Dividing type welding structure of flow divider

Abstract

A welding area is arranged on one side of a circuit board, a shunt is connected with the circuit board through the welding area, the welding area comprises segmentation bonding pad areas, the left side and the right side of the middle of the circuit board are provided with the segmentation bonding pad areas, and the shunt is connected with the circuit board through the segmentation bonding pad areas. The welding pad is arranged to be the square single-point welding pad, the cross-shaped flow channel is formed, bubbles generated during welding in the peripheral direction can be conveniently dissipated, tin overflowing is prevented, the yield is greatly improved, meanwhile, the square single-point welding pad is slow in heat dissipation and low in welding temperature, existing gas-phase welding can be replaced with reflow welding, and the welding cost is greatly reduced; a temperature monitoring area is arranged to facilitate monitoring of the temperature of the shunt.

Description

Technical Field

[0001] This utility model relates to the field of splitter technology, and more specifically, to a split welded structure for a splitter. Background Technology

[0002] Shunts are commonly used DC current measuring devices in the new energy electric vehicle and energy storage industries.

[0003] Publication No.: CN103369813A, a printed circuit board structure, including a base and a plurality of solder joints disposed on the base, each solder joint including an elliptical solder hole and an elliptical annular pad surrounding the solder hole, wherein each pad has an opening facing the adjacent pad.

[0004] Announcement No.: CN101965100B, a circuit board, the circuit board having a first pad and a second pad arranged in parallel with the first pad, the first pad including a first column of welding components and a second column of welding components, the first column of welding components and the second column of welding components each having multiple welding points, characterized in that: the welding points of the first column of welding components and the welding points of the second column of welding components are arranged alternately and correspond to the pins on both sides of the thick film substrate of the thick film circuit.

[0005] The existing electrical components and PCB board solder pads are all set as strip-shaped solder pads. Strip-shaped solder pads have a large area and dissipate heat quickly, so vapor phase soldering is required. The soldering cost is high, and other soldering methods result in low yield or are impossible to use.

[0006] In view of this, the present invention proposes a simple, efficient, and low-cost split welding structure for a shunt. Utility Model Content

[0007] The purpose of this utility model is to provide a simple, efficient, and low-cost welding structure for a split-type welding of a shunt.

[0008] A split-type soldering structure for a current shunt includes a current shunt and a circuit board 1. The circuit board 1 has a soldering area 2 on one side, through which the current shunt is connected to the circuit board 1. The soldering area 2 includes a split pad area 3. Split pad areas 3 are located on the left and right sides of the middle of the circuit board 1. The current shunt is connected to the circuit board 1 through the split pad areas 3. Each split pad area 3 includes multiple sets of pads 4, which are arranged in parallel intervals. Adjacent sets of pads 4 form a transverse flow channel 5 to facilitate the dissipation of air bubbles generated during transverse soldering and to prevent solder overflow.

[0009] Furthermore, the solder pad 4 includes multiple single-point solder pads 6, which are arranged in parallel and spaced apart. A vertical flow channel 7 is formed between adjacent single-point solder pads 6 to facilitate the dissipation of air bubbles generated during vertical soldering and to prevent solder overflow.

[0010] Furthermore, the horizontal flow channel 5 and the vertical flow channel 7 form a cross flow channel 8, which facilitates the dissipation of bubbles generated during soldering around the perimeter and prevents solder overflow. The horizontal flow channel 5 has a stepped depression with a deeper middle and shallower ends, while the vertical flow channel 7 has a uniform depth. The difference in stepped depth creates a natural bubble guide, accelerating the diffusion of bubbles from the soldering center to the edge. The shallow end flow channel can limit excessive solder flow, reduce the risk of solder overflow, and reduce solder waste.

[0011] Furthermore, the shape of the single-point solder pad 6 is one of square, rectangle, or circle. Preferably, the single-point solder pad 6 is a combination structure of a square body and semi-circular protrusions extending from the four corners. The semi-circular protrusions can increase the solder adhesion area and reduce cold solder joints. The square body maintains the characteristic of slow heat dissipation and is still suitable for low-cost reflow soldering. The local gaps formed by the protrusions can guide air bubbles to be discharged along a fixed path and avoid random solder overflow.

[0012] Furthermore, the other side of the circuit board 1 is provided with a temperature monitoring area 9 for monitoring the temperature of the shunt.

[0013] Furthermore, the temperature monitoring area 9 is provided with multiple heat conduction holes 10, which are used to receive the heat output by the splitter through heat conduction.

[0014] Furthermore, the arrangement density of the heat-conducting holes 10 is 1 mm in the central area and gradually increases to 2 mm in the peripheral area. The dense central holes improve the monitoring sensitivity of the core heating area of ​​the shunt; the sparse peripheral holes reduce the loss of mechanical strength of the circuit board and avoid deformation of the board due to excessive drilling.

[0015] Furthermore, a heat conduction channel area 11 is provided between adjacent partitioned pad areas 3 to facilitate contact with the shunt and conduct the shunt temperature to the heat conduction hole 10 on the circuit board 1 for temperature monitoring.

[0016] Furthermore, the width of the segmented pad area 3 is equal to that of the heat conduction channel area 11.

[0017] The beneficial effects of this utility model are as follows: This utility model proposes a split-type soldering structure for a shunt. One side of the circuit board 1 is provided with a soldering area 2. The shunt is connected to the circuit board 1 through the soldering area 2. The soldering area 2 includes a split pad area 3. The left and right sides of the middle of the circuit board 1 are provided with split pad areas 3. The shunt is connected to the circuit board 1 through the split pad areas 3. The pads are set as square single-point pads and form a cross flow channel, which facilitates the dissipation of air bubbles generated during soldering in all directions and prevents solder overflow, greatly improving the yield. At the same time, the square single-point pads dissipate heat slowly and the soldering temperature is low. Reflow soldering can be used instead of the existing vapor phase soldering, greatly reducing the soldering cost. A temperature monitoring area 9 is set to facilitate the monitoring of the shunt temperature. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a split welding structure for a shunt according to this application.

[0019] Figure 2 This is a schematic diagram of the circuit board welding area of ​​a shunt segmented welding structure according to this application.

[0020] Figure 3 This is a schematic diagram of the circuit temperature monitoring area of ​​a shunt segmented welding structure according to this application.

[0021] Explanation of main component symbols

[0022] Circuit board 1, soldering area 2, segmented pad area 3, pad 4, horizontal flow channel 5, single-point pad 6, vertical flow channel 7, cross flow channel 8, temperature monitoring area 9, heat conduction hole 10, heat conduction channel area 11.

[0023] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0024] The following embodiments are described to aid in understanding this application. These embodiments are not, and should not be, construed in any way as limiting the scope of protection of this application.

[0025] In the following description, those skilled in the art will recognize that throughout this discussion, components may be described as individual functional units (which may include subunits), but those skilled in the art will recognize that various components or portions thereof may be divided into individual components or may be integrated together (including integrated within a single system or component).

[0026] Furthermore, the connection between components or systems is not intended to be limited to a direct connection; on the contrary, data between these components may be modified, reformatted, or otherwise altered by intermediate components. Additionally, other or fewer connections may be used. It should also be noted that the terms "connection," "link," or "input" should be understood to include direct connections, indirect connections via one or more intermediate devices, and wireless connections. Example 1:

[0027] like Figure 1 The diagram shown is a structural schematic of a split-type welded structure for a shunt according to this application; as shown... Figure 2 The diagram shown is a schematic representation of the circuit board welding area of ​​a shunt segmented welding structure according to this application; as shown... Figure 3 The diagram shown is a schematic of the circuit temperature monitoring area of ​​a shunt segmented welding structure according to this application.

[0028] A split-type soldering structure for a current shunt includes a current shunt and a circuit board 1. The circuit board 1 has a soldering area 2 on one side, through which the current shunt is connected to the circuit board 1. The soldering area 2 includes a split pad area 3. Split pad areas 3 are located on the left and right sides of the middle of the circuit board 1. The current shunt is connected to the circuit board 1 through the split pad areas 3. Each split pad area 3 includes multiple sets of pads 4, which are arranged in parallel intervals. Adjacent sets of pads 4 form a transverse flow channel 5 to facilitate the dissipation of air bubbles generated during transverse soldering and to prevent solder overflow.

[0029] The solder pad 4 includes multiple single-point solder pads 6, which are arranged in parallel and spaced apart. A vertical flow channel 7 is formed between adjacent single-point solder pads 6 to facilitate the dissipation of air bubbles generated during vertical soldering and to prevent solder overflow.

[0030] The horizontal flow channel 5 and the vertical flow channel 7 form a cross flow channel 8, which facilitates the dissipation of bubbles generated during soldering around the perimeter and prevents solder overflow. The horizontal flow channel 5 has a stepped depression with a deeper middle and shallower ends, while the vertical flow channel 7 has a uniform depth. The difference in stepped depth creates a natural bubble guide, accelerating the diffusion of bubbles from the soldering center to the edge. The shallow end flow channel can limit excessive solder flow, reduce the risk of solder overflow, and reduce solder waste.

[0031] The shape of the single-point solder pad 6 is one of square, rectangle, or circle. Preferably, the single-point solder pad 6 is a combination structure of a square body and semi-circular protrusions extending from the four corners. The semi-circular protrusions can increase the solder adhesion area and reduce cold solder joints. The square body maintains the characteristic of slow heat dissipation and is still suitable for low-cost reflow soldering. The local gaps formed by the protrusions can guide air bubbles to be discharged along a fixed path and avoid random solder overflow.

[0032] The other side of the circuit board 1 is provided with a temperature monitoring area 9 for monitoring the temperature of the shunt.

[0033] Multiple heat conduction holes 10 are provided in the temperature monitoring area 9. The heat conduction holes 10 are used to receive the heat output by the splitter through heat conduction.

[0034] The arrangement density of the heat-conducting holes 10 is 1 mm in the central area and gradually increases to 2 mm in the outer area. The dense central holes improve the monitoring sensitivity of the core heating area of ​​the shunt; the sparse outer holes reduce the loss of mechanical strength of the circuit board and avoid deformation of the board due to excessive drilling.

[0035] A heat conduction channel area 11 is also provided between adjacent partitioned pad areas 3, which facilitates contact with the shunt and conducts the shunt temperature to the heat conduction hole 10 of the circuit board 1 for temperature monitoring.

[0036] The width of the segmented solder pad area 3 is equal to that of the heat conduction channel area 11.

[0037] The beneficial effects of this utility model are as follows: This utility model proposes a split-type soldering structure for a shunt. One side of the circuit board 1 is provided with a soldering area 2. The shunt is connected to the circuit board 1 through the soldering area 2. The soldering area 2 includes a split pad area 3. The left and right sides of the middle of the circuit board 1 are provided with split pad areas 3. The shunt is connected to the circuit board 1 through the split pad areas 3. The pads are set as square single-point pads and form a cross flow channel, which facilitates the dissipation of air bubbles generated during soldering in all directions and prevents solder overflow, greatly improving the yield. At the same time, the square single-point pads dissipate heat slowly and the soldering temperature is low. Reflow soldering can be used instead of the existing vapor phase soldering, greatly reducing the soldering cost. A temperature monitoring area 9 is set to facilitate the monitoring of the shunt temperature.

[0038] Although this application discloses several aspects and embodiments, other aspects and embodiments will be obvious to those skilled in the art. Various modifications and improvements can be made without departing from the concept of this application, and these all fall within the scope of protection of this application. The various aspects and embodiments disclosed in this application are for illustrative purposes only and are not intended to limit this application. The actual scope of protection of this application is determined by the claims.

Claims

1. A split-type welding structure for a shunt, comprising a shunt and a circuit board (1), characterized in that, The circuit board (1) has a soldering area (2) on one side. The shunt is connected to the circuit board (1) through the soldering area (2). The soldering area (2) includes a divided pad area (3). The left and right sides of the middle part of the circuit board (1) are provided with divided pad areas (3). The shunt is connected to the circuit board (1) through the divided pad areas (3). The divided pad area (3) includes multiple sets of pads (4). The multiple sets of pads (4) are arranged in parallel and spaced apart. A cross channel (5) is formed between adjacent sets of pads (4) to facilitate the dissipation of air bubbles generated during horizontal soldering and to prevent solder overflow.

2. The split-type welded structure of the shunt as described in claim 1, characterized in that: The pad (4) includes multiple single-point pads (6), which are arranged in parallel and spaced apart. A vertical flow channel (7) is formed between adjacent single-point pads (6) to facilitate the dissipation of air bubbles generated during vertical soldering and to prevent solder overflow.

3. The split-type welded structure of the shunt as described in claim 2, characterized in that: The cross channel (5) and the vertical channel (7) form a cross channel (8), which facilitates the dissipation of air bubbles generated during soldering and prevents solder overflow. The depth of the cross channel (5) is a stepped depression that is deep in the middle and shallow at both ends, and the depth of the vertical channel (7) is uniform.

4. The split-type welded structure of the shunt as described in claim 2, characterized in that: The shape of the single-point pad (6) is one of square, rectangle, or circle.

5. The split-type welded structure of the shunt as described in claim 1, characterized in that: The circuit board (1) has a temperature monitoring area (9) on the other side for monitoring the temperature of the shunt.

6. The split-type welded structure of the shunt as described in claim 5, characterized in that: Multiple heat conduction holes (10) are provided in the temperature monitoring area (9). The heat conduction holes (10) are used to receive the heat output by the splitter through heat conduction.

7. The split-type welded structure of the shunt as described in claim 6, characterized in that: The arrangement density of the heat-conducting holes (10) is 1 mm in the central area and gradually increases to 2 mm in the outer area.

8. The split-type welded structure of the shunt as described in claim 1, characterized in that: A heat conduction channel area (11) is also provided between adjacent partitioned pad areas (3) to facilitate contact with the shunt and conduct the shunt temperature to the heat conduction hole (10) of the circuit board (1) for temperature monitoring.

9. The split-type welded structure of the shunt as described in claim 8, characterized in that: The width of the segmented pad area (3) is equal to that of the heat conduction channel area (11).

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