Heat dissipation device of power electronic equipment and photovoltaic inverter with same
By employing a heat dissipation substrate and finned dielectric cavity design in the inverter, and utilizing the evaporation and condensation cycle of the cooling medium, the problem of insufficient heat dissipation in the inverter under high heat flux density is solved, achieving efficient heat transfer and heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- AISWEI NEW ENERGY TECHNOLOGY (YANGZHONG) CO LTD
- Filing Date
- 2025-05-06
- Publication Date
- 2026-05-05
AI Technical Summary
Existing conventional heat sinks are insufficient to effectively solve the heat dissipation problem of inverters under high heat flux density, and their heat dissipation performance is inadequate as market demand increases their power density.
A heat dissipation device is employed, comprising a heat dissipation substrate and heat dissipation fins. The medium cavity contains liquid and gaseous cooling media, and the medium cavity includes an evaporation region and a condensation region. The cooling media circulates in the medium cavity to transfer heat, and efficient heat dissipation is achieved by utilizing the evaporation and condensation processes.
It achieves efficient heat dissipation of the inverter by rapidly transferring heat through the evaporation and condensation cycle of the cooling medium, thereby improving the heat dissipation effect and equipment reliability.
Smart Images
Figure CN224205463U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of power electronics technology, specifically relating to a heat dissipation device for power electronic equipment and a photovoltaic inverter having the same. Background Technology
[0002] With the continuous development and widespread adoption of energy sources such as photovoltaics, people's demands for the performance of related equipment are increasing. Inverters and other power conversion equipment are one of the core components of energy utilization. However, inverters are characterized by high heat generation and concentrated heat distribution during operation. Existing ordinary heat sinks are insufficient to effectively address this high heat flux density scenario. As market demand continues to increase, their power density is also rising. Therefore, improving the heat dissipation performance of heat sinks under high heat flux density has become an urgent technical problem to be solved. Utility Model Content
[0003] To solve the above-mentioned technical problems, this utility model provides a heat dissipation device for power electronic equipment and a photovoltaic inverter, which has a better heat dissipation effect.
[0004] To achieve the above objectives, the present invention adopts the following technical solution:
[0005] A heat dissipation device for power electronic equipment includes a heat sink for dissipating heat from power components on the power electronic equipment. The heat sink has a heat dissipation substrate and heat dissipation fins disposed on the heat dissipation substrate. The heat sink has a medium cavity containing a cooling medium, which has a liquid state and a gaseous state. The medium cavity includes a first cavity disposed within the heat dissipation substrate and a second cavity disposed within the heat dissipation fins. The first cavity and the second cavity are connected to allow the cooling medium to flow between the first cavity and the second cavity. The medium cavity has an evaporation region adjacent to the power components and a condensation region away from the power components. The evaporation region includes at least the first cavity, and the condensation region is located in the second cavity and is higher than the evaporation region.
[0006] In a preferred embodiment, the heat dissipation substrate has a first facade and a second facade that are opposite to each other and parallel to each other. The power component is disposed on the first facade, and the heat dissipation fins are disposed on the second facade. The ratio of the contact area between the power component and the first facade to the projected area of the first cavity on the second facade is 1:(1~2). The top of the first cavity is lower than the top of the second cavity.
[0007] In a preferred embodiment, the bottom of the first cavity is level with the bottom of the second cavity, or the bottom of the first cavity is higher than the bottom of the second cavity; the evaporation region is located in the first cavity, and the condensation region includes at least the top of the second cavity.
[0008] In a preferred embodiment, the first cavity is disposed at the lower end of the heat dissipation substrate, and the lower end is connected to the heat dissipation fins; the height of the heat dissipation fins is higher than the height of the heat dissipation substrate.
[0009] In a preferred embodiment, the heat dissipation fins have an upper end and a lower end, the lower end being connected to the heat dissipation substrate, and a gap being between the upper end and the heat dissipation substrate.
[0010] In a preferred embodiment, the first cavity is disposed at the upper end of the heat dissipation substrate, and the upper end is connected to the heat dissipation fins; the height of the heat dissipation fins is higher than the height of the heat dissipation substrate.
[0011] In a preferred embodiment, the first cavity is disposed at the lower end of the heat dissipation substrate, and the lower end is connected to the heat dissipation fins; the height of the heat dissipation fins is equal to the height of the heat dissipation substrate.
[0012] In a preferred embodiment, the heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin, the first heat dissipation fin being connected to the upper end of the heat dissipation substrate, and the second heat dissipation fin being connected to the lower end of the heat dissipation substrate; the first cavity is disposed at the lower end of the heat dissipation substrate, and the second cavity is disposed on the second heat dissipation fin.
[0013] In a preferred embodiment, the heat sink has a first end and a second end, the first end and the heat sink substrate are integrally formed, the second end is provided with a liquid collection mechanism, the liquid collection mechanism has a liquid collection cavity, the liquid collection cavity is connected to the second cavity of the heat sink fins; the first cavity is located at the lower end of the heat sink substrate.
[0014] This utility model also adopts the following technical solution:
[0015] A photovoltaic inverter includes multiple power components, and the photovoltaic inverter also includes the aforementioned heat dissipation device, with the power components disposed on the heat dissipation device.
[0016] In a preferred embodiment, the power component includes a first power component and a second power component, with the bottom end of the first power component located above the top end of the second power component; the first cavity is disposed at the lower end of the heat dissipation substrate, and the upper end of the heat dissipation substrate is further provided with a third cavity; the heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin, with the first heat dissipation fin having a fifth cavity communicating with the third cavity, and the second heat dissipation fin having a fourth cavity communicating with the first cavity; the first power component is disposed in the first cavity, and the second power component is disposed in the third cavity.
[0017] The present invention adopts the above solution and has the following advantages compared with the prior art:
[0018] In this heat dissipation device, when the power components are dissipating heat, the cooling medium in the first cavity changes from liquid to gas after absorbing heat, forming an evaporation zone. The cooling medium in the second cavity is also replenished to the first cavity in a timely manner. At the same time, the gaseous cooling medium in the first cavity flows to the upper end of the second cavity, condenses and cools down, releasing heat. The condensed liquid cooling medium flows back to the first cavity or falls into the lower end of the second cavity due to gravity, thereby achieving efficient heat transfer and further ensuring the heat dissipation effect. Attached Figure Description
[0019] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a perspective view of the heat dissipation device according to Embodiment 1 of the present invention;
[0021] Figure 2 According to Figure 1 Sectional view at point AA;
[0022] Figure 3 This is a perspective view of the heat dissipation device according to Embodiment 2 of the present invention;
[0023] Figure 4 This is a perspective view of the heat dissipation device according to Embodiment 3 of the present invention;
[0024] Figure 5 This is an internal schematic diagram of a heat dissipation device according to Embodiment 3 of the present invention;
[0025] Figure 6 This is another schematic diagram of the heat dissipation device according to Embodiment 3 of the present invention;
[0026] Figure 7 This is an internal schematic diagram of a heat dissipation device according to Embodiment 4 of the present invention;
[0027] Figure 8 This is an internal schematic diagram of a heat dissipation device according to Embodiment 5 of the present invention;
[0028] Figure 9 This is a schematic diagram of the heat dissipation device according to Embodiment 6 of the present invention;
[0029] Figure 10 This is an internal schematic diagram of the heat dissipation device according to Embodiment 7 of the present invention;
[0030] in,
[0031] 100. Power component; 101. First power component; 102. Second power component;
[0032] 1. Heat sink; 11. Heat sink base plate; 111. First cavity; 12. Heat sink fins; 121. Second cavity; 122. First heat sink fins; 123. Second heat sink fins; 124. Third cavity; 125. Fourth cavity; 126. Fifth cavity; 13. Protrusion; 14. First end; 15. Second end; 151. Liquid collection mechanism; 16. Liquid level line. Detailed Implementation
[0033] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is for the purpose of aiding understanding the present invention, but does not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0034] Example 1
[0035] This embodiment provides a power electronic device, which can be a rectifier or an inverter. Specifically, in this embodiment, it is a photovoltaic inverter. The photovoltaic inverter includes a housing (not shown in the figure), and power components 100 are provided inside the housing. A heat dissipation device is provided on the back of the housing. The heat dissipation device is used to dissipate heat from the power components inside the housing. Specifically, in this embodiment, the heat dissipation device refers to a heat sink.
[0036] Reference Figure 1 and Figure 2As shown, the heat sink 1 has a heat dissipation substrate 11 and heat dissipation fins 12 disposed on the heat dissipation substrate 11. A medium cavity is provided in the heat sink 1, containing a cooling medium (e.g., water), which can be in liquid or gaseous state. The medium cavity includes a first cavity 111 disposed on the heat dissipation substrate 11 and a second cavity 121 disposed within the heat dissipation fins 12. The first cavity 111 and the second cavity 121 are connected to allow the cooling medium to flow between them. This embodiment does not limit the specific type of cooling medium. The medium cavity has an evaporation region adjacent to the power components and a condensation region away from the power components. The evaporation region is located in the first cavity 111, and the condensation region is located in the second cavity 121 and is higher than the evaporation region; specifically, the condensation region is the top of the second cavity 121.
[0037] The heat dissipation substrate 11 has a first facade and a second facade that are opposite and parallel to each other. A power component 100 is disposed on the first facade, and heat dissipation fins 12 are disposed on the second facade. The ratio of the contact area between the power component 100 and the first facade to the projected area of the first cavity 111 on the second facade is 1:(1-2). The top of the first cavity 111 is lower than the top of the second cavity 121. Further, the bottom of the first cavity 111 is flush with the bottom of the second cavity 121, or the bottom of the first cavity 111 is higher than the bottom of the second cavity 121. Specifically, in this embodiment, the bottom of the first cavity 111 is flush with the bottom of the second cavity 121.
[0038] The height of the heat dissipation fins 12 is greater than or equal to the height of the heat dissipation substrate 11. This allows for effective heat dissipation of the power module 40, which is higher in the height direction of the heat sink. Furthermore, the greater height of the heat dissipation fins 12 increases the heat dissipation area, thus improving the heat dissipation effect. The height of the second cavity 121 is greater than the height of the power components, ensuring timely heat dissipation for the power components. The upper end of the heat dissipation substrate 11 is a solid area, which reduces the size of the first cavity 111, allowing the cooling medium to vaporize quickly and fully enter the heat dissipation fins 12, improving the overall utilization rate of the cooling medium and the heat dissipation effect of the heat sink. Simultaneously, the smaller area of the first cavity 111, which is only connected to the lower end of the heat dissipation fins 12, reduces the difficulty of welding or other processes during connection, reduces the probability of leakage between the first cavity 111 and the second cavity 121, and improves equipment reliability.
[0039] Specifically, in this embodiment, the first cavity 111 is disposed at the lower end of the heat dissipation substrate 11, and the lower end is connected to the heat dissipation fin 12. Further, the heat dissipation fin 12 has an upper end and a lower end, the lower end of the heat dissipation fin 12 is connected to the lower end of the heat dissipation substrate 11, and there is a gap between the upper end of the heat dissipation fin 12 and the heat dissipation substrate 11, which can effectively reduce the processing difficulty.
[0040] During heat dissipation, the heat from the power component 100 is transferred to the first cavity 111 via the heat dissipation substrate 11. The cooling medium in the first cavity 111 absorbs heat and changes from a liquid to a gaseous state, forming an evaporation zone. The cooling medium in the second cavity 121 also flows into the first cavity 111. Simultaneously, the gaseous cooling medium flows to the upper end of the heat dissipation fins 12 and condenses, releasing heat. The condensed liquid medium flows back to the first cavity 111 due to gravity, repeating the above process. This achieves efficient heat transfer and effective heat dissipation for the power component 100. In this embodiment, the first cavity 111 is connected to the second cavity 121 with multiple heat dissipation fins 12. Heat can be quickly transferred within the first cavity 111 and the second cavity 121 and dissipated through the heat dissipation fins 12, improving the heat dissipation effect.
[0041] The heat dissipation device in this embodiment imposes fewer constraints on the heat dissipation fins 12. Specifically, the height of the heat dissipation fins can be greater than the height of the heat dissipation substrate, which can also achieve a good heat dissipation effect for power components located at the upper end of the heat dissipation substrate. In other words, this embodiment can improve the heat dissipation effect by increasing the area of the heat dissipation fins. Furthermore, in this embodiment, the first cavity 111 of the heat dissipation substrate 11 and the second cavity 121 of the heat dissipation fins 12 are connected, and the internal medium can achieve rapid heat dissipation through the flow channels inside the heat sink, thereby improving the heat dissipation effect of the heat sink.
[0042] Example 2
[0043] Reference Figure 3 As shown, this embodiment is basically the same as embodiment 1, except that the first cavity 111 in this embodiment is disposed at the upper end of the heat dissipation substrate 11, and the upper end is connected to the second cavity 121 of the heat dissipation fin 12. The heat dissipation fin 12 also has a solid fin region lower than the second cavity 121, and some heat can also be dissipated through the solid fin region.
[0044] Example 3
[0045] Reference Figures 4 to 6 As shown, this embodiment is basically the same as embodiment 1, except that the height of the heat dissipation substrate 11 and the height of the heat dissipation fins 12 are the same, and the heat sink 1 has a liquid level line 16. The height of the liquid level line 16 is higher than that of the power component 100 to ensure the heat dissipation effect.
[0046] Example 4
[0047] Reference Figure 7As shown, the heat dissipation fins 12 in this embodiment include a first heat dissipation fin 122 and a second heat dissipation fin 123. The first heat dissipation fin 122 is connected to the upper end of the heat dissipation substrate 11, and the second heat dissipation fin 123 is connected to the lower end of the heat dissipation substrate 11. A first cavity 111 is disposed at the lower end of the heat dissipation substrate 11, and a second cavity 121 is disposed on the second heat dissipation fin 123. The power component 100 includes a first power component 101 and a second power component 102. The first power component 101 mainly dissipates heat through the second heat dissipation fin 123, and the second power component 102 mainly dissipates heat through the first heat dissipation fin 122.
[0048] Example 5
[0049] This embodiment is basically the same as Embodiment 1, except that, referring to... Figure 8 As shown, the inner surface of the heat dissipation fins 12 is provided with multiple protrusions 13, which increases the movement path of the cooling medium and improves the heat dissipation effect.
[0050] Example 6
[0051] Reference Figure 9 As shown, the radiator 1 has a first end 14 and a second end 15. The first end 14 is integrally formed with the heat dissipation substrate 11. The second end 15 is provided with a liquid collection mechanism 151. The liquid collection mechanism 151 has a liquid collection cavity. The liquid collection cavity is connected to the second cavity 121 of the heat dissipation fins 12, which increases the flow path of the liquid medium and further improves the heat dissipation effect.
[0052] Example 7
[0053] Reference Figure 10 As shown, the power component 100 includes a first power component 101 and a second power component 102. The bottom end of the first power component 101 is located above the top end of the second power component 102. A first cavity 111 is disposed at the lower end of the heat dissipation substrate 11, and a third cavity 124 is also provided at the upper end of the heat dissipation substrate 11. The heat dissipation fins 12 include a first heat dissipation fin and a second heat dissipation fin. The first heat dissipation fin has a fifth cavity 126 communicating with the third cavity 124, and the second heat dissipation fin 123 has a fourth cavity 125 communicating with the first cavity 111. The first power component 101 is disposed in the first cavity 111, and the second power component 102 is disposed in the third cavity 124. That is, different heat dissipation fins can be provided for power components of different heights.
[0054] As indicated in this specification and claims, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, and these steps and elements do not constitute an exclusive list; the method or apparatus may also include other steps or elements. The term "and / or" as used herein includes any combination of one or more of the associated listed items.
[0055] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," and "right" used in this utility model are only relative to the relative positional relationships of the various components of this utility model in the accompanying drawings.
[0056] The above embodiments are only for illustrating the technical concept and features of this utility model, and are preferred embodiments. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly, and should not be construed as limiting the protection scope of this utility model. All equivalent transformations or modifications made based on the principles of this utility model should be covered within the protection scope of this utility model.
Claims
1. A heat dissipation device for power electronic equipment, comprising a heat sink for dissipating heat from power components on the power electronic equipment, the heat sink having a heat dissipation substrate and heat dissipation fins disposed on the heat dissipation substrate, characterized in that, The heat sink is provided with a medium cavity containing a cooling medium, which has both liquid and gaseous states. The medium cavity includes a first cavity disposed within the heat sink substrate and a second cavity disposed within the heat sink fins. The first cavity and the second cavity are connected to allow the cooling medium to flow between the first cavity and the second cavity. The medium cavity has an evaporation region adjacent to the power components and a condensation region away from the power components. The evaporation region includes at least the first cavity, and the condensation region is located in the second cavity and is higher than the evaporation region.
2. The heat dissipation device according to claim 1, characterized in that, The heat dissipation substrate has a first facade and a second facade that are opposite to each other and parallel to each other. The power components are disposed on the first facade, and the heat dissipation fins are disposed on the second facade. The ratio of the contact area between the power components and the first facade to the projected area of the first cavity on the second facade is 1:(1~2). The top of the first cavity is lower than the top of the second cavity.
3. The heat dissipation device according to claim 2, characterized in that, The bottom of the first cavity is level with the bottom of the second cavity, or the bottom of the first cavity is higher than the bottom of the second cavity; the evaporation region is located in the first cavity, and the condensation region includes at least the top of the second cavity.
4. The heat dissipation device according to claim 3, characterized in that, The first cavity is disposed at the lower end of the heat dissipation substrate, and the lower end is connected to the heat dissipation fins; the height of the heat dissipation fins is higher than the height of the heat dissipation substrate.
5. The heat dissipation device according to claim 4, characterized in that, The heat dissipation fins have an upper end and a lower end, the lower end is connected to the heat dissipation substrate, and there is a gap between the upper end and the heat dissipation substrate.
6. The heat dissipation device according to claim 3, characterized in that, The first cavity is disposed at the upper end of the heat dissipation substrate, and the upper end is connected to the heat dissipation fins; the height of the heat dissipation fins is higher than the height of the heat dissipation substrate.
7. The heat dissipation device according to claim 3, characterized in that, The first cavity is disposed at the lower end of the heat dissipation substrate, and the lower end is connected to the heat dissipation fins; the height of the heat dissipation fins is equal to the height of the heat dissipation substrate.
8. The heat dissipation device according to claim 3, characterized in that, The heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin. The first heat dissipation fin is connected to the upper end of the heat dissipation substrate, and the second heat dissipation fin is connected to the lower end of the heat dissipation substrate. The first cavity is disposed at the lower end of the heat dissipation substrate, and the second cavity is disposed on the second heat dissipation fin.
9. The heat dissipation device according to claim 3, characterized in that, The heat sink has a first end and a second end. The first end is integrally formed with the heat sink substrate. The second end is provided with a liquid collection mechanism. The liquid collection mechanism has a liquid collection cavity. The liquid collection cavity is connected to the second cavity of the heat sink fins. The first cavity is located at the lower end of the heat sink substrate.
10. A photovoltaic inverter, comprising multiple power components, characterized in that, The photovoltaic inverter further includes a heat dissipation device as described in any one of claims 1 to 9, wherein the power components are disposed on the heat dissipation device.
11. The photovoltaic inverter according to claim 10, characterized in that, The power components include a first power component and a second power component, with the bottom end of the first power component located above the top end of the second power component; the first cavity is disposed at the lower end of the heat dissipation substrate, and the upper end of the heat dissipation substrate is further provided with a third cavity; the heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin, with the first heat dissipation fin having a fifth cavity communicating with the third cavity, and the second heat dissipation fin having a fourth cavity communicating with the first cavity; the first power component is disposed in the first cavity, and the second power component is disposed in the third cavity.