Circuit board structure easy to dissipate heat
By using a design that directly exposes heat dissipation metal blocks on the circuit board and combining etched holes with a thin metal film layer, the problem of low heat dissipation efficiency in existing circuit board heat dissipation structures is solved, achieving faster heat dissipation and more efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KEEPER TECH
- Filing Date
- 2025-05-16
- Publication Date
- 2026-05-05
AI Technical Summary
In existing circuit board heat dissipation structures, heat dissipation efficiency is low, especially the heat conduction speed through dielectric and metal layers is slow, resulting in poor heat convection and affecting the heat dissipation effect of the circuit board.
The design employs an exposed heat dissipation metal block, combined with etched holes and a thin metal film layer, to quickly dissipate heat through direct heat conduction, avoiding heat conduction and convection through multiple layers of dielectric and metal layers.
It achieves faster heat dissipation, improves the heat dissipation efficiency of the circuit board, ensures good connection between layers and does not limit the number of stacked substrate layers, thus enhancing the heat dissipation effect.
Smart Images
Figure CN224205473U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a circuit board structure, and more particularly to a circuit board structure that is easy to dissipate heat. Background Technology
[0002] In order to maintain the quality of electrical signals transmitted by a circuit and extend the lifespan of electronic components in the circuit, the waste heat generated by a circuit board during operation needs to be efficiently discharged, thereby reducing the temperature of the circuit board and reducing the impact of thermal noise on electrical signals.
[0003] Please see Figure 3 As shown, an existing circuit board heat dissipation structure 100 is composed of an upper circuit layer module 110, a middle circuit layer module 120 and a lower circuit layer module 130, with the middle circuit layer module 120 stacked between the upper circuit layer module 110 and the lower circuit layer module 130.
[0004] The upper circuit layer module 110 has an upper metal layer 111 and at least one dielectric layer 112 stacked together. A surface 113 of the upper metal layer 111 facing away from the at least one dielectric layer 112 is provided to receive heat generated by a heat source. For example, an electronic component 140 is provided on the surface 113, and the electronic component 140 generates waste heat when energized. Therefore, for the existing circuit board heat dissipation structure 100, the surface 113 receives the heat that needs to be dissipated.
[0005] The middle circuit layer module 120 has an upper middle metal layer 121, a middle layer unit 122, and a lower middle metal layer 123 stacked together. The middle layer unit 122 is stacked between the upper middle metal layer 121 and the lower middle metal layer 123, and a surface of the upper middle metal layer 121 facing away from the middle layer unit 122 is connected to the at least one dielectric layer 112 of the upper circuit layer module 110.
[0006] The lower circuit layer module 130 has at least one dielectric layer 131 and a lower metal layer 132 stacked together. A surface of the at least one dielectric layer 131 opposite to the lower metal layer 132 is connected to the lower middle metal layer 123 of the middle circuit layer module 120.
[0007] To maintain a suitable operating temperature for the electronic component 140 mounted on surface 113, the existing circuit board heat dissipation structure 100 further includes a heat dissipation metal block 150 within the middle layer unit 122 of the middle circuit layer module 120. Specifically, the heat dissipation metal block 150 is manufactured by pressing it between the upper middle metal layer 121 and the lower middle metal layer 123 of the middle circuit layer module 120. Additionally, the existing circuit board heat dissipation structure 100 also includes at least one heat dissipation hole, such as an upper heat dissipation hole 161, a middle heat dissipation hole 162, a lower heat dissipation hole 163, and a through-hole heat dissipation hole 164.
[0008] The upper heat dissipation hole 161 penetrates the upper metal layer 111 and the at least one dielectric layer 112 that are stacked on the upper circuit layer module 110, and connects the upper metal layer 111, the at least one dielectric layer 112 and the upper middle metal layer 121 of the middle circuit layer module 120.
[0009] The central heat dissipation hole 162 penetrates the upper middle metal layer 121, the middle layer unit 122, and the lower middle metal layer 123 of the overlapping middle circuit layer module 120, and connects the at least one dielectric layer 112, the upper middle metal layer 121, the middle layer unit 122, the lower middle metal layer 123, and the at least one dielectric layer 131. Furthermore, one side of the heat dissipation metal block 150 is exposed in the central heat dissipation hole 162.
[0010] The lower heat dissipation hole 163 penetrates the at least one dielectric layer 131 and the lower metal layer 132 that are stacked on the lower circuit layer module 130, and connects the middle lower metal layer 123, the at least one dielectric layer 131 and the lower metal layer 132 of the middle circuit layer module 120.
[0011] The through-hole 164 passes through and connects the superimposed upper circuit layer module 110, the middle circuit layer module 120 and the lower circuit layer module 130, and the other side of the heat dissipation metal block 150 is exposed in the through-hole 164.
[0012] Therefore, the existing circuit board heat dissipation structure 100 facilitates the conduction of heat from the electronic component 140 to the heat sink 150, and then the upper metal layer 121 conducts the heat from the heat sink 150 to the central heat dissipation hole 162 and the through heat dissipation hole 164. The central heat dissipation hole 162 then conducts the heat to the lower metal layer 123.
[0013] However, the lower metal layer 123 collects heat directly or indirectly conducted by the heat dissipation metal block 150, but still needs to dissipate the collected heat to the lower metal layer 132 through limited means. The lower metal layer 123 can dissipate heat to the lower metal layer 132 through the lower heat dissipation hole 163 and the through heat dissipation hole 164, but the degree of heat convection between the lower heat dissipation hole 163 and the through heat dissipation hole 164 is limited, so this method of heat dissipation is slow. The lower metal layer 123 can also conduct heat to the at least one dielectric layer 131 first, and then the at least one dielectric layer 131 conducts heat to the lower metal layer 132. However, the heat conduction speed of the at least one dielectric layer 131, which is a dielectric material, is slow, and the lower metal layer 132 still needs to rely on heat convection to dissipate heat. Therefore, it is clear that the heat dissipation method of the existing circuit board heat dissipation structure 100 needs improvement. Utility Model Content
[0014] This invention provides a circuit board structure that facilitates heat dissipation, enabling more efficient removal of waste heat generated by a heat source.
[0015] The heat-dissipating circuit board structure of this utility model includes:
[0016] A connection circuit layer module has an overlapping connection metal layer and at least one dielectric layer, the connection metal layer having a connection surface and the connection surface facing away from the at least one dielectric layer.
[0017] A heat dissipation circuit layer module has an upper heat dissipation metal layer and a middle heat dissipation layer unit that are stacked together;
[0018] The upper heat dissipation metal layer has a surface opposite to the middle heat dissipation layer unit, and the surface is connected to at least one dielectric layer of the connection circuit layer module.
[0019] The middle heat dissipation layer unit has a heat dissipation metal block with a heat dissipation surface facing away from the upper heat dissipation metal layer and exposed from the heat dissipation circuit layer module.
[0020] The heat dissipation surface of the heat dissipation metal block of this invention is directly exposed from the heat dissipation circuit layer module. Therefore, it can directly dissipate the heat received by the heat dissipation metal block without indirectly dissipating the received heat through other structures, which would affect the heat dissipation speed. Compared with existing circuit board heat dissipation structures, the easily heat-dissipating circuit board structure of this invention can dissipate heat more quickly, that is, it does not require heat convection through heat dissipation holes or heat conduction through at least one dielectric layer or one metal layer to dissipate the heat of a heat dissipation metal block. Attached Figure Description
[0021] Figure 1 This is a top view of the circuit board structure for easy heat dissipation of this utility model, connecting electronic components.
[0022] Figure 2 This is a cross-sectional view of the heat-dissipating circuit board structure of this utility model in one embodiment.
[0023] Figure 3 This is a cross-sectional schematic diagram of an existing circuit board heat dissipation structure. Detailed Implementation
[0024] Please see Figure 1 As shown, this utility model provides a heat-dissipating circuit board structure 1, which assists in the heat dissipation of an electronic component 2. This electronic component 2, in conjunction with this invention, easily generates heat during operation, serving as a heat source.
[0025] In one embodiment, the electronic component 2 used in this invention is a light-emitting element, such as a set of light-emitting diode (LED) vehicle lights. The LED vehicle lights are directly or indirectly disposed on the heat-dissipating circuit board structure 1 of this invention. For the heat-dissipating circuit board structure 1 of this invention, everything disposed on the heat-dissipating circuit board structure 1 can be regarded as a heat source that needs to be dissipated.
[0026] Please refer to the following: Figure 2 As shown, Figure 2 This is a cross-sectional view of a framed portion B along a section line A of the heat-dissipating circuit board structure 1. In this embodiment, the heat-dissipating circuit board structure 1 includes a superimposed connection circuit layer module 10 and a heat dissipation circuit layer module 20.
[0027] The connection circuit layer module 10 has an overlapping connection metal layer 11 and at least one dielectric layer 12. The connection metal layer 11 has a connection surface 13 facing away from the at least one dielectric layer 12 for receiving the heat generated by the electronic component 2.
[0028] The heat dissipation circuit layer module 20 further comprises an upper heat dissipation metal layer 21 and a middle heat dissipation layer unit 22 stacked together. A surface 23 of the upper heat dissipation metal layer 21, facing away from the middle heat dissipation layer unit 22, is connected to the at least one dielectric layer 12 of the connecting circuit layer module 10. Furthermore, the middle heat dissipation layer unit 22 comprises a plurality of stacked circuit board layers 24 and a heat dissipation metal block 25.
[0029] The heat dissipation metal block 25 has a heated surface 251 and a heat dissipation surface 252 facing each other, and at least one side wall 253 is provided between the heated surface 251 and the heat dissipation surface 252 of the heat dissipation metal block 25. The heated surface 251 of the heat dissipation metal block 25 faces the upper heat dissipation metal layer 21, and the at least one side wall 253 of the heat dissipation metal block 25 is surrounded by the stacked circuit board layers 24, while the heat dissipation surface 252 of the heat dissipation metal block 25 facing away from the upper heat dissipation metal layer 21 is exposed from the heat dissipation circuit layer module 20. Figure 2 In the example shown, the several circuit board layers 24 are stacked with multiple alternating dielectric and metal layers, and... Figure 2 Among the several circuit board layers 24 shown, the parts with diagonal lines are metal layers, while the blank parts without diagonal lines are dielectric layers.
[0030] Therefore, the heat dissipation surface 252 directly exposed from the heat dissipation circuit layer module 20 can most efficiently dissipate the heat from the heat dissipation metal block 25 in the heat dissipation circuit layer module 20. This invention eliminates the need for indirect heat dissipation through other structures, thus avoiding any impact on the heat dissipation rate. Compared to... Figure 3 The present invention provides a heat dissipation circuit board structure 1 that can dissipate heat more quickly than the existing circuit board heat dissipation structure 100, which requires heat convection through a lower heat dissipation hole 163 and a through heat dissipation hole 164, or multiple layers of heat conduction through a middle and lower metal layer 123, at least a dielectric layer 131 and a lower metal layer 132 to dissipate heat from a heat dissipation metal block 150.
[0031] In detail, in this embodiment, the plurality of circuit board layers 24 have a hole 28 formed by etching, and the hole 28 is connected to the upper heat dissipation metal layer to form a bottom surface 29 of the hole. Furthermore, the heat-dissipating circuit board structure 1 includes at least one first heat dissipation hole 31, at least one second heat dissipation hole 32, and at least one third heat dissipation hole 33.
[0032] At least one first heat dissipation hole 31 penetrates the connection metal layer 11 and the at least one dielectric layer 12 of the connection circuit layer module 10. At least one second heat dissipation hole 32 penetrates the upper heat dissipation metal layer 21 and the plurality of circuit board layers 24 of the middle heat dissipation layer unit 22 of the heat dissipation circuit layer module 20. At least one third heat dissipation hole 33 penetrates both the connection metal layer 11 and the at least one dielectric layer 12 of the connection circuit layer module 10, as well as the upper heat dissipation metal layer 21 and the plurality of circuit board layers 24 of the heat dissipation circuit layer module 20. Therefore, the heat dissipation circuit layer module 20 is penetrated by the at least one second heat dissipation hole 32 and the at least one third heat dissipation hole 33.
[0033] The hole 28 of this invention connects the at least one second heat dissipation hole 32 and the at least one third heat dissipation hole 33 of the heat dissipation circuit layer module 20, and the heat dissipation metal block 25 is disposed in the hole 28. In order to make the heat dissipation metal block 25 more efficiently conduct heat to the outside of the heat dissipation circuit layer module 20, and to simplify the process of setting the heat dissipation metal block 25 in the hole 28, this invention fixes the heat dissipation metal block 25 in the hole 28 without relying on molding during the manufacturing process.
[0034] In other words, in comparison, Figure 3 In the existing circuit board heat dissipation structure 100 shown, the heat dissipation metal block 150 is manufactured by pressing it between the upper metal layer 121 and the lower metal layer 123 of the middle circuit layer module 120. However, since the present invention does not have the lower metal layer 123 that would hinder heat dissipation, the heat dissipation metal block 25 is not fixed in the hole 28 by pressing.
[0035] This invention first deposits a thin metal film layer 26 into the hole 28, then adds a heat-dissipating adhesive 27 to the bottom surface 29 of the hole, and finally bonds the heat-dissipating metal block 25 to the hole 28 using the adhesive of the heat-dissipating adhesive 27. This method has the following advantages:
[0036] (1) By bonding the heat dissipation metal block 25 into the hole 28, it is ensured that the heat dissipation metal block 25 can be fixed into the hole 28 without molding, thus avoiding the limitation on the number of stacked circuit board layers 24 caused by molding. In the technical field to which this invention pertains, it is known that the number of stacked circuit board layers 24 that can be bonded by molding is limited. When too many layers are molded, it is impossible to ensure good connection between the layers. However, the circuit board layers 24 of this invention can be generated by stacking them layer by layer through semiconductor processing, thus ensuring better connection between layers and increasing the number of stacked circuit board layers 24.
[0037] (2) By using the heat dissipation adhesive 27 to bond the heat dissipation metal block 25, it is ensured that the heat from the upper heat dissipation metal layer 21 can be conducted to the heat dissipation metal block 25 more seamlessly and densely, thereby increasing the effectiveness of the heat dissipation metal block 25 in assisting the heat dissipation of the connection circuit layer module 10 and the electronic component 2.
[0038] (3) The inner walls of the at least one second heat dissipation hole 32 and the at least one third heat dissipation hole 33 are coated with the metal thin film layer 26 because they are connected to the hole 28, and the metal thin film layer 26 contacts at least one side wall 253 of the heat dissipation metal block 25. This arrangement ensures that the heat of the metal thin film layer 26 can be more efficiently conducted to the inner walls of the at least one second heat dissipation hole 32 and the at least one third heat dissipation hole 33. Furthermore, the at least one second heat dissipation hole 32 and the at least one third heat dissipation hole 33 do not need to rely on thermal convection to carry the heat of the heat dissipation metal block 25 disposed between the at least one second heat dissipation hole 32 and the at least one third heat dissipation hole 33 out of the heat dissipation circuit layer module 20, but instead use thermal conduction to carry the heat away from the heat dissipation circuit layer module 20 more quickly and efficiently. In other words, the at least one second heat dissipation hole 32 and the at least one third heat dissipation hole 33 filled with the metal thin film layer 26 become channels for rapid heat conduction.
[0039] Preferably, the heat dissipation metal block 25 and the metal thin film layer 26 are made of the same metal material. For example, in this embodiment, the heat dissipation metal block 25 is a copper metal block, and the metal thin film layer 26 is a copper thin film layer. Thus, the heat dissipation metal block 25 and the metal thin film layer 26, with matching thermal conductivity coefficients, can more efficiently conduct heat from the heat dissipation metal block 25 to the outside of the heat dissipation circuit layer module 20. In one embodiment, the thermal adhesive 27 may be a stone adhesive. In other embodiments, the thermal adhesive 27 contains the same metal material as the heat dissipation metal block 25; for example, the heat dissipation metal block 25 is a silver metal block, the metal thin film layer 26 is a silver thin film layer, and the thermal adhesive 27 is a silver paste. In this embodiment, the metal layer portions of the plurality of circuit board layers 24 are grounded together.
[0040] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model's technical solution. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the content of the present utility model's technical solution shall still fall within the scope of the present utility model's technical solution.
Claims
1. A heat-dissipating circuit board structure, characterized in that, include: A connection circuit layer module has an overlapping connection metal layer and at least one dielectric layer, the connection metal layer having a connection surface and the connection surface facing away from the at least one dielectric layer. A heat dissipation circuit layer module has an upper heat dissipation metal layer and a middle heat dissipation layer unit that are stacked together; The upper heat dissipation metal layer has a surface opposite to the middle heat dissipation layer unit, and the surface is connected to at least one dielectric layer of the connection circuit layer module. The middle heat dissipation layer unit has a heat dissipation metal block with a heat dissipation surface facing away from the upper heat dissipation metal layer and exposed from the heat dissipation circuit layer module.
2. The heat-dissipating circuit board structure as described in claim 1, characterized in that, The central heat dissipation layer unit includes several stacked circuit board layers, each having an etched hole, and the heat dissipation metal block is disposed in the hole.
3. The heat-dissipating circuit board structure as described in claim 2, characterized in that, The heat dissipation circuit layer module has at least one heat dissipation hole, which penetrates the superimposed upper heat dissipation metal layer and the plurality of circuit board layers, and the at least one heat dissipation hole connects the hole and the connection surface. Each of the at least one heat dissipation hole has an inner wall, and a thin metal film layer is deposited between the heat dissipation metal block and the inner wall of the at least one heat dissipation hole.
4. The heat-dissipating circuit board structure as described in claim 3, characterized in that, The heat dissipation metal block and the metal thin film layer are made of the same metal material.
5. The heat-dissipating circuit board structure as described in claim 4, characterized in that, The heat dissipation metal block is a copper metal block, and the metal thin film layer is a copper thin film layer.
6. The heat-dissipating circuit board structure as described in claim 3, characterized in that, The at least one heat dissipation hole that connects to the hole is a plurality of heat dissipation holes, and the heat dissipation metal block is disposed between the plurality of heat dissipation holes.
7. The heat-dissipating circuit board structure as described in claim 2, characterized in that, The hole in the middle heat dissipation layer unit is connected to the upper heat dissipation metal layer to form the bottom surface of the hole; The space between the bottom of the hole and the heat dissipation metal block is filled with heat dissipation adhesive.
8. The heat-dissipating circuit board structure as described in claim 7, characterized in that, The thermal adhesive contains several metal particles, and these metal particles are the same metal as the heat dissipation metal block.
9. The heat-dissipating circuit board structure as described in claim 1, characterized in that, The connection circuit layer module has at least one upper heat dissipation hole, which penetrates the overlapping connection metal layer and the at least one dielectric layer.