Semi-automatic chip coupling test platform

Abstract

The utility model relates to the technical field of photoelectric testing, in particular to a semi-automatic chip coupling testing platform, which not only can test a plurality of groups of chips at one time, greatly improves the testing effect, is convenient for testing a large batch of chips, but also can pick out unqualified chips after testing, so that the testing efficiency is improved. The trouble of manual picking is omitted; comprising a collecting mechanism; the device further comprises two containing mechanisms, a rotating mechanism, a testing mechanism and a picking-out mechanism, the two containing mechanisms are installed on the collecting mechanism in a sliding mode and carry the chips, the rotating mechanism is installed on the collecting mechanism and drives the testing mechanism and the picking-out mechanism to rotate, and the testing mechanism is installed on the rotating mechanism and tests the chips. The picking-out mechanism is installed on the rotating mechanism and picks out the unqualified chips.

Description

Technical Field

[0001] This utility model relates to the technical field of optoelectronic testing, and in particular to a semi-automatic chip coupling test platform. Background Technology

[0002] Before final packaging, integrated circuits undergo comprehensive circuit performance testing according to testing specifications. The purpose is to select qualified finished products. Spectroscopic analysis identifies substances and determines their chemical composition and relative content based on their spectra.

[0003] Existing semi-automatic chip coupling test platforms, such as the COC chip coupling test device disclosed in utility model patent application number 202420820841.6, mainly include a height-adjustable standard breadboard. A fixed base plate is fixedly connected to the upper side of the height-adjustable standard breadboard, and a cylinder support frame is fixedly connected to the upper side of the fixed base plate. A slide cylinder is fixedly connected to the front side of the cylinder support frame. In use, the COC chip product is placed on the limiting plate, and then the chip is cooled by a cold water plate and a TEC semiconductor cooling plate. Then, the slide cylinder is controlled to drive the upper fixed bar to descend, and the upper fixed bar drives a high-current probe to contact the product for testing.

[0004] However, existing testing platforms have a slow testing speed, making it difficult to test batches of chips. Furthermore, it is difficult to remove defective chips after testing, which is very troublesome for staff to pick them out. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides a semi-automatic chip coupling test platform that can not only test multiple groups of chips at one time, greatly improving the test effect and facilitating the testing of large batches of chips, but also pick out unqualified chips after testing, saving the trouble of manual picking.

[0006] This utility model discloses a semi-automatic chip coupling test platform, including a collection mechanism; it also includes two sets of holding mechanisms, a rotating mechanism, a testing mechanism, and a picking mechanism. The two holding mechanisms are slidably mounted on the collection mechanism to support the chips. The rotating mechanism is mounted on the collection mechanism and drives the testing and picking mechanisms to rotate. The testing mechanism is mounted on the rotating mechanism to test the chips, and the picking mechanism is mounted on the rotating mechanism to pick out defective chips. The operator inserts the holding mechanism, which contains multiple sets of chips, into the collection mechanism. The testing mechanism tests the chips. After testing, the picking mechanism drives the testing mechanism to rotate, facilitating the rotating mechanism to detect defective chips. Then, the rotating mechanism drives the testing mechanism to reverse and reset, and the picking mechanism delivers the defective chips to the collection mechanism. The operator then removes the holding mechanism and replaces the chips with new ones for testing.

[0007] Preferably, the collection mechanism includes a workbench, two sets of collection boxes, two sets of inclined platforms, two sets of hinges, two sets of sealing covers, and two sets of handles. The bottom of the workbench is connected to the ground. Both sets of collection boxes are installed on the workbench. The two sets of inclined platforms are installed inside the two sets of collection boxes respectively. The two sets of hinges are installed on the two sets of collection boxes respectively. The two sets of sealing covers are installed on the two sets of hinges respectively. The two sets of handles are installed on the two sets of sealing covers respectively. The picking mechanism throws the defective chips into the collection boxes for collection. After the test is completed, the operator pulls the handle to open the sealing cover, and the chips in the collection box slide down the inclined platform and are discharged.

[0008] Preferably, a silicone pad is also attached to the upper surface of the inclined platform; by attaching the silicone pad, the chip is prevented from falling onto the inclined platform and causing secondary damage.

[0009] Preferably, the holding mechanism includes a tray, a handle, multiple sets of springs, and multiple sets of gaskets. A positioning groove is provided on the worktable, and the tray is slidably installed within the positioning groove. The handle is mounted on the tray, which has multiple sets of mounting holes. Multiple sets of springs are installed within the mounting holes on the tray, and multiple sets of gaskets are installed on the springs. Chips are placed on the gaskets. The operator uses the handle to insert the tray into the positioning groove on the worktable, facilitating testing of multiple chips by the testing mechanism. During testing, the springs and gaskets reduce the impact and vibration on the chips, protecting them.

[0010] Preferably, the rotating mechanism includes a stepper motor, a reducer, and a rotating shaft. The stepper motor is mounted on the worktable, the reducer is mounted on the worktable, and the rotating shaft is rotatably mounted on the worktable and longitudinally connected to the reducer. After the test is completed, the stepper motor is started, and the stepper motor drives the rotating shaft to rotate through the reducer. The rotating shaft drives the testing mechanism and the picking mechanism to rotate 90° clockwise. After the picking mechanism picks out the defective chip, the stepper motor is started to rotate in the opposite direction, driving the testing mechanism and the picking mechanism to rotate 90° counterclockwise to reset.

[0011] Preferably, the testing mechanism includes a support plate, two sets of testing machines, and multiple sets of probes. The support plate is mounted on a rotating shaft, both sets of testing machines are mounted on the support plate, and the multiple sets of probes are mounted on the testing machines. The testing machines push the multiple sets of probes down to contact the chip, facilitating coupling testing of the chip. The testing machines transmit the test results to the controller, and then the testing machines drive the multiple sets of probes to rise and reset.

[0012] Preferably, the picking mechanism includes a connecting plate, two sets of hydraulic cylinders, two sets of air distribution plates, multiple sets of suction cups, multiple sets of solenoid valves, an air pump, and two sets of suction hoses. The connecting plate is mounted on the rotating shaft, and both sets of hydraulic cylinders are mounted on the connecting plate. The tops of the two sets of air distribution plates are connected to the bottoms of the two sets of hydraulic cylinders, respectively. The multiple sets of suction cups are mounted on the two sets of air distribution plates, and the multiple sets of solenoid valves are mounted on the multiple sets of suction cups. The air pump is mounted on the connecting plate, and the two sets of suction hoses are mounted on the air pump and communicate with the inside of the two sets of air distribution plates. The hydraulic cylinders push the air distribution plates down, causing the multiple sets of suction cups to adhere to the chip. According to the test results of the testing machine, the solenoid valve corresponding to the unqualified chip is opened, and the air pump is started to draw air, causing the suction cup to adhere to the chip. The hydraulic cylinder drives the chip to rise. When the air distribution plate rotates above the collection box, the air pump blows air to detach the suction cup from the chip.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: the staff inserts the holding mechanism containing multiple sets of chips into the collection mechanism, the testing mechanism tests the chips, and after the test is completed, the picking mechanism drives the testing mechanism to rotate, which facilitates the rotating mechanism to detect the unqualified chips. Then the rotating mechanism drives the testing mechanism to reverse and reset, and the picking mechanism throws the unqualified chips into the collection mechanism. The staff then pulls out the holding mechanism and replaces the chips with new ones for testing. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the isometric structure of this utility model;

[0015] Figure 2 This is a partially enlarged cross-sectional isometric structural schematic diagram of the collection mechanism of this utility model;

[0016] Figure 3 This is a partially enlarged cross-sectional isometric structural schematic diagram of the holding mechanism of this utility model;

[0017] Figure 4 This is a cross-sectional isometric structural diagram of the rotating mechanism, testing mechanism and picking mechanism of this utility model;

[0018] Figure 5 This is a partially enlarged front view schematic diagram of the picking mechanism of this utility model.

[0019] The attached diagram is labeled as follows: 01, collecting mechanism; 11, workbench; 12, collecting box; 13, inclined platform; 14, hinge; 15, sealing cover; 16, handle; 02, holding mechanism; 21, tray; 22, grip; 23, spring; 24, gasket; 03, rotating mechanism; 31, stepper motor; 32, reducer; 33, rotating shaft; 04, testing mechanism; 41, support plate; 42, testing machine; 43, probe; 05, picking mechanism; 51, connecting plate; 52, hydraulic cylinder; 53, air distribution plate; 54, suction cup; 55, solenoid valve; 56, air pump; 57, suction hose. Detailed Implementation

[0020] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. This utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of this utility model more thorough and complete.

[0021] Example 1

[0022] This utility model discloses a semi-automatic chip coupling test platform, including a collection mechanism 01; it also includes two sets of holding mechanisms 02, a rotating mechanism 03, a testing mechanism 04, and a picking mechanism 05. The two sets of holding mechanisms 02 are slidably mounted on the collection mechanism 01 and support the chips. The rotating mechanism 03 is mounted on the collection mechanism 01 and drives the testing mechanism 04 and the picking mechanism 05 to rotate. The testing mechanism 04 is mounted on the rotating mechanism 03 and tests the chips. The picking mechanism 05 is mounted on the rotating mechanism 03 and picks out defective chips. The collection mechanism 01 includes a workbench 11, two sets of collection boxes 12, two sets of inclined platforms 13, two sets of hinges 14, two sets of sealing covers 15, and two sets of handles 16. The bottom end of the workbench 11 is connected to the ground, and the two sets of collection boxes... All 12 are installed on the workbench 11. Two sets of inclined platforms 13 are respectively installed in the two sets of collection boxes 12. Two sets of hinges 14 are respectively installed on the two sets of collection boxes 12. Two sets of sealing covers 15 are respectively installed on the two sets of hinges 14. Two sets of handles 16 are respectively installed on the two sets of sealing covers 15. It also includes a silicone pad attached to the upper surface of the inclined platform 13. The holding mechanism 02 includes a tray 21, a handle 22, multiple sets of springs 23 and multiple sets of gaskets 24. The workbench 11 has a positioning groove. The tray 21 is slidably installed in the positioning groove of the workbench 11. The handle 22 is installed on the tray 21. The tray 21 has multiple sets of mounting holes. Multiple sets of springs 23 are respectively installed in multiple sets of mounting holes of the tray 21. Multiple sets of gaskets 24 are respectively installed on multiple sets of springs 23. Rotation mechanism 03 The device includes a stepper motor 31, a reducer 32, and a rotating shaft 33. The stepper motor 31 is mounted on the worktable 11, the reducer 32 is mounted on the worktable 11, and the rotating shaft 33 is rotatably mounted on the worktable 11 and longitudinally connected to the reducer 32. The testing mechanism 04 includes a support plate 41, two sets of testing machines 42, and multiple sets of probes 43. The support plate 41 is mounted on the rotating shaft 33, both sets of testing machines 42 are mounted on the support plate 41, and the multiple sets of probes 43 are mounted on the testing machines 42. During operation, the chip is first placed on multiple sets of pads 24. The operator operates the handle 22 to insert the tray 21 into the positioning slot of the worktable 11. The testing machines 42 push the multiple sets of probes 43 down to contact the chip, facilitating coupling testing of the chip. Springs 23 and pads 24 are also included. 4. To mitigate the impact and vibration on the chip and protect it, the testing machine 42 transmits the test results to the controller. Then, the testing machine 42 drives multiple sets of probes 43 to lift and reset, and starts the stepper motor 31. The stepper motor 31 drives the rotating shaft 33 to rotate through the reducer 32. The rotating shaft 33 drives the testing mechanism 04 and the picking mechanism 05 to rotate 90° clockwise, so that the picking mechanism 05 can pick out the unqualified chips. The stepper motor 31 is then started to rotate in the opposite direction, driving the testing mechanism 04 and the picking mechanism 05 to rotate 90° counterclockwise to reset. The picking mechanism 05 throws the unqualified chips into the collection box 12 for collection. When all tests are completed, the operator pulls the handle 16 to open the sealing cover 15, and the chips in the collection box 12 slide down the inclined platform 13 and are discharged.

[0023] Example 2

[0024] like Figures 1 to 5 As shown, this utility model discloses a semi-automatic chip coupling test platform based on Embodiment 1. The picking mechanism 05 includes a connecting plate 51, two sets of hydraulic cylinders 52, two sets of air distribution plates 53, multiple sets of suction cups 54, multiple sets of solenoid valves 55, an air pump 56, and two sets of suction hoses 57. The connecting plate 51 is mounted on the rotating shaft 33, and both sets of hydraulic cylinders 52 are mounted on the connecting plate 51. The top ends of the two sets of air distribution plates 53 are respectively connected to the bottom ends of the two sets of hydraulic cylinders 52. The multiple sets of suction cups 54 are respectively mounted on the two sets of air distribution plates 53. On the air plate 53, multiple sets of solenoid valves 55 are respectively mounted on multiple sets of suction cups 54, and the air pump 56 is mounted on the connecting plate 51. Two sets of suction hoses 57 are both mounted on the air pump 56 and communicate with the inside of the two sets of air distribution plates 53. When it is working, firstly, the chip is placed on multiple sets of pads 24. The operator operates the handle 22 to insert the tray 21 into the positioning slot of the workbench 11. The testing machine 42 pushes multiple sets of probes 43 down to contact the chip, which facilitates the coupling test of the chip. The spring 23 and the pads 24 reduce The tester 42 protects the chip from impacts and vibrations. It then transmits the test results to the controller. The tester 42 then lifts and resets multiple probes 43, activating the stepper motor 31. The stepper motor 31, via the reducer 32, drives the rotating shaft 33 to rotate. The rotating shaft 33 then rotates the testing mechanism 04 and the pickup mechanism 05 90° clockwise. The hydraulic cylinder 52 pushes the air distribution plate 53 downwards, causing multiple suction cups 54 to adhere to the chip. Based on the tester 42's detection results, the corresponding defective chips are removed. When the solenoid valve 55 is opened, the air pump 56 is started to draw air, causing the suction cup 54 to adhere to the chip. The hydraulic cylinder 52 drives the chip to be lifted, and then the stepper motor 31 is started to rotate in the opposite direction, driving the testing mechanism 04 and the picking mechanism 05 to rotate 90° counterclockwise to reset. The air pump 56 blows air to detach the suction cup 54 from the chip. The unqualified chips are sent to the collection box 12 for collection. When all tests are completed, the operator pulls the handle 16 to open the sealing cover 15, and the chips in the collection box 12 slide down the inclined platform 13 and are discharged.

[0025] The stepper motor 31, reducer 32, and air pump 56 of this utility model are commercially available. Technical personnel in this industry only need to install and operate them according to the accompanying instruction manual, without requiring any creative work from those skilled in the art.

[0026] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A semi-automatic chip coupling test platform, comprising a collection mechanism (01); characterized in that, It also includes two sets of holding mechanisms (02), a rotating mechanism (03), a testing mechanism (04), and a picking mechanism (05). The two sets of holding mechanisms (02) are slidably mounted on the collecting mechanism (01) and carry the chip. The rotating mechanism (03) is mounted on the collecting mechanism (01) and drives the testing mechanism (04) and the picking mechanism (05) to rotate. The testing mechanism (04) is mounted on the rotating mechanism (03) and tests the chip. The picking mechanism (05) is mounted on the rotating mechanism (03) and picks out the defective chip.

2. The semi-automatic chip coupling test platform as described in claim 1, characterized in that, The collection mechanism (01) includes a workbench (11), two sets of collection boxes (12), two sets of inclined platforms (13), two sets of hinges (14), two sets of sealing covers (15), and two sets of handles (16). The bottom of the workbench (11) is connected to the ground. Both sets of collection boxes (12) are installed on the workbench (11). The two sets of inclined platforms (13) are installed inside the two sets of collection boxes (12). The two sets of hinges (14) are installed on the two sets of collection boxes (12). The two sets of sealing covers (15) are installed on the two sets of hinges (14). The two sets of handles (16) are installed on the two sets of sealing covers (15).

3. The semi-automatic chip coupling test platform as described in claim 2, characterized in that, It also includes a silicone pad attached to the upper surface of the inclined platform (13).

4. The semi-automatic chip coupling test platform as described in claim 2, characterized in that, The holding mechanism (02) includes a tray (21), a handle (22), multiple sets of springs (23) and multiple sets of pads (24). The workbench (11) has a positioning groove. The tray (21) is slidably installed in the positioning groove of the workbench (11). The handle (22) is installed on the tray (21). The tray (21) has multiple sets of mounting holes. The multiple sets of springs (23) are respectively installed in the multiple sets of mounting holes of the tray (21). The multiple sets of pads (24) are respectively installed on the multiple sets of springs (23).

5. The semi-automatic chip coupling test platform as described in claim 2, characterized in that, The rotating mechanism (03) includes a stepper motor (31), a reducer (32) and a rotating shaft (33). The stepper motor (31) is mounted on the worktable (11), the reducer (32) is mounted on the worktable (11), and the rotating shaft (33) is rotatably mounted on the worktable (11) and longitudinally connected to the reducer (32).

6. The semi-automatic chip coupling test platform as described in claim 5, characterized in that, The testing mechanism (04) includes a support plate (41), two sets of testing machines (42) and multiple sets of probes (43). The support plate (41) is mounted on the rotating shaft (33), both sets of testing machines (42) are mounted on the support plate (41), and multiple sets of probes (43) are mounted on the testing machines (42).

7. The semi-automatic chip coupling test platform as described in claim 5, characterized in that, The picking mechanism (05) includes a connecting plate (51), two sets of hydraulic cylinders (52), two sets of air distribution plates (53), multiple sets of suction cups (54), multiple sets of solenoid valves (55), an air pump (56), and two sets of suction hoses (57). The connecting plate (51) is mounted on the rotating shaft (33). Both sets of hydraulic cylinders (52) are mounted on the connecting plate (51). The tops of the two sets of air distribution plates (53) are connected to the bottoms of the two sets of hydraulic cylinders (52), the multiple sets of suction cups (54) are mounted on the two sets of air distribution plates (53), the multiple sets of solenoid valves (55) are mounted on the multiple sets of suction cups (54), the air pump (56) is mounted on the connecting plate (51), and the two sets of suction hoses (57) are mounted on the air pump (56) and communicate with the inside of the two sets of air distribution plates (53).

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