Modularized environment-friendly gas insulation ring main unit

Abstract

The utility model relates to the technical field of ring main units, and particularly discloses a modular environment-friendly gas insulated ring main unit, which comprises a ring main unit body, two protective doors are hinged to the outer surface of the ring main unit body, and a heat dissipation mechanism for dissipating heat inside the ring main unit body is arranged on the right side of the ring main unit body; and the heat dissipation mechanism comprises a heat dissipation piece, a semiconductor refrigeration piece is fixed to the side wall of the heat dissipation piece, a cold conduction piece is fixed to the left side of the semiconductor refrigeration piece, the lower surface of the heat dissipation piece communicates with a connecting pipe, and the tail end of the connecting pipe communicates with an air conveying pump. By arranging the heat dissipation mechanism, the cold conduction sheet can be cooled, so that the temperature of the cold conduction sheet is reduced, nitrogen is cooled when passing through the cold conduction sheet, moisture in air can be condensed into water drops to be adhered to the surface of the cold conduction sheet, and the cooled air enters the ring main unit body again through the circulating pipe to cool internal parts; and the internal temperature and humidity are effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of ring main unit technology, and in particular to a modular environmentally friendly gas-insulated ring main unit. Background Technology

[0002] Environmentally friendly gas-insulated ring main units use non-toxic and harmless environmentally friendly gases, such as nitrogen or SF6 alternatives, as the insulating medium, replacing greenhouse gases like SF6 that may be used in traditional equipment, thus reducing environmental pollution. This type of equipment features simple structure, flexible operation, reliable interlocking, and convenient installation, meeting the needs of various applications. Environmentally friendly gas-insulated ring main units typically consist of multiple modules, including a switch compartment, fuse compartment, operating mechanism compartment, and cable compartment.

[0003] Due to the nature of the existing cabinets' operation, they consume a certain amount of electricity during continuous 24-hour operation. This can lead to a heavy electricity load during peak hours, with a single power source and poor energy-saving performance.

[0004] An existing patent (publication number: CN219717698U) discloses an environmentally friendly gas-insulated ring main unit, which includes a base and a cabinet. The cabinet is fixedly connected to the top of the base, and an electrical assembly rack is installed inside the cabinet. A mounting bracket is fixedly connected to the top of the cabinet, and a rainproof cover is fixedly connected to the top of the mounting bracket. A photovoltaic solar panel is installed on the top of the rainproof cover. By incorporating a rainproof cover, a photovoltaic solar panel, and a power converter, the photovoltaic solar panel can, during peak electricity consumption periods, replace a portion of the electrical energy allocated to power the electrical components within the electrical assembly rack, significantly reducing the electrical load.

[0005] To address the aforementioned issues, while existing patents offer solutions that utilize photovoltaic solar panels to distribute a portion of the electrical energy to power the various electrical components within the electrical assembly frame, significantly reducing electrical load, the ring main unit suffers from poor heat dissipation due to exposure to direct sunlight. Prolonged use leads to severe overheating, which can damage electrical components within the ring main unit or cause internal components to spontaneously combust, posing a certain safety risk. Summary of the Invention

[0006] The purpose of this utility model is to provide a modular, environmentally friendly gas-insulated ring main unit that can cool the cooling plates, causing the temperature of the cooling plates to drop. When nitrogen passes through the cooling plates, it also cools them down. Moisture in the air condenses into water droplets and adheres to the surface of the cooling plates. The cooled air then re-enters the ring main unit through the circulation pipe to cool the internal components, effectively reducing the internal temperature and humidity, thereby solving the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a modular environmentally friendly gas-insulated ring main unit, including a ring main unit body, with two protective doors hinged to the outer surface of the ring main unit body, and a heat dissipation mechanism for heat dissipation of the interior provided on the right side of the ring main unit body;

[0008] The heat dissipation mechanism includes a heat dissipation component, a semiconductor cooling chip is fixed to the side wall of the heat dissipation component, a cooling fin is fixed to the left side of the semiconductor cooling chip, a connecting pipe is connected to the lower surface of the heat dissipation component, an air pump is connected to the end of the connecting pipe, and a collection mechanism for collecting cooling water is provided inside the heat dissipation component.

[0009] Preferably, the upper surface of the heat sink is connected to a circulation pipe that communicates with the inside of the ring network cabinet, and a heat sink is fixed to the right side of the semiconductor cooling chip.

[0010] Preferably, a fixing plate is fixed to the right side of the heat sink, and two cooling fans are fixed inside the fixing plate by bolts.

[0011] Preferably, the collection mechanism includes a guide plate, which is fixed to the inner wall of the heat sink and below the heat conduction fin.

[0012] Preferably, a collecting component fixedly connected to the heat sink is provided below the guide plate, and a sealing plug movably connected to the heat sink is provided on the right side of the collecting component.

[0013] Preferably, the input end of the air pump is connected to a filter pipe that is interconnected with the ring network cabinet, and a filter screen is fixed inside the filter pipe.

[0014] Preferably, two mounting brackets are fixed to the inner wall of the ring network cabinet, and two lifting rings are fixed to the upper surface of the ring network cabinet.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. The heat dissipation mechanism can cool the heat dissipation plate, causing the temperature of the heat dissipation plate to drop. When nitrogen passes through the heat dissipation plate, it is cooled. Moisture in the air will condense into water droplets and adhere to the surface of the heat dissipation plate. The cooled air will then enter the ring network cabinet through the circulation pipe to cool the internal components, effectively reducing the internal temperature and humidity.

[0017] 2. Through the set collection mechanism, the water droplets that condense and adhere to the cooling plate drip onto the guide plate and are discharged into the collection component. The liquid inside the collection component can be discharged to the outside through the through hole by opening the sealing plug, which is convenient for use. Attached Figure Description

[0018] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is an overall structural view of the present invention;

[0020] Figure 2 This is a half-sectional structural diagram of the ring network cabinet of this utility model;

[0021] Figure 3 This is a half-sectional structural diagram of the heat sink of this utility model;

[0022] Figure 4 For the present utility model Figure 3 A magnified view of A in the middle.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Ring main unit; 2. Protective door; 3. Heat sink; 31. Semiconductor cooling chip; 32. Cooling fin; 33. Connecting pipe; 34. Air pump; 35. Circulation pipe; 36. Heat sink; 37. Fixing plate; 38. Cooling fan; 4. Guide plate; 41. Collection component; 42. Sealing plug; 5. Filter pipe; 6. Filter screen; 7. Mounting bracket; 8. Lifting ring. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] This utility model provides a technical solution:

[0027] Please see Figures 1 to 4 A modular environmentally friendly gas-insulated ring main unit includes a ring main unit 1, with two protective doors 2 hinged to the outer surface of the ring main unit 1, and a heat dissipation mechanism for internal heat dissipation provided on the right side of the ring main unit 1.

[0028] The heat dissipation mechanism includes a heat sink 3, a thermoelectric cooler 31 fixed to the side wall of the heat sink 3, a cooling fin 32 fixed to the left side of the thermoelectric cooler 31, a connecting pipe 33 connected to the lower surface of the heat sink 3, an air pump 34 connected to the end of the connecting pipe 33, a collection mechanism for collecting cooling water inside the heat sink 3, a circulation pipe 35 connected to the inside of the ring network cabinet 1 on the upper surface of the heat sink 3, a heat sink 36 fixed to the right side of the thermoelectric cooler 31, a fixing plate 37 fixed to the right side of the heat sink 36, and two cooling fans 38 fixed inside the fixing plate 37 by bolts.

[0029] By adopting the above technical solution, before using the modular environmentally friendly gas-insulated ring main unit, the ring main unit 1 is first placed in a suitable position. When the temperature inside the ring main unit 1 is too high, the gas pump 34 can extract the nitrogen gas inside. When the nitrogen gas passes through the filter pipe 5, the filter screen 6 can filter the impurities in the nitrogen gas. Then, it enters the heat sink 3 through the connecting pipe 33. At the same time, the semiconductor cooling chip 31 is activated to cool the cooling plate 32, causing the temperature of the cooling plate 32 to drop. When the nitrogen gas passes through the cooling plate 32, it is cooled, and the moisture in the air will condense into water droplets and adhere to the surface of the cooling plate 32. The cooled air enters the ring main unit 1 again through the circulation pipe 35, thereby cooling the internal components and effectively reducing the internal humidity. The heat generated by the semiconductor cooling chip 31 during operation is absorbed by the heat sink 36. The cooling fan 38 set on the fixing plate 37 can blow air onto the heat sink 36, thereby dissipating heat from the semiconductor cooling chip 31 and improving the service life of the semiconductor cooling chip 31.

[0030] Specifically, such as Figure 1 , Figure 3 and Figure 4 As shown, the collection mechanism includes a guide plate 4, which is fixed to the inner wall of the heat sink 3 and below the heat conduction plate 32. A collection component 41 fixedly connected to the heat sink 3 is provided below the guide plate 4. A sealing plug 42 movably connected to the heat sink 3 is provided on the right side of the collection component 41. The input end of the air pump 34 is connected to a filter pipe 5 that is interconnected with the ring network cabinet 1. A filter screen 6 is fixed inside the filter pipe 5. Two mounting brackets 7 are fixed to the inner wall of the ring network cabinet 1. Two hanging rings 8 are fixed to the upper surface of the ring network cabinet 1.

[0031] By adopting the above technical solution, the ring main unit 1 can be easily hoisted using hoisting equipment via the lifting rings 8 installed on the ring main unit 1. By opening the protective door 2, the switches and fuses to be assembled can be fixed onto the mounting frame 7, thereby realizing the modular assembly of the ring main unit. After assembly, the protective door 2 can be closed, and an insulating medium, such as nitrogen, can be filled into the ring main unit 1. The water droplets condensed and adhering to the cooling fins 32 will drip onto the guide plate 4 and drain into the collection component 41. The liquid in the collection component 41 can be discharged to the outside through the through hole by opening the sealing plug 42, which is convenient for use.

[0032] Working principle: When the temperature inside the ring main unit 1 is too high, the gas pump 34 can extract the nitrogen gas inside. When the nitrogen gas passes through the filter pipe 5, the filter screen 6 can filter the impurities in the nitrogen gas. Then, it enters the heat sink 3 through the connecting pipe 33. At the same time, the semiconductor cooling chip 31 is activated to cool the cooling plate 32, causing the temperature of the cooling plate 32 to drop. As the nitrogen gas passes through the cooling plate 32, the moisture in the air will condense into water droplets and adhere to the surface of the cooling plate 32. The cooled air then passes through the circulation pipe 3. 5. It re-enters the ring network cabinet 1 to cool down the internal components. Water droplets condensed and adhered to the cooling fins 32 drip onto the guide plate 4 and are discharged into the collection unit 41. The liquid in the collection unit 41 can be discharged to the outside through the through hole by opening the sealing plug 42 for easy use. The heat generated by the semiconductor cooling chip 31 during operation is absorbed by the heat sink 36. The cooling fan 38 set on the fixing plate 37 can blow air onto the heat sink 36 to dissipate heat from the semiconductor cooling chip 31.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A modular environmentally friendly gas-insulated ring main unit, comprising a ring main unit (1), characterized in that: The outer surface of the ring network cabinet (1) is hinged with two protective doors (2), and the right side of the ring network cabinet (1) is provided with a heat dissipation mechanism for internal heat dissipation. The heat dissipation mechanism includes a heat dissipation component (3), a semiconductor cooling chip (31) is fixed on the side wall of the heat dissipation component (3), a cooling plate (32) is fixed on the left side of the semiconductor cooling chip (31), a connecting pipe (33) is connected to the lower surface of the heat dissipation component (3), an air pump (34) is connected to the end of the connecting pipe (33), and a collection mechanism for collecting cooling water is provided inside the heat dissipation component (3).

2. The modular environmentally friendly gas-insulated ring main unit according to claim 1, characterized in that: The upper surface of the heat sink (3) is connected to a circulation pipe (35) that is interconnected with the inside of the ring network cabinet (1), and a heat sink (36) is fixed on the right side of the semiconductor cooling chip (31).

3. The modular environmentally friendly gas-insulated ring main unit according to claim 2, characterized in that: A fixing plate (37) is fixed to the right side of the heat sink (36), and two cooling fans (38) are fixed inside the fixing plate (37) by bolts.

4. The modular environmentally friendly gas-insulated ring main unit according to claim 1, characterized in that: The collection mechanism includes a guide plate (4), which is fixed to the inner wall of the heat sink (3) and close to the bottom of the cooling plate (32).

5. A modular environmentally friendly gas-insulated ring main unit according to claim 4, characterized in that: Below the guide plate (4) is a collection component (41) that is fixedly connected to the heat sink (3), and on the right side of the collection component (41) is a sealing plug (42) that is movably connected to the heat sink (3).

6. A modular environmentally friendly gas-insulated ring main unit according to claim 1, characterized in that: The input end of the gas pump (34) is connected to a filter pipe (5) that is connected to the ring network cabinet (1), and a filter screen (6) is fixed inside the filter pipe (5).

7. A modular environmentally friendly gas-insulated ring main unit according to claim 1, characterized in that: The inner wall of the ring network cabinet (1) is fixed with two mounting brackets (7), and the upper surface of the ring network cabinet (1) is fixed with two lifting rings (8).

Images