Low-shrinkage ceramic and electronic badge made of same

Abstract

The utility model belongs to the technical field of ceramic badges, and particularly relates to low-shrinkage ceramic and an electronic badge made of the ceramic, the low-shrinkage ceramic comprises a framework layer, a fiber layer and a filler layer, the fiber layer is of a three-dimensional net structure, the framework layer is embedded in meshes of the three-dimensional net structure, and the filler layer is arranged in the framework layer. And the filler layer particles are filled in a gap between the framework layer and the fiber layer. The problems of unstable size, uneven surface and the like of a traditional ceramic electronic badge caused by high shrinkage rate of a ceramic material are effectively solved through the low-shrinkage ceramic, the electronic badge can be accurately formed in the manufacturing process, and the design size and the appearance quality are kept.

Description

Technical Field

[0001] This utility model belongs to the field of ceramic badge technology, specifically relating to a low-shrinkage ceramic and an electronic badge made of the ceramic. Background Technology

[0002] In the field of traditional ceramic materials, shrinkage rate has always been a key factor affecting the quality and performance of ceramic products. During the sintering process, traditional ceramics often experience significant shrinkage due to changes in the internal structure of the material. This makes it difficult to control the dimensional accuracy of the products, leading to defects such as deformation and cracking, which seriously affects the yield and performance of ceramic products. The high shrinkage rate of traditional ceramics is particularly prominent in applications where dimensional stability is critical.

[0003] With the rapid development of electronic technology, electronic badges, as a product that integrates functions such as identification, information storage and transmission, are widely used in fields such as identity recognition, event commemoration and information display. Electronic badges made of ceramic material are highly favored because of their beautiful appearance, wear resistance and excellent texture.

[0004] However, the ceramic materials used in existing ceramic electronic badges have a high shrinkage rate, which makes the badges prone to problems such as unstable dimensions and uneven surfaces during the manufacturing process. This can cause the internal electronic chips to fall out during use, or the shrinkage of the electronic chip mounting slot can cause the electronic chips to be squeezed, affecting their normal operation and seriously impacting the overall quality and performance of the electronic badges. Utility Model Content

[0005] To address the problems existing in the prior art, this utility model provides a low-shrinkage ceramic and an electronic badge made of the ceramic. The low-shrinkage ceramic effectively solves the problems of dimensional instability and uneven surface caused by the high shrinkage rate of ceramic materials in traditional ceramic electronic badges, ensuring that the electronic badge can be accurately formed during the manufacturing process and maintaining the design size and appearance quality.

[0006] The specific technical solution adopted in this utility model is as follows:

[0007] A low-shrinkage ceramic includes a skeleton layer, a fiber layer, and a filler layer. The fiber layer has a three-dimensional mesh structure, the skeleton layer is embedded in the mesh of the three-dimensional mesh structure, and the filler particles fill the gaps between the skeleton layer and the fiber layer.

[0008] The skeleton layer is composed of α-Al2O3 particles, the fiber layer is composed of SiC whiskers, and the filler layer is composed of SiO2 particles.

[0009] The α-Al2O3 particles have a particle size of 150-200 nm, and the SiO2 particles have a particle size of 4-5 nm.

[0010] The aspect ratio of the SiC whiskers is 30-50.

[0011] An electronic badge made of ceramic includes an electroplated layer, a ceramic layer, and an elastic layer, wherein the electroplated layer and the elastic layer are respectively disposed on both sides of the ceramic layer and sandwich the ceramic layer, and the ceramic layer is made of the aforementioned low-shrinkage ceramic.

[0012] The elastic layer has anti-slip textures on the side away from the ceramic layer.

[0013] The elastic layer is provided with a fixing groove, and the back of the ceramic layer is provided with a pre-embedded protrusion that cooperates with the fixing groove. The elastic layer and the ceramic layer are connected by a snap-fit ​​method through the pre-embedded protrusion.

[0014] The ceramic layer is also provided with a mounting groove for placing electronic chips, with the opening of the mounting groove facing the side of the elastic layer.

[0015] The beneficial effects of this utility model are:

[0016] 1. The low-shrinkage ceramic in this utility model effectively solves the problems of unstable dimensions and uneven surface caused by the high shrinkage rate of ceramic materials in traditional ceramic electronic badges, ensuring that the electronic badges can be accurately formed during the manufacturing process and maintain the design dimensions and appearance quality.

[0017] The ceramic uses a three-dimensional network structure of fiber layers to form a physical support framework, creating a structure similar to reinforced concrete. This three-dimensional framework restricts the free shrinkage of the skeleton layer during sintering, while the fiber layer also acts as a reinforcing phase to inhibit crack propagation and reduce the risk of sintering cracking. In addition, a filler layer is added, with nanoparticles filling the pores between the skeleton and fibers to reduce volume shrinkage during sintering and improve the density of the material. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the microstructure of low-shrinkage ceramics.

[0019] Figure 2 This is a schematic diagram of the ceramic badge structure in specific embodiment 1;

[0020] Figure 3 This is a schematic diagram of the side structure of the ceramic badge in specific embodiment 2;

[0021] Figure 4 This is a schematic diagram of the elastic layer structure in specific embodiment 2;

[0022] In the attached diagram, 1 is the skeleton layer, 2 is the fiber layer, 3 is the filler layer, 4 is the electroplating layer, 5 is the ceramic layer, 6 is the elastic layer, 7 is the anti-slip texture, 8 is the fixing groove, 9 is the pre-embedded protrusion, and 10 is the mounting groove. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0024] like Figure 1 As shown, this utility model provides a low shrinkage ceramic, including a skeleton layer 1, a fiber layer 2 and a filler layer 3. The fiber layer 2 has a three-dimensional mesh structure, the skeleton layer 1 is embedded in the mesh of the three-dimensional mesh structure, and the filler layer 3 particles fill the gaps between the skeleton layer 1 and the fiber layer 2.

[0025] The ceramic materials used in existing ceramic electronic badges have a high shrinkage rate, which makes the badges prone to dimensional instability and uneven surface during the manufacturing process. This can cause the internal electronic chip to fall out during use, or the shrinkage of the electronic chip mounting slot can cause the electronic chip to be squeezed, affecting its normal operation and seriously affecting the overall quality and performance of the electronic badge.

[0026] Therefore, in this invention, a three-dimensional mesh structure of fiber layer 2 is used to form a physical support framework, forming a structure similar to reinforced concrete. The three-dimensional framework restricts the free shrinkage of skeleton layer 1 during sintering. At the same time, fiber layer 2 can also serve as a reinforcing phase to inhibit crack propagation and reduce the risk of sintering cracking. In addition, a filler layer 3 is added. The nanoparticles of filler layer 3 fill the pores between the skeleton and the fiber, reducing volume shrinkage during sintering and improving the densification of the material.

[0027] The framework layer 1 consists of α-Al₂O₃ particles, the fiber layer 2 consists of SiC whiskers, and the filler layer 3 consists of SiO₂ particles. The α-Al₂O₃ particles provide basic strength to the ceramic matrix, while the SiC whiskers, in forming a three-dimensional network framework, can also improve the fracture toughness of the ceramic. In addition to serving as a filler, the SiO₂ particles can also act as a sintering aid, promoting the interfacial bonding of the α-Al₂O₃ particles and enhancing the thermal stability of the material.

[0028] The α-Al₂O₃ particles have a diameter of 150-200 nm, and the SiO₂ particles have a diameter of 4-5 nm. The SiO₂ nanoparticles can uniformly fill the pores between the α-Al₂O₃ and SiC whiskers, forming a continuous interfacial transition layer and improving the overall strength of the material.

[0029] The aspect ratio of the SiC whiskers is 30-50.

[0030] Specific embodiment 1, such as Figure 2As shown, an electronic badge made of ceramic includes an electroplated layer 4, a ceramic layer 5, and an elastic layer 6. The electroplated layer 4 and the elastic layer 6 are respectively disposed on both sides of the ceramic layer 5 and sandwich the ceramic layer 5. The ceramic layer 5 is made of the aforementioned low-shrinkage ceramic.

[0031] The ceramic layer 5 of the electronic badge uses low-shrinkage ceramic, which effectively solves the problems of dimensional instability and uneven surface caused by the high shrinkage rate of ceramic materials in traditional ceramic electronic badges. This ensures that the electronic badge can be accurately formed during the manufacturing process, maintaining the design size and appearance quality. At the same time, the low shrinkage rate reduces the internal stress concentration of the ceramic, reduces the risk of cracking of the ceramic layer 5, improves the overall stability and service life of the electronic badge, and provides a more stable and reliable working environment for internal electronic chips and other components.

[0032] like Figure 2 As shown, the elastic layer 6 has anti-slip texture 7 on the side away from the ceramic layer 5. The anti-slip texture 7 increases the surface roughness of the badge contact side, improves the coefficient of friction between the badge and the cabinet on which it is placed, and prevents the badge from sliding or falling off.

[0033] The ceramic layer 5 is further provided with a mounting groove 10 for placing the electronic chip, with the opening of the mounting groove 10 facing the elastic layer 6. The mounting groove 10 in this invention is used to place the electronic chip. The low shrinkage rate of the ceramic layer 5 ensures the dimensional stability of the mounting groove 10, preventing the electronic chip from being squeezed due to changes in the size of the mounting groove 10 caused by ceramic shrinkage, effectively protecting the electronic chip from damage and ensuring its normal operation.

[0034] Specific embodiment 2, such as Figure 3-4 As shown, the elastic layer 6 is provided with a fixing groove 8, and the back of the ceramic layer 5 is provided with a pre-embedded protrusion 9 that mates with the fixing groove 8. The elastic layer 6 and the ceramic layer 5 are connected by a snap-fit ​​mechanism through the pre-embedded protrusion 9. When the ceramic badge needs to be worn, the pre-embedded protrusion 9 can also be perforated to serve as a pin mounting point.

Claims

1. A low-shrinkage ceramic, characterized in that, It includes a skeleton layer (1), a fiber layer (2) and a filler layer (3). The fiber layer (2) has a three-dimensional mesh structure, the skeleton layer (1) is embedded in the mesh of the three-dimensional mesh structure, and the filler layer (3) particles fill the gap between the skeleton layer (1) and the fiber layer (2).

2. The low-shrinkage ceramic according to claim 1, characterized in that, The skeleton layer (1) is α-Al2O3 particles, the fiber layer (2) is SiC whiskers, and the filler layer (3) is SiO2 particles.

3. A low-shrinkage ceramic according to claim 2, characterized in that, The α-Al2O3 particles have a particle size of 150-200 nm, and the SiO2 particles have a particle size of 4-5 nm.

4. A low-shrinkage ceramic according to claim 2, characterized in that, The aspect ratio of the SiC whiskers is 30-50.

5. An electronic badge made of ceramic, comprising an electroplated layer (4), a ceramic layer (5), and an elastic layer (6), wherein the electroplated layer (4) is attached to one side of the ceramic layer (5), and the elastic layer (6) is located on the other side of the ceramic layer (5), characterized in that, The ceramic layer (5) is made of the low-shrinkage ceramic as described in claim 1.

6. An electronic badge made of ceramic according to claim 5, characterized in that, The elastic layer (6) has anti-slip texture (7) on the side away from the ceramic layer (5).

7. An electronic badge made of ceramic according to claim 5, characterized in that, The elastic layer (6) is provided with a fixing groove (8), and the back of the ceramic layer (5) is provided with a pre-embedded protrusion (9) that cooperates with the fixing groove (8). The elastic layer (6) and the ceramic layer (5) are connected by the pre-embedded protrusion (9).

8. An electronic badge made of ceramic according to claim 5, characterized in that, The ceramic layer (5) is also provided with a mounting groove (10) for placing electronic chips, and the opening of the mounting groove (10) faces the side of the elastic layer (6).

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