Wafer positioning device and positioning edge searching system

Abstract

The utility model relates to a wafer positioning device and a positioning edge searching system. The wafer positioning device comprises a jacking mechanism and a rotating mechanism, the rotating mechanism comprises a rotating disc and an adjusting motor; the adjusting motor is arranged below the turntable and is used for driving the turntable to rotate; the jacking mechanism comprises a driving assembly, a jacking platform and a first adsorption device. The driving assembly is used for driving the jacking platform to ascend and descend. The jacking platform is arranged around the periphery of the turntable; the first adsorption device comprises a plurality of suction cup assemblies evenly distributed on the jacking platform. According to the jacking platform, the lower surface of the wafer is adsorbed through the first adsorption device, positioning of the wafer with the warping problem is facilitated, the stability of the wafer in the moving process is ensured, waggling or displacement of the wafer is avoided, and the adaptability of the positioning device to wafers of different sizes and shapes is improved.

Description

Technical Field

[0001] This application relates to the field of wafer testing technology, specifically to a wafer positioning device and a positioning edge-finding system. Background Technology

[0002] Loading is a crucial step in wafer aging testing. Specialized positioning devices are needed to ensure accurate and stable loading of wafers into the aging fixture. The varying storage locations of wafers in the hopper make accurate position control during loading difficult and prone to displacement during loading and positioning processes.

[0003] Existing positioning devices often struggle to achieve stable and accurate positioning of wafers, affecting the accuracy of subsequent wafer testing and potentially causing damage to the wafers. Utility Model Content

[0004] To address the problem that existing positioning devices struggle to achieve stable and accurate wafer positioning, which affects the accuracy of subsequent wafer testing and may even damage the wafer.

[0005] This application provides a wafer positioning device, including a lifting mechanism and a rotating mechanism;

[0006] The rotating mechanism includes a turntable and an adjusting motor; the adjusting motor is located below the turntable and is used to drive the turntable to rotate.

[0007] The lifting mechanism includes a drive assembly, a lifting platform, and a first suction device. The drive assembly is used to drive the lifting platform to rise and fall. The lifting platform is arranged around the outer periphery of the turntable. The first suction device includes a plurality of suction cup assemblies evenly arranged on the lifting platform.

[0008] Furthermore, the lifting platform includes a first half-platform and a second half-platform symmetrically arranged on the outer periphery of the turntable, and a plurality of suction cup assemblies are symmetrically arranged on the first half-platform and the second half-platform.

[0009] Furthermore, each of the suction cup assemblies includes a movable suction cup and an elastic element disposed below it.

[0010] Furthermore, the lifting platform is provided with at least one first air passage, and each of the movable suction cups is connected to the corresponding first vacuum generator through the corresponding first air passage.

[0011] Furthermore, the rotating mechanism includes a second adsorption device, which includes a second air passage, a second vacuum generator, and at least one suction nozzle. At least one suction nozzle is disposed on the turntable and is connected to the second vacuum generator through the second air passage.

[0012] Furthermore, the second adsorption device includes a plurality of suction nozzles, which are evenly distributed along the circumference of the turntable.

[0013] Furthermore, the second air passage is disposed within the output shaft of the regulating motor.

[0014] Furthermore, after the lifting mechanism brings the wafer into contact with the rotating mechanism and completes the handover, the lifting mechanism descends further to a first position, in which the upper surface of the movable suction cup is lower than the upper surface of the turntable.

[0015] This application also provides a wafer positioning and edge-finding system, including the positioning device and an auxiliary edge-finding mechanism;

[0016] The positioning device includes a rotating mechanism; the rotating mechanism includes a turntable and an adjusting motor;

[0017] The auxiliary edge-finding mechanism includes an edge camera, which is positioned above and to the side of the turntable of the positioning device to capture images with wafer edges. The auxiliary edge-finding mechanism is electrically connected to the adjustment motor of the positioning device and the edge camera.

[0018] Furthermore, the auxiliary edge-finding mechanism includes a reflector, which is disposed on the lower side of the turntable and is used to cooperate with the edge camera to form a wafer edge imaging optical path.

[0019] Implementing the embodiments of this application has the following beneficial effects:

[0020] The lifting and rotating mechanisms of the positioning device in this application work together to achieve high-precision wafer positioning. A lifting platform is positioned around the outer periphery of the turntable, and first adsorption devices are evenly distributed on the lifting platform. When the lifting platform rises to receive the wafer, the first adsorption devices can adsorb the lower surface of the wafer, which is beneficial for positioning wafers with warping issues, ensuring the stability of the wafer during movement, avoiding wafer wobbling or displacement, and improving the adaptability of the positioning device to wafers of different sizes and shapes. The lifting and rotating mechanisms work together to accurately position the wafer in both vertical and horizontal rotational directions, which helps to accurately adjust the wafer position in subsequent processes and reduces testing errors caused by inaccurate positioning.

[0021] The edge-finding mechanism of this application, through the cooperation of an edge camera and a reflector, can clearly acquire images of the wafer edge. Combined with the processing of image information by the control system and the precise rotation control of the rotating mechanism, it can achieve the finding and high-precision positioning of the wafer edge, thus meeting the requirements for wafer positioning and edge finding in the wafer production process. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of the wafer positioning device according to an embodiment of this application;

[0024] Figure 2 This is a cross-sectional view of the wafer positioning device according to an embodiment of this application;

[0025] Figure 3 This is a partial cross-sectional view of the lifting platform according to an embodiment of this application;

[0026] Figure 4 This is a schematic diagram of the positioning and edge-finding system according to an embodiment of this application.

[0027] The corresponding reference numerals in the figure are as follows: 1. Lifting mechanism; 11. Lead screw guide rail; 12. Moving seat; 13. Lifting platform; 14. First adsorption device; 141. Suction cup assembly; 1411. Movable suction cup; 1412. Support tube; 142. First air passage; 143. First vacuum generator; 15. Fixed seat; 16. Lifting motor; 2. Rotation mechanism; 21. Turntable; 211. First half-stage; 212. Second half-stage; 22. Adjustment motor; 23. Second adsorption device; 231. Second air passage; 232. Second vacuum generator; 233. Suction nozzle; 24. Fixed plate; 3. Auxiliary edge-finding mechanism; 31. Edge camera; 32. Reflector. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0029] In the description of this application, it should be understood that the terms "upper," "lower," "inner," "outer," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or regarding the vertical, perpendicular, or gravitational direction of the component itself. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0030] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for descriptive purposes only and is not intended to limit the scope of this application. Terms such as “part” or “component” appearing herein can refer to a single part or a combination of multiple parts. Terms such as “installation,” “setup,” and “connection” appearing herein should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can indicate that one component is directly attached to another component or that one component is attached to another component via an intermediate component; they can refer to the internal connection of two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. A feature described in one embodiment herein may be applied alone or in combination with other features to another embodiment, unless that feature is not applicable in that other embodiment or is otherwise stated.

[0031] Figure 1 This is a schematic diagram of the structure of the wafer positioning device according to an embodiment of this application; Figure 2 This is a cross-sectional view of the wafer positioning device according to an embodiment of this application; Figure 3 This is a partial cross-sectional view of the lifting platform according to an embodiment of this application; Figure 4 This is a schematic diagram of the positioning and edge-finding system according to an embodiment of this application.

[0032] The following combination Figures 1-4 This application provides a wafer positioning device, including a lifting mechanism 1 and a rotating mechanism 2. The rotating mechanism 2 includes a turntable 21 and an adjusting motor 22. The adjusting motor 22 is located below the turntable 21 and is used to drive the turntable 21 to rotate.

[0033] The lifting mechanism 1 includes a drive assembly, a lifting platform 13, and a first suction device 14. The drive assembly is used to drive the lifting platform 13 to rise and fall. The lifting platform 13 is arranged around the outer periphery of the turntable 21. The first suction device 14 includes a plurality of suction cup assemblies 141 evenly arranged on the lifting platform 13.

[0034] Examples of embodiments in this application, such as Figure 1 and Figure 2 As shown, the adjusting motor 22 of the rotating mechanism 2 is installed below the turntable 21, providing power for the rotation of the turntable 21. The output shaft of the adjusting motor 22 is connected to the turntable 21, and a fixing plate 24 is provided above the adjusting motor 22, which is connected to the frame. The rotating mechanism 2 adjusts the circumferential angle of the wafer by rotating the turntable 21, improving the positional accuracy of the wafer and effectively preventing additional positional offset during wafer rotation.

[0035] The driving assembly of the lifting mechanism 1 includes a lead screw guide rail 11, a movable base 12, and a lifting motor 16. In one possible embodiment, the lead screw guide rail 11 includes a lead screw, a nut, a guide rail, and a slider. The slider is connected to the movable base 12, and the lifting platform 13 is fixedly mounted on the movable base 12. The lifting motor 16 drives the slider to move the movable base 12 and the lifting platform 13 up and down. In other possible embodiments, the driving assembly can also be configured as a pneumatic, hydraulic, or electric actuator assembly capable of driving the lifting platform 13 to move linearly. The lifting motor 16 is located below the lead screw guide rail 11 and connected to a fixed base 15. The driving assembly is connected to the frame through the fixed base 15.

[0036] During the loading operation, the wafer is first removed from the chuck by the toothed fork and moved to the transfer position. At this time, the lifting platform 13 of the lifting mechanism 1 rises to the first transfer position along the lead screw guide 11 in the axial direction of the turntable via the moving seat 12, and transfers the wafer with the toothed fork. The lifting platform 13 adsorbs the lower surface of the wafer by the suction cup assembly 141 set on it. After the wafer transfer is completed, the toothed fork returns to the safe position. Subsequently, the lifting platform 13 carries the wafer down along the lead screw guide 11 to the second transfer position, and transfers the wafer with the turntable 21 of the rotating mechanism 2. After the suction cup assembly 141 releases the wafer and successfully places the wafer on the turntable 21, the lifting platform 13 further descends to the first position. Then, the rotating mechanism 2 performs preliminary positioning of the wafer.

[0037] The lifting mechanism 1 and rotating mechanism 2 of the positioning device in this application work together to achieve high-precision wafer positioning. A lifting platform 13 is arranged around the outer periphery of the turntable 21, and first adsorption devices 14 are evenly distributed on the lifting platform 13. When the lifting platform rises to receive the wafer, it can adsorb the lower surface of the wafer through the first adsorption devices, which is beneficial for positioning wafers with warpage issues, ensuring the stability of the wafer during movement, avoiding wafer wobbling or displacement, improving the compatibility with wafers with warpage issues, and enhancing the adaptability of the positioning device to wafers of different sizes and shapes. The lifting mechanism 1 and rotating mechanism 2 work together to accurately position the wafer from both vertical and horizontal rotational directions, which helps to accurately adjust the wafer position in subsequent processes and reduces testing errors caused by inaccurate positioning.

[0038] Furthermore, the lifting platform 13 includes a first half platform 211 and a second half platform 212 symmetrically arranged around the outer periphery of the turntable 21, and a plurality of suction cup assemblies 141 symmetrically arranged on the first half platform 211 and the second half platform 212.

[0039] Examples of embodiments in this application, such as Figure 3 As shown, the lifting platform 13 is an integral structure. A first half-platform 211 and a second half-platform 212 are located above the lifting platform 13, with multiple suction cup assemblies 141 symmetrically distributed on the two half-platforms. Preferably, the number of suction cup assemblies 141 is four, symmetrically distributed in pairs on the two half-platforms. Because the lifting platform 13 is an integral structure, the number of parts and connecting points is reduced, making the entire device more compact and providing better rigidity and stability during lifting. Furthermore, symmetrically distributing the suction cup assemblies on the two half-platforms allows for a more uniform suction force on the wafer during adsorption, thereby improving the accuracy and stability of wafer positioning.

[0040] In one possible implementation, the lifting platform 13 can also be designed as a two-section, three-section, or multi-section splicing structure. Each section can be independently equipped with suction cup assemblies 141 and assembled together through precise positioning and connection. This structure may be more flexible in manufacturing and installation, facilitating adjustments according to different production needs and equipment space.

[0041] Furthermore, each suction cup assembly 141 includes a movable suction cup 1411 and an elastic element disposed below it.

[0042] In this embodiment, each suction cup assembly 141 includes a movable suction cup 1411 for direct contact with the object being adsorbed and generating an adsorption force. The movable suction cup 1411 is typically made of a soft and elastic material to ensure good adhesion to the surface of the wafer being adsorbed. The movable suction cup 1411 is disposed in a suction cup cavity on the corresponding first half-stage 211 or second half-stage 212. A support tube 1412 is provided in the suction cup cavity, and the movable suction cup 1411 is slidably sleeved on the support tube 1412. An elastic element (not shown in the figure) is disposed below the movable suction cup 1411 and is also sleeved on the support tube 1412.

[0043] Preferably, the elastic element can be a spring, such as a compression spring, fitted onto the support tube 1412. The main function of the elastic element is to provide cushioning and shock absorption, preventing damage to the movable suction cup 1411 or the adsorbed wafer due to impact or vibration during lifting or movement. Simultaneously, the elastic element can also improve compatibility with wafers exhibiting warpage by adjusting the contact pressure between the movable suction cup 1411 and the adsorbed wafer to a certain extent, ensuring the stability and reliability of the adsorption force.

[0044] Furthermore, the lifting platform 13 is provided with at least one first air passage 142, and each movable suction cup 1411 is connected to the corresponding first vacuum generator 143 through the corresponding first air passage 142.

[0045] The first air passage 142 is located inside the lifting platform 13. Each movable suction cup 1411 can be connected to the first vacuum generator 143 through an independent or shared first air passage 142, ensuring that the movable suction cup 1411 can receive airflow from the first vacuum generator 143 when needed.

[0046] In this embodiment, each movable suction cup 1411 is connected to a separate first vacuum generator 143 via a lower support tube 1412 and an independent first air channel 142. The first vacuum generator 143 is located below the lifting platform 13. When the lifting platform 13 rises and performs wafer transfer with the toothed fork, the first vacuum generator 143 is activated, providing negative pressure to the movable suction cup 1411 through the first air channel 142. As the air inside the movable suction cup 1411 is extracted, a negative pressure is formed inside the movable suction cup 1411, thereby tightly adsorbing the wafer onto the movable suction cup 1411. In this embodiment, a suitable negative pressure value can be set in the control device to maintain a stable adsorption force. At the same time, a pressure sensor can be set to monitor the negative pressure value in real time to ensure the safety and reliability of the adsorption process.

[0047] In another possible implementation, in order to reduce installation complexity and improve maintenance convenience, multiple first air passages 142 can be connected to the same first vacuum generator 143.

[0048] Furthermore, the rotating mechanism 2 includes a second adsorption device 23, which includes a second air passage 231, a second vacuum generator 232, and at least one suction nozzle 233. The at least one suction nozzle 233 is disposed on the turntable 21 and is connected to the second vacuum generator 232 through the second air passage 231.

[0049] Based on the size and shape of the wafer, at least one suction nozzle 233 is evenly arranged on the turntable 21 to ensure that the wafer can be stably adsorbed during rotation. When wafer adsorption is required, the second vacuum generator 232 is activated to provide negative pressure to the suction nozzle 233 through the second air channel 231. As the air inside the suction nozzle 233 is extracted, a negative pressure is formed inside the suction nozzle 233, thereby firmly adsorbing the wafer onto the suction nozzle 233. Using the second adsorption device 23 ensures that the wafer is stably adsorbed during rotation, avoiding problems such as wafer detachment or displacement.

[0050] In one possible implementation, the second adsorption device 23 includes a plurality of suction nozzles 233, which are evenly distributed around the circumference of the turntable 21. Preferably, there are four suction nozzles 233, which are evenly distributed around the circumference of the turntable 21. Using multiple suction nozzles 233 to adsorb the wafer together can distribute the weight of the wafer and improve the stability and uniformity of adsorption.

[0051] Furthermore, the second air passage 231 is disposed within the output shaft of the regulating motor 22, and the second vacuum generator 232 is disposed below the regulating motor 22. Disposing of the second air passage 231 within the output shaft of the regulating motor 22 saves space and makes the overall structure more compact.

[0052] Furthermore, after the lifting mechanism 1 brings the wafer into contact with the rotating mechanism 2 and completes the transfer, the lifting mechanism 1 descends further to a first position, where the upper surface of the movable chuck 1411 is lower than the upper surface of the turntable 21. This design ensures that the wafer is completely disengaged from the movable chuck 1411 of the lifting mechanism 1 after the transfer is completed, and avoids possible interference or damage to the wafer during subsequent rotation.

[0053] This application also provides a wafer positioning and edge finding system, including a positioning device and an auxiliary edge finding mechanism 3; the positioning device includes a rotating mechanism 2; the rotating mechanism 2 includes a turntable 21 and an adjusting motor 22.

[0054] like Figure 4As shown, the auxiliary edge-finding mechanism 3 includes an edge camera 31, which is positioned above and to the side of the turntable 21 to capture images showing the wafer edge. The auxiliary edge-finding mechanism 3 is electrically connected to the adjusting motor 22 and the edge camera 31. Further, the auxiliary edge-finding mechanism 3 includes a reflector 32, which is positioned below and to the side of the turntable 21 to cooperate with the edge camera 31 in forming a wafer edge imaging optical path. The reflector 32 is fixed above the lead screw guide rail 11, and its position matches that of the edge camera 31.

[0055] In this embodiment, after the lifting platform 13, carrying the wafer, completes the wafer transfer with the turntable 21 of the rotating mechanism 2, the lifting platform 13 further descends to the first position. Then, the side camera 31 is activated to capture images of the wafer on the turntable 21, obtaining images with the wafer edges. During the capture process, the side camera 31 transmits the acquired image signals to the control system. After receiving the image signals from the side camera 31, the control system analyzes and processes the images using image processing algorithms to identify the edge contour information of the wafer. Through the analysis of the edge contour information, the position and orientation deviation of the wafer relative to the center of the turntable 21 is calculated. Based on the position and orientation deviation information calculated by the control system, the control system generates corresponding control signals and sends them to the adjusting motor 22. The adjusting motor 22 drives the turntable 21 to rotate according to preset rules and angles based on the received control signals. For example, if the wafer has a deviation of a certain angle in clockwise rotation, the adjusting motor 22 will drive the turntable 21 to rotate counterclockwise by the same angle to correct the wafer's orientation. During the rotation of turntable 21, edge camera 31 can continuously capture images of the wafer edge to obtain the latest position information of the wafer in real time. Based on the newly acquired image information, the control system dynamically adjusts the rotation angle of adjustment motor 22 until the position and orientation of the wafer reach the preset accuracy requirements.

[0056] In practical applications, wafers have truncated edges, which are positioned parallel to or parallel to the rack as needed. In this embodiment, the auxiliary edge-finding mechanism 3 forms an imaging optical path through the cooperation of the edge camera 31 and the reflector 32, which can clearly acquire images of the wafer edge. Combined with the image information processing of the control system and the precise rotation control of the motor 22, high-precision positioning of the wafer truncated edge position and orientation can be achieved, meeting the positioning requirements in the wafer production process.

[0057] This application's wafer positioning device and edge-finding system, through a unique structural design and collaborative working method, makes wafer positioning and edge-finding operations more precise and stable. Even if the wafer has warpage, uniform adsorption force ensures its stability during movement, preventing wafer wobbling or displacement, thus improving compatibility with warped wafers and the adaptability of the positioning device to wafers of different sizes and shapes. By using an auxiliary edge-finding mechanism in conjunction with a rotating structure to find the edge of the wafer, the rotation angle of the motor can be dynamically adjusted to ensure that the wafer's position and orientation meet the preset accuracy requirements, achieving high-precision positioning of the wafer's position and orientation, and realizing the automation and intelligence of wafer positioning and edge-finding.

[0058] Obviously, the embodiments described above are merely some, not all, of the embodiments in this specification. Based on the embodiments in this specification, those skilled in the art can make other variations or modifications without creative effort, and all such variations should fall within the scope of protection of the embodiments in this specification. The specification and embodiments are considered exemplary only, and the true scope and spirit of the embodiments in this specification are indicated by the appended claims.

Claims

1. A wafer positioning device, characterized in that, Includes lifting and rotating mechanisms; The rotating mechanism includes a turntable and an adjusting motor; the adjusting motor is located below the turntable and is used to drive the turntable to rotate. The lifting mechanism includes a drive assembly, a lifting platform, and a first adsorption device. The drive assembly is used to drive the lifting platform to rise and fall. The lifting platform is arranged around the outer periphery of the turntable; the first adsorption device includes a plurality of suction cup assemblies evenly arranged on the lifting platform.

2. The wafer positioning device according to claim 1, characterized in that, The lifting platform includes a first half-platform and a second half-platform symmetrically arranged on the outer periphery of the turntable, and a plurality of suction cup assemblies are symmetrically arranged on the first half-platform and the second half-platform.

3. The wafer positioning device according to claim 1, characterized in that, Each of the suction cup assemblies includes a movable suction cup and an elastic element disposed below it.

4. The wafer positioning device according to claim 3, characterized in that, The lifting platform is provided with at least one first air passage, and each of the movable suction cups is connected to the corresponding first vacuum generator through the corresponding first air passage.

5. The wafer positioning device according to claim 1, characterized in that, The rotating mechanism includes a second adsorption device, which includes a second air passage, a second vacuum generator, and at least one suction nozzle. At least one suction nozzle is disposed on the turntable and is connected to the second vacuum generator through the second air passage.

6. The wafer positioning device according to claim 5, characterized in that, The second adsorption device includes multiple suction nozzles, which are evenly distributed along the circumference of the turntable.

7. The wafer positioning device according to claim 5, characterized in that, The second air passage is located inside the output shaft of the regulating motor.

8. The wafer positioning device according to claim 3, characterized in that, After the lifting mechanism brings the wafer into contact with the rotating mechanism and completes the handover, the lifting mechanism further descends to a first position, in which the upper surface of the movable suction cup is lower than the upper surface of the turntable.

9. A wafer positioning and edge-finding system, characterized in that, Includes the positioning device and auxiliary edge-finding mechanism as described in any one of claims 1-8; The auxiliary edge-finding mechanism includes an edge camera, which is positioned above and to the side of the turntable of the positioning device to capture images with wafer edges. The auxiliary edge-finding mechanism is electrically connected to the adjustment motor of the positioning device and the edge camera.

10. The wafer positioning and edge-finding system according to claim 9, characterized in that, The auxiliary edge-finding mechanism includes a reflector, which is disposed on the lower side of the turntable and is used to cooperate with the edge camera to form a wafer edge imaging optical path.

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