High-power integrated circuit chip packaging device

Abstract

The utility model belongs to the technical field of chip packaging, and discloses a high-power integrated circuit chip packaging device which comprises a feeding structure, a machine body, a control unit, a suction unit, a feeding structure and a fixing structure. The feeding structure comprises a tray, a guide part and a transmission part, the guide part is connected to the machine body and used for driving the transmission part to move, the transmission part is connected to the guide part and used for driving the tray to move, the tray is connected to the transmission part and used for bearing chips, and the control unit is connected to the machine body and used for controlling the packaging device to operate. When the chip is packaged, the rack meshed with the gear is moved, so that the end part of the clamping block is attached to the end part of the chip, the chip is fixed on the slide holder, the position deviation of the chip during packaging is effectively avoided, and the packaging quality and the product percent of pass are greatly improved.

Description

A high-power integrated circuit chip packaging device Technical Field

[0001] This utility model belongs to the field of chip packaging technology, and in particular relates to a high-power integrated circuit chip packaging device. Background Technology

[0002] With the rapid development of electronic information technology, high-power integrated circuit chips are widely used in many fields such as communications, new energy, and industrial control. In the key process of chip packaging, the chip carrier stage, as an important component that carries the chip, plays a crucial role in performance.

[0003] In actual chip packaging operations, static electricity is easily generated due to air friction in the manufacturing environment and contact separation between equipment components. When a chip carrying static electricity is placed on the wafer stage, the chip will be displaced due to the Coulomb force generated by the static electricity, deviating from the original preset precise position. At the same time, the packaging equipment will generate various forms of vibration during operation, which makes the chip easily break through the friction limit provided by the wafer stage under the continuous action of vibration, resulting in sliding or displacement.

[0004] In other words, during chip packaging, the wafer stage is affected by static electricity and vibration, causing the chip to shift, which reduces packaging quality, increases the defect rate, and seriously affects packaging efficiency and product reliability. Summary of the Invention

[0005] The purpose of this invention is to provide a high-power integrated circuit chip packaging device to solve the problem that in existing chip packaging processes, the wafer stage is affected by static electricity and vibration, causing chip displacement, which reduces packaging quality, increases the defect rate, and seriously affects packaging efficiency and product reliability.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] This utility model provides a high-power integrated circuit chip packaging device, comprising:

[0008] The body, the component used to support the packaging device;

[0009] The feeding structure includes a tray, a guide, and a transmission component. The guide is connected to the machine body and is used to drive the transmission component to move. The transmission component is connected to the guide and is used to drive the tray to move. The tray is connected to the transmission component and is used to carry the chip.

[0010] A control unit, connected to the main body, is used to control the operation of the packaging device;

[0011] A pick-up structure, connected to the control unit, is used to pick up the chip;

[0012] A feeding structure, connected to the machine body, is used to transport chips;

[0013] A fixed structure includes a clamping assembly and a wafer carrier stage, wherein the wafer carrier stage is connected to the body for carrying chips, and the clamping assembly is connected to the wafer carrier stage for clamping chips.

[0014] As an optional technical solution for a high-power integrated circuit chip packaging device, a cleaning device is also included, the cleaning device comprising:

[0015] A sleeve, the sleeve being connected to the feeding structure;

[0016] A piston and a connecting rod, the connecting rod being connected to the piston, the piston being inserted into the sleeve for compressing the gas inside the sleeve;

[0017] A connecting pipe, connected to the sleeve, is used to guide gas;

[0018] An elastic element, connected to the connecting rod, is used to provide elastic force for the piston to return to its original position.

[0019] As an optional technical solution for a high-power integrated circuit chip packaging device, the clamping assembly includes:

[0020] A drive unit and a rotating shaft, wherein the rotating shaft is connected to the drive unit, and the drive unit is connected to the stage for driving the rotating shaft to rotate;

[0021] A gear and a rack, wherein the rack meshes with the gear, and the gear is connected to the rotating shaft for driving the rack to move;

[0022] A clamping block, connected to the rack, is used to hold the chip.

[0023] As an optional technical solution for a high-power integrated circuit chip packaging device, the wafer stage is provided with a mounting slot, and the clamping assembly is placed in the mounting slot.

[0024] As an optional technical solution for a high-power integrated circuit chip packaging device, the rack is provided with a sliding groove, the driving component is provided with a fixed seat, the fixed seat is provided with a limiting block, and the limiting block is inserted into the sliding groove.

[0025] As an optional technical solution for high-power integrated circuit chip packaging devices, the card block is equipped with a rubber pad to buffer the clamping force of the card block on the chip.

[0026] Beneficial effects:

[0027] This utility model provides a high-power integrated circuit chip packaging device. This device includes a loading structure, a body, a control unit, a pick-up unit, a feeding structure, and a fixing structure. The body supports the components of the packaging device. The loading structure includes a tray, a guide, and a transmission component. The guide is connected to the body and drives the transmission component to move. The transmission component is connected to the guide and drives the tray to move. The tray is connected to the transmission component and supports the chip. The control unit is connected to the body and controls the operation of the packaging device. The feeding structure is connected to the body and transports the chip. The pick-up structure is connected to the control unit and picks up the chip. The fixing structure includes a clamping assembly and a wafer carrier. The wafer carrier is connected to the body and supports the chip. The clamping assembly is connected to the wafer carrier and clamps the chip. A drive component drives a gear to rotate via a rotating shaft, causing a rack meshing with the gear to move. This allows the end of the clamping block to contact the end of the chip, fixing the chip on the wafer carrier and effectively preventing positional deviation during packaging, greatly improving packaging quality and product yield. Attached Figure Description

[0028] Figure 1 is a schematic diagram of a high-power integrated circuit chip packaging device provided in an embodiment of the present invention.

[0029] Figure 2 is a schematic diagram of the clamping assembly provided in an embodiment of the present invention.

[0030] Figure 3 is a second structural schematic diagram of the clamping assembly provided in an embodiment of this utility model;

[0031] Figure 4 is a schematic diagram of the structure of a high-power integrated circuit chip packaging device provided in an embodiment of this utility model;

[0032] Figure 5 is a schematic diagram of the cleaning component provided in an embodiment of this utility model.

[0033] In the diagram: 1. Machine body; 2. Tray; 3. Guide component; 4. Transmission component; 5. Control unit; 6. Suction structure; 7. Feeding structure; 8. Plate carrier; 9. Sleeve; 10. Piston; 11. Connecting rod; 12. Connecting pipe; 13. Elastic component; 14. Drive component; 15. Rotating shaft; 16. Gear; 17. Rack; 18. Locking block; 19. Fixed seat; 20. Limiting block; 21. Rubber pad. Detailed Implementation

[0034] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0035] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0038] As shown in Figures 1 to 5, this embodiment provides a high-power integrated circuit chip packaging device, including a loading structure, a body 1, a control unit 5, a pick-up unit, a feeding structure 7, and a fixing structure. The body 1 is used to support the components of the packaging device. The loading structure includes a tray 2, a guide 3, and a transmission component 4. The guide 3 is connected to the body 1 and is used to drive the transmission component 4 to move. The transmission component 4 is connected to the guide 3 and is used to drive the tray 2 to move. The tray 2 is connected to the transmission component 4 and is used to carry the chip. The control unit 5 is connected to the body 1 and is used to control the operation of the packaging device. The feeding structure 7 is connected to the body 1 and is used to transport the chip. The pick-up structure 6 is connected to the control structure 5 and is used to pick up the chip. The fixing structure includes a clamping assembly and a wafer carrier 8. The chip carrier 8 is connected to the body 1 and is used to carry the chip. The clamping assembly includes a drive unit 14, a rotating shaft 15, a gear 16, a rack 17, and a clamping block 18. The rotating shaft 15 is connected to the drive unit 14, and the drive unit 14 is connected to the chip carrier 8 to drive the rotating shaft 15 to rotate. The rack 17 meshes with the gear 16, and the gear 16 is connected to the rotating shaft 15 to drive the rack 17 to move. The clamping block 18 is connected to the rack 17 to clamp the chip. The chip carrier 8 is provided with a mounting groove, and the clamping assembly is placed in the mounting groove. The rack 17 is provided with a sliding groove. The drive unit 14 is provided with a fixing seat 19, and the fixing seat 19 is provided with a limiting block 20, which is inserted into the sliding groove. The clamping block 18 is provided with a rubber pad 21 to buffer the clamping force of the clamping block 18 on the chip.

[0039] The drive unit 14 drives the gear 16 to rotate via the rotating shaft 15, which causes the rack 17 meshing with the gear 16 to move, thereby making the end of the card block 18 fit with the end of the chip, thus fixing the chip on the wafer stage 8, effectively avoiding positional deviation of the chip during packaging, and greatly improving packaging quality and product qualification rate.

[0040] In use, driven by the transmission component 4 and the guide component 3, the chip on the tray 2 is moved into the suction range of the suction structure 6. Then, the suction structure 6 moves the chip from the tray 2 to the wafer stage 8. When the suction structure 6 places the chip on the wafer stage 8, the drive component 14 is activated. The drive component 14, connected by the rotating shaft 15, drives the gear 16 to start rotating. During the rotation of the gear 16, because the rack 17 is tightly meshed with the gear 16, the rotational force of the gear 16 is transmitted to the rack 17, causing the rack 17 to move. During the movement of the rack 17, the limiting block 20 slides in the groove, limiting the movement. Block 20 provides a guide position for rack 17. The movement of rack 17 then pulls block 18, causing it to gradually approach the chip. As block 18 approaches, rubber pad 21 adheres to the chip, stopping drive 14. The chip end is firmly held in place, preventing any displacement. This accurately and effectively fixes the chip's position on the wafer stage 8, laying a solid foundation for the smooth progress of subsequent packaging processes. Then, when pick-up structure 6 moves the chip from wafer stage 8 to feeding structure 7, drive 14 is activated, causing block 18 to separate from the chip. This allows pick-up structure 6 to pick up the chip and move it to feeding structure 7.

[0041] Specifically, the top of the stage 8 is provided with a chip positioning slot for placing chips. The drive component 14 can be a motor or other component that can drive the rotating shaft 15 to rotate. The rotating shaft 15 is fixedly connected to the output shaft of the drive component 14. The gear 16 is fixedly connected to the top of the rotating shaft 15. The rack 17 meshes with the rotating shaft 15. The locking block 18 is fixedly connected to the rack 17. The guide component 3 can be an electric slide rail structure. The transmission component 4 can be an electric lead screw structure. These are existing technologies and will not be elaborated on here.

[0042] In this embodiment, there are two sets of racks 17, located at both ends of the outer surface of the gear 16.

[0043] Referring to Figures 4 and 5, this embodiment also includes a cleaning component. The cleaning component includes a sleeve 9, a piston 10, a connecting rod 11, a connecting pipe 12, and an elastic element 13. The sleeve 9 is connected to the feeding structure 7, the connecting rod 11 is connected to the piston 10, the piston 10 is inserted into the sleeve 9, and is used to compress the gas inside the sleeve 9. The connecting pipe 12 is connected to the sleeve 9 and is used to guide the gas. The elastic element 13 is connected to the connecting rod 11 and is used to provide elastic force for the piston 10 to reset.

[0044] During the reciprocating motion of the suction structure 6, it moves downwards to pick up the chip. In this process, it squeezes the connecting rod 11, causing the air inside the sleeve 9 to be compressed by the piston 10. The compressed gas is discharged through the connecting pipe 12, whose outlet is precisely aligned with the chip surface to clean it. This cleans the chip and prevents problems such as decreased electrical performance caused by surface dust, impurities, and other contaminants during packaging. This effectively improves the chip yield and reliability, ensuring stability in subsequent packaging and use.

[0045] During use, the suction structure 6 presses down the connecting rod 11, causing the elastic element 13 to stretch and contract under pressure. Simultaneously, the connecting rod 11 drives the piston 10 to slide downwards within the sleeve 9, compressing the gas inside the sleeve 9 and allowing it to be discharged from the connecting tube 12. The outlet end of the connecting tube 12 is aligned with the chip on the feeding structure 7, allowing the gas discharged from the connecting tube 12 to purge the chip surface. This prevents the chip from experiencing a decline in electrical performance due to surface dust, impurities, and other contaminants during the packaging process, effectively improving the chip yield and reliability, and ensuring the stability of subsequent packaging and use. When the suction structure 6 moves upwards, the pressure on the elastic element 13 is released, restoring its elastic deformation. The connecting rod 11 then drives the piston 10 to slide upwards within the sleeve 9, thus preparing for the next cleaning operation.

[0046] Specifically, the suction structure 6 is equipped with two vacuum nozzles, and a connecting plate is fixedly connected between the two vacuum nozzles. One end of the feeding structure 7 is connected to a tape packaging device to cover the chip with a cover tape for sealing. This is existing technology and will not be elaborated on here. The sleeve 9 is fixedly installed at one end of the feeding structure 7, the piston 10 is slidably installed inside the sleeve 9, the connecting rod 11 is fixedly installed at the top of the piston 10, and the elastic element 13 can be an elastic element with elasticity such as a spring.

[0047] The following is a detailed description of the usage process of a high-power integrated circuit chip packaging device:

[0048] In use, driven by the transmission component 4 and the guide component 3, the chip on the tray 2 is moved into the suction range of the suction structure 6. Then, the suction structure 6 moves the chip from the tray 2 to the wafer stage 8. When the suction structure 6 places the chip on the wafer stage 8, the drive component 14 is activated. The drive component 14, connected by the rotating shaft 15, drives the gear 16 to start rotating. During the rotation of the gear 16, because the rack 17 is tightly meshed with the gear 16, the rotational force of the gear 16 is transmitted to the rack 17, causing the rack 17 to move. As the rack 17 moves, the limiting block 20 slides within the groove, providing a guiding position for the rack 17. The movement of the rack 17 then pulls the locking block 18, causing it to gradually approach the chip. As the locking block 18 approaches, the rubber pad 21 adheres to the chip, stopping the drive unit 14. The chip end is firmly held in place, preventing any displacement. This precisely and effectively fixes the chip's position on the wafer stage 8, laying a solid foundation for the smooth progress of subsequent packaging processes. Then, when the pick-up structure 6 moves the chip from the wafer stage 8 to the feeding structure... When the chip is placed on the feeding structure 7, the drive unit 14 is activated, causing the card block 18 to separate from the chip. This allows the suction structure 6 to pick up the chip and move it onto the feeding structure 7. When the suction structure 6 lowers and places the chip onto the feeding structure 7, the suction structure 6's pressing rod 11 descends. At this time, the elastic element 13 is compressed and expands elastically. Simultaneously, the connecting rod 11 drives the piston 10 to slide downwards within the sleeve 9, causing the gas inside the sleeve 9 to be compressed and discharged from the connecting pipe 12. The outlet end of the connecting pipe 12 is aligned with the chip on the feeding structure 7, allowing the gas discharged by the connecting pipe 12 to flow freely. The body blows the chip surface to avoid problems such as decreased electrical performance caused by surface dust, impurities and other contaminants during the packaging process, effectively improving the yield and reliability of the chip, and providing a guarantee for the stability of subsequent packaging and use. When the suction structure 6 moves upward, the pressure on the elastic element 13 is released, and it restores its elastic deformation. The piston 10 is driven to slide upward in the sleeve 9 through the connecting rod 11, thus preparing for the next cleaning operation. The chip that has been cleaned on the feeding structure 7 is transported to the tape and reel packaging device through the feeding structure 7.

[0049] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A high-power integrated circuit chip packaging device, characterized in that, include: The machine body (1) is used to support the components of the packaging device; the feeding structure includes a tray (2), a guide (3) and a transmission component (4), wherein the guide (3) is connected to the machine body (1) and is used to drive the transmission component (4) to move, the transmission component (4) is connected to the guide (3) and is used to drive the tray (2) to move, and the tray (2) is connected to the transmission component (4) and is used to support the chip; the control unit (5) is connected to the machine body (1) and is used to control the operation of the packaging device; the pick-up structure (6) is connected to the control unit (5) and is used to pick up the chip; the feeding structure (7) is connected to the machine body (1) and is used to transport the chip; the fixing structure includes a clamping assembly and a wafer carrier (8), wherein the wafer carrier (8) is connected to the machine body (1) and is used to support the chip, and the clamping assembly is connected to the wafer carrier (8) and is used to clamp the chip.

2. The high-power integrated circuit chip packaging device according to claim 1, characterized in that, It also includes a cleaning device comprising: a sleeve (9) connected to the feeding structure (7); a piston (10) and a connecting rod (11) connected to the piston (10), the piston (10) being inserted into the sleeve (9) for compressing the gas inside the sleeve (9); a connecting pipe (12) connected to the sleeve (9) for guiding the gas; and an elastic element (13) connected to the connecting rod (11) for providing elastic force for the piston (10) to reset.

3. The high-power integrated circuit chip packaging device according to claim 1, characterized in that, The clamping assembly includes: a drive member (14) and a rotating shaft (15), the rotating shaft (15) being connected to the drive member (14), the drive member (14) being connected to the wafer stage (8) for driving the rotating shaft (15) to rotate; a gear (16) and a rack (17), the rack (17) being meshed with the gear (16), the gear (16) being connected to the rotating shaft (15) for driving the rack (17) to move; and a clamping block (18) connected to the rack (17) for clamping the chip.

4. The high-power integrated circuit chip packaging device according to claim 1, characterized in that, The stage (8) is provided with a mounting slot, and the clamping assembly is placed in the mounting slot.

5. A high-power integrated circuit chip packaging device according to claim 3, characterized in that, The rack (17) has a sliding groove, the drive member (14) has a fixed seat (19), the fixed seat (19) has a limiting block (20), and the limiting block (20) is inserted into the sliding groove.

6. A high-power integrated circuit chip packaging device according to claim 3, characterized in that, The card block (18) is provided with a rubber pad (21) to buffer the clamping force of the card block (18) on the chip.

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