Waterproof LED ceramic packaging substrate

Abstract

The utility model discloses a waterproof LED ceramic packaging substrate which comprises a ceramic base layer, a metal box dam, a front bonding pad, a back bonding pad, a first heat dissipation layer, a second heat dissipation layer, a reinforcing frame, a nanometer waterproof coating and an arc-shaped light-transmitting cover plate. The reinforcing frame is arranged outside the ceramic base layer, the nanometer waterproof coating is arranged on the outer surface of the reinforcing frame, the lower portion of the arc-shaped light-transmitting cover plate is embedded in the annular caulking groove and matched with the annular caulking groove, and the bottom face of the periphery of the arc-shaped light-transmitting cover plate and the annular caulking groove are sealed and fixed through sealant. The waterproof LED ceramic packaging substrate with the structure can effectively enhance the waterproof performance of a product and enhance the strength of the product, when the product is in a humid environment, external moisture is not easy to permeate into the ceramic packaging substrate, the product is prevented from being damaged due to erosion of a conductive circuit, the normal work of the product is ensured, the safety performance during use is improved, and the service life of the product is prolonged. Convenience is brought to use of a user, the product quality is improved, the service life of the product is prolonged, and existing requirements are met.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrates, and in particular to a waterproof LED ceramic packaging substrate. Background Technology

[0002] Ceramic substrates are special boards made by directly bonding copper foil to the surface (single-sided or double-sided) of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperatures. The resulting ultra-thin composite substrates possess excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength. Like PCB boards, they can be etched with various patterns and have a large current-carrying capacity. Therefore, ceramic substrates have become a fundamental material for high-power power electronic circuit structure and interconnection technologies.

[0003] Currently, the microelectronics industry is developing rapidly, and electronic devices and equipment are moving towards high integration and miniaturization, which places increasingly higher demands on the performance of substrates. Alumina ceramic substrates and aluminum nitride ceramic substrates are widely used in electronic packaging fields such as thick-film integrated circuits and LED packaging due to their excellent insulation properties, good thermal conductivity, low coefficient of thermal expansion, and high mechanical strength.

[0004] Current LED ceramic packaging substrates generally consist of a ceramic base and a metal dam. Front and back pads are located on the upper and lower surfaces of the ceramic base and connected to conductive pillars penetrating the ceramic base. While this type of ceramic substrate has a simple structure, it suffers from poor waterproofing. In humid environments, external moisture can easily penetrate the substrate, corroding the conductive circuitry and damaging the product. This leads to malfunctions, significant safety hazards, inconvenience for users, generally lower product quality, shorter lifespan, and lack of competitiveness, failing to meet current demands. Therefore, it is necessary to research a new technical solution to improve current LED ceramic packaging substrates. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a waterproof LED ceramic packaging substrate. This effectively solves the problems of existing LED ceramic packaging substrates, such as poor waterproof performance, easy penetration of external moisture into the ceramic packaging substrate in humid environments, corrosion of conductive circuits, damage to the product, failure of the product to work properly, significant safety hazards, inconvenience to users, mediocre product quality, short product lifespan, and lack of competitiveness.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A waterproof LED ceramic packaging substrate includes a ceramic base layer, a metal dam, a front pad, a back pad, a first heat dissipation layer, a second heat dissipation layer, a reinforcing frame, a nano-waterproof coating, and an arc-shaped light-transmitting cover.

[0008] The ceramic substrate is provided with a through hole, a first heat-conducting hole and a second heat-conducting hole. A conductive pillar is provided in the through hole, a heat-conducting pillar is provided in the first heat-conducting hole, and a heat-conducting ring is provided in the second heat-conducting hole. An annular groove is recessed around the upper surface of the ceramic substrate. A metal dam is provided in the annular groove and extends upward beyond the upper surface of the ceramic substrate. The metal dam and the ceramic substrate form an upward-opening encapsulation cavity. An annular groove is recessed at the opening edge of the encapsulation cavity.

[0009] The front pad is disposed on the upper surface of the ceramic substrate and located in the encapsulation cavity, and the front pad is connected to the upper end of the conductive pillar; the back pad is disposed on the lower surface of the ceramic substrate and connected to the lower end of the conductive pillar; the first heat dissipation layer is disposed on the upper surface of the ceramic substrate and located in the encapsulation cavity, and the first heat dissipation layer is connected to the upper end of the heat-conducting pillar and the upper end of the heat-conducting ring; the second heat dissipation layer is disposed on the lower surface of the ceramic substrate and connected to the lower end of the heat-conducting pillar and the lower end of the heat-conducting ring.

[0010] The reinforcing frame is disposed outside the ceramic substrate, and the reinforcing frame and the ceramic substrate form a cavity. The aforementioned back solder pad and the second heat dissipation layer are disposed in the cavity. The nano waterproof coating is disposed on the outer surface of the reinforcing frame. The lower part of the arc-shaped light-transmitting cover is embedded in the annular groove and is adapted to the annular groove. The bottom edge of the arc-shaped light-transmitting cover is sealed and fixed to the annular groove with sealant.

[0011] As a preferred embodiment, a third heat dissipation layer is further provided, which is disposed on the inner wall of the encapsulation cavity to effectively enhance the heat dissipation performance of the product.

[0012] As a preferred embodiment, a mirror-finish silver plating layer is further provided, which is disposed on the surface of the third heat dissipation layer to effectively improve the LED reflectivity.

[0013] As a preferred embodiment, a waterproof adhesive layer is provided between the arc-shaped light-transmitting cover and the metal dam, which effectively enhances the waterproof performance of the product.

[0014] As a preferred embodiment, the cross-section of the annular groove is a structure with multiple V-shapes, and correspondingly, the cross-section of the bottom surface of the arc-shaped light-transmitting cover is a structure with multiple V-shapes, which effectively enhances the sealing performance of the product and improves its waterproof performance.

[0015] As a preferred embodiment, the nano-waterproof coating is a nano-silica layer. The nano-silica layer has high hardness and good waterproof performance, heat dissipation performance, wear resistance, high temperature resistance, weather resistance and impact resistance.

[0016] As a preferred embodiment, the reinforcing frame is made of carbon fiber, which is characterized by high strength, light weight, good heat dissipation, high temperature resistance, and corrosion resistance.

[0017] As a preferred embodiment, the ceramic substrate is made of aluminum nitride, which has high thermal conductivity, good mechanical properties, good electrical insulation properties, and chemical stability.

[0018] As a preferred embodiment, the first and second heat dissipation layers are made of graphene, which has excellent heat dissipation and thermal conductivity.

[0019] As a preferred embodiment, the heat-conducting pillar and heat-conducting ring are made of graphene, which has excellent heat dissipation and thermal conductivity.

[0020] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0021] By placing a reinforcing frame outside the ceramic substrate, applying a nano-waterproof coating to the outer surface of the reinforcing frame, embedding the lower part of the arc-shaped light-transmitting cover plate into and fitting it into the annular groove, and sealing and fixing the bottom edge of the arc-shaped light-transmitting cover plate to the annular groove with sealant, this structure of waterproof LED ceramic encapsulation substrate can effectively enhance the waterproof performance and increase the strength of the product. When the product is in a humid environment, external moisture is less likely to penetrate into the interior of the ceramic encapsulation substrate, preventing corrosion of conductive circuits and damage to the product, ensuring normal operation of the product, improving safety performance during use, bringing convenience to users, improving product quality, extending product lifespan, making the product more competitive, and meeting current needs.

[0022] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0023] Figure 1 This is a cross-sectional view of a preferred embodiment of the present invention.

[0024] Explanation of reference numerals in the attached diagram:

[0025] 10. Ceramic base layer 11. Through holes

[0026] 12. First heat conduction hole; 13. Second heat conduction hole

[0027] 14. Annular groove; 20. Metal dam

[0028] 21. Encapsulation cavity; 211. Annular groove

[0029] 30, front pad; 40, back pad

[0030] 50. First heat dissipation layer; 60. Second heat dissipation layer

[0031] 70. Reinforcing frame; 71. Receiving cavity

[0032] 80. Nano waterproof coating; 90. Curved light-transmitting cover.

[0033] 100, conductive pillar; 110, thermally conductive pillar

[0034] 120, thermal ring, 130, sealant

[0035] 140, Third heat dissipation layer; 150, Mirror silver plating layer

[0036] 160, waterproof adhesive layer; 170, LED chip. Detailed Implementation

[0037] Please refer to Figure 1 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, including a ceramic base layer 10, a metal dam 20, a front solder pad 30, a back solder pad 40, a first heat dissipation layer 50, a second heat dissipation layer 60, a reinforcing frame 70, a nano waterproof coating 80, and an arc-shaped light-transmitting cover plate 90.

[0038] The ceramic base layer 10 is provided with a through hole 11, a first heat-conducting hole 12, and a second heat-conducting hole 13. A conductive pillar 100 is provided in the through hole 11, a heat-conducting pillar 110 is provided in the first heat-conducting hole 12, and a heat-conducting ring 120 is provided in the second heat-conducting hole 13. An annular groove 14 is recessed around the periphery of the upper surface of the ceramic base layer 10. In this embodiment, the ceramic base layer 10 is made of aluminum nitride, which has high thermal conductivity, good mechanical properties, good electrical insulation properties, and good chemical stability. The heat-conducting pillar 110 and the heat-conducting ring 120 are made of graphene, which has good heat dissipation and thermal conductivity.

[0039] The metal dam 20 is disposed in the annular groove 14 and extends upward beyond the upper surface of the ceramic base layer 10. The metal dam 20 and the ceramic base layer 10 form an upward-opening encapsulation cavity 21. The opening edge of the encapsulation cavity 21 is recessed with an annular groove 211. In this embodiment, the cross-section of the annular groove 211 is a structure of multiple V-shapes.

[0040] The front pad 30 is disposed on the upper surface of the ceramic substrate 10 and located in the encapsulation cavity 21. The front pad 30 is connected to the upper end of the conductive post 100. The back pad 40 is disposed on the lower surface of the ceramic substrate 10 and connected to the lower end of the conductive post 100.

[0041] The first heat dissipation layer 50 is disposed on the upper surface of the ceramic base layer 10 and located in the encapsulation cavity 21. The first heat dissipation layer 50 is connected to the upper end of the heat-conducting pillar 110 and the upper end of the heat-conducting ring 120. In this embodiment, the first heat dissipation layer 50 is made of graphene, which has good heat dissipation and thermal conductivity.

[0042] The second heat dissipation layer 60 is disposed on the lower surface of the ceramic base layer 10 and connected to the lower end of the heat-conducting pillar 110 and the lower end of the heat-conducting ring 120. In this embodiment, the second heat dissipation layer 60 is made of graphene, which has good heat dissipation and thermal conductivity.

[0043] The reinforcing frame 70 is disposed outside the ceramic base layer 10, and the reinforcing frame 70 and the ceramic base layer 10 form a cavity 71. The aforementioned back solder pad 40 and the second heat dissipation layer 60 are disposed in the cavity 71. In this embodiment, the reinforcing frame 70 is made of carbon fiber. Carbon fiber has the characteristics of high strength and light weight, and has good heat dissipation performance, high temperature resistance and corrosion resistance.

[0044] The nano-waterproof coating 80 is disposed on the outer surface of the reinforcing frame 70; in this embodiment, the nano-waterproof coating 80 is a nano-silica layer, which has high hardness and good waterproof performance, heat dissipation performance, wear resistance, high temperature resistance, weather resistance and impact resistance.

[0045] The lower part of the arc-shaped light-transmitting cover 90 is embedded in and adapted to the annular groove 211. The bottom edge of the arc-shaped light-transmitting cover 90 is sealed and fixed to the annular groove 211 by sealant 130. The arc-shaped light-transmitting cover 90 can increase the light emission angle and make the illumination more uniform. In this embodiment, a waterproof adhesive layer 160 is provided between the arc-shaped light-transmitting cover 90 and the metal dam 20, which effectively enhances the waterproof performance of the product. The cross-section of the bottom edge of the arc-shaped light-transmitting cover 90 has a structure of multiple V-shapes.

[0046] A third heat dissipation layer 140 is further provided, which is disposed on the inner wall of the encapsulation cavity 21 to effectively enhance the heat dissipation performance of the product. Specifically, the third heat dissipation layer 140 is made of graphene. A mirror silver plating layer 150 is further provided, which is disposed on the surface of the third heat dissipation layer 140 to effectively improve the LED reflectivity. A wire is provided on the lower surface of the ceramic base layer 10. The wire is disposed in the accommodating cavity 71. The wire passes through the reinforcing frame 70 and the nano waterproof coating 80 and connects the back pad 40 to the external circuit.

[0047] The packaging process of this embodiment is described in detail below:

[0048] First, the LED chip 170 is placed in the encapsulation cavity 21 and fixed to the first heat dissipation layer 50. Next, the LED chip 170 is electrically connected to the front pad 30. Then, sealant 130 is injected into the annular groove 211, and the arc-shaped light-transmitting cover 90 is embedded into the annular groove 211 from top to bottom. After embedding, waterproof adhesive is filled into the gap between the arc-shaped light-transmitting cover 90 and the metal dam 20 to form a waterproof adhesive layer 160. In use, the back pad 40 is electrically connected to external circuitry via wires to enable the LED chip 170 to emit light. Through the coordinated arrangement of the first heat dissipation layer 50, the heat-conducting pillar 110, the heat-conducting ring 120, the second heat dissipation layer 60, and the third heat dissipation layer 140, the product achieves excellent heat dissipation.

[0049] The key design feature of this utility model is:

[0050] By placing a reinforcing frame outside the ceramic substrate, applying a nano-waterproof coating to the outer surface of the reinforcing frame, embedding the lower part of the arc-shaped light-transmitting cover plate into and fitting it into the annular groove, and sealing and fixing the bottom edge of the arc-shaped light-transmitting cover plate to the annular groove with sealant, this structure of waterproof LED ceramic encapsulation substrate can effectively enhance the waterproof performance and increase the strength of the product. When the product is in a humid environment, external moisture is less likely to penetrate into the interior of the ceramic encapsulation substrate, preventing corrosion of conductive circuits and damage to the product, ensuring normal operation of the product, improving safety performance during use, bringing convenience to users, improving product quality, extending product lifespan, making the product more competitive, and meeting current needs.

[0051] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A waterproof LED ceramic encapsulation substrate, characterized in that: It includes a ceramic base layer, a metal dam, front solder pads, back solder pads, a first heat dissipation layer, a second heat dissipation layer, a reinforcing frame, a nano waterproof coating, and an arc-shaped light-transmitting cover. The ceramic substrate is provided with a through hole, a first heat-conducting hole and a second heat-conducting hole. A conductive pillar is provided in the through hole, a heat-conducting pillar is provided in the first heat-conducting hole, and a heat-conducting ring is provided in the second heat-conducting hole. An annular groove is recessed around the upper surface of the ceramic substrate. A metal dam is provided in the annular groove and extends upward beyond the upper surface of the ceramic substrate. The metal dam and the ceramic substrate form an upward-opening encapsulation cavity. An annular groove is recessed at the opening edge of the encapsulation cavity. The front pad is disposed on the upper surface of the ceramic substrate and located in the encapsulation cavity, and the front pad is connected to the upper end of the conductive pillar; the back pad is disposed on the lower surface of the ceramic substrate and connected to the lower end of the conductive pillar; the first heat dissipation layer is disposed on the upper surface of the ceramic substrate and located in the encapsulation cavity, and the first heat dissipation layer is connected to the upper end of the heat-conducting pillar and the upper end of the heat-conducting ring; the second heat dissipation layer is disposed on the lower surface of the ceramic substrate and connected to the lower end of the heat-conducting pillar and the lower end of the heat-conducting ring. The reinforcing frame is disposed outside the ceramic substrate, and the reinforcing frame and the ceramic substrate form a cavity. The aforementioned back solder pad and the second heat dissipation layer are disposed in the cavity. The nano waterproof coating is disposed on the outer surface of the reinforcing frame. The lower part of the arc-shaped light-transmitting cover is embedded in the annular groove and is adapted to the annular groove. The bottom edge of the arc-shaped light-transmitting cover is sealed and fixed to the annular groove with sealant.

2. The waterproof LED ceramic packaging substrate according to claim 1, characterized in that: A third heat dissipation layer is further provided, which is disposed on the inner wall surface of the encapsulation cavity.

3. The waterproof LED ceramic packaging substrate according to claim 2, characterized in that: A mirror-finish silver plating layer is further provided on the surface of the third heat dissipation layer.

4. The waterproof LED ceramic packaging substrate according to claim 1, characterized in that: A waterproof adhesive layer is provided between the arc-shaped light-transmitting cover and the metal dam.

5. The waterproof LED ceramic packaging substrate according to claim 1, characterized in that: The cross-section of the annular groove is a structure of multiple V-shapes, and correspondingly, the cross-section of the bottom surface of the periphery of the arc-shaped light-transmitting cover is a structure of multiple V-shapes.

6. The waterproof LED ceramic packaging substrate according to claim 1, characterized in that: The nano-waterproof coating is a nano-silica layer.

7. The waterproof LED ceramic packaging substrate according to claim 1, characterized in that: The reinforcing frame is made of carbon fiber.

8. The waterproof LED ceramic packaging substrate according to claim 1, characterized in that: The ceramic base layer is made of aluminum nitride.

9. The waterproof LED ceramic packaging substrate according to claim 1, characterized in that: The first and second heat dissipation layers are made of graphene.

10. The waterproof LED ceramic packaging substrate according to claim 1, characterized in that: The heat-conducting pillars and rings are made of graphene.

Images