneficial effects of this utility model are:

[0021] This utility model provides a wafer flipping device, including a vacuum chamber, a clamping and flipping mechanism, and a detection mechanism. The clamping and flipping mechanism is fixed within the vacuum chamber, with its output end located inside the chamber. A sensor is positioned outside the vacuum chamber, and its detection light shines through a vacuum window into the chamber, facilitating wafer flipping in a vacuum environment and enabling wafer size identification. The clamping and flipping mechanism holds wafers of different sizes at different clamping positions. Sensors are correspondingly placed at each clamping position, allowing for accurate determination of the clamping position and wafer size, thus avoiding errors in subsequent processes caused by incorrect size identification. Attached Figure Description

[0022] Figure 1 is a schematic diagram of the wafer flipping device provided by this utility model;

[0023] Figure 2 is a first-view structural schematic diagram of the wafer flipping device (showing part of the vacuum chamber) provided by this utility model;

[0024] Figure 3 is a second-view structural schematic diagram of the wafer flipping device (showing part of the vacuum chamber) provided by this utility model;

[0025] Figure 4 is a structural schematic diagram of the rotating seat, two sensing elements and two clamping arms involved in this utility model.

[0026] In the picture:

[0027] 1. Vacuum chamber; 11. Vacuum viewing window; 12. Transfer port;

[0028] 2. Clamping and flipping mechanism; 21. Drive assembly; 211. Flipping drive component; 2111. Drive component; 2112. Rotating seat; 212. Clamping drive component; 22. Clamping arm;

[0029] 31. First sensor; 32. Second sensor; 33. Third sensor; 34. Sensing element; 341. Channel; 342. L-shaped plate; 35. Fourth sensor; 36. Mounting bracket; 361. First bending plate; 362. Second bending plate;

[0030] 100. Wafer;

[0031] 10. First detection light; 20. Second detection light. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0033] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0036] As shown in Figures 1 to 4, this utility model provides a wafer flipping device, including a vacuum chamber 1, a clamping and flipping mechanism 2, and a detection mechanism. The cavity wall of the vacuum chamber 1 is provided with at least two vacuum windows 11. The clamping and flipping mechanism 2 is fixed to the vacuum chamber 1, and its output end is located inside the vacuum chamber 1. It is used to clamp and flip wafers 100. The clamping and flipping mechanism 2 has at least two clamping positions for clamping at least two sizes of wafers 100. The detection mechanism includes at least two sensors, both of which are located outside the vacuum chamber 1. The at least two sensors are arranged one-to-one with the at least two clamping positions and one-to-one with the at least two vacuum windows 11. The detection light of the sensors can pass through the corresponding vacuum windows 11 and enter the vacuum chamber 1, and can reach the corresponding clamping position to detect whether the clamping and flipping mechanism 2 is located at the corresponding clamping position. The clamping and flipping mechanism 2 is fixedly inserted into the vacuum chamber 1, with its output end located inside the vacuum chamber 1. A sensor is positioned outside the vacuum chamber 1, allowing the sensor's detection light to pass through the vacuum window 11 and enter the vacuum chamber 1. This facilitates the flipping of the wafer 100 in a vacuum environment and enables the identification of the wafer 100's dimensions. The size of the wafer 100 varies depending on the clamping and flipping mechanism 2's position. A corresponding sensor is positioned at each clamping position to accurately determine the location of the clamping and flipping mechanism 2, thereby determining the wafer 100's dimensions and preventing errors in subsequent processes caused by incorrect size identification.

[0037] Optionally, in this embodiment, there are two clamping positions, namely a first clamping position and a second clamping position. There are also two sensors, namely a first sensor 31 and a second sensor 32. The first sensor 31 corresponds to the first clamping position, and the second sensor 32 corresponds to the second clamping position. When the clamping arm 22 is in the first clamping position, it can clamp a large-sized wafer 100, such as a 12-inch wafer 100. When the clamping arm 22 is in the second clamping position, it can clamp a small-sized wafer 100, such as an 8-inch wafer 100. When the clamping and flipping mechanism 2 is in the first clamping position, the first sensor 31 can detect that the clamping and flipping mechanism 2 is clamping a large-sized wafer 100. When the clamping and flipping mechanism 2 is in the second clamping position, the second sensor 32 can detect that the clamping arm 22 is clamping a small-sized wafer 100, as shown in Figure 3. The detection light of the second sensor 32 is the second detection light 20. The dimensions of the clamped wafer 100 can be accurately determined based on the first sensor 31 and the second sensor 32, avoiding errors in subsequent processes caused by incorrect dimension recognition.

[0038] Optionally, the clamping and flipping mechanism 2 includes a drive assembly 21 and two clamping arms 22. The drive assembly 21 is fixed outside the vacuum chamber 1, and its output end is located inside the vacuum chamber 1. It drives the two clamping arms 22 to move towards or away from each other to clamp the wafer 100 and can also drive the wafer 100 to flip. The clamping arms 22 can be positioned in the clamping position. Clamping the wafer 100 using two clamping arms 22 simplifies the clamping structure. In this embodiment, since the two clamping arms 22 perform mirror motion, it is only necessary to detect whether one of the clamping arms 22 is in position.

[0039] Optionally, in this embodiment, the driving assembly 21 includes a flipping driving component 211 and two sets of clamping driving components 212. The flipping driving component 211 includes a driving member 2111 and a rotating seat 2112. The driving member 2111 is fixed outside the vacuum chamber 1, and the output end of the driving member 2111 extends into the vacuum chamber 1 and is fixedly connected to the rotating seat 2112 for driving the rotating seat 2112 to rotate. Both clamping arms 22 are slidably connected to the rotating seat 2112 and can slide towards or away from each other. Each clamping arm 22 is connected to the rotating seat 2112 with an elastic element. Both sets of clamping driving components 212 are inserted into the vacuum chamber 1. The two sets of clamping driving components 212 are arranged one-to-one with the two clamping arms 22. The clamping driving component 212 can move the clamping arm 22, causing the clamping arm 22 to slide away from the other clamping arm 22. Two sets of clamping drive components 212 respectively actuate the two clamping arms 22, causing the two clamping arms 22 to slide away from each other, thereby opening the two clamping arms 22. Then, the wafer 100 is placed between the two clamping arms 22. Afterwards, both sets of clamping drive components 212 disengage from actuating the clamping arms 22, and the two clamping arms 22 slide towards each other under the elastic force of their corresponding elastic elements, thus clamping the wafer 100. By incorporating elastic elements, damage to the wafer 100 is less likely during the clamping process, and the clamping and flipping requirements for wafers 100 of different sizes can be met. The wafer 100 can be flipped by driving the rotating base 2112 to rotate via the drive component 2111. Optionally, the drive component 2111 is a motor, and the elastic element is a spring.

[0040] Optionally, the detection mechanism also includes a third sensor 33, located outside the vacuum chamber 1. The detection light from the third sensor 33 passes through the corresponding vacuum window 11 and enters the vacuum chamber 1 to detect whether the clamped wafer 100 is in a horizontal position. When flipping the wafer 100 in a vacuum environment for front and back processing, the wafer 100 must be in a horizontal position. Detecting whether the clamped wafer 100 is in a horizontal position using the third sensor 33 can further prevent errors in subsequent processes.

[0041] When the rotating base 2112 is in a horizontal position, the clamped wafer 100 is also in a horizontal position. Optionally, in this embodiment, the detection mechanism further includes two sensors 34. The two sensors 34 are detachably connected to opposite end faces of the rotating base 2112 and are arranged opposite each other. Each sensor 34 has a channel 341, and the center lines of the two channels 341 are on the same straight line. When the rotating base 2112 is in a horizontal position, the detection light from the third sensor 33 selectively passes through the two channels 341 and is projected onto the bottom wall of the corresponding channel 341. By setting the third sensor 33 and the two sensors 34, it can be ensured that the wafer 100 is in a horizontal position when the front side is facing up, and it can also be ensured that the wafer 100 is in a horizontal position when the back side is facing up. The structure is simple and cost-effective.

[0042] Optionally, in this embodiment, the center lines of the two channels 341 are aligned perpendicularly to the rotating base 2112. The third sensor 33 is disposed on the top wall of the vacuum chamber 1. The detection light from the third sensor 33 can pass through the vacuum window 11 and selectively pass through the two channels 341, hitting the bottom wall of the corresponding channel 341. This arrangement facilitates the installation of the third sensor 33 and the fabrication of the channels 341. In other embodiments, the center lines of the two channels 341 can also be arranged at an acute angle on the rotating base 2112, and the position of the third sensor 33 can be changed accordingly. This allows the detection light from the third sensor 33 to pass through the vacuum window 11 and selectively pass through the two channels 341, hitting the bottom wall of the corresponding channel 341.

[0043] Optionally, in this embodiment, the sensing element 34 includes two L-shaped plates 342, which are configured to be spaced apart and disposed opposite to each other on the rotating seat 2112. The two L-shaped plates 342 and the rotating seat 2112 together form a channel 341. This configuration simplifies the structure of the sensing element 34 and saves processing and manufacturing time.

[0044] The wafer 100 enters the vacuum chamber 1 through the transfer port 12 and reaches the wafer clamping area. Optionally, the detection mechanism also includes a fourth sensor 35, which is located outside the vacuum chamber 1. The detection light of the fourth sensor 35 can pass through the vacuum window 11 into the vacuum chamber 1 and reach the wafer clamping area to detect whether the wafer 100 is located in the wafer clamping area. As shown in Figure 3, the detection light of the fourth sensor 35 is the first detection light 10. When the detection light of the fourth sensor 35 detects the wafer 100 in the wafer clamping area, the clamping arm 22 clamps the wafer 100 to avoid subsequent process errors caused by the clamping arm 22 not clamping the wafer 100 if it is not in the wafer clamping area.

[0045] Optionally, in this embodiment, the sensing element, the third sensor 33, and the fourth sensor 35 are all light reflection sensors, which are low in cost, simple in structure, and easy to maintain.

[0046] Optionally, in this embodiment, a sealing structure is provided at the connection between the vacuum window 11 and the wall of the vacuum chamber 1. Further, the sealing structure is a sealing ring. This arrangement improves the sealing performance of the vacuum chamber 1 without affecting its vacuuming efficiency.

[0047] Optionally, the sensing element, the third sensor 33, and the fourth sensor 35 are all mounted on the vacuum chamber 1 via mounting brackets 36, each of which is detachably connected to the vacuum chamber 1. This arrangement facilitates the disassembly, assembly, and replacement of the sensors. Optionally, each mounting bracket 36 includes a first bending plate 361 and a second bending plate 362. The first bending plate 361 is detachably connected to the vacuum chamber 1, and the second bending plate 362 is detachably connected to the first bending plate 361. The sensing element, the third sensor 33, and the fourth sensor 35 are respectively detachably connected to their corresponding second bending plates 362. This arrangement ensures support strength while facilitating the processing and manufacturing of the mounting brackets 36.

[0048] Optionally, each first bent plate 361 is connected to the vacuum chamber 1 by screws. This arrangement facilitates disassembly and ensures reliable connection. Furthermore, each first bent plate 361 and its corresponding second bent plate 362 are connected by bolts and nuts.

[0049] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer flipping device, characterized in that, include: A vacuum chamber (1) is provided with at least two vacuum windows (11) on its wall; a clamping and flipping mechanism (2) is fixed to the vacuum chamber (1), the output end of which is located inside the vacuum chamber (1) and is used to clamp and flip the wafer (100). The clamping and flipping mechanism (2) has at least two clamping positions for clamping at least two sizes of the wafer (100); a detection mechanism includes at least two sensors, both of which are located outside the vacuum chamber (1). The at least two sensors are arranged in a one-to-one correspondence with the at least two clamping positions and the at least two vacuum windows (11). The detection light of the sensors can pass through the corresponding vacuum windows (11) and enter the vacuum chamber (1), and can reach the corresponding clamping position to detect whether the clamping and flipping mechanism (2) is located at the corresponding clamping position.

2. The wafer flipping device according to claim 1, characterized in that, The clamping and flipping mechanism (2) includes a drive assembly (21) and two clamping arms (22). The drive assembly (21) is fixed outside the vacuum chamber (1). The output end of the drive assembly (21) is located inside the vacuum chamber (1) and is used to drive the two clamping arms (22) to move towards each other or away to clamp the wafer (100) and to drive the wafer (100) to flip. The clamping arms (22) can be located at the clamping position.

3. The wafer flipping device according to claim 2, characterized in that, The drive assembly (21) includes a flip drive component (211) and two sets of clamping drive components (212). The flip drive component (211) includes a drive element (2111) and a rotating seat (2112). The drive element (2111) is fixed outside the vacuum chamber (1). The output end of the drive element (2111) extends into the vacuum chamber (1) and is fixedly connected to the rotating seat (2112) to drive the rotating seat (2112) to rotate. Both clamping arms (22) are connected to the rotating seat. The seat (2112) is slidably connected and can slide towards or away from each other; each of the clamping arms (22) is connected to the rotating seat (2112) with an elastic element; two sets of clamping drive components (212) are both installed in the vacuum chamber (1), and the two sets of clamping drive components (212) are arranged one-to-one with the two clamping arms (22). The clamping drive component (212) can move the clamping arm (22) so that the clamping arm (22) slides away from the other clamping arm (22).

4. The wafer flipping device according to claim 3, characterized in that, The detection mechanism also includes a third sensor (33), which is located outside the vacuum chamber (1). The detection light of the third sensor (33) can pass through the corresponding vacuum window (11) and enter the vacuum chamber (1) to detect whether the clamped wafer (100) is in a horizontal position.

5. The wafer flipping device according to claim 4, characterized in that, The detection mechanism also includes two sensors (34), which are detachably connected to the opposite end faces of the rotating seat (2112) and are arranged opposite to each other. Each sensor (34) is provided with a channel (341), and the center lines of the two channels (341) are on the same straight line. When the rotating seat (2112) is in a horizontal position, the detection light of the third sensor (33) can selectively pass through the two channels (341) and be projected onto the bottom wall of the corresponding channel (341).

6. The wafer flipping apparatus according to claim 5, characterized in that, The center lines of the two channels (341) are on the same straight line perpendicular to the rotating seat (2112). The third sensor (33) is disposed on the top wall of the vacuum chamber (1). The detection light of the third sensor (33) can pass through the vacuum window (11) and selectively pass through the two channels (341) and be projected onto the bottom wall of the corresponding channel (341).

7. The wafer flipping apparatus according to claim 5, characterized in that, The sensing element (34) includes two L-shaped plates (342), which are arranged at intervals and opposite to each other on the rotating seat (2112). The two L-shaped plates (342) and the rotating seat (2112) together form the channel (341).

8. The wafer flipping apparatus according to any one of claims 1-7, characterized in that, The detection mechanism also includes a fourth sensor (35), which is located outside the vacuum chamber (1). The detection light of the fourth sensor (35) can pass through the vacuum window (11) into the vacuum chamber (1) and can be directed to the wafer clamping area to detect whether the wafer (100) is located in the wafer clamping area.

9. The wafer flipping apparatus according to any one of claims 1-7, characterized in that, The sensing element is a light reflection sensor.

10. The wafer flipping apparatus according to any one of claims 1-7, characterized in that, The connection between the vacuum window (11) and the wall of the vacuum chamber (1) is provided with a sealing structure.

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