LED light source device and lighting equipment

Abstract

The utility model relates to the field of lighting, and discloses an LED light source device and lighting equipment. The white ink layer is positioned on the upper surface of the substrate; mounting holes are distributed in the white ink layer; the LED chip is positioned on the upper surface of the substrate and is electrically connected with the substrate through the mounting hole; the white glue reflecting layer is positioned on the surface of the white ink layer and is positioned around the LED chip; and the fluorescent colloid is positioned on the surface of the white glue reflecting layer and covers the LED chip. The white glue reflecting layer is located on the upper surface of the white ink layer, and the white glue reflecting layer has the characteristic of high temperature resistance, is not prone to discoloration at the high temperature and ensures long-term lighting effect stability, so that a good reflecting effect can be achieved on light emitted by the LED chip, the lighting effect of the LED light source device is improved, and the service life of the LED light source device is prolonged. And the problems of color temperature dispersion and poor color consistency can be solved, and the chromaticity stability is improved.

Description

Technical Field

[0001] This application relates to the field of lighting, and in particular to an LED light source device and lighting equipment. Background Technology

[0002] In LED (Light Emitting Diode) light source devices, a layer of white ink is usually applied to the surface of the substrate to protect the circuitry. The LED chip is then fixed to the substrate and electrically connected to it. The typical reflectivity of white ink is between 70% and 85%, which means that at least 15% of the light is absorbed and cannot be effectively utilized, reducing the overall luminous efficacy of the light source.

[0003] Furthermore, during the high-temperature reflow soldering process (typically exceeding 250°C) of LED chips and substrates, the white ink layer undergoes thermal aging and discoloration, leading to a further reduction in reflectivity. Simultaneously, color differences result in color temperature dispersion, low retention rate, and poor color consistency. Actual testing shows that the reflectivity of the white ink layer after reflow soldering typically only reaches around 80%, and the retention rate is only around 85%, far below the target requirements for high-efficiency LED light sources.

[0004] Therefore, how to solve the above-mentioned technical problems should be a key focus for those skilled in the art. Utility Model Content

[0005] The purpose of this application is to provide an LED light source device and lighting equipment to improve the luminous efficacy, color consistency, and chromaticity stability of the LED light source device.

[0006] To address the aforementioned technical problems, this application provides an LED light source device, comprising:

[0007] substrate;

[0008] A white ink layer located on the upper surface of the substrate; the white ink layer has mounting holes distributed thereon;

[0009] An LED chip located on the upper surface of the substrate and electrically connected to the substrate through the mounting hole;

[0010] A white adhesive reflective layer located on the surface of the white ink layer and surrounding the LED chip;

[0011] The fluorescent colloid located on the surface of the white adhesive reflective layer and covering the LED chip.

[0012] Optionally, it also includes:

[0013] A dam located on the surface of the white ink layer and surrounding the fluorescent colloid.

[0014] Optionally, the portion of the white adhesive reflective layer that contacts the side of the LED chip has an inclined surface, and the highest point of the inclined surface is located on the side of the LED chip; and / or,

[0015] The portion of the white adhesive reflective layer that contacts the inner surface of the dam is an inclined surface, and the highest point of the inclined surface is located on the inner surface of the dam; the inner surface of the dam is the surface that contacts the fluorescent colloid.

[0016] Optionally, the inclined surface is an arc-shaped curved surface.

[0017] Optionally, the dike may include a transparent dike.

[0018] Optionally, the dike may include a white dike.

[0019] Optionally, the LED chip is fixed on the substrate in a flip-chip configuration.

[0020] Optionally, it also includes:

[0021] The protrusions are located on the outer surface of the fluorescent adhesive.

[0022] This application also provides a lighting device, including any of the LED light source devices described above.

[0023] This application provides an LED light source device comprising: a substrate; a white ink layer on the upper surface of the substrate; mounting holes distributed in the white ink layer; an LED chip located on the upper surface of the substrate and electrically connected to the substrate through the mounting holes; a white adhesive reflective layer located on the surface of the white ink layer and surrounding the LED chip; and a phosphoric colloid located on the surface of the white adhesive reflective layer and covering the LED chip.

[0024] As can be seen, the LED light source device in this application includes a substrate, a white ink layer, an LED chip, a white adhesive reflective layer, and a phosphor. The white ink layer is located on the upper surface of the substrate, and the LED chip is electrically connected to the substrate through mounting holes in the white ink layer. The white adhesive reflective layer is located on the upper surface of the white ink layer. The white adhesive reflective layer has high-temperature resistance and is not prone to discoloration at high temperatures, ensuring long-term luminous efficacy stability. Therefore, it can effectively reflect the light emitted by the LED chip, improving the luminous efficacy of the LED light source device. Furthermore, it can solve the problems of color temperature dispersion and poor color consistency, improving color stability.

[0025] In addition, this application also provides a lighting device that has the above-mentioned advantages. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A schematic diagram of the structure of an LED light source device provided in an embodiment of this application. Figure 1 ;

[0028] Figure 2 A schematic diagram of the structure of an LED light source device provided in an embodiment of this application. Figure 2 ;

[0029] Figure 3 for Figure 2 An enlarged schematic diagram of the dashed box portion in an LED light source device;

[0030] In the figure, 1 is the substrate, 11 is the aluminum substrate, 12 is the insulating adhesive layer, 13 is the circuit layer, 2 is the white ink layer, 3 is the LED chip, 31 is the electrode, 4 is the white adhesive reflective layer, 5 is the fluorescent colloid, and 6 is the dam. Detailed Implementation

[0031] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0033] As described in the background section, the white ink layer currently applied to the substrate surface will undergo thermal aging and discoloration at high temperatures, resulting in a further reduction in reflectivity. At the same time, color differences will lead to color temperature dispersion, low archiving rate, and poor color consistency.

[0034] In view of this, this application provides an LED light source device, please refer to... Figures 1 to 2 ,include:

[0035] substrate1;

[0036] A white ink layer 2 is located on the upper surface of the substrate 1; the white ink layer 2 has mounting holes distributed thereon.

[0037] An LED chip 3 is located on the upper surface of the substrate 1 and is electrically connected to the substrate 1 through the mounting hole;

[0038] A white adhesive reflective layer 4 located on the surface of the white ink layer 2 and surrounding the LED chip 3;

[0039] The fluorescent colloid 5 is located on the surface of the white adhesive reflective layer 4 and covers the LED chip 3.

[0040] It should be noted that the type of substrate 1 is not limited in this application and depends on the circumstances. For example, substrate 1 can be an aluminum substrate or a ceramic substrate, etc.

[0041] When substrate 1 is an aluminum substrate, such as Figure 1 As shown, the substrate 1 includes an aluminum substrate 11, an insulating adhesive layer 12, and a circuit layer 13. The insulating adhesive layer 12 is located on the upper surface of the aluminum substrate 11, and the circuit layer 13 is located on the upper surface of the insulating adhesive layer 12.

[0042] When substrate 1 is a ceramic substrate, such as Figure 2 As shown, substrate 1 includes a ceramic substrate and a circuit layer 13, which is fabricated on the upper surface of the ceramic substrate using screen printing. The ceramic substrate can be an alumina ceramic substrate or an aluminum nitride ceramic substrate.

[0043] The main components of the white ink layer 2 include photosensitive materials, titanium dioxide (TiO2), and resin. The photosensitive materials are used in the photolithography process to form precise patterns and mounting holes in the white ink layer 2. Titanium dioxide, as the main white filler material, improves reflectivity, and the resin gives the white ink layer 2 good adhesion and weather resistance.

[0044] The white ink layer 2 also serves to protect the circuit layer 13 on the substrate 1.

[0045] It should be noted that the number of LED chips 3 is not limited in this embodiment and can be set arbitrarily. For example, the number of LED chips 3 can be one, or more than two. When the number of LED chips 3 is more than two, the LED chips 3 can be arranged in an array.

[0046] It should be noted that the installation method of LED chip 3 is not limited in this embodiment and can be set by oneself.

[0047] In one possible implementation, the LED chip 3 is fixed to the substrate 1 in a flip-chip configuration. The electrodes 31 of the LED chip 3 are electrically connected to the pads on the substrate 1 through mounting holes. To improve the connection strength between the LED chip 3 and the substrate 1, solder paste can be used to solder the electrodes 31 of the LED chip 3 to the pads.

[0048] When the LED chip 3 is fixed on the substrate 1 in a flip-chip manner, there is no need to set up a wire to connect the LED chip 3 and the substrate 1, avoiding problems such as wire breakage and loose connection points, and improving the reliability of the LED light source device; the LED chip 3 is in direct contact with the substrate 1, which can improve the heat dissipation performance of the LED chip 3.

[0049] As another possible implementation, the LED chip 3 can also be fixed on the substrate 1 in a positive mounting manner. In this case, a wire needs to be provided, with one end of the wire electrically connected to the electrode 31 of the LED chip 3 and the other end electrically connected to the pad of the substrate 1.

[0050] The white adhesive reflective layer 4 is made of a mixture of titanium dioxide and silicone. It does not contain photosensitive materials and requires no exposure treatment. The white adhesive reflective layer 4 can be formed by spraying it onto the surface of the white ink layer 2 using a spraying technique.

[0051] The white adhesive reflective layer 4 has a reflectivity of over 95%, which can significantly improve light reflection efficiency.

[0052] In this implementation, the thickness of the white adhesive reflective layer 4 is not limited and can be set by the user.

[0053] As one possible implementation, the thickness of the white adhesive reflective layer 4 is no more than one-quarter of the thickness of the LED chip 3, so as to avoid blocking the light emission of the LED chip 3 and affecting the light emission efficiency.

[0054] Fluorescent colloid 5 is a mixture of phosphor and silica gel.

[0055] In this embodiment, the LED light source device includes a substrate 1, a white ink layer 2, an LED chip 3, a white adhesive reflective layer 4, and a fluorescent colloid 5. The white ink layer 2 is located on the upper surface of the substrate 1, and the LED chip 3 is electrically connected to the substrate 1 through mounting holes in the white ink layer 2. The white adhesive reflective layer 4 is located on the upper surface of the white ink layer 2. The white adhesive reflective layer 4 has high temperature resistance and is not prone to discoloration at high temperatures, ensuring long-term luminous efficacy stability. Therefore, it can effectively reflect the light emitted by the LED chip 3, improving the luminous efficacy of the LED light source device. It can also solve the problems of color temperature dispersion and poor color consistency, improving color stability.

[0056] Based on the above embodiments, in one embodiment of this application, the LED light source device may further include:

[0057] A dam 6 located on the surface of the white ink layer 2 and surrounding the fluorescent colloid 5.

[0058] The dam 6 can prevent the diffusion of fluorescent colloid 5, ensuring that fluorescent colloid 5 can be evenly coated in the light-emitting area, avoiding overflow and affecting the consistency of light color.

[0059] In this embodiment, the type of dam 6 is not limited and can be determined depending on the circumstances.

[0060] As one possible implementation, the dam 6 includes a transparent dam, which allows the light from the LED light source device to radiate in all directions, achieving five-sided light output and improving the light output efficiency of the LED light source device.

[0061] As another possible implementation, the dam 6 includes a white dam, which has a high reflectivity and can reflect light back to the light-emitting area, thereby improving the luminous efficiency.

[0062] Please refer to Figure 3 Based on any of the above embodiments, in one embodiment of this application, the portion of the white adhesive reflective layer 4 that contacts the side of the LED chip 3 is an inclined surface, and the highest point of the inclined surface is located on the side of the LED chip 3; and / or,

[0063] The portion of the white adhesive reflective layer 4 that contacts the inner surface of the dam 6 is an inclined surface, and the highest point of the inclined surface is located on the inner surface of the dam 6; the inner surface of the dam 6 is the surface that contacts the fluorescent colloid 5.

[0064] This embodiment includes three cases: First, only the part of the white adhesive reflective layer 4 that contacts the side of the LED chip 3 is an inclined surface; second, only the part of the white adhesive reflective layer 4 that contacts the inner surface of the dam 6 is an inclined surface; third, the part of the white adhesive reflective layer 4 that contacts the side of the LED chip 3 is an inclined surface, and the part of the white adhesive reflective layer 4 that contacts the inner surface of the dam 6 is also an inclined surface.

[0065] The portion of the white adhesive reflective layer 4 that contacts the side of the LED chip 3 is an inclined surface. When light emitted from the LED chip 3 shines on this inclined surface, it can be reflected, optimizing the light reflection path so that the light shines on the outside of the LED light source device and improving the light extraction efficiency.

[0066] It should be noted that the shape of the inclined surface is not limited in this embodiment and can be set by the user.

[0067] As one possible implementation, the inclined surface is an arc-shaped curved surface, which can further optimize the light reflection path and improve the light extraction efficiency.

[0068] Of course, in other embodiments, the inclined surface can also be a plane.

[0069] Based on any of the above embodiments, in one embodiment of this application, the LED light source device further includes:

[0070] The protrusion is located on the outer surface of the fluorescent colloid 5.

[0071] The protrusions can increase the uniformity of light output from LED light source devices.

[0072] The protrusions can be fish-scale shaped or other shapes.

[0073] The following is a specific example illustrating the fabrication process of the LED light source device in this application.

[0074] Step 1: Coat the substrate surface with white ink to form a white ink layer, and use photolithography to process the white ink layer to form mounting holes;

[0075] Step 2: Using flip-chip soldering, solder paste is used to electrically connect the LED chip to the substrate and precisely place it on the pre-set pads on the substrate surface to form a strong solder structure, ensuring stable electrical performance and heat dissipation.

[0076] Step 3: Construct a dam around the luminous area according to the set dimensions;

[0077] Step 4: In the light-emitting area, use piezoelectric ceramic valve spraying technology to spray a layer of high reflectivity white wall adhesive on the surface of the white ink layer and in the gap area between the LED chips; wherein, the coating height of the white wall adhesive is flush with the bottom of the LED chip, and is attached in an arc-shaped curved surface in the contact area of ​​the side surface of the LED chip and the inner surface of the dam.

[0078] Step 5: After the white wall adhesive is sprayed, the product is baked and cured to form a stable high-reflectivity white adhesive reflective layer, which further improves the light utilization rate and reduces light absorption loss.

[0079] Step 6: According to the preset light color requirements, precisely apply fluorescent adhesive to the light-emitting area to ensure uniform distribution of the phosphor in order to achieve the target spectrum output;

[0080] Step 7, Adding Powder (Color Temperature and Color Coordinate Adjustment): After the fluorescent adhesive has initially cured, fine-tune the color temperature and color coordinates by increasing or decreasing the amount of fluorescent adhesive based on the actual measured color temperature and color coordinates data, so that the final light source color coordinates fall within the target color temperature BIN range, ensuring color consistency and stability.

[0081] Step 8: After completing the fluorescent adhesive dotting and powder replenishment, bake the product to further cure the fluorescent adhesive, form a fluorescent colloid, and improve the mechanical stability and durability of the fluorescent colloid.

[0082] Step 9, Long-term post-curing (stress relief treatment): After the fluorescent adhesive has initially cured, a long-term post-curing process is performed to further release the stress inside the fluorescent adhesive, ensuring that the performance will not degrade due to stress concentration during long-term use, and improving the stability and reliability of the device.

[0083] Step 10, Testing and Grading (Photoelectric Performance Testing): Conduct comprehensive testing on the LED light source, including: photoelectric parameter measurement (luminous flux, color temperature, color rendering index, etc.), chromaticity coordinate detection (ensuring compliance with the target BIN), electrical characteristic testing (VF, IR, etc.), and reliability testing (high temperature aging, damp heat cycling, etc.).

[0084] Step 11, Packaging and Warehousing: After testing and quality grading are completed, qualified products are packaged and warehoused, and labeled and shipped according to customer requirements.

[0085] This application also provides a lighting device, including the LED light source device described in any of the above embodiments.

[0086] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0087] The LED light source device and lighting equipment provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the solution and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. An LED light source device, characterized in that, include: substrate; A white ink layer located on the upper surface of the substrate; The white ink layer has mounting holes distributed thereon; An LED chip located on the upper surface of the substrate and electrically connected to the substrate through the mounting hole; A white adhesive reflective layer located on the surface of the white ink layer and surrounding the LED chip; The fluorescent colloid located on the surface of the white adhesive reflective layer and covering the LED chip.

2. The LED light source device as described in claim 1, characterized in that, Also includes: A dam located on the surface of the white ink layer and surrounding the fluorescent colloid.

3. The LED light source device as described in claim 2, characterized in that, The portion of the white adhesive reflective layer that contacts the side of the LED chip has an inclined surface, and the highest point of the inclined surface is located on the side of the LED chip; and / or, The portion of the white adhesive reflective layer that contacts the inner surface of the dam is an inclined surface, and the highest point of the inclined surface is located on the inner surface of the dam; the inner surface of the dam is the surface that contacts the fluorescent colloid.

4. The LED light source device as described in claim 3, characterized in that, The inclined surface is an arc-shaped curved surface.

5. The LED light source device as described in claim 2, characterized in that, The dikes include transparent dikes.

6. The LED light source device as described in claim 2, characterized in that, The dikes include white dikes.

7. The LED light source device as described in claim 1, characterized in that, The LED chip is fixed on the substrate in a flip-chip configuration.

8. The LED light source device according to any one of claims 1 to 7, characterized in that, Also includes: The protrusions located on the outer surface of the fluorescent adhesive.

9. A lighting device, characterized in that, Includes the LED light source device as described in any one of claims 1 to 8.

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