Vacuum dehydration and degassing device for electronic pouring sealant
The vacuum dehydration and degassing device, with its three-layer cavity structure and dual-cavity synchronous vacuum design, solves the problems of long degassing and dehydration time and high cost in the production of electronic potting compounds, achieving efficient and continuous processing and reducing equipment and energy costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NINGBO JIANGBEI GOFRONT HERONG ELECTRIC
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-05
AI Technical Summary
The existing vacuum degassing and dehydration process for electronic potting compounds is time-consuming, resulting in low production efficiency and high equipment investment and energy costs. While existing solutions improve efficiency, they also increase equipment and maintenance costs.
The vacuum dehydration and degassing device adopts a three-layer cavity structure, including a glue distribution cavity, a dispersion cavity, and a storage cavity. Combined with dual-cavity synchronous vacuuming and a multi-stage dispersion structure, it can achieve synchronous dehydration and degassing of the glue during the flow process, reducing the number of equipment and downtime.
It enables continuous operation of adhesive liquid processing, vacuum dehydration, and degassing, significantly shortening the production cycle, reducing equipment investment and maintenance costs, improving processing efficiency, and avoiding repeated vacuuming operations and energy consumption.
Smart Images

Figure CN224194170U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic potting compound production technology, and more specifically, to a vacuum dehydration and degassing device for electronic potting compounds. Background Technology
[0002] During the production, manufacturing, and transportation of electronic potting compounds, due to their unique physicochemical properties, moisture and gases from the air inevitably adsorb and dissolve in the adhesive. This introduced moisture and gas can significantly impact subsequent vacuum potting processes, such as causing defects like bubbles and voids after potting, reducing the sealing and electrical performance of electronic products, and in severe cases, even leading to product failure. Therefore, before vacuum potting, it is essential to perform vacuum degassing and dehydration treatment on the adhesive to remove moisture and gases.
[0003] Currently, the common method for vacuum degassing and dehydration of electronic potting compounds is for operators to pre-treat the compound before use. Existing vacuum dispensing equipment is equipped with at least one material preparation unit specifically for dehydrating and degassing resin AB compounds. However, this process is time-consuming, significantly extending the entire production cycle and severely restricting production efficiency. To address the problem of excessively long production waiting times, the industry typically employs a scheme of alternating material preparation units. While this approach can improve production efficiency to some extent, it also leads to a significant increase in equipment investment, along with a substantial rise in energy and equipment maintenance costs, resulting in persistently high production costs and reduced market competitiveness. Therefore, how to shorten production waiting times and reduce equipment investment, energy consumption, and maintenance costs while ensuring effective degassing and dehydration of electronic potting compounds has become a pressing technical challenge in this field. Utility Model Content
[0004] The problem solved by this invention is to shorten production waiting time and reduce investment costs while ensuring the degassing and dehydration effect of electronic potting compound.
[0005] To solve the above problems, this utility model provides a vacuum dehydration and degassing device for electronic potting adhesives, including a housing, a dispensing device, a dispersing frame, and a vacuum pump.
[0006] The shell contains an inner cavity; the inner cavity is divided into a glue distribution cavity, a dispersion cavity, and a storage cavity from top to bottom; a discharge port is provided at the bottom of the storage cavity;
[0007] The adhesive applicator is located inside the adhesive application chamber, and the adhesive inlet end of the adhesive applicator is connected to the adhesive application tube;
[0008] The dispersion rack is installed inside the dispersion chamber; the dispersion rack includes an upper rack plate and a lower rack plate; the middle of the upper rack plate arches towards the adhesive distribution chamber; the middle of the lower rack plate is recessed towards the storage chamber; dispersion holes are provided on both the upper and lower rack plates;
[0009] The vacuum pump is connected to the adhesive distribution chamber and the dispersion chamber via air pipes.
[0010] Optionally, a support platform is installed on the wall of the dispersion chamber; the lower support plate is placed on the support platform; and the upper support plate is placed on the lower support plate.
[0011] Optionally, a dispersion plate is also included; the dispersion plate is disposed between the dispersion chamber and the storage chamber.
[0012] Optionally, the rubber tube includes a vertical section and an extension section; the vertical section is located inside the inner cavity and is coaxial with the inner cavity; one end of the extension section is connected to the bottom of the vertical section, and the other end extends to the outside of the shell and is connected to the rubber inlet tube.
[0013] Optionally, the adhesive applicator includes an adhesive applicator head and multiple adhesive applicator rods.
[0014] The adhesive applicator is connected to the top of the vertical section; the adhesive applicator has an adhesive inlet cavity inside.
[0015] Multiple adhesive spreading rods are evenly distributed circumferentially on the outer wall of the adhesive spreading head; the adhesive spreading rods have cavities that communicate with the adhesive inlet chamber; the bottom surface of the adhesive spreading rods has multiple adhesive outlet holes that communicate with the cavities.
[0016] Optionally, the applicator may also include a connector, a drive shaft, and drive fan blades.
[0017] Optionally, the connector is coaxially arranged with the vertical section, with one end fixedly connected to the top of the vertical section and the other end rotatably connected to the adhesive head;
[0018] The drive shaft is installed inside the glue inlet cavity and is coaxially arranged with the connector;
[0019] The drive fan blades are mounted on the drive shaft.
[0020] Optionally, a heating device may be installed on the inlet hose.
[0021] Optionally, the trachea includes the main tube and branches.
[0022] One end of the main pipe is connected to the dispersion chamber, and the other end is connected to the vacuum pump;
[0023] One end of the branch pipe is connected to the adhesive cavity, and the other end is connected to the main pipe.
[0024] Optionally, a stirring shaft is rotatably mounted on the bottom of the shell; one end of the stirring shaft located inside the storage cavity is connected to a stirring frame, and the other end located outside the shell is connected to a drive motor.
[0025] Optionally, the cavity wall is provided with a heat insulation layer.
[0026] The beneficial effects of this invention's electronic potting compound vacuum dehydration and degassing device are:
[0027] In operation, the vacuum dehydration and degassing device for electronic potting adhesives injects the adhesive solution into the distribution chamber through the distribution tube, spreads it by the distributor, and then flows into the dispersion chamber. The adhesive solution first contacts the arched portion of the upper shelf, dispersing and flowing along the curved surface, forming fine streams through the dispersion holes. As the streams fall, they impact the concave curved surface of the lower shelf, further dispersing and flowing along the curved surface, forming fine streams through the dispersion holes. During this process, the distribution chamber and dispersion chamber are simultaneously evacuated by a vacuum pump, continuously exposing the adhesive solution to a negative pressure environment during the flow and dispersion stage, causing the water in the adhesive to escape as bubbles. The degassed adhesive solution is collected in the storage chamber and directly discharged through the bottom outlet for use. The multi-stage dispersion path formed by the arched and concave curved surfaces and dispersion holes increases the specific surface area of the adhesive solution compared to traditional single-layer processing, shortens the bubble escape path, and achieves efficient continuous processing. The three-layer cavity structure, integrating adhesive application, dispersion, and storage functions, allows for simultaneous adhesive processing, vacuum dehydration, and degassing, eliminating the need for downtime while waiting for material preparation. Through dual-cavity synchronous vacuuming and a multi-stage dispersion structure, the adhesive undergoes dehydration and degassing during its flow, improving processing efficiency while reducing the number of devices. This enables continuous operation of adhesive processing and vacuum degassing, eliminating downtime caused by material preparation device changes and significantly shortening the production cycle. The integrated structure reduces the number of devices and floor space, lowering equipment investment and maintenance costs. The dual-cavity synchronous vacuuming design allows degassing to begin in the initial flow stage of the adhesive, and the multi-stage dispersion structure enhances bubble escape efficiency, achieving the desired degassing effect in a single processing cycle, avoiding repeated vacuuming operations and reducing energy consumption. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of the electronic potting compound vacuum dehydration and degassing device in this embodiment;
[0029] Figure 2 for Figure 1 The main view;
[0030] Figure 3 This is a schematic diagram of the internal structure of the shell in this embodiment;
[0031] Figure 4 This is a structural diagram of the rubber distribution tube, dispersion frame, and dispersion plate in this embodiment;
[0032] Figure 5 This is a schematic diagram of the rubber tube structure in this embodiment;
[0033] Figure 6 This is a schematic diagram of the adhesive applicator in this embodiment;
[0034] Figure 7 This is a schematic diagram of the trachea structure in this embodiment;
[0035] Figure 8 This is a schematic diagram of the stirring rack in this embodiment.
[0036] Explanation of reference numerals in the attached figures:
[0037] 1. Shell; 2. Outlet; 3. Inlet pipe; 4. Heating device; 5. Air pipe; 501. Main pipe; 502. Branch pipe; 6. Vacuum pump; 7. Observation window; 8. Glue distribution pipe; 801. Vertical section; 802. Extension section; 9. Glue distributor; 901. Glue distribution head; 902. Glue distribution rod; 903. Connector; 904. Drive shaft; 10. Dispersing rack; 1001. Upper rack plate; 1002. Lower rack plate; 11. Dispersing plate; 12. Mixing rack. Detailed Implementation
[0038] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Although some embodiments of this utility model are shown in the drawings, it should be understood that this utility model can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this utility model. It should be understood that the drawings and embodiments of this utility model are for illustrative purposes only and are not intended to limit the scope of protection of this utility model.
[0039] The term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to"; the term "based on" means "at least partially based on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; and the term "optionally" means "optional embodiments". Definitions of other terms will be given in the following description. It should be noted that the concepts of "first," "second," etc., mentioned in this utility model are only used to distinguish different devices, modules, or units, and are not used to limit the order of functions performed by these devices, modules, or units or their interdependencies.
[0040] It should be noted that the terms "one" and "multiple" used in this utility model are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".
[0041] like Figure 1-8 As shown in the figure, an electronic potting compound vacuum dehydration and degassing device provided in this embodiment of the present invention includes a housing 1, a glue applicator 9, a dispersing rack 10 and a vacuum pump 6.
[0042] The shell 1 contains an inner cavity; the inner cavity is divided into a glue distribution cavity, a dispersion cavity, and a storage cavity from top to bottom; a discharge port 2 is provided at the bottom of the storage cavity;
[0043] The adhesive applicator 9 is located inside the adhesive application chamber, and the adhesive inlet end of the adhesive applicator 9 is connected to the adhesive application tube 8.
[0044] The dispersion rack 10 is installed in the dispersion cavity; the dispersion rack 10 includes an upper rack plate 1001 and a lower rack plate 1002; the middle part of the upper rack plate 1001 arches towards the adhesive distribution cavity; the middle part of the lower rack plate 1002 is recessed towards the storage cavity; dispersion holes are provided on both the upper rack plate 1001 and the lower rack plate 1002.
[0045] The vacuum pump 6 is connected to the adhesive distribution chamber and the dispersion chamber via the air pipe 5.
[0046] The shell 1 refers to a multi-layered structure, which can be formed by welding metal materials. The inner cavity is roughly divided into three layers: a distribution chamber for initial distribution of the adhesive, a dispersion chamber for dispersion treatment, and a storage chamber for temporary storage of the degassed adhesive. This layered structure extends the adhesive flow path, creating conditions for multi-stage vacuum degassing. The adhesive distributor 9 is the adhesive distribution mechanism, whose inlet end is connected to the distribution tube 8. It allows the adhesive to flow into the dispersion chamber in a thin layer through evenly distributed outlet holes. This structure avoids localized accumulation caused by concentrated adhesive falling. The dispersion frame 10 is a support component with a curved structure. The upper frame plate 1001 arches upwards in the middle to form an arc-shaped convex surface, while the lower frame plate 1002 is concave downwards in the middle to form an arc-shaped concave surface. The upper and lower frame plates 1001 are roughly umbrella-shaped, and the diameter of the dispersion holes can be controlled within a specific size range. The curved structure guides the adhesive to flow in multiple directions, and the dispersion holes further divide the adhesive flow, increasing the contact area between the adhesive and the vacuum environment. Vacuum pump 6 refers to a pumping device that connects both the adhesive application chamber and the dispersion chamber. Specifically, it can adopt a dual-channel vacuum pipeline design, connecting the two chambers respectively. Simultaneous vacuuming of the two chambers can continuously degas the adhesive during its flow, reducing the waiting time for staged processing.
[0047] Specifically, the adhesive is injected into the distribution chamber through the distribution tube 8, spread by the distributor 9, and then flows into the dispersion chamber. The adhesive first contacts the arched part of the upper frame plate 1001, disperses and flows along the curved surface, and forms a fine stream through the dispersion holes. As the fine stream falls, it impacts the concave curved surface of the lower frame plate 1002, further disperses and flows along the curved surface, and forms a fine stream through the dispersion holes. During this process, the distribution chamber and the dispersion chamber are simultaneously evacuated by the vacuum pump 6, and the adhesive is continuously exposed to a negative pressure environment during the flow and dispersion stage, causing the water in the adhesive to turn into bubbles and escape step by step. The degassed adhesive is collected in the storage chamber and directly discharged for use through the bottom outlet 2. The multi-stage dispersion path formed by the arched and concave curved surfaces and the dispersion holes increases the specific surface area of the adhesive compared to traditional single-layer processing, shortens the bubble escape path, and achieves efficient continuous processing. The three-layer cavity structure, integrating adhesive application, dispersion, and storage functions, allows for simultaneous adhesive processing, vacuum dehydration, and degassing, eliminating the need for downtime while waiting for material preparation. Through dual-cavity synchronous vacuuming and a multi-stage dispersion structure, the adhesive undergoes dehydration and degassing during its flow, improving processing efficiency while reducing the number of devices. This enables continuous operation of adhesive processing and vacuum degassing, eliminating downtime caused by material preparation device changes and significantly shortening the production cycle. The integrated structure reduces the number of devices and floor space, lowering equipment investment and maintenance costs. The dual-cavity synchronous vacuuming design allows degassing to begin in the initial flow stage of the adhesive, and the multi-stage dispersion structure enhances bubble escape efficiency, achieving the desired degassing effect in a single processing cycle, avoiding repeated vacuuming operations and reducing energy consumption.
[0048] Optionally, a support platform is installed on the wall of the dispersion chamber; the lower support plate 1002 is placed on the support platform; and the upper support plate 1001 is placed on the lower support plate 1002.
[0049] The support platform refers to an annular boss structure fixed to the wall of the dispersion chamber. It can be implemented using welding or bolting, and serves to provide a rigid bearing surface for the lower frame plate 1002, preventing structural displacement during dispersion operations. The lower frame plate 1002 forms a self-positioning assembly through contact with the support platform, enabling rapid installation and disassembly. The upper frame plate 1001, stacked on top of the lower frame plate 1002, forms a layered dispersion area, maintaining the dispersion function while retaining independent assembly and disassembly capabilities.
[0050] Specifically, the support platform is fixedly installed in the middle section of the dispersion chamber wall, forming a horizontal annular bearing surface. The lower support plate 1002 is placed horizontally on the support platform surface, achieving self-stabilizing positioning through gravity. The upper support plate 1001 is stacked on top of the lower support plate 1002, with the dispersion holes of both plates staggered. During the flow of the adhesive, the rigid connection between the support platform and the chamber wall can withstand the vibration load generated by the dispersion operation, preventing displacement of the frame. During maintenance, the upper support plate 1001 can be directly removed upwards, and the lower support plate 1002 can be horizontally pulled away along the support platform without disassembling the chamber structure or using special tools, significantly reducing maintenance time. Through the support platform and layered assembly structure, maintenance operation time is reduced to a few minutes without damaging the chamber's sealing, significantly improving the efficiency of continuous production operations.
[0051] Optionally, it also includes a dispersion plate 11; the dispersion plate 11 is disposed between the dispersion chamber and the storage chamber.
[0052] The dispersing plate 11 can be implemented using a perforated plate or a plate structure with guide channels. This structure forces the rubber compound to change direction during flow, extending its residence time in a vacuum environment. Secondary control of the flow path refers to altering the flow state of the rubber compound through the physical obstruction effect of the dispersing plate 11, which can be achieved using staggered through-holes or inclined guide channels. This structure disrupts the laminar flow state of the rubber compound, promoting bubble escape.
[0053] Specifically, the adhesive material passes through the dispersion plate 11 when entering the storage chamber from the dispersion chamber. The through-holes or guide grooves on the dispersion plate 11 force the adhesive material flow path to undergo multiple turns, creating turbulence. Under turbulent conditions, residual air bubbles inside the adhesive material are further broken up by shear force and extracted by the vacuum pump 6. Simultaneously, the physical barrier effect of the dispersion plate 11 prevents insufficiently degassed adhesive material from directly entering the storage chamber, ensuring the uniformity of degassing and dehydration. In this embodiment, the dehydration and degassing device changes the flow state through the dispersion plate 11, extending the degassing time of the adhesive material under the same vacuum conditions, thus improving the processing effect without the need for additional vacuum processing equipment. This effectively reduces the problem of residual air bubbles and moisture in the adhesive material during transfer, improving degassing and dehydration efficiency. The uniformity of the adhesive material in the storage chamber is improved, avoiding defects caused by localized gas residue in subsequent dispensing processes, while also reducing the need for multiple sets of material preparation devices.
[0054] Optionally, please combine Figure 4 and Figure 5 The rubber tube 8 includes a vertical section 801 and an extension section 802; the vertical section 801 is located inside the inner cavity and is coaxial with the inner cavity; one end of the extension section 802 is connected to the bottom of the vertical section 801, and the other end extends to the outside of the housing 1 and is connected to the rubber inlet tube 3.
[0055] The vertical section 801 refers to a tubular structure extending axially along the inner cavity, which can be made of stainless steel or corrosion-resistant plastic tubing. Its axis coincides with the center line of the inner cavity, guiding the adhesive to flow symmetrically along the axial direction. The extension section 802 refers to a pipe connected to the bottom of the vertical section 801, which can be made of an arc-shaped transition pipe or a flanged connection pipe. It is used to guide the adhesive from the bottom of the vertical section 801 to the outside of the housing 1 while maintaining the continuity of the fluid channel. The adhesive inlet pipe 3 refers to an adhesive supply pipe located outside the housing 1, which can be connected using a quick-release connector 903 or a threaded interface, for receiving external adhesive input.
[0056] Specifically, the coaxial layout of the vertical section 801 and the inner cavity creates a centrally symmetrical flow path for the adhesive as it enters the distribution chamber, avoiding local velocity differences caused by pipe eccentricity and thus improving the uniformity of adhesive diffusion within the distribution chamber. The extension section 802 connects the vertical section 801 to the inlet pipe 3 via a bottom connection, forming a continuous delivery channel from the inside to the outside of the housing 1, eliminating the risk of interface leakage caused by multi-section pipe splicing in traditional structures. The integrated structural design of the vertical section 801 and the extension section 802 maintains a laminar flow state for the adhesive, reducing turbulent disturbances caused by abrupt path changes and ensuring pressure stability during adhesive delivery. The combined structure of the coaxial vertical section 801 and the arc-shaped extension section 802 achieves a smooth transition in the adhesive delivery path while reducing the number of external interfaces to a single connection point, thus reducing pipe installation complexity and avoiding potential problems with multi-interface sealing failure.
[0057] Optionally, please combine Figure 6 The adhesive applicator 9 includes an adhesive applicator head 901 and multiple adhesive applicator rods 902.
[0058] The adhesive applicator 901 is connected to the top of the vertical section 801; the adhesive applicator 901 is provided with an adhesive inlet cavity.
[0059] Multiple adhesive spreading rods 902 are evenly distributed circumferentially on the outer wall of the adhesive spreading head 901; each adhesive spreading rod 902 has a cavity communicating with the adhesive inlet chamber; and the bottom surface of the adhesive spreading rod 902 has multiple adhesive outlet holes communicating with the cavity.
[0060] The adhesive applicator 901 is the component connected to the top of the vertical section 801, which can be achieved using a flange or threaded connection. It has an internal adhesive inlet chamber for temporarily storing the adhesive, which balances pressure fluctuations. The adhesive applicator rod 902 is a tubular structure evenly distributed along the outer circumference of the adhesive applicator 901, which can be installed using welding or snap-fit fixing. The internal cavity of the rod is used to distribute the adhesive from the center to the periphery. The adhesive outlet refers to multiple through holes opened on the bottom surface of the adhesive applicator rod 902, which can be processed using laser drilling or mechanical drilling techniques, forming a vertically downward adhesive flow channel through the porous structure.
[0061] Specifically, the adhesive enters the inlet chamber of the adhesive distribution head 901 through the vertical section 801, and under pressure, it is evenly distributed into the cavities of each adhesive distribution rod 902. The circumferentially distributed adhesive distribution rods 902 diffuse the adhesive from the central area to the periphery, forming a vertically downward adhesive curtain through multiple outlet holes on the bottom surface. This structure allows the adhesive to form a multi-layered, uniformly distributed fluid within the distribution chamber, preventing accumulation in localized areas due to excessive flow. After entering the dispersion chamber, the uniformly distributed adhesive curtain can fully contact the vacuum degassing area, thereby improving degassing and dehydration efficiency. The circumferentially distributed adhesive distribution rods 902 and the porous structure enable the adhesive to form a uniformly distributed dispersion in three-dimensional space, providing a uniform material distribution basis for subsequent vacuum processing. This achieves a three-dimensional, uniform distribution of the adhesive within the distribution chamber, effectively eliminating localized accumulation and allowing the adhesive to be fully exposed to the vacuum environment during subsequent vacuum degassing, reducing residual bubbles and moisture accumulation, thereby improving the dehydration and degassing efficiency of electronic potting compounds.
[0062] Optionally, the adhesive applicator 9 also includes a connector 903, a drive shaft 904, and drive fan blades.
[0063] The connector 903 is coaxially arranged with the vertical section 801, with one end fixedly connected to the top of the vertical section 801 and the other end rotatably connected to the adhesive head 901;
[0064] The drive shaft 904 is installed in the glue inlet cavity and is coaxially arranged with the connector 903;
[0065] The drive fan blades are mounted on the drive shaft 904.
[0066] The connector 903 is a rotating component connecting the vertical section 801 and the adhesive application head 901. It can be implemented using a universal joint structure with bearings, allowing the adhesive application head 901 to rotate freely through the combination of a fixed end and a rotating end. The drive shaft 904 is the shaft that transmits rotational power. It can be implemented using a solid stainless steel shaft that passes through the adhesive cavity, transmitting the rotational torque of the drive fan blades to the adhesive application head 901. The drive fan blades are fluid-driven impeller structures. They can be propeller-type blades coaxially mounted on the drive shaft 904, generating rotational power through the impact of the adhesive flow.
[0067] Specifically, when the adhesive enters the inlet chamber of the adhesive distribution head 901 through the vertical section 801, the flow pressure drives the fan blades to rotate, causing the drive shaft 904 and the adhesive distribution head 901 to rotate around the axis of the vertical section 801. As the adhesive distribution rod 902 rotates with the adhesive distribution head 901, the adhesive outlet, under centrifugal force, evenly distributes the adhesive to the circumferential area of the adhesive distribution chamber, preventing localized accumulation and cavitation. The rotating connection structure between the connector 903 and the vertical section 801 prevents torsional stress on the inlet pipe 3 when the adhesive distribution head 901 rotates, while also preventing pressure fluctuations caused by adhesive backflow. The drive fan blades utilize the adhesive's own kinetic energy to achieve rotation without external power, reducing additional energy consumption. The adhesive flow drives the rotating distribution, achieving dynamic dispersion and forming a uniform film of adhesive within the distribution chamber, increasing the degassing surface area. This solves the problem of adhesive retention caused by uneven distribution, reduces the generation of secondary bubbles, and significantly improves the dehydration and degassing efficiency. Meanwhile, by utilizing the kinetic energy of the adhesive flow to drive the rotation, the energy consumption of an external power unit is avoided, achieving the dual benefits of shortening the processing cycle and reducing operating costs.
[0068] Optionally, a heating device 4 is installed on the inlet tube 3.
[0069] The heating device 4 refers to a component that heats the adhesive flowing inside the pipeline using an external heat source. Specifically, it can be implemented using an electric heating jacket or a heat-conducting oil circulation structure. This device acts directly on the pipeline conveying the adhesive, reducing its viscosity by increasing the adhesive temperature. The adhesive inlet pipe 3 refers to the pipeline structure that transports the adhesive to the adhesive distribution system. Specifically, it can be implemented using a high-temperature resistant metal pipe or a composite material pipe. This pipe connects the external adhesive supply equipment to the adhesive distributor 9, forming an adhesive flow channel. The heating device 4 can also be arranged in a U-shape to improve the heating effect.
[0070] Specifically, the adhesive compound is preheated before entering the dispensing system. The heating device 4 transfers heat to the adhesive compound in the inlet pipe 3 via conduction or circulation, raising its temperature. The viscosity of the adhesive decreases with the increased temperature, enhancing its fluidity and allowing for more uniform dispersion within the dispensing chamber. Simultaneously, the movement of moisture and gas molecules within the adhesive compound intensifies under heat, making them easier to escape under subsequent vacuum conditions. This process does not require interruption of the production flow; the adhesive compound undergoes temperature regulation during transport and directly enters the degassing and dehydration stage. Integrating the heating device 4 into the inlet pipe 3, utilizing the path of the adhesive compound during transport for synchronous heating, avoids additional equipment investment and reduces energy consumption. This effectively improves the fluidity of the adhesive compound, solves the problem of uneven dispersion caused by insufficient temperature, accelerates the removal of moisture and gas, shortens the pretreatment time, and eliminates the need for an additional independent heating station.
[0071] Optionally, please combine Figure 7 Trachea 5 includes main tube 501 and bronchus tube 502.
[0072] One end of the main pipe 501 is connected to the dispersion chamber, and the other end is connected to the vacuum pump 6;
[0073] One end of the branch pipe 502 is connected to the adhesive cavity, and the other end is connected to the main pipe 501.
[0074] The main pipe 501 is the core gas channel connecting the vacuum pump 6 and the dispersion chamber. It can be implemented using a metal bellows or a pressure-resistant rubber hose, and its function is to establish a direct evacuation path between the dispersion chamber and the vacuum pump 6. The branch pipe 502 is the branch pipe connecting the rubber-coated chamber to the main pipe 501. It can be connected to the main pipe 501 using a reducing tee connector 903. Its function is to allow the vacuuming operation of the rubber-coated chamber to be incorporated into the main pipe 501 system through the branch pipe 502, forming a stepped vacuum gradient. The connection point between the main pipe 501 and the branch pipe 502 is located in the section of the main pipe 501 between the dispersion chamber and the vacuum pump 6, making the evacuation path length of the rubber-coated chamber longer than that of the dispersion chamber, thus achieving a vacuum difference between the far and near ends.
[0075] Specifically, when vacuum pump 6 is started, the dispersion chamber establishes a rapid evacuation channel directly through the main pipe 501, while the gas in the adhesive distribution chamber needs to flow through the branch pipe 502 and the main pipe 501 sequentially before being discharged. Because the connection point of the branch pipe 502 is close to the dispersion chamber end in the main pipe 501, the gas flow path in the adhesive distribution chamber forms a longer series pipeline, resulting in a slower vacuum establishment speed compared to the dispersion chamber. This stepped vacuum gradient ensures that after the adhesive undergoes initial degassing in the adhesive distribution chamber, it maintains a continuously increasing vacuum environment when entering the dispersion chamber. This prevents internal structural damage caused by sudden changes in vacuum during continuous processing, achieving a smooth transition in dehydration and degassing rates. By connecting the dispersion chamber to a single main pipe 501 and extending the evacuation path of the adhesive distribution chamber using the branch pipe 502, a differentiated vacuum environment is created while maintaining a single vacuum pump 6 configuration. This simplifies the pipeline layout and optimizes the stability of the adhesive processing process. It effectively reduces equipment manufacturing costs and energy consumption. Through stepped vacuum gradient control, it maintains continuous and stable processing conditions for the glue during dehydration and degassing, avoiding secondary bubble generation. At the same time, it simplifies the pipeline structure of the vacuum system, reducing the risk of equipment failure and maintenance workload.
[0076] Optionally, please combine Figure 8 A stirring shaft is rotatably mounted on the bottom of the shell 1; one end of the stirring shaft located inside the storage cavity is connected to a stirring frame 12, and the other end located outside the shell 1 is connected to a drive motor.
[0077] The stirring shaft refers to a rotating shaft that penetrates the bottom of the housing 1 and extends into the storage cavity. It can be a hollow stainless steel shaft with an anti-stick coating to reduce adhesive adhesion. This structure uses shaft rotation to shear the adhesive at the bottom of the storage cavity, preventing stratification. The stirring frame 12 is the stirring component connected to the end of the stirring shaft. It can be a cross-shaped metal frame or a spiral blade structure, with the bending angle of the frame edges enhancing the material mixing range. This structure creates vortices at the bottom of the storage cavity, promoting uniform distribution of the adhesive components. The drive motor is the external power unit that provides rotational power to the stirring shaft. It can be a combination of a variable frequency speed control motor and a reducer, rigidly connected to the stirring shaft via a coupling. This design isolates the power output from the vacuum chamber, preventing damage to the storage cavity's seal.
[0078] Specifically, the stirring shaft rotates continuously under the drive of the motor, causing the stirring frame 12 to mechanically stir the adhesive material in the storage chamber. During rotation, the stirring frame 12 tumbles the adhesive material deposited at the bottom upwards, while simultaneously breaking up locally agglomerated colloidal particles through radial movement. This process ensures that the adhesive material maintains a dynamic flow state throughout the vacuum dehydration and degassing stage, effectively preventing phase separation caused by differences in colloidal component density. Therefore, the adhesive material output from the storage chamber possesses uniform physical properties, avoiding secondary bubbles or incomplete degassing problems caused by uneven composition in subsequent processes.
[0079] In some specific embodiments, the stirring rack 12 may be equipped with multiple horizontally distributed annular scrapers, with the edges of the scrapers maintaining a clearance fit with the sidewall of the storage cavity, for example, the clearance being controlled within the range of three to five millimeters. This structure can scrape off the adhesive material adhering to the cavity wall during rotation, while simultaneously forming axial material circulation. The speed of the drive motor can be set to a stepped adjustment mode, for example, using low speed during the start-up phase to prevent splashing, and switching to medium to high speed during the stabilization phase to enhance the stirring intensity.
[0080] This embodiment eliminates the risk of rubber compound stratification directly during vacuum degassing by simultaneously implementing mechanical stirring during the storage stage, reducing the rubber compound processing time by approximately one-third and eliminating the need for multiple alternating storage devices. It effectively solves the problem of decreased homogeneity caused by rubber compound stratification during vacuum processing. Continuous mechanical stirring maintains a uniform distribution of colloidal components, reducing the probability of air bubble defects in subsequent dispensing processes. Simultaneously, it reduces reliance on multiple sets of material preparation equipment, achieving stable control of rubber compound quality under continuous production conditions with a single unit.
[0081] Optionally, the cavity wall is provided with a heat insulation layer.
[0082] The insulation layer refers to the heat-insulating structure covering the inner cavity of the vacuum dehydration and degassing device. It can be made of aluminum silicate fiber or aerogel composite material and is fixed to the cavity wall surface through filling or coating. This structure reduces heat loss of the adhesive during vacuum processing by inhibiting heat conduction between the inner cavity and the external environment.
[0083] Specifically, the insulation layer covers the surface of the inner cavity wall, forming a continuous thermal barrier. During the vacuum dehydration and degassing process, the adhesive material in the storage cavity experiences temperature changes due to the vacuum environment and heating. The insulation layer maintains the stability of the adhesive material processing temperature by blocking heat diffusion to the outside of the shell 1. This reduces the operating frequency of the heating device 4, preventing abnormal increases in adhesive material viscosity or decreases in dehydration efficiency caused by temperature fluctuations. Simultaneously, by reducing heat loss, the insulation layer eliminates the need for the vacuum pump 6 to frequently compensate for pressure changes caused by temperature differences while maintaining the cavity vacuum, thereby improving equipment operational stability. This embodiment creates a stable thermal environment through the insulation layer, effectively reducing the impact of heat loss and temperature fluctuations on the process and minimizing energy waste. This invention solves the problem of increased energy consumption caused by heat loss during vacuum dehydration and degassing. By maintaining the stability of the internal cavity temperature, the workload of the heating device 4 is reduced, thus lowering power consumption. At the same time, it avoids viscosity changes in the adhesive due to temperature fluctuations, ensuring consistent dehydration and degassing efficiency. Furthermore, the insulation layer reduces the pressure compensation requirement of the vacuum pump 6 due to temperature fluctuations by suppressing heat leakage, thereby extending the equipment's operating life and improving processing efficiency.
[0084] Optionally, a vacuum gauge, temperature sensor, and level switch can also be installed inside the cavity; the vacuum gauge is used to monitor the vacuum level inside the vacuum dehydration and degassing device. The temperature sensor is used to monitor the temperature of the heating device 4, the temperature of the rubber compound, and the temperature of the vacuum dehydration and degassing device. The level switch is used to monitor the level of the rubber compound in the storage cavity.
[0085] Specifically, by monitoring vacuum, temperature, and liquid level, the environmental parameters inside the housing 1 can be controlled to ensure efficient degassing and dehydration. For example, when the amount of adhesive stored in the storage chamber reaches a set value, the liquid level switch sends a signal to the feeding valve corresponding to the adhesive inlet pipe 3, and the valve closes to stop feeding. When the adhesive in the storage chamber is needed, the outlet valve corresponding to the outlet port 2 is opened, and the adhesive is pumped out for use.
[0086] In some specific embodiments, multiple observation windows 7 arranged at intervals in the vertical direction can also be provided on the outer wall of the housing 1 to facilitate observation of the working conditions inside the housing 1.
[0087] Although the present invention has been disclosed above, its protection scope is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the protection scope of the present invention.
Claims
1. A vacuum dehydration and degassing device for electronic potting compound, characterized in that, include: The shell (1) contains an inner cavity; the inner cavity is divided into a glue distribution cavity, a dispersion cavity and a storage cavity from top to bottom; the storage cavity is provided with a discharge port (2) at the bottom. The adhesive applicator (9) is located inside the adhesive application chamber, and the adhesive inlet end of the adhesive applicator (9) is connected to the adhesive application tube (8). A dispersing rack (10) is installed inside the dispersing cavity; the dispersing rack (10) includes an upper rack plate (1001) and a lower rack plate (1002); the middle part of the upper rack plate (1001) arches towards the adhesive distribution cavity; the middle part of the lower rack plate (1002) is recessed towards the storage cavity; both the upper rack plate (1001) and the lower rack plate (1002) are provided with dispersing holes; and A vacuum pump (6) is connected to the adhesive distribution chamber and the dispersion chamber respectively via an air pipe (5).
2. The vacuum dehydration and degassing device for electronic potting compound according to claim 1, characterized in that, The cavity wall of the dispersion chamber is equipped with a support platform; the lower shelf plate (1002) is placed on the support platform; and the upper shelf plate (1001) is placed on the lower shelf plate (1002).
3. The vacuum dehydration and degassing device for electronic potting compound according to claim 1, characterized in that, It also includes a dispersion plate (11); the dispersion plate (11) is disposed between the dispersion cavity and the storage cavity.
4. The vacuum dehydration and degassing device for electronic potting compound according to claim 1, characterized in that, The adhesive tube (8) includes a vertical section (801) and an extension section (802); the vertical section (801) is located inside the inner cavity and is coaxial with the inner cavity; one end of the extension section (802) is connected to the bottom of the vertical section (801), and the other end extends to the outside of the housing (1) and is connected to the adhesive inlet tube (3).
5. The vacuum dehydration and degassing device for electronic potting compound according to claim 4, characterized in that, The adhesive applicator (9) includes: A glue applicator (901) is connected to the top of the vertical section (801); the glue applicator (901) is provided with a glue inlet cavity; Multiple adhesive application rods (902); the multiple adhesive application rods (902) are evenly distributed circumferentially on the outer wall of the adhesive application head (901); each adhesive application rod (902) has a cavity communicating with the adhesive inlet cavity; the bottom surface of each adhesive application rod (902) has multiple adhesive outlet holes communicating with the cavity.
6. The vacuum dehydration and degassing device for electronic potting compound according to claim 5, characterized in that, The adhesive applicator (9) also includes: The connector (903) is coaxially arranged with the vertical section (801), and one end is fixedly connected to the top of the vertical section (801), while the other end is rotatably connected to the adhesive head (901). A drive shaft (904) is installed in the glue inlet cavity and is coaxially arranged with the connector (903); Drive fan blades, which are sleeved on the drive shaft (904).
7. The vacuum dehydration and degassing device for electronic potting compound according to claim 4, characterized in that, A heating device (4) is installed on the glue inlet pipe (3).
8. The vacuum dehydration and degassing device for electronic potting compound according to claim 1, characterized in that, The trachea (5) includes: The main tube (501) is connected at one end to the dispersion chamber and at the other end to the vacuum pump (6). A branch pipe (502) is connected at one end to the adhesive cavity and at the other end to the main pipe (501).
9. The vacuum dehydration and degassing device for electronic potting compound according to claim 1, characterized in that, A stirring shaft is rotatably mounted on the bottom of the housing (1); one end of the stirring shaft located inside the storage cavity is connected to a stirring rack (12), and the other end located outside the housing (1) is connected to a drive motor.
10. The vacuum dehydration and degassing device for electronic potting compounds according to any one of claims 1-9, characterized in that, The inner cavity wall is provided with a heat insulation layer.