Water pipe joint injection mold for semiconductor device cleaning equipment

Abstract

The utility model discloses a water pipe joint injection mold for semiconductor device cleaning equipment, which comprises a mold base, an injection molding base is fixedly mounted at the top end of the mold base, an injection molding top seat is arranged right above the injection molding base, and a pressing top cover is arranged at the bottom end of the injection molding top seat. Telescopic connecting rods are symmetrically and fixedly installed in the middle of the injection molding base and the middle of the injection molding top base, and an ejection mechanism facilitating ejection of the water pipe connector mold obtained after injection molding is completed is arranged in the mold base. The ejection mechanism comprises a through hole formed in the bottom end of the injection molding base, a cavity formed in the mold base and an empty groove formed in the top end in the cavity and located under the through hole. Through the cam, the connecting roller, the connecting rod and the connecting block which are arranged on the ejection mechanism, the guide-out rod can be driven to automatically eject out the water pipe connector subjected to injection molding, the situation that labor is wasted due to the fact that a worker frequently and manually rotates and removes a screw rod is reduced, and the working convenience of the worker is improved.

Description

Technical Field

[0001] This utility model relates to the field of injection mold technology, specifically to an injection mold for a water pipe connector for a semiconductor device cleaning equipment. Background Technology

[0002] The water pipe fittings commonly used in semiconductor device cleaning equipment are mainly PFA pipe fittings. PFA, or perfluoroalkoxy polymer, has extremely strong chemical stability and can withstand the erosion of various corrosive chemicals such as strong acids, strong alkalis, and organic solvents used in semiconductor cleaning. This ensures that it will not experience corrosion or aging due to contact with these chemicals during long-term use, thus guaranteeing the purity of the cleaning solution and the stability of equipment operation. Injection molds for water pipe fittings in semiconductor device cleaning equipment are divided into single-cavity injection molds, multi-cavity injection molds, and hot runner injection molds, etc.

[0003] When the water pipe connector is injection molded, the operator needs to remove the water pipe connector mold from the cavity. However, this is usually done manually or by manually removing the screw. But when using the screw, the operator needs to manually rotate the screw to remove the finished water pipe connector. This continuous removal work can be very strenuous. Utility Model Content

[0004] The purpose of this utility model is to solve the problem that when water pipe connectors are injection molded, workers need to remove the water pipe connector mold from the cavity. However, when removing it, it is usually done manually or by manually removing the screw. But when removing it by removing the screw, workers need to manually rotate it to remove the finished water pipe connector. The continuous removal work by workers will cause laborious work. The present invention provides a water pipe connector injection mold for semiconductor device cleaning equipment.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a water pipe connector injection mold for semiconductor device cleaning equipment, comprising a mold base, an injection base fixedly mounted on the top of the mold base, an injection top seat disposed directly above the injection base, and a pressing top cover disposed at the bottom of the injection top seat; telescopic connecting rods symmetrically fixedly mounted in the middle of the injection base and the injection top seat; and an ejection mechanism disposed inside the mold base to facilitate ejecting the injection-molded water pipe connector mold, the ejection mechanism including a through-hole at the bottom of the injection base. The mold includes a hole, a cavity inside the mold base, a slot at the top of the cavity and directly below the through hole, and an outlet rod slidably connected inside the slot. A return spring for lifting and resetting the outlet rod is fixedly installed inside the slot. A connecting rod is fixedly installed at the bottom of the outlet rod, and a connecting block is fixedly installed at the bottom of the connecting rod. A connecting roller is rotatably connected to the bottom of the connecting block. A rotating motor is fixedly installed inside the cavity, and a rotating shaft is rotatably connected to one end of the rotating motor. A cam is fixedly installed at one end of the rotating shaft and directly below the connecting roller.

[0006] As a further embodiment of this utility model: a limiting outer ring that rotates in cooperation with the connecting roller is fixedly installed on the outer periphery of the cam, and a limiting groove that matches the limiting outer ring is opened on the outer periphery of the connecting roller.

[0007] As a further embodiment of this utility model: a cooling component for cooling the inside of the injection molding base is provided at one end, and the cooling components are symmetrically arranged at both ends of the injection molding base. The cooling component includes a heat dissipation shell embedded inside the injection molding base, and a heat dissipation fan is symmetrically fixedly installed inside the heat dissipation shell for heat dissipation.

[0008] As a further improvement of this utility model: a heat exchange fin is fixedly installed inside the heat dissipation shell and on the side of the heat dissipation fan.

[0009] As a further improvement of this utility model: liquid storage tanks are symmetrically fixedly installed at the top of the mold base and at both ends of the injection molding base.

[0010] As a further improvement of this utility model, one end of the liquid storage tank is provided with an observation window to facilitate staff to observe the remaining liquid volume inside.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This utility model uses a cam, connecting roller, connecting rod, and connecting block in the ejection mechanism to drive the guide rod to automatically eject the injection-molded water pipe joint, reducing the laborious situation caused by frequent manual rotation and removal of the screw by the staff, and increasing the convenience of the staff's work.

[0013] 2. The cooling component can cool down the injection-molded water pipe joint, reducing the risk of workers getting burned when removing the injection-molded water pipe joint due to excessive temperature, and increasing the safety of mold removal. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a cross-sectional structural diagram of the mold base of this utility model;

[0016] Figure 3 This is a utility model Figure 2 A magnified schematic diagram of the local structure at point A;

[0017] Figure 4 This is a schematic diagram of the top structure of the injection-molded base of this utility model;

[0018] Figure 5 This is a cross-sectional structural diagram of the injection molded base of this utility model;

[0019] Figure 6 This is a schematic diagram of the unfolded structure of the heat dissipation shell and heat exchange fins of this utility model.

[0020] In the diagram: 1. Mold base; 2. Injection base; 3. Injection top seat; 4. Lower pressure top cover; 5. Telescopic connecting rod; 6. Ejection mechanism; 61. Cavity; 62. Groove; 63. Guide rod; 65. Return spring; 66. Connecting rod; 67. Connecting block; 68. Rotating motor; 69. Rotating shaft; 610. Cam; 611. Connecting roller; 612. Limiting outer ring; 613. Limiting groove; 7. Cooling component; 71. Heat dissipation shell; 72. Heat exchange fins; 73. Cooling fan; 74. Liquid storage tank; 75. Observation window; 8. Through hole. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, it should be noted that unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. The embodiments of this utility model will be described below based on its overall structure.

[0023] Reference Figures 1 to 6 In this embodiment of the present invention, a water pipe connector injection mold for a semiconductor device cleaning equipment includes a mold base 1, an injection base 2 fixedly mounted on the top of the mold base 1, an injection top seat 3 disposed directly above the injection base 2, and a pressing top cover 4 disposed at the bottom of the injection top seat 3. Telescopic connecting rods 5 are symmetrically fixedly mounted on the middle of the injection base 2 and the injection top seat 3. An ejection mechanism 6 is provided inside the mold base 1 to facilitate ejecting the completed water pipe connector mold. The ejection mechanism 6 includes a through hole 8 at the bottom of the injection base 2, a cavity 61 inside the mold base 1, and a cavity 62... The cavity 61 has a slot 62 at its top and directly below the through hole 8, and an outlet rod 63 slidably connected inside the slot 62. A return spring 65 is fixedly installed inside the slot 62 to lift and reset the outlet rod 63. A connecting rod 66 is fixedly installed at the bottom of the outlet rod 63, and a connecting block 67 is fixedly installed at the bottom of the connecting rod 66. A connecting roller 611 is rotatably connected to the bottom of the connecting block 67. A rotating motor 68 is fixedly installed inside the cavity 61, and a rotating shaft 69 is rotatably connected to one end of the rotating motor 68. A cam 610 is fixedly installed at one end of the rotating shaft 69 and directly below the connecting roller 611.

[0024] By implementing this method, the contact setting between the connecting roller 611 and the cam 610 can reduce the friction generated by the cam 610 when it rotates, reduce the wear between the cam 610 and the connecting roller 611, and increase the service life of the cam 610.

[0025] Reference Figures 1 to 6The outer periphery of the cam 610 is fixedly installed with a limiting outer ring 612 that rotates in cooperation with the connecting roller 611, and the outer periphery of the connecting roller 611 is provided with a limiting groove 613 that matches the limiting outer ring 612.

[0026] With this method, the limiting outer ring 612 and the limiting groove 613 are in a fitted state. When the cam 610 and the connecting roller 611 rotate, the limiting outer ring 612 and the limiting groove 613 will limit the cam 610 and the connecting roller 611, reducing the possibility of the connecting roller 611 deviating from the cam 610 during adjustment.

[0027] Reference Figures 1 to 6 A cooling component 7 for cooling the inside of the injection base 2 is provided at one end of the injection base 2, and the cooling component 7 is symmetrically arranged at both ends of the injection base 2. The cooling component 7 includes a heat dissipation shell 71 embedded inside the injection base 2. A heat dissipation fan 73 is symmetrically fixedly installed inside the heat dissipation shell 71. A heat exchange fin 72 is fixedly installed inside the heat dissipation shell 71 and on one side of the heat dissipation fan 73. A liquid storage tank 74 is symmetrically fixedly installed at the top of the mold base 1 and at both ends of the injection base 2. An observation window 75 is provided at one end of the liquid storage tank 74 to facilitate the staff to observe the remaining liquid volume inside.

[0028] Through this method, the coolant inside the liquid storage tank 74 is sent into the injection molding base 2 through the connecting hose. The heat exchange plate 72 is made of graphite material. Graphite has a high thermal conductivity, generally around 129-165W / (m・K). It has good thermal conductivity and can work stably in high-temperature environments.

[0029] The working principle of this utility model is as follows: When the water pipe connector is injection molded by the injection base 2 and the injection top seat 3, the operator first starts the cooling fan 73 inside the heat dissipation shell 71. At this time, the coolant inside the liquid storage tank 74 is sent into the device through the connecting hose, and the cooling fan 73 and the heat exchange fins 72 cool the injection-molded water pipe connector. The cooling component 7 can cool the injection-molded water pipe connector, reducing the risk of burns to the operator's hands when removing the injection-molded water pipe connector. When cooling is complete, the operator starts the rotating motor 68 inside the cavity 61 of the mold base 1 to rotate... Motor 68 drives rotating shaft 69 to rotate, which in turn drives cam 610 to rotate as well. When the highest point of cam 610 rotates to contact connecting roller 611, guide rod 63 will be pushed out from through hole 8 through connecting rod 66 and connecting block 67, and will lift and push out the water pipe joint that has been injected into the injection base 2. The cam 610, connecting roller 611, connecting rod 66 and connecting block 67 set in ejection mechanism 6 can drive guide rod 63 to automatically eject the water pipe joint that has been injected into the base 2, reducing the laborious situation caused by frequent manual rotation of the screw to remove the screw and increasing the convenience of the workers.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An injection mold for a water pipe connector in a semiconductor device cleaning equipment, characterized in that, The system includes a mold base (1), an injection base (2) fixedly mounted on the top of the mold base (1), an injection top seat (3) positioned directly above the injection base (2), and a pressure cap (4) positioned at the bottom of the injection top seat (3). Telescopic connecting rods (5) are symmetrically fixedly mounted in the middle of the injection base (2) and the injection top seat (3). An ejection mechanism (6) is provided inside the mold base (1) to facilitate ejecting the injection-molded water pipe connector mold. The ejection mechanism (6) includes a through hole (8) at the bottom of the injection base (2), a cavity (61) inside the mold base (1), and a top part inside the cavity (61) located directly below the through hole (8). The cavity (62) has a square slot and a guide rod (63) slidably connected inside the slot (62). A reset spring (65) for lifting and resetting the guide rod (63) is fixedly installed inside the slot (62). A connecting rod (66) is fixedly installed at the bottom end of the guide rod (63), and a connecting block (67) is fixedly installed at the bottom end of the connecting rod (66). A connecting roller (611) is rotatably connected at the bottom end of the connecting block (67). A rotating motor (68) is fixedly installed inside the cavity (61), and a rotating shaft (69) is rotatably connected at one end of the rotating motor (68). A cam (610) is fixedly installed at one end of the rotating shaft (69) and directly below the connecting roller (611).

2. The injection mold for a water pipe connector in a semiconductor device cleaning equipment according to claim 1, characterized in that, The outer periphery of the cam (610) is fixedly installed with a limiting outer ring (612) that rotates in cooperation with the connecting roller (611), and the outer periphery of the connecting roller (611) is provided with a limiting groove (613) that is adapted to the limiting outer ring (612).

3. The injection mold for a water pipe connector in a semiconductor device cleaning equipment according to claim 1, characterized in that, The injection base (2) is provided with a cooling component (7) for cooling the inside of the injection base (2) at one end, and the cooling component (7) is symmetrically arranged at both ends of the injection base (2). The cooling component (7) includes a heat dissipation shell (71) embedded in the injection base (2), and a heat dissipation fan (73) is symmetrically fixedly installed inside the heat dissipation shell (71).

4. The injection mold for a water pipe connector in a semiconductor device cleaning equipment according to claim 3, characterized in that, A heat exchange fin (72) is fixedly installed inside the heat dissipation housing (71) and on one side of the cooling fan (73).

5. The injection mold for a water pipe connector in a semiconductor device cleaning equipment according to claim 3, characterized in that, Liquid storage tanks (74) are symmetrically fixedly installed at the top of the mold base (1) and at both ends of the injection base (2).

6. The injection mold for a water pipe connector in a semiconductor device cleaning equipment according to claim 5, characterized in that, The liquid storage tank (74) is provided with an observation window (75) at one end to facilitate staff to observe the remaining liquid volume inside.

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