Circuit board heat dissipation structure and heat pump water heater

Abstract

The utility model discloses a circuit board heat dissipation structure and a heat pump water heater, and relates to the technical field of heat pump water heaters, the circuit board heat dissipation structure comprises a circuit board assembly, a heat exchanger assembly and a heat pipe, and the first end of the heat pipe is connected with the circuit board assembly, so that the first end of the heat pipe can absorb heat of the circuit board assembly; and the second end of the heat pipe is connected with the heat exchanger assembly, so that the second end of the heat pipe can transfer heat to the heat exchanger assembly, the heat exchanger assembly can be communicated with cooling water, and after heat exchange with the cooling water, the cooling water can take away heat, so that heat dissipation of the circuit board assembly is realized. When the circuit board assembly cannot be directly connected with the heat exchanger assembly, the circuit board assembly and the heat exchanger assembly can be connected through the heat pipe to form heat conduction contact, so that the heat exchanger assembly can dissipate heat of the circuit board assembly.

Description

Technical Field

[0001] This application relates to the field of heat pump water heater technology, and in particular to a circuit board heat dissipation structure and a heat pump water heater. Background Technology

[0002] Currently, heat pump water heaters use a small amount of electricity as power and refrigerant as a carrier to continuously absorb low-temperature heat energy from environmental heat sources (such as water and air), convert it into higher-temperature heat energy, and then release the higher-temperature heat energy into the water that needs to be heated.

[0003] Heat pump water heaters typically include a circuit board assembly, which controls the start-up, shutdown, and heat exchange of the heat pump water heater. The circuit board assembly includes various heating components such as capacitors, inductors, and resistors. When the circuit board assembly is working, these heating components generate a lot of heat. If the heat is not dissipated in time, the heating components will become too hot and eventually be damaged.

[0004] In related technologies, a heat sink is installed on a circuit board. The heat sink includes a heat sink base and heat sink fins. The heat sink base is fixed to the circuit board and connected to the heat sink fins, and heat dissipation is achieved through the heat sink fins. However, the heat sink occupies a large amount of space, making it impossible to directly connect the heat sink to the circuit board when installation space is limited, and the structure of the heat sink is also complex. Utility Model Content

[0005] This application provides a circuit board heat dissipation structure and a heat pump water heater, which can solve the technical problem that it is inconvenient to directly set a heat dissipation structure on the circuit board when the installation space is limited.

[0006] In a first aspect, embodiments of this application provide a circuit board heat dissipation structure, which includes:

[0007] Circuit board assembly;

[0008] A heat exchanger assembly for communicating with cooling water;

[0009] A heat pipe, wherein the first end of the heat pipe is connected to the circuit board assembly to absorb heat from the circuit board assembly, and the second end of the heat pipe is connected to the heat exchanger assembly to transfer heat to the heat exchanger assembly, wherein the first end and the second end of the heat pipe are opposite ends.

[0010] In some embodiments, the heat pipe includes a first pipe segment, a connecting pipe segment, and a second pipe segment connected in sequence. The first pipe segment has a first end of the heat pipe and is arranged at an angle to the connecting pipe segment. The second pipe segment has a second end of the heat pipe and is arranged at an angle to the connecting pipe segment.

[0011] In some embodiments, the heat exchanger assembly is at least partially made of a metallic material, and the second end of the heat pipe is connected to the metallic portion of the heat exchanger assembly to form a thermally conductive contact.

[0012] In some embodiments, the heat exchanger assembly has a plug hole into which a second end of the heat pipe is inserted and in contact with the cooling water.

[0013] In some embodiments, the circuit board heat dissipation structure includes:

[0014] A sealing element is disposed between the heat pipe and the heat exchanger assembly and surrounds the periphery of the insertion hole to seal the gap between the heat pipe and the heat exchanger assembly.

[0015] In some embodiments, the second end of the heat pipe is threaded to the heat exchanger assembly, and thermally conductive adhesive is provided at the threaded connection.

[0016] In some embodiments, the second end of the heat pipe is interference-fitted to the heat exchanger assembly, and thermally conductive adhesive is provided at the interference fit.

[0017] In some embodiments, the circuit board assembly includes a printed circuit board and a heating element disposed on the printed circuit board, wherein a first end of the heat pipe is connected to the heating element and forms a thermally conductive contact.

[0018] In some embodiments, the circuit board assembly includes a plurality of the heat-generating components, and the circuit board heat dissipation structure includes a plurality of the heat pipes, wherein a first end of one of the heat pipes is connected to a corresponding heat-generating component and forms a thermally conductive contact.

[0019] In some embodiments, the circuit board heat dissipation structure includes a heat-conducting component disposed on the heat exchanger assembly, and the second end of the heat pipe is connected to the heat-conducting component.

[0020] Secondly, embodiments of this application provide a heat pump water heater, which includes:

[0021] Box;

[0022] A compressor assembly, wherein the compressor assembly is disposed within the housing;

[0023] A fan assembly, wherein the fan assembly is disposed within the housing;

[0024] In the circuit board heat dissipation structure described above, the heat exchanger assembly is disposed inside the housing and is connected to the compressor assembly. The circuit board assembly is connected to the heat exchanger assembly through the heat pipe for heat exchange.

[0025] The circuit board heat dissipation structure and heat pump water heater based on the embodiments of this application have at least the following beneficial effects:

[0026] By connecting the first end of the heat pipe to the circuit board assembly, the first end of the heat pipe can absorb the heat from the circuit board assembly. By connecting the second end of the heat pipe to the heat exchanger assembly, the second end of the heat pipe can transfer the heat to the heat exchanger assembly. The heat exchanger assembly can be connected to cooling water. After heat exchange with the cooling water, the cooling water can carry away the heat, thereby dissipating heat from the circuit board assembly. When the circuit board assembly cannot be directly connected to the heat exchanger assembly, the heat pipe can be used to connect the circuit board assembly and the heat exchanger assembly to form a thermally conductive contact, allowing the heat exchanger assembly to dissipate heat from the circuit board assembly. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A three-dimensional structural schematic diagram of the circuit board heat dissipation structure provided in the embodiments of this application from a first perspective;

[0029] Figure 2 This is a front view of the circuit board heat dissipation structure provided in an embodiment of this application;

[0030] Figure 3 A second perspective three-dimensional structural schematic diagram of the circuit board heat dissipation structure provided in the embodiments of this application;

[0031] Figure 4 This is a three-dimensional structural diagram of the circuit board heat dissipation structure provided in the embodiments of this application from a third perspective.

[0032] Explanation of reference numerals in the attached figures:

[0033] 100. Circuit board heat dissipation structure; 10. Circuit board assembly; 11. Printed circuit board; 12. Heating component; 20. Heat exchanger assembly; 201. Insertion hole; 30. Heat pipe; 31. First pipe section; 32. Connecting pipe section; 33. Second pipe section. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0035] Please see Figures 1 to 4 This application provides a circuit board heat dissipation structure 100, which may include a circuit board assembly 10, a heat exchanger assembly 20, and a heat pipe 30. The heat exchanger assembly 20 is used to connect cooling water. The first end of the heat pipe 30 can be connected to the circuit board assembly 10 so that the first end of the heat pipe 30 can absorb the heat of the circuit board assembly 10, and the second end of the heat pipe 30 can be connected to the heat exchanger assembly 20 so that the second end of the heat pipe 30 can transfer the heat to the heat exchanger assembly 20. The first end and the second end of the heat pipe 30 are opposite ends.

[0036] Optionally, the circuit board heat dissipation structure 100 can be applied to a heat pump water heater. The circuit board assembly 10 can control the start-up and shutdown of the heat pump water heater and the heat exchange operation. When the circuit board assembly 10 is working, it will generate a lot of heat. If this heat cannot be dissipated in time, the circuit board temperature will gradually rise, which will affect its performance and lifespan.

[0037] The heat exchanger assembly 20 can be a heat exchange component of the heat pump water heater itself. The heat exchanger assembly 20 can be a titanium tube heat exchanger, and the heat exchanger assembly 20 can be connected to cooling water. In this embodiment, the heat exchanger assembly 20 can include a heat exchanger body and a pipeline structure connected to the heat exchanger body. The pipeline structure is used to communicate with cooling water.

[0038] The first end and the second end of the heat pipe 30 are opposite ends, and the first end of the heat pipe 30 can be the evaporation end of the heat pipe 30, and the second end of the heat pipe 30 can be the condensation end of the heat pipe 30. More specifically, when the first end of the heat pipe 30 is connected to the circuit board assembly 10, the heat generated by the circuit board assembly 10 can be transferred to the first end of the heat pipe 30. The working fluid inside the first end of the heat pipe 30 evaporates upon heating to form vapor, which can flow through the core inside the heat pipe 30 to the second end of the heat pipe 30. When the second end of the heat pipe 30 is connected to the heat exchanger assembly 20, the vapor at the second end of the heat pipe 30 can release heat and recondense into working fluid. The cooling water flowing inside the heat exchanger assembly 20 can absorb and remove the heat. The working fluid at the second end of the heat pipe 30 can flow back to the first end of the heat pipe 30 through the core under the action of capillary force, completing a cycle. In this process, the heat pipe 30 can transfer the heat generated by the circuit board assembly 10 to the heat exchanger assembly 20, and the cooling water inside the heat exchanger assembly 20 can absorb and remove the heat, thereby achieving heat dissipation for the circuit board assembly 10.

[0039] Therefore, when the circuit board assembly 10 cannot be directly connected to the heat exchanger assembly 20, the circuit board assembly 10 and the heat exchanger assembly 20 can be connected through the heat pipe 30 to form a thermally conductive contact, so that the heat exchanger assembly 20 can dissipate heat from the circuit board assembly 10.

[0040] Optionally, the heat pump water heater is used to heat pool water. The cooling water connected to the heat exchanger assembly 20 can be pool water. More specifically, the heat exchanger assembly 20 can heat the pool water, and the pool water can also dissipate heat to the circuit board assembly 10 through the heat exchanger assembly 20. At the same time, the circuit board assembly 10 can also heat the pool water, which can improve the heating efficiency of the pool water.

[0041] Please see Figure 1 and Figure 2 In some embodiments, the heat pipe 30 may include a first pipe segment 31, a connecting pipe segment 32, and a second pipe segment 33 connected in sequence. The first pipe segment 31 may have a first end of the heat pipe 30 and the first pipe segment 31 and the connecting pipe segment 32 are arranged at an angle. The second pipe segment 33 may have a second end of the heat pipe 30 and the second pipe segment 33 and the connecting pipe segment 32 are also arranged at an angle.

[0042] Optionally, the first pipe segment 31 and the second pipe segment 33 are respectively connected to the opposite ends of the connecting pipe segment 32, and the first pipe segment 31 and the connecting pipe segment 32 can form a first angle, and the second pipe segment 33 and the connecting pipe segment 32 can form a second angle. The first angle and the second angle are set in opposite directions, so that the first pipe segment 31 and the second pipe segment 33 are located on opposite sides of the connecting pipe segment 32. Thus, the first pipe segment 31, the connecting pipe segment 32 and the second pipe segment 33 can be connected in a Z-shape. When the circuit board assembly 10 and the heat exchanger assembly 20 are located at different heights, for example, the circuit board assembly 10 is installed above the heat exchanger assembly 20, the first pipe segment 31 can be connected to the circuit board assembly 10 above, and the second pipe segment 33 can be connected to the heat exchanger assembly 20 below. By setting the shape of the heat pipe 30 to Z-shape, it is convenient to connect the circuit board assembly 10 and the heat exchanger assembly 20.

[0043] In some embodiments, the heat exchanger assembly 20 is at least partially made of a metallic material, and the second end of the heat pipe 30 is capable of connecting to the metallic portion of the heat exchanger assembly 20 and forming a thermally conductive contact.

[0044] Optionally, the heat exchanger assembly 20 may include a heat exchanger body and a piping structure communicating with the heat exchanger body. The heat exchanger body may be a titanium tube heat exchanger, which is mainly made of industrial pure titanium or titanium alloy. The second end of the heat pipe 30 may be connected to the heat exchanger body made of titanium alloy to form a thermally conductive contact. Titanium alloy has good thermal conductivity and high structural strength, and is also easy to connect with the heat pipe 30. Of course, the heat exchanger assembly 20 may also be made of metal materials such as copper and aluminum. Metal materials have good thermal conductivity and high structural strength, which can improve thermal conductivity and facilitate the connection of the heat pipe 30.

[0045] Please see Figure 3In some embodiments, the heat exchanger assembly 20 may also have a plug hole 201, into which the second end of the heat pipe 30 may be inserted, and in contact with cooling water.

[0046] Optionally, a insertion hole 201 can be provided on the side wall of the heat exchanger assembly 20. The size and shape of the insertion hole 201 match the size and shape of the heat pipe 30, so that the heat pipe 30 can be smoothly inserted into the insertion hole 201 and remain stable. Thus, the second end of the heat pipe 30 can extend into the interior of the heat exchanger assembly 20, and the second end of the heat pipe 30 can directly contact the cooling water.

[0047] When the second end of the heat pipe 30 is inserted into the insertion hole 201 and comes into contact with the cooling water, the heat inside the heat pipe 30 will be transferred to the cooling water through heat conduction and convection. The cooling water will continuously carry away the heat during the flow process, thereby reducing the temperature of the heat pipe 30 and reducing the obstruction of the side wall of the heat exchanger assembly 20. The heat pipe 30 is in direct thermal contact with the cooling water, which can improve the heat exchange efficiency of the heat pipe 30 and increase the heat dissipation effect. Furthermore, directly inserting the heat pipe 30 into the insertion hole 201 also makes it convenient to fix the heat pipe 30.

[0048] In some embodiments, the circuit board heat dissipation structure 100 may include a seal that is disposed between the heat pipe 30 and the heat exchanger assembly 20 and surrounds the periphery of the insertion hole 201 to seal the gap between the heat pipe 30 and the heat exchanger assembly 20.

[0049] Optionally, a seal may be provided in the gap between the heat pipe 30 and the heat exchanger assembly 20, and the seal may surround the periphery of the insertion hole 201 to seal the gap between the heat pipe 30 and the heat exchanger assembly 20. The insertion hole 201 may be coated with a sealing material or other sealing structure to prevent cooling water leakage.

[0050] Optionally, the sealant can be a sealant. The sealant is filled in the gap between the heat pipe 30 and the insertion hole 201. After the sealant is applied, it is cured according to the sealant curing requirements to form a good sealing effect. The sealant can also fix the heat pipe 30.

[0051] Please see Figure 4 In some embodiments, the second end of the heat pipe 30 can be threaded to the heat exchanger assembly 20, and thermally conductive adhesive is provided at the threaded connection.

[0052] Optionally, the heat exchanger assembly 20 may be provided with a threaded hole structure, and the second end of the heat pipe 30 may be provided with a threaded connector, so that the second end of the heat pipe 30 can be threadedly connected to the heat exchanger assembly 20. The threaded connection can provide a high-strength connection, ensuring a stable connection between the heat pipe 30 and the heat exchanger assembly 20, which is not easy to loosen or fall off. In addition, the threaded connection design makes it easy to install and disassemble the heat pipe 30, facilitating maintenance and replacement.

[0053] Thermally conductive adhesive can be filled in the gap between the heat pipe 30 and the heat exchanger assembly 20. This adhesive, a material with excellent thermal conductivity, can quickly and evenly transfer heat from the heat pipe 30 to the heat exchanger assembly 20, improving heat exchange efficiency. Furthermore, the adhesive not only provides thermal conductivity but also strengthens the connection between the heat pipe 30 and the heat exchanger assembly 20, making the connection more secure. Therefore, the combination of threaded connection and thermally conductive adhesive provides a double guarantee for the connection between the heat pipe 30 and the heat exchanger assembly 20, ensuring both connection stability and improved heat exchange efficiency.

[0054] Please see Figure 4 In some embodiments, the second end of the heat pipe 30 can be interference-fitted with the heat exchanger assembly 20, and thermally conductive adhesive is provided at the interference fit.

[0055] Optionally, a groove can be formed on the outer wall of the heat exchanger assembly 20. The size and inner contour shape of the groove are adapted to the size and outer contour shape of the second end of the heat pipe 30, so that the second end of the heat pipe 30 can be inserted into the groove. The second end of the heat pipe 30 and the heat exchanger assembly 20 can form a certain interference fit, so that the second end of the heat pipe 30 and the heat exchanger assembly 20 can achieve an interference fit connection. The interference fit connection has high connection strength and stability, can withstand large axial and radial loads, and the interference fit can form a tight contact surface, which can increase the thermal contact area between the heat pipe 30 and the heat exchanger assembly 20 and improve the heat exchange effect. Compared with the threaded connection, the interference fit connection does not require additional fasteners, simplifying the installation process.

[0056] Due to manufacturing tolerances and assembly errors, there may be tiny gaps between the heat pipe 30 and the heat exchanger assembly 20. Thermally conductive adhesive can be applied to the interference fit to fill these gaps, which can further improve heat exchange efficiency, ensure that heat can be transferred evenly and efficiently, and the adhesive strength of the thermally conductive adhesive can more firmly bond the heat pipe 30 and the heat exchanger assembly 20 together, preventing loosening or detachment due to vibration or impact.

[0057] Please see Figure 1 and Figure 4In some embodiments, the circuit board assembly 10 may include a printed circuit board 11 and a heating element 12 disposed on the printed circuit board 11, and the first end of the heat pipe 30 may be connected to the heating element 12 to form a thermally conductive contact.

[0058] Optionally, the heat-generating component 12 refers to electronic components that generate heat when working in electronic devices, such as integrated circuits, resistors, capacitors, etc. The first end of the heat pipe 30 can be directly connected to the heat-generating component 12. For example, the first end of the heat pipe 30 can be connected to the heat-generating component 12 by means of direct bonding, welding, threaded connection, etc., so that the first end of the heat pipe 30 can form a thermally conductive contact with the heat-generating component 12, thereby the heat generated by the heat-generating component 12 can be directly transferred to the heat pipe 30, which can further improve the heat dissipation efficiency.

[0059] Optionally, in order to ensure good thermal contact between the heat pipe 30 and the heating element 12, thermally conductive adhesive can be applied to the connection between the heat pipe 30 and the heating element 12. The thermally conductive adhesive can fill the tiny gaps between the heat pipe 30 and the heating element 12 and improve the heat conduction efficiency.

[0060] Please see Figure 4 In some embodiments, the circuit board assembly 10 may include a plurality of heat-generating components 12, and the circuit board heat dissipation structure 100 may include a plurality of heat pipes 30, the first end of a heat pipe 30 being connected to a corresponding heat-generating component 12 to form a thermally conductive contact.

[0061] Optionally, distributing multiple heat-generating components 12 on the printed circuit board 11 can avoid heat source concentration, thereby reducing thermal stress on the printed circuit board 11. Furthermore, the first end of each heat pipe 30 can be connected to a corresponding heat-generating component 12 to form a thermally conductive contact, so that each heat pipe 30 acts as an independent heat dissipation channel, effectively conducting away the heat generated by the corresponding heat-generating component 12, which can significantly improve the heat dissipation efficiency of the circuit board.

[0062] In some embodiments, the circuit board heat dissipation structure 100 may include a heat-conducting component, which may be disposed on the heat exchanger assembly 20, and the second end of the heat pipe 30 may be connected to the heat-conducting component.

[0063] Optionally, the heat-conducting component is a component specifically designed to transfer heat. The heat-conducting component is usually made of a material with high thermal conductivity, such as copper, aluminum and other metals. The heat-conducting component can be set on the heat exchanger assembly 20 to form a good thermal contact with the heat exchanger assembly 20. The second end of the heat pipe 30 can be connected to the heat-conducting component, so that heat can be effectively conducted from the circuit board assembly 10 to the heat exchanger assembly 20. Furthermore, by setting the heat-conducting component, it is also convenient to form a thermal contact between the heat pipe 30 and the heat exchanger assembly 20.

[0064] On the other hand, this application embodiment also provides a heat pump water heater, which includes a housing, a compressor assembly, a fan assembly, and a circuit board heat dissipation structure 100. The housing serves as an external protective component of the heat pump water heater and can form an installation cavity. The compressor assembly, the fan assembly, and the circuit board heat dissipation structure 100 can all be disposed inside the housing. The compressor assembly can be connected to the heat exchanger assembly 20, so that the compressor assembly can compress the refrigerant into the heat exchanger assembly 20. The circuit board assembly 10 can be connected to the heat exchanger assembly 20 through a heat pipe 30 and form a thermally conductive contact. The fan assembly can drive the airflow inside the housing to increase the heat dissipation effect.

[0065] The beneficial effects of the heat pump water heater in this application are the same as those of the circuit board heat dissipation structure 100 in this application, and will not be described again here.

[0066] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0067] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation structure for a circuit board, characterized in that, include: Circuit board assembly; A heat exchanger assembly for communicating with cooling water, the heat exchanger assembly including a heat exchanger body and a piping structure communicating with the heat exchanger body, the piping structure being for communicating with the cooling water; A heat pipe, the first end of which is connected to the circuit board assembly to absorb heat from the circuit board assembly, and the second end of which is connected to the heat exchanger body to transfer heat to the heat exchanger body. The heat exchanger body is used to heat the cooling water, and the first and second ends of the heat pipe are opposite ends.

2. The circuit board heat dissipation structure according to claim 1, characterized in that, The heat pipe includes a first pipe segment, a connecting pipe segment, and a second pipe segment connected in sequence. The first pipe segment has a first end of the heat pipe and is set at an angle to the connecting pipe segment. The second pipe segment has a second end of the heat pipe and is set at an angle to the connecting pipe segment.

3. The circuit board heat dissipation structure according to claim 1, characterized in that, The heat exchanger assembly is at least partially made of a metallic material, and the second end of the heat pipe is connected to the metallic portion of the heat exchanger assembly to form a thermally conductive contact.

4. The circuit board heat dissipation structure according to claim 1, characterized in that, The heat exchanger assembly has a plug hole, and the second end of the heat pipe is inserted into the plug hole and in contact with the cooling water.

5. The circuit board heat dissipation structure according to claim 4, characterized in that, The heat dissipation structure of the circuit board includes: A sealing element is disposed between the heat pipe and the heat exchanger assembly and surrounds the periphery of the insertion hole to seal the gap between the heat pipe and the heat exchanger assembly.

6. The circuit board heat dissipation structure according to claim 1, characterized in that, The second end of the heat pipe is threadedly connected to the heat exchanger assembly, and thermally conductive adhesive is provided at the threaded connection.

7. The circuit board heat dissipation structure according to claim 1, characterized in that, The second end of the heat pipe is interference-fitted to the heat exchanger assembly, and thermally conductive adhesive is provided at the interference fit.

8. The circuit board heat dissipation structure according to claim 1, characterized in that, The circuit board assembly includes a printed circuit board and a heating element disposed on the printed circuit board, wherein the first end of the heat pipe is connected to the heating element and forms a thermally conductive contact.

9. The circuit board heat dissipation structure according to claim 8, characterized in that, The circuit board assembly includes multiple heat-generating components, and the circuit board heat dissipation structure includes multiple heat pipes. The first end of one of the heat pipes is connected to a corresponding heat-generating component and forms a thermally conductive contact.

10. The circuit board heat dissipation structure according to claim 1, characterized in that, The circuit board heat dissipation structure includes a heat-conducting component, which is disposed on the heat exchanger assembly, and the second end of the heat pipe is connected to the heat-conducting component.

11. A heat pump water heater, characterized in that, include: Box; A compressor assembly, wherein the compressor assembly is disposed within the housing; A fan assembly, wherein the fan assembly is disposed within the housing; According to any one of claims 1-10, the heat exchanger assembly is disposed in the housing and is connected to the compressor assembly, and the circuit board assembly is connected to the heat exchanger assembly through the heat pipe for heat exchange.

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