Solder ball flattening device for semiconductor packaging

Abstract

The utility model relates to a solder ball flattening device for semiconductor packaging, which comprises a bedplate, a through hole is arranged on the bedplate, upright posts are symmetrically and fixedly arranged on two sides of the through hole, the two upright posts jointly fix and support a heating plate, a lifting plate is arranged below the heating plate, two sides of the lifting plate are respectively connected with the two upright posts in a sliding manner, and the lifting plate is lifted through a lifting device. The utility model mainly aims to provide a solder ball flattening device for semiconductor packaging so as to prevent a solder ball from falling off or being damaged in the flattening process and shorten the overall solder ball flattening process time.

Description

Technical Field

[0001] This utility model relates to a semiconductor packaging device, specifically to a solder ball flattening device for semiconductor packaging. Background Technology

[0002] During the DPC ceramic substrate packaging process, the circuit bumps on the DPC ceramic substrate must be flattened to ensure packaging performance and usability.

[0003] During the packaging process, solder balls are typically used for soldering. This is because the solder balls melt when heated during processes such as reflow soldering, forming a strong metal connection between the pads on the DPC ceramic substrate and the pins of the chip or other electronic components. This ensures that current can be stably transmitted between the components, thereby enabling the entire circuit to function properly.

[0004] As mentioned above, in order to achieve a tighter and more precise fit between the solder balls and other components or substrates, and because some DPC ceramic substrates also require the use of solder balls for heat dissipation or to meet certain specific requirements, the solder balls need to be flattened during the packaging process.

[0005] In the existing technology, during the solder ball flattening process, a robotic arm is usually used to first grab the ceramic substrate, then heat the ceramic substrate, and then move the ceramic substrate into the flattening machine for flattening. This makes the robotic arm program highly demanding. At the same time, during the solder ball flattening process, the temperature of the solder ball drops, which can easily damage the solder ball or cause it to fall off.

[0006] The applicant previously filed a utility model patent application, application number 202520197540.7, which used a lead screw motor to drive the lifting platform to move downward. Although the lead screw motor achieved precise control, the overall flattening process time was increased due to the long drive time of the lead screw motor. Therefore, this application has made improvements based on the above solution. Utility Model Content

[0007] The main purpose of this invention is to provide a solder ball flattening device for semiconductor packaging to prevent solder balls from falling off or being damaged during the flattening process, while also shortening the overall solder ball flattening process time.

[0008] To achieve the above objectives, this utility model provides a solder ball flattening device for semiconductor packaging, including a platform with a through hole. Columns are symmetrically fixed on both sides of the through hole, and the two columns jointly support a heating plate. A lifting plate is provided below the heating plate, and the two sides of the lifting plate are slidably connected to the two columns respectively. The lifting plate is raised and lowered by a lifting device.

[0009] Preferably, the heating plate has a first ear on each side, and the first ear is inserted through the top of the column.

[0010] In a further preferred embodiment, the top of the column is provided with an external thread, and the top of the column is provided with a nut and a threaded sleeve from top to bottom, with the first ear located between the nut and the threaded sleeve.

[0011] Even more preferably, the bottom of the threaded sleeve is provided with a stop block.

[0012] Preferably, the lifting plate is provided with a second ear on each side, and the second ear is slidably connected to the column.

[0013] A further preferred option is that the lifting device is a pneumatic rod.

[0014] More preferably, the movable end of the pneumatic rod's telescopic rod passes through the through hole and is fixedly connected to the bottom of the lifting plate.

[0015] The beneficial effects of this utility model are as follows:

[0016] 1. Prevent solder balls from falling off or being damaged:

[0017] This solder ball flattening device places a heating plate above a lifting plate, which is raised and lowered by a lifting mechanism. During the flattening process, the ceramic substrate is first heated by the heating plate to bring the solder balls to a suitable temperature. Then, the lifting mechanism drives the lifting plate to rise and flatten the solder balls. This ensures that the solder balls remain in a suitable temperature environment throughout the flattening process, avoiding the problem of solder balls cooling down and easily becoming damaged or falling off during the transfer of the ceramic substrate by a robotic arm in existing technologies. It effectively prevents solder balls from falling off or being damaged during the flattening process, ensuring the stability and reliability of the connection between the solder balls and the ceramic substrate and other components.

[0018] 2. Shorten the overall flattening process time:

[0019] Using a pneumatic rod as the lifting device, compared with the screw motor drive used in the previous application, the pneumatic rod has a faster response speed and shorter driving time, which can quickly realize the lifting action of the lifting plate, thereby greatly shortening the overall welding ball flattening process time and improving production efficiency.

[0020] 3. Stable and reliable structure:

[0021] The lifting plate has second ears on both sides that slide to the column. With the help of the pneumatic rod, the lifting process of the lifting plate is more stable and reliable, ensuring the accuracy and consistency of the flattening operation and improving the quality of the product. Attached Figure Description

[0022] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0023] Figure 1 This is a three-dimensional structural schematic diagram of the welding ball flattening device of this utility model;

[0024] Figure 2 This is a front view of the welding ball flattening device of this utility model.

[0025] Explanation of reference numerals in the attached figures

[0026] 10. Platform; 11. Through hole;

[0027] 20. Lifting plate; 21. Second ear;

[0028] 30. Heating plate; 31. First ear; 32. Electric heating wire;

[0029] 40. Column; 41. Stop block;

[0030] 50. Pneumatic rod. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Many specific details are set forth in the following description to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0032] like Figure 1 and Figure 2 As shown, the platform 10 is made of aluminum alloy with an anodized surface and has through holes 11. Symmetrical columns 40 are arranged on both sides of the through holes 11. The columns 40 are made of 45# steel, hardened and plated with hard chrome. A heating plate 30 is fixed at the top of the columns 40, and electric heating wires 32 are evenly spiraled inside the heating plate 30. A lifting plate 20 is located below the heating plate 30, and the lifting plate 20 is driven to rise and fall by a lifting device. Additionally, grooves can be formed in the lifting plate 20 according to actual needs to place the ceramic substrate in the grooves, thereby preventing displacement of the ceramic substrate during operation.

[0033] Specifically, in this embodiment, first ears 31 are provided on both sides of the heating plate 30. The first ears 31 pass through the top of the column 40, and the heating plate 30 is fixedly installed on the top of the column 40 through the first ears 31. Preferably, in this embodiment, the top of the column 40 is provided with external threads, and a nut and a threaded sleeve are provided sequentially from top to bottom on the top of the column 40, with the first ears 31 located between the nut and the threaded sleeve.

[0034] In addition, in this embodiment, a stop block 41 is provided at the bottom of the threaded sleeve. The stop block 41 can prevent the lifting plate 20 from rising too high, which could damage the solder balls, and at the same time, prevent damage to the pins of the semiconductor chip. As described above, this allows the thickness of the stop block 41 to be changed according to the requirements of the semiconductor chip.

[0035] In this embodiment, the lifting plate 20 is provided with second ears 21 on both sides, and the second ears 21 are slidably connected to the column 40, which makes the column 40 have a guiding function.

[0036] In this embodiment, the lifting device is a pneumatic rod 50. Compared to a lead screw motor drive, the pneumatic rod 50 has a faster response speed and shorter driving time, enabling rapid lifting of the lifting plate 20, thereby significantly shortening the overall ball flattening process time. Preferably, the movable end of the telescopic rod of the pneumatic rod 50 passes through the through hole 11 and is fixedly connected to the bottom of the lifting plate 20.

[0037] The usage method of this embodiment is as follows:

[0038] Initial state: The pneumatic rod 50 is in the retracted state, the lifting plate 20 is lowered to the lowest position, and the operator places the ceramic substrate coated with solder balls in the center of the lifting plate 20;

[0039] Preheating: The pneumatic rod 50 slowly rises, bringing the ceramic substrate close to the bottom surface of the heating plate 30 (generally with a spacing of 5mm). The heating plate 30 heats up and continues to heat for a certain period of time, allowing the solder balls to be fully preheated to a molten state.

[0040] Flattening operation: After heating is completed, the pneumatic rod 50 rises rapidly, the lifting plate 20 drives the ceramic substrate to move upward, the welding ball contacts the bottom surface of the heating plate 30, and after a certain period of time, the flattening operation is completed. At this time, the welding ball forms a flat connecting layer with uniform height.

[0041] Unloading and resetting: After flattening, the pneumatic rod 50 retracts, the lifting plate 20 descends to the initial position, and the operator removes the substrate.

[0042] Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

Claims

1. A solder ball flattening device for semiconductor packaging, characterized in that, The device includes a platform with a through hole. Columns are symmetrically fixed on both sides of the through hole, and the two columns together support a heating plate. A lifting plate is located below the heating plate, and the two sides of the lifting plate are slidably connected to the two columns respectively. The lifting plate is raised and lowered by a lifting device.

2. The solder ball flattening device for semiconductor packaging according to claim 1, characterized in that, The heating plate has a first ear on each side, and the first ear passes through the top of the column.

3. The solder ball flattening device for semiconductor packaging according to claim 2, characterized in that, The top of the column is provided with an external thread, and the top of the column is provided with a nut and a threaded sleeve from top to bottom, with the first ear located between the nut and the threaded sleeve.

4. The solder ball flattening device for semiconductor packaging according to claim 3, characterized in that, The bottom of the threaded sleeve is provided with a stop block.

5. A solder ball flattening device for semiconductor packaging according to any one of claims 1 to 4, characterized in that, The lifting plate is provided with a second ear on each side, and the second ear is slidably connected to the column.

6. The solder ball flattening device for semiconductor packaging according to claim 5, characterized in that, The lifting device is a pneumatic rod.

7. The solder ball flattening device for semiconductor packaging according to claim 6, characterized in that, The movable end of the telescopic rod of the pneumatic rod passes through the through hole and is fixedly connected to the bottom of the lifting plate.

Images